CN210429755U - Wafer etching device - Google Patents
Wafer etching device Download PDFInfo
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- CN210429755U CN210429755U CN201921609245.9U CN201921609245U CN210429755U CN 210429755 U CN210429755 U CN 210429755U CN 201921609245 U CN201921609245 U CN 201921609245U CN 210429755 U CN210429755 U CN 210429755U
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Abstract
The utility model relates to a wafer production technical field especially relates to a wafer corrosion device, including controller, work box, wafer mount and the liquid medicine pump package and the washing unit of being connected with the controller electricity, the wafer mount sets up in the work box, and the liquid medicine pump package is connected with the work box, and the leakage fluid dram has been seted up to the work box, and washing unit installs in the work box. On the one hand, the utility model discloses help avoiding the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand avoids the relatively poor problem of quality stability that manual operation caused, improves the uniformity of product, improves wafer production's degree of automation simultaneously, improves production efficiency.
Description
Technical Field
The utility model relates to a wafer production technical field especially relates to a wafer corrosion device.
Background
In the prior art, after grinding, a wafer needs to be corroded by a corrosive liquid, and the main purposes are to eliminate the residual stress on the surface of the wafer and reduce the thickness of a damaged layer, so that preparation is made for the next step of polishing.
The flow of current operation all is through the manual work to place the jam box of placing a plurality of quantity wafers in the box that fills up the etchant, and operating personnel makes the etchant submergence wafer, keeps submergence 4 minutes, and accomplishes the corruption back, need follow the etchant and take out immediately with the wafer periphery of flushing the jam box of flush fluid 1 minute, the action of above-mentioned corruption and washing need repeat many times, because present manual operation wafer corrosion process, the main problem of existence has:
1. the operation time is long, the single corrosion cycle operation needs 20 minutes, the personnel are easy to fatigue, and the time and the labor are consumed in batch production;
2. the corrosive liquid is corrosive, and the manual operation has certain harm to the body of a worker;
3. due to the fact that the subjective difference and the proficiency of different workers are different in manual operation, the accuracy of the operation process is low, the consistency of the production quality of the wafer is poor, the quality inspection qualified rate is large in fluctuation, and the rejection rate is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a help realizing that the wafer corrodes the automation, reduce artifical the input, the guarantee workman is healthy, improves a wafer corrosion unit of product production quality.
In order to realize the above object, the utility model provides a wafer corrosion device, including controller, work box, wafer mount and the liquid medicine pump package and the washing unit be connected with the controller electricity, the wafer mount sets up and is used for the fixed wafer of putting into the work box in the work box, the liquid medicine pump package is connected with the work box and is used for to work box pump sending liquid medicine, the leakage fluid dram has been seted up to the work box and is used for the discharge liquid medicine, washing unit installs and is used for spraying flush fluid washing wafer to the wafer in the work box.
Optionally, the flushing device includes a flushing pump and a plurality of spray pipes arranged on the work box and used for spraying flushing liquid to the wafers in the work box, and the flushing pump is electrically connected with the controller.
Optionally, the work box is provided with a box cover, and the plurality of spray pipes are arranged on the inner side of the box cover.
Optionally, the plurality of spray pipes are arranged in parallel and uniformly along the length direction of the box cover.
Optionally, the flushing device further comprises a flushing liquid tank, and the flushing liquid tank is communicated with the spray pipe through the flushing pump.
Optionally, the medical liquid storage box is used for storing medical liquid, and the working box is communicated with the medical liquid storage box through a medical liquid pump set and a liquid outlet.
Optionally, still include liquid medicine proportioning device, liquid medicine proportioning device include a plurality of head tanks and with a plurality of measuring pumps that head tank quantity corresponds, the head tank passes through the measuring pump is connected with the liquid medicine case, the measuring pump is connected with the controller electricity.
Optionally, a liquid level sensor for detecting the liquid level of the liquid medicine is arranged in the working box, and the liquid level sensor is in communication connection with the controller.
Implement the utility model discloses an embodiment has following technological effect:
the utility model discloses a place the wafer on the wafer mount, and let in the liquid medicine in to the work box through the liquid medicine pump package, make the liquid medicine soak the wafer, corrode the wafer surface, corrode the completion back, pass through the leakage fluid dram discharge back with the liquid medicine, washing unit sprays the liquid medicine that the flush fluid dilutes immediately and remains at the wafer surface, avoid the liquid medicine to continue to corrode the wafer, the letting in and washing of wafer liquid medicine need not manual operation, the accessible controller is set for and is carried out work, on the one hand, avoid the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand, avoid the relatively poor problem of quality stability that manual operation caused, improve the uniformity of product, improve the degree of automation of wafer production simultaneously, and.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
fig. 2 is a schematic view of a part of the structure in the preferred embodiment of the present invention.
Description of reference numerals:
1. the device comprises a controller, 2, a working box, 21, a liquid discharge port, 22, a box cover, 3, a wafer fixing frame, 4, a liquid medicine pump set, 5, a flushing device, 51, a flushing pump, 52, a spray pipe, 53, a flushing liquid box, 6, a liquid medicine box, 7 and a liquid medicine proportioning device.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 and 2, the embodiment provides a wafer etching device, which includes a controller 1, a work box 2, a wafer fixing frame 3, and a liquid medicine pump set 4 and a flushing device 5 electrically connected to the controller 1, wherein the wafer fixing frame 3 is disposed in the work box 2 and used for fixing a wafer placed in the work box 2, the liquid medicine pump set 4 is connected to the work box 2 and used for pumping liquid medicine to the work box 2, the work box 2 is provided with a liquid discharge port 21 for discharging liquid medicine, and the flushing device 5 is mounted on the work box 2 and used for spraying flushing liquid to the wafer to clean the wafer. The utility model discloses a place the wafer on wafer mount 3, and let in the liquid medicine through liquid medicine pump package 4 in to work box 2, make the liquid medicine soak the wafer, corrode the wafer surface, corrode and accomplish the back, pass through leakage fluid dram 21 discharge back with the liquid medicine, washing unit 5 sprays the flush fluid immediately and dilutes the liquid medicine of remaining on the wafer surface, avoid the liquid medicine to continue to corrode the wafer, the letting in and washing of wafer liquid medicine need not manual operation, accessible controller 1 sets for and carries out work, on the one hand, avoid the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand, avoid the relatively poor problem of quality stability that manual operation caused, improve the uniformity of product, improve the degree of automation of wafer production simultaneously, and improve the production efficiency.
Wherein, washing unit 5 includes flush pump 51 and a plurality of sets up and is used for the shower 52 to the wafer injection flush fluid in work box 2 on work box 2, flush pump 51 is connected with 1 electricity of controller, through 1 work of control flush pump 51 of controller, the blowout in the pump sending flush fluid follow shower 52, realize the washing of wafer, convenient and fast, in addition, shower 52 spun flush fluid distributes comparatively evenly, help improving the abluent degree of consistency of wafer surface, guarantee the uniformity of wafer quality.
Referring to fig. 2, further, the working box 2 is provided with a box cover 22, and the plurality of spraying pipes 52 are disposed inside the box cover 22, on one hand, the box cover 22 can be covered on the working box 2, so that the corrosion process of the wafer is performed in a sealed environment, occupational hazards caused by corrosive harmful gases generated in the corrosion process of the wafer are prevented, and the use safety of the equipment is improved.
Wherein, a plurality of shower pipes 52 in this embodiment are arranged in parallel and evenly along the length direction of the case lid 22, so that the rinse liquid sprayed from the shower pipes 52 can further flush the wafer in the work box 2 evenly, thereby improving the flushing quality.
Referring to fig. 1, the flushing device 5 of this embodiment further includes a flushing liquid tank 53, the flushing liquid tank 53 is communicated with the spray pipe 52 through the flushing pump 51, the flushing liquid tank 53 is used for storing the flushing liquid or pure water to be configured in advance, the flushing liquid is supplied in time, and the influence of factors such as water cut-off on the production efficiency is avoided.
Further, still including the liquid medicine case 6 that is used for depositing the liquid medicine, work box 2 communicates with liquid medicine case 6 through liquid medicine pump package 4 and leakage fluid dram 21 respectively, on the one hand, when accomplishing a circulation duty cycle, work box 2 discharges the liquid medicine through leakage fluid dram 21 and keeps in liquid medicine case 6, when the liquid medicine in liquid medicine case 6 can cyclic utilization, accessible liquid medicine pump package 4 goes into the liquid medicine to work box 2 pump in the liquid medicine case 6, carry out next duty cycle of corruption, realize the cyclic utilization of liquid medicine, the cost is reduced consumes, pollution abatement, on the other hand, liquid medicine case 6 is connected with the blow off pipe and is used for discharging the liquid medicine that can't continue to use, conveniently change the liquid medicine.
Further, still include liquid medicine proportioning device 7, liquid medicine proportioning device 7 includes a plurality of head tanks and a plurality of measuring pumps that correspond with head tank quantity, the head tank passes through the measuring pump and is connected with spray tank 6, the measuring pump is connected with 1 electricity of controller, switch through 1 control measuring pump of controller, the medicine that realizes letting in preset proportion in to spray tank 6 automatically dispenses, the efficiency and the precision of dispensing have been improved, artificial unstable factor has been eliminated, the efficiency of dispensing is improved, and in the use, can dispense immediately as required, reduce the waste that too much dispenses and cause, the inefficiency problem of dispensing many times when dispensing few quantity and causing is avoided.
Wherein, for the standard use of standardizing the liquid medicine quantity, be equipped with the liquid level inductor that is used for detecting liquid medicine liquid level height in the work box 2, the liquid level inductor is connected with 1 communication of controller, thereby detect the volume that the liquid medicine lets in work box 2 through the liquid level inductor, conveniently predetermine the liquid medicine quantity simultaneously, when the liquid level inductor detects liquid medicine liquid level arrival and predetermines the position, feedback signal is to controller 1, make 1 control liquid medicine pump package 4 stop work of controller, further improve the degree of automation that the device used.
The controller 1 in this embodiment may be a plc logic controller, and one of ordinary skill in the art would know the prior art and would be programmed to implement logic control of the liquid drug pump set and the flushing device by means of conventional techniques.
To sum up, the utility model discloses a place the wafer on wafer mount 3, and let in the liquid medicine through liquid medicine pump package 4 in to work box 2, make the liquid medicine soak the wafer, corrode the wafer surface, corrode the completion back, pass through leakage fluid dram 21 discharge back with the liquid medicine, washing unit 5 sprays the flush fluid immediately and dilutes the liquid medicine of remaining on the wafer surface, avoid the liquid medicine to continue to corrode the wafer, the letting in and washing of wafer liquid medicine need not manual operation, accessible controller 1 sets for and carries out work, on the one hand, avoid the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand, avoid the relatively poor problem of quality stability that manual operation caused, improve the uniformity of product, improve wafer production's degree of automation simultaneously, and the production efficiency is improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer corrosion device, its characterized in that includes controller, work box, wafer mount and the liquid medicine pump package and the washing unit that are connected with the controller electricity, the wafer mount sets up and is used for the fixed wafer of putting into the work box in the work box, the liquid medicine pump package is connected with the work box and is used for to work box pump sending liquid medicine, the liquid discharge port has been seted up to the work box and is used for discharging the liquid medicine, washing unit installs and is used for spraying the flush fluid to wash the wafer in the work box.
2. The wafer etching apparatus of claim 1, wherein the rinsing device comprises a rinsing pump and a plurality of shower pipes disposed on the work box for spraying a rinsing liquid to the wafer in the work box, and the rinsing pump is electrically connected to the controller.
3. The wafer etching apparatus of claim 2, wherein the work box is provided with a box cover, and the plurality of shower pipes are disposed inside the box cover.
4. The wafer etching apparatus of claim 3, wherein the plurality of shower pipes are arranged in parallel and uniformly along the length of the box cover.
5. The wafer etching apparatus of claim 2, wherein the rinse apparatus further comprises a rinse tank in communication with a shower via the rinse pump.
6. The wafer etching apparatus according to claim 1, further comprising a chemical tank for storing a chemical, wherein the work tank is communicated with the chemical tank through a chemical pump unit and a drain port, respectively.
7. The wafer etching device according to claim 1, further comprising a chemical solution proportioning device, wherein the chemical solution proportioning device comprises a plurality of material tanks and a plurality of metering pumps corresponding to the number of the material tanks, the material tanks are connected to the chemical solution tank through the metering pumps, and the metering pumps are electrically connected to the controller.
8. The wafer etching apparatus as claimed in claim 1, wherein a liquid level sensor is disposed in the chamber for detecting a liquid level of the chemical solution, and the liquid level sensor is in communication with the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921609245.9U CN210429755U (en) | 2019-09-25 | 2019-09-25 | Wafer etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921609245.9U CN210429755U (en) | 2019-09-25 | 2019-09-25 | Wafer etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210429755U true CN210429755U (en) | 2020-04-28 |
Family
ID=70367676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921609245.9U Active CN210429755U (en) | 2019-09-25 | 2019-09-25 | Wafer etching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210429755U (en) |
-
2019
- 2019-09-25 CN CN201921609245.9U patent/CN210429755U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Guangdong lead Microelectronics Technology Co.,Ltd. Assignor: FIRST SEMICONDUCTOR MATERIALS Co.,Ltd. Contract record no.: X2023990000449 Denomination of utility model: A wafer etching device Granted publication date: 20200428 License type: Common License Record date: 20230505 |
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| EE01 | Entry into force of recordation of patent licensing contract |