CN210430406U - Laser heat abstractor - Google Patents
Laser heat abstractor Download PDFInfo
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- CN210430406U CN210430406U CN201920980537.7U CN201920980537U CN210430406U CN 210430406 U CN210430406 U CN 210430406U CN 201920980537 U CN201920980537 U CN 201920980537U CN 210430406 U CN210430406 U CN 210430406U
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- heat sink
- preservation cotton
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Abstract
A laser heat dissipation device comprises a heat dissipation sheet, a semiconductor refrigeration sheet, a laser support, a first heat preservation cotton portion and a heat preservation cotton group. The radiating fin is connected with the laser device support, and the laser device support is used for holding the laser device. The heat preservation cotton group is arranged between the laser and the laser support, and the first heat preservation cotton part is embedded in one surface of the laser support between the radiating fin and the laser. Laser instrument and fin bolted connection, semiconductor refrigeration piece inlay and locate the cotton portion of first heat preservation, the one side and the laser instrument butt of semiconductor refrigeration piece, the one side and the fin butt that the laser instrument was kept away from to the semiconductor refrigeration piece. The laser support is provided with a first opening, and the first opening is used for exposing the wiring port of the laser. Connect gradually through laser instrument, semiconductor refrigeration piece, fin and dispel the heat, thereby first cotton portion of keeping warm and the cotton group of keeping warm can improve the two-sided temperature difference of semiconductor refrigeration piece and heat conduction is effectual, can conveniently carry out the wiring to the laser instrument through first opening.
Description
Technical Field
The utility model relates to a laser instrument heat dissipation field particularly, relates to a laser instrument heat abstractor.
Background
The heat dissipation mode of the laser on the existing gene sequencer is more traditional, and the heat dissipation is carried out by utilizing the installation surface of the laser. Due to the problem that the mounting surface of the laser is not large enough, heat generated by the laser during long-time operation cannot be released at any time, and the risk problem that the laser cannot operate due to overheating exists.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a laser instrument heat abstractor, it is connected gradually through laser instrument, semiconductor refrigeration piece, fin and dispels the heat, thereby first heat preservation cotton portion and heat preservation cotton group can improve the two sides temperature difference heat conduction effect of semiconductor refrigeration piece good, and first opening exposes the wiring mouth of laser instrument, conveniently works a telephone switchboard to the laser instrument.
The embodiment of the utility model discloses a realize through following technical scheme:
a laser heat dissipation device comprises a heat dissipation sheet, a semiconductor refrigeration sheet, a laser support, a first heat preservation cotton portion and a heat preservation cotton group.
The radiating fin is connected with the laser device support, and the laser device support is used for holding the laser device. The heat preservation cotton group is arranged between the laser and the laser support, and the first heat preservation cotton part is embedded in one surface of the laser support between the radiating fin and the laser. Laser instrument and fin bolted connection, semiconductor refrigeration piece inlay and locate the cotton portion of first heat preservation, the one side and the laser instrument butt of semiconductor refrigeration piece, the one side and the fin butt that the laser instrument was kept away from to the semiconductor refrigeration piece. The laser support is provided with a first opening, and the first opening is used for exposing the wiring port of the laser.
The inventor finds that the heat dissipation of the existing laser is based on the mounting surface of the laser, and due to the fact that the mounting surface is not large enough, heat generated by the laser during long-time operation cannot be released temporarily, so that the risk problem that the laser cannot work due to overheating exists, and the normal operation and the service life of the laser are affected.
The invention provides a laser heat dissipation device which comprises a heat dissipation sheet, a semiconductor refrigeration sheet, a laser bracket, a first heat preservation cotton part and a heat preservation cotton group. The laser is placed on the laser support and the laser is also separately bolted to the heat sink to form a positional fixation between the laser and the heat sink.
For laser instrument and fin bolted connection, the laser instrument support is connected with the fin, guarantees through dual connection that the relative position of laser instrument and fin is fixed, connection is stable.
The heat preservation cotton group is arranged between the laser and the laser support, the first heat preservation cotton portion is embedded in one surface of the laser support between the radiating fin and the laser, and the semiconductor refrigeration piece is embedded in the first heat preservation cotton portion. Semiconductor refrigeration piece one side and laser instrument butt, the one side and the fin butt of laser instrument are kept away from to the semiconductor refrigeration piece to realize that laser instrument, semiconductor refrigeration piece, fin connect gradually, the laser instrument dispels the heat through semiconductor refrigeration piece and fin. The first heat-preservation cotton part and the heat-preservation cotton group jointly preserve heat of parts, which are easy to heat, of the laser, heat is gathered on the contact surface of the semiconductor refrigerating sheet and the laser, the temperature difference of the two surfaces of the semiconductor refrigerating sheet is improved, and the heat conduction effect is good.
The laser support is provided with a first opening, the first opening is used for exposing the wiring port of the laser, and the wiring operation of the wiring port of the laser by an operator is facilitated.
To sum up, such laser instrument heat abstractor connects gradually through laser instrument, semiconductor refrigeration piece, fin and dispels the heat, thereby first heat preservation cotton portion with keep warm cotton group can improve the two-sided temperature difference heat conduction effect good of semiconductor refrigeration piece, first opening exposes the wiring mouth of laser instrument, conveniently wiring to the laser instrument, have good heat insulating ability and heat conductivity.
Further, the laser heat sink includes a first bolt portion;
a threaded hole is preset in the laser;
the first bolt portion is matched with the threaded hole and sequentially penetrates through the laser, the laser support and the radiating fin.
Further, the laser holder includes a body;
the body comprises a first containing surface and a second containing surface which are vertical to each other, and one end of the first containing surface is connected with one end of the second containing surface;
the laser is placed on the first accommodating surface, and the second accommodating surface is one surface of the laser support between the radiating fin and the laser;
the first heat-preservation cotton part is embedded in the second accommodating surface.
Further, the laser bracket further comprises a first side plate and a second side plate;
the first side plate and the second side plate are respectively arranged on two sides of the laser;
the first side plate and the second side plate are respectively and simultaneously connected with the radiating fin, the laser and the body.
Further, the first side plate and the second side plate are respectively connected with the body through bolts.
Further, the heat insulation cotton group comprises a second heat insulation cotton part and a third heat insulation cotton part;
the second heat preservation cotton part is respectively arranged between the laser and the first side plate and between the laser and the second side plate;
the third heat preservation cotton part is arranged between the laser and the first accommodating surface.
Furthermore, the first accommodating surface and the third heat-preservation cotton part are provided with through holes, and the through holes are used for emitting laser by a laser.
Further, the laser heat sink includes a second bolt portion;
the second accommodating surface is in bolted connection with the radiating fins through second bolt parts.
Further, the first heat-preservation cotton part and the heat-preservation cotton group are both made of EVA foam.
Furthermore, the laser support and the radiating fins are made of aluminum.
The utility model discloses technical scheme has following advantage and beneficial effect at least:
1. the laser support is connected with the radiating fin, and the relative position of the laser and the radiating fin is fixed and the connection is stable through double connection;
2. the laser, the semiconductor refrigerating sheet and the radiating fin are sequentially connected for radiating;
3. the first heat-preservation cotton part and the heat-preservation cotton group jointly preserve heat of parts, which are easy to heat, of the laser, so that heat is gathered on the contact surface of the semiconductor refrigerating sheet and the laser, the temperature difference of the two surfaces of the semiconductor refrigerating sheet is improved, and the heat conduction effect is good;
4. the first opening exposes the wiring port of the laser, and wiring of the laser is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a first structure of a heat dissipation device for a laser according to an embodiment of the present invention;
fig. 2 is a second schematic structural view of a heat dissipation device for a laser according to an embodiment of the present invention;
fig. 3 is a third schematic structural view of the embodiment of the present invention.
Icon: 10-laser heat dissipation device, 100-heat dissipation sheet, 200-semiconductor refrigeration sheet, 300-laser support, 310-first opening, 320-body, 321-first accommodating surface, 322-second accommodating surface, 330-first side plate, 340-second side plate, 400-first heat preservation cotton part, 500-heat preservation cotton group, 510-second heat preservation cotton part, 520-third heat preservation cotton part, 521-through hole, 600-first bolt part, 700-second bolt part and 20-laser.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, the description is only for convenience of description and simplification, but the indication or suggestion that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus, cannot be understood as a limitation of the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not require that the components be absolutely horizontal or vertical, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a laser heat dissipation device 10 according to an embodiment of the present invention, specifically illustrating an overall structure of the laser heat dissipation device 10;
fig. 2 is a second schematic structural view of the laser heat dissipation device 10 according to an embodiment of the present invention, specifically showing a side-view cross-sectional view of the laser heat dissipation device 10, showing a schematic structural view of the first heat-insulating cotton portion 400, the third heat-insulating cotton portion 520, and the semiconductor refrigeration sheet 200 on the laser heat dissipation device 10;
fig. 3 is a third structural schematic diagram of the laser heat dissipation device 10 according to an embodiment of the present invention, specifically showing a top view of the laser heat dissipation device 10, and showing a partial cross-sectional view of the first bolt portion 600 and a partial cross-sectional view of the second bolt portion 700.
Referring to fig. 1 to 3, a heat dissipation device 10 for a laser includes a heat sink 100, a semiconductor cooling plate 200, a laser bracket 300, a first heat-insulating cotton section 400, and a heat-insulating cotton group 500. The heat sink 100 is connected to a laser holder 300, and the laser holder 300 is used for accommodating the laser 20. The heat insulating cotton group 500 is disposed between the laser 20 and the laser holder 300, and the first heat insulating cotton portion 400 is embedded in one surface of the laser holder 300 between the heat sink 100 and the laser 20. The laser 20 is connected with the heat sink 100 through bolts, the semiconductor refrigeration piece 200 is embedded in the first heat-preservation cotton part 400, one surface of the semiconductor refrigeration piece 200 is abutted to the laser 20, and the surface of the semiconductor refrigeration piece 200 away from the laser 20 is abutted to the heat sink 100. The laser holder 300 is provided with a first opening 310, and the first opening 310 is used for exposing the wiring port of the laser 20.
The inventor finds that the heat dissipation of the laser 20 is performed based on the mounting surface of the laser 20, and the problem that the mounting surface is not large enough exists, so that heat generated by the laser 20 during long-time operation cannot be released at any time, the risk that the laser 20 cannot operate due to overheating exists, and the normal operation and the service life of the laser 20 are affected.
The inventor invents a laser heat dissipation device 10, which comprises a heat dissipation sheet 100, a semiconductor refrigeration sheet 200, a laser bracket 300, a first heat insulation cotton part 400 and a heat insulation cotton group 500. The laser 20 is placed on the laser holder 300 and the laser 20 is also separately bolted to the heat sink 100 to form a positional fixation between the laser 20 and the heat sink 100.
In addition to the bolted connection of laser 20 and heat sink 100, one side of laser holder 300 is connected to heat sink 100 by means of bolts. The relative position of the laser 20 and the heat sink 100 is fixed through the double connection, and the connection is stable.
The heat insulation cotton group 500 is arranged between the laser 20 and the laser support 300, the first heat insulation cotton part 400 is embedded in one surface of the laser support 300 between the heat sink 100 and the laser 20, and the semiconductor refrigeration piece 200 is embedded in the first heat insulation cotton part 400. One side of the semiconductor refrigeration piece 200 is abutted with the laser 20, and the side of the semiconductor refrigeration piece 200 far away from the laser 20 is abutted with the radiating fin 100, so that the laser 20, the semiconductor refrigeration piece 200 and the radiating fin 100 are sequentially connected, and the laser 20 radiates heat through the semiconductor refrigeration piece 200 and the radiating fin 100. The first heat-preservation cotton part 400 and the heat-preservation cotton group 500 jointly preserve heat of parts, which are easy to heat, of the laser 20, heat is gathered on the contact surface of the semiconductor refrigerating sheet 200 and the laser 20, the temperature difference between the two surfaces of the semiconductor refrigerating sheet 200 is improved, and the heat conduction effect is good.
The laser bracket 300 is provided with a first opening 310, and the first opening 310 is used for exposing the wiring port of the laser 20, so that an operator can conveniently perform wiring operation on the wiring port of the laser 20.
In summary, the laser heat dissipation device 10 sequentially connects the laser 20, the semiconductor refrigeration piece 200 and the heat dissipation plate 100 for heat dissipation, the first heat insulation cotton part 400 and the heat insulation cotton group 500 can improve the temperature difference between the two sides of the semiconductor refrigeration piece 200, so that the heat conduction effect is good, the first opening 310 exposes the wiring port of the laser 20, the wiring of the laser 20 is facilitated, and the heat insulation performance and the heat conductivity are good.
Further, referring to fig. 1 and 3, the heat sink 10 of the laser includes a first bolt portion 600, and the laser 20 is preset with a threaded hole. The first bolt portion 600 is matched with the threaded hole, and the first bolt portion 600 sequentially penetrates through the laser 20, the laser holder 300 and the heat sink 100.
The first bolt portion 600 is screwed with the screw hole through the screw hole preset in the laser 20, and the laser 20 is fixed on the heat sink 100, wherein the first bolt portion 600 passes through a portion of the laser holder 300 between the laser 20 and the heat sink 100, thereby providing an effect that the laser 20, the laser holder 300, and the heat sink 100 are sequentially connected through the first bolt portion 600.
Further, referring to fig. 1 and 2, the laser holder 300 includes a body 320, the body 320 includes a first accommodating surface 321 and a second accommodating surface 322 perpendicular to each other, and one end of the first accommodating surface 321 is connected to one end of the second accommodating surface 322. The laser 20 is disposed on the first receiving surface 321, and the second receiving surface 322 is a surface of the laser holder 300 between the heat sink 100 and the laser 20. The first heat insulating cotton portion 400 is embedded in the second accommodating surface 322.
The first accommodating face 321 and the second accommodating face 322 form an L shape, the laser 20 is placed on the first accommodating face 321, and the second accommodating face 322 is disposed between the heat sink 100 and the laser 20. The first heat-insulating cotton section 400 is embedded in the second accommodating surface 322, and the semiconductor chilling plate 200 is embedded in the second accommodating surface 322 on the basis that the semiconductor chilling plate 200 is embedded in the first heat-insulating cotton section 400. One surface of the semiconductor cooling plate 200 abuts against the laser 20, and one surface of the semiconductor cooling plate 200 away from the laser 20 abuts against the heat sink 100, so that the laser 20 radiates heat by transferring the heat to the heat sink 100 through the semiconductor cooling plate 200.
At this time, the first bolt portion 600 is inserted through the laser 20, the second receiving surface 322, and the heat sink 100 in this order.
Further, referring to fig. 1, the laser holder 300 further includes a first side plate 330 and a second side plate 340. The first side plate 330 and the second side plate 340 are respectively disposed at two sides of the laser 20, and the first side plate 330 and the second side plate 340 are respectively connected to the heat sink 100, the laser 20, and the body 320.
The first side plate 330 and the second side plate 340 and the first accommodating surface 321 and the second accommodating surface 322 of the body 320 form the laser holder 300. Specifically, the laser 20 is placed on the first accommodating surface 321, a certain gap exists between the first side plate 330 and the laser 20, and a certain gap also exists between the second side plate 340 and the laser 20.
Further, referring to fig. 1 and 3, the first side plate 330 and the second side plate 340 are respectively connected to the body 320 by bolts. Fig. 3 shows a partial cross-sectional view of the bolted connection of the second side plate 340 with the body 320. Referring to fig. 1, the first side plate 330 is respectively bolted to the first receiving surface 321 and the second receiving surface 322 of the body 320, and correspondingly, the second side plate 340 is respectively bolted to the first receiving surface 321 and the second receiving surface 322 of the body 320, so as to improve the overall stability of the laser holder 300.
Further, referring to fig. 1 and 2, the insulation cotton group 500 includes a second insulation cotton portion 510 and a third insulation cotton portion 520. The second thermal insulation cotton portion 510 is respectively disposed between the laser 20 and the first side plate 330, and between the laser 20 and the second side plate 340. The third thermal insulation cotton part 520 is disposed between the laser 20 and the first accommodating surface 321.
The laser 20, together with the first side plate 330 and the second side plate 340, respectively clamps the second thermal insulation cotton portion 510, and the laser 20 is placed on the first accommodating surface 321 through the third thermal insulation cotton portion 520, and also plays a role in fixing the third thermal insulation cotton portion 520. The cotton portion 510 of second heat preservation, the cotton portion 520 of third heat preservation and the cotton portion 400 combined action of first heat preservation realize keeping warm to let the heat gathering in the face of semiconductor refrigeration piece 200 with the contact of laser instrument 20, improve the temperature difference of the two sides of semiconductor refrigeration piece 200, heat conduction effect is good.
Further, referring to fig. 2, the first accommodating surface 321 and the third thermal insulation cotton part 520 are provided with through holes 521, and the through holes 521 are used for the laser 20 to emit laser. The laser port of the laser 20 faces the through hole 521.
Further, referring to fig. 1, the laser heat sink 10 includes a second bolt portion 700, and the second accommodating surface 322 and the heat sink 100 are bolted through the second bolt portion 700.
The second receiving surface 322 of the body 320 of the laser holder 300 is bolted to the heat sink 100 by the second bolt 700, which is convenient to install and easy to detach.
Further, the first heat-insulating cotton section 400 and the heat-insulating cotton group 500 are both made of EVA foam.
In this embodiment, the first heat-insulating cotton section 400 and the heat-insulating cotton group 500 made of EVA foam are selected. The EVA foam has the antistatic property, is environment-friendly, has good heat insulation effect and good buffering and anti-seismic performance. The first heat insulating cotton section 400 and the heat insulating cotton group 500 can be stably fixed to the laser heat sink 10 due to their excellent elastic properties.
Further, the laser holder 300 and the heat sink 100 are made of aluminum. The texture is light, and the installation of being convenient for is dismantled.
The utility model discloses technical scheme has following advantage and beneficial effect at least:
1. relative to the bolted connection of the laser 20 and the heat sink 100, the laser bracket 300 is connected with the heat sink 100, and the relative position of the laser 20 and the heat sink 100 is fixed and the connection is stable through double connection;
2. the laser 20, the semiconductor refrigerating sheet 200 and the radiating sheet 100 are sequentially connected for radiating;
3. the first heat insulation cotton part 400 and the heat insulation cotton group 500 jointly insulate the parts of the laser 20, which are easy to heat, so that heat is gathered on the contact surface of the semiconductor chilling plate 200 and the laser 20, the temperature difference between the two surfaces of the semiconductor chilling plate 200 is improved, and the heat conduction effect is good;
4. the first opening 310 exposes a wiring port of the laser 20, so that wiring of the laser 20 is facilitated;
5. the first heat-insulating cotton part 400 made of the EVA foam and the heat-insulating cotton group 500 have good heat-insulating and shock-resistant properties, and can be stably fixed to the laser heat sink 10;
6. the texture is light, and the installation is dismantled simply.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a laser instrument heat abstractor which characterized in that:
the device comprises a radiating fin, a semiconductor refrigerating fin, a laser bracket, a first heat-preservation cotton part and a heat-preservation cotton group;
the radiating fin is connected with the laser support, and the laser support is used for accommodating a laser;
the heat insulation cotton group is arranged between the laser and the laser bracket;
the first heat-preservation cotton part is embedded in one surface of the laser support between the radiating fin and the laser;
the laser is connected with the radiating fin through bolts;
the semiconductor refrigeration piece is embedded in the first heat-preservation cotton part, one surface of the semiconductor refrigeration piece is abutted with the laser, and the surface of the semiconductor refrigeration piece, far away from the laser, is abutted with the radiating fin;
the laser support is provided with a first opening, and the first opening is used for exposing the wiring port of the laser.
2. The laser heat sink of claim 1, wherein:
the laser heat sink includes a first bolt portion;
a threaded hole is preset in the laser;
the first bolt portion is matched with the threaded hole and sequentially penetrates through the laser, the laser support and the radiating fin.
3. The laser heat sink of claim 1, wherein:
the laser mount includes a body;
the body comprises a first accommodating surface and a second accommodating surface which are vertical to each other, and one end of the first accommodating surface is connected with one end of the second accommodating surface;
the laser is placed on the first accommodating surface, and the second accommodating surface is one surface of the laser support between the radiating fin and the laser;
the first heat-preservation cotton part is embedded in the second accommodating surface.
4. The laser heat sink of claim 3, wherein:
the laser bracket further comprises a first side plate and a second side plate;
the first side plate and the second side plate are respectively arranged on two sides of the laser;
the first side plate and the second side plate are connected with the radiating fin, the laser and the body simultaneously respectively.
5. The laser heat sink of claim 4, wherein:
the first side plate and the second side plate are respectively connected with the body through bolts.
6. The laser heat sink of claim 4, wherein:
the heat insulation cotton group comprises a second heat insulation cotton part and a third heat insulation cotton part;
the second heat preservation cotton part is arranged between the laser and the first side plate and between the laser and the second side plate respectively;
the third heat preservation cotton part is arranged between the laser and the first accommodating face.
7. The laser heat sink of claim 6, wherein:
the first containing surface and the third heat-preservation cotton part are provided with through holes, and the through holes are used for the laser to emit laser.
8. The laser heat sink of claim 3, wherein:
the laser heat sink includes a second bolt portion;
the second accommodating surface and the heat sink are bolted by the second bolt portion.
9. The laser heat sink of claim 1, wherein:
the first heat-preservation cotton part and the heat-preservation cotton group are both made of EVA foam.
10. The laser heat sink of claim 1, wherein:
the laser support and the radiating fins are made of aluminum materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920980537.7U CN210430406U (en) | 2019-06-26 | 2019-06-26 | Laser heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920980537.7U CN210430406U (en) | 2019-06-26 | 2019-06-26 | Laser heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210430406U true CN210430406U (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920980537.7U Active CN210430406U (en) | 2019-06-26 | 2019-06-26 | Laser heat abstractor |
Country Status (1)
| Country | Link |
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| CN (1) | CN210430406U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115037865A (en) * | 2022-08-12 | 2022-09-09 | 北京中科飞鸿科技股份有限公司 | Reconnaissance device with anti-invasion laser striking function |
| WO2023097497A1 (en) * | 2021-11-30 | 2023-06-08 | 华为技术有限公司 | Light source module, detection device and terminal device |
-
2019
- 2019-06-26 CN CN201920980537.7U patent/CN210430406U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023097497A1 (en) * | 2021-11-30 | 2023-06-08 | 华为技术有限公司 | Light source module, detection device and terminal device |
| CN115037865A (en) * | 2022-08-12 | 2022-09-09 | 北京中科飞鸿科技股份有限公司 | Reconnaissance device with anti-invasion laser striking function |
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Address after: Room 1105, 11 / F, block 3-2b, 88 pubin Avenue, Jiangpu street, Pukou District, Nanjing City, Jiangsu Province, 210000 Patentee after: NANJING SUPERYEARS GENE TECHNOLOGY Co.,Ltd. Address before: 210000 Pukou Nanjing District, Nanjing, Jiangsu, Nanjing Zijin (Pukou) science and technology entrepreneurship special community 99 Patentee before: NANJING SUPERYEARS GENE TECHNOLOGY Co.,Ltd. |
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