CN210403671U - Automatic wafer etching spraying equipment - Google Patents

Abstract

The utility model relates to a wafer production technical field especially relates to a wafer automatic corrosion spraying apparatus, which comprises a controller, the work box, the wafer mount and the liquid medicine pump package of being connected with the controller electricity, flushing device and washing unit, the wafer mount sets up and is used for the fixed wafer of putting into the work box in the work box, the liquid medicine pump package is connected with the work box and is used for to the work box in pump sending liquid medicine, the liquid discharge port has been seted up to the work box and has been used for the discharge liquid medicine, flushing device installs and forms the liquid medicine flow in the liquid medicine that the work box is used for making and erodees the wafer in the work box flows, washing unit installs and is used for spraying flush fluid. On the one hand, avoid the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand, avoid the relatively poor problem of stability of quality that manual operation caused, improve the uniformity of product, improve wafer production's degree of automation simultaneously, improve production efficiency.

Description

Automatic wafer etching spraying equipment

Technical Field

The utility model relates to a wafer production technical field especially relates to a wafer automatic corrosion spraying equipment.

Background

In the prior art, after grinding, a wafer needs to be corroded by a corrosive liquid, and the main purposes are to eliminate the residual stress on the surface of the wafer and reduce the thickness of a damaged layer, so that preparation is made for the next step of polishing.

The flow of current operation is all through the manual work to place the jam box of placing a plurality of quantity wafers in the box that fills with the etchant, operating personnel makes the etchant submergence wafer, and be about 30 jiaos of horizontal 45 jiaos luffing motion downwards with the jam box, need repeat about 4 minutes, and accomplish the corruption back, need take out from the etchant and immediately wash the wafer periphery 1 minute of jam box with the flush fluid, the action of above-mentioned corruption and washing need be repeated many times, because manual operation wafer corrosion process at present, the main problem of existence has:

1. the operation time is long, the single corrosion cycle operation needs 20 minutes, the personnel are easy to fatigue, and the time and the labor are consumed in batch production;

2. the corrosive liquid is corrosive, and the manual operation has certain harm risk to the body of workers;

3. due to the fact that the subjective difference and the proficiency of different workers are different in manual operation, the accuracy of the operation process is low, the consistency of the production quality of the wafer is poor, the quality inspection qualified rate is large in fluctuation, and the rejection rate is high.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a help realizing that the wafer corrodes the automation, reduce artifical the input, the guarantee workman is healthy, improves a wafer automatic corrosion spraying apparatus of product production quality.

In order to realize the above-mentioned purpose, the utility model provides a wafer automatic corrosion spraying apparatus, including controller, work box, wafer mount and the liquid medicine pump package, flushing device and the washing unit of being connected with the controller electricity, the wafer mount sets up and is used for the fixed wafer of putting into the work box in the work box, the liquid medicine pump package is connected with the work box and is used for to the work box in pump sending liquid medicine, the leakage fluid dram has been seted up to the work box and is used for the discharge liquid medicine, flushing device installs and forms the liquid medicine flow in the liquid medicine that the work box is used for making and erodees the wafer in the work box flows, washing unit installs and is used for spraying flush fluid washing wafer to the wafer in.

Optionally, the flushing device includes one end open-ended shower and is used for carrying liquid medicine or flush fluid to the shower to erode the pump package, a plurality of spraying mouths have been seted up along the circumferencial direction to the shower, the spraying mouth extends along shower axial direction, it is connected with the transfer line to erode the pump package, the shower just rotates with the transfer line intercommunication and is connected.

Optionally, the liquid inlet end of the scouring pump set is connected into the working box, and the liquid outlet end of the scouring pump set is communicated with the spray pipe through a liquid conveying pipe.

Optionally, the spraying opening is arranged in an arc shape outwards along the radial direction of the spraying pipe.

Optionally, the flushing device further comprises a liquid guide pipe, the liquid guide pipe is communicated with the liquid conveying pipe, the liquid guide pipe is sleeved into the spray pipe from the opening end of the spray pipe and forms a spray gap with the spray pipe, the spray pipe is provided with an inner cavity, a driving part for driving the spray pipe to rotate under impact is arranged on one side wall of the inner cavity opposite to the opening end of the liquid guide pipe, and the liquid guide pipe, the inner cavity, the spray gap and the spray opening are sequentially communicated.

Optionally, the inner cavity is provided with a stabilizing frame, and the stabilizing frame is provided with a flow guide inclined plane for diffusing the liquid sprayed from the liquid guide tube to the periphery of the inner cavity through the flow guide inclined plane when the liquid impacts the inner wall of the inner cavity and then reflects.

Optionally, the stabilizing frame is provided with a tapered sleeve, the outer side surface of the tapered sleeve forms the diversion inclined plane, and the liquid outlet end of the liquid guide tube is arranged in the tapered sleeve.

Optionally, the flushing device further comprises a driving mechanism for driving the shower pipe to rotate circumferentially.

Optionally, the driving mechanism includes a first adsorption part, a second adsorption part, a swinging magnet and a power supply, the first adsorption part and the second adsorption part are respectively arranged at two ends of the swinging magnet, the swinging magnet is fixedly connected with the spray pipe and swings around the axis of the spray pipe, the power supply is respectively electrically connected with the first adsorption part and the second adsorption part, and the controller is in communication connection with the power supply.

Optionally, the device further comprises a flushing liquid tank, and the flushing liquid tank is connected with the spray pipe through a flushing pump set.

Optionally, the medical liquid storage box is used for storing medical liquid, and the working box is communicated with the medical liquid storage box through a medical liquid pump set and a liquid outlet.

Optionally, still include liquid medicine proportioning device, liquid medicine proportioning device include a plurality of head tanks and with a plurality of measuring pumps that head tank quantity corresponds, the head tank passes through the measuring pump and is connected with the liquid medicine case, the measuring pump is connected with the controller electricity.

Optionally, the flushing device includes a flushing pump and a plurality of flushing pipes arranged on the work box and used for spraying flushing liquid to the wafers in the work box, and the flushing pump is electrically connected with the controller.

Implement the utility model discloses an embodiment has following technological effect:

the utility model discloses a place the wafer on the wafer mount, and let in the liquid medicine in to the work box through the liquid medicine pump package, submerge the wafer when the liquid medicine, form the liquid medicine stream through the washing device disturbance liquid medicine and erode the wafer, realize the corruption to the wafer surface, corrode after accomplishing, arrange the liquid medicine to the liquid medicine case through the leakage fluid dram, close the leakage fluid dram after, washing unit sprays the flush fluid immediately and dilutes the liquid medicine of remaining on the wafer surface, avoid the liquid medicine to continue to corrode the wafer, the wafer liquid medicine erodees and washes and need not manual operation, the accessible controller is set for and is worked, on the one hand, avoid the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand, avoid the relatively poor problem of quality stability that manual operation caused, improve the uniformity of product, improve the degree.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment 1 of the present invention;

FIG. 2 is a schematic structural view of a working box and a flushing device according to the preferred embodiment of the present invention 1;

FIG. 3 is a schematic view of a part of the structure of a flushing device according to the preferred embodiment 1 of the present invention;

FIG. 4 is an exploded view of a part of the structure of a flushing device according to the preferred embodiment 1 of the present invention;

FIG. 5 is a sectional view showing a part of the structure of a flushing device according to a preferred embodiment 1 of the present invention;

fig. 6 is a schematic structural view of a stabilizer according to a preferred embodiment 1 of the present invention;

fig. 7 is a schematic cross-sectional view of a shower pipe according to a preferred embodiment 1 of the present invention;

FIG. 8 is an exploded view of a part of the structure of a flushing device according to a preferred embodiment of the present invention 2;

FIG. 9 is a sectional view showing a part of the structure of a flushing device according to a preferred embodiment 2 of the present invention;

fig. 10 is a schematic cross-sectional view of a shower pipe according to a preferred embodiment 2 of the present invention;

fig. 11 is a schematic structural view of a driving mechanism according to preferred embodiment 2 of the present invention.

Description of reference numerals:

1. the device comprises a controller, 2, a working box, 21, a liquid discharge port, 22, a box cover, 3, a wafer fixing frame, 4, a liquid medicine pump set, 5, a flushing device, 51, a spray pipe, 511, a spray port, 512, an inner cavity, 513, a vortex bulge, 514, a guide inclined plane, 52, a flushing pump set, 53, a liquid guide pipe, 531, a roller bearing, 54, a spray gap, 55, a stabilizing frame, 551, a taper sleeve, 552, a flow guide inclined plane, 553, a supporting arm, 554, a jointing plate, 56, a driving mechanism, 561, a swinging magnet, 562, a first suction part, 563, a second suction part, 564, a power supply, 6, a flushing device, 61, a flushing pipe, 7, a flushing liquid box, 8, a liquid medicine box, 9 and a liquid medicine proportioning device.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Example 1:

referring to fig. 1-7, the embodiment provides a wafer automatic corrosion spraying apparatus, including controller 1, work box 2, wafer mount 3 and the liquid medicine pump package 4 that is connected with controller 1 electricity, flushing device 5 and washing unit 6, wafer mount 3 sets up and is used for the fixed wafer of putting into work box 2 in work box 2, liquid medicine pump package 4 is connected with work box 2 and is used for pumping liquid medicine in work box 2, work box 2 has seted up leakage fluid dram 21 and is used for discharging the liquid medicine, flushing device 5 is installed in work box 2 and is used for making the liquid medicine of work box 2 flow and form the liquid medicine flow and erode the wafer, washing unit 6 is installed in work box 2 and is used for spraying the washing liquid to the wafer.

The utility model discloses a place the wafer on wafer mount 3, and let in the liquid medicine through liquid medicine pump package 4 to work box 2, when the liquid medicine soaks the wafer, it forms the liquid medicine flow and erodees the wafer to disturb the liquid medicine through scouring device 5, realize the corruption to the wafer surface, after the corruption is accomplished, arrange the liquid medicine to the liquid medicine case through the leakage fluid dram, after closing the leakage fluid dram, flushing device 6 sprays the flush fluid immediately and dilutes the liquid medicine that remains on the wafer surface, wherein, the flush fluid in this embodiment is pure water, thereby avoid the liquid medicine to continue to corrode the wafer, wafer liquid medicine erodees and washes and need not manual operation, can set for to work through controller 1, on the one hand, avoid the liquid medicine to cause the injury to workman's health, reduce artifical the input simultaneously, on the other hand, avoid the relatively poor problem of quality stability that manual operation caused, improve the uniformity of product, the production efficiency is improved.

The controller 1 in this embodiment may be a plc logic controller, and one of ordinary skill in the art will appreciate the prior art and use conventional techniques in the art to program the logic control of the drug pump set 4, the flushing device 5 and the flushing device 6.

Referring to fig. 2 to 7, in particular, the flushing device 5 includes a spraying pipe 51 with an opening at one end and a flushing pump set 52 for delivering a liquid medicine or a flushing liquid to the spraying pipe 51, the spraying pipe 51 is provided with five spraying ports 511 along a circumferential direction, the spraying ports 511 extend along an axial direction of the spraying pipe 51, the flushing pump set 52 is connected with a liquid conveying pipe, the spraying pipe 51 is communicated with the liquid conveying pipe and is rotatably connected with the liquid conveying pipe, in the embodiment, the liquid medicine in the work box 2 immerses the wafer and the spraying pipe 51, when the flushing pump set 52 pumps the liquid medicine to the spraying pipe 51, the spraying pipe 51 is sprayed out from the spraying ports 511, when the spraying pipe 51 rotates, the liquid medicine sprayed out from the spraying ports 511 drives the liquid medicine in the work box 2 to form a liquid medicine spraying flow of 360 degrees, and the liquid medicine flow acts on the;

in addition, the spraying pipe 51 is arranged to enable the liquid medicine to form liquid medicine flow to wash the wafer, the wafer is kept static in the process, and the stability of the wafer in the corrosion process is further improved.

Referring to fig. 1, further, the liquid inlet end of the flushing pump unit 52 is connected to the inside of the working box 2, and the liquid outlet end of the flushing pump unit 52 is communicated with the spray pipe 51 through a liquid conveying pipe, so that the liquid medicine sprayed from the spray pipe 51 and the liquid medicine after corroding the wafer can well form self-circulation in the working box 2, the problem that the corrosion time is not easy to control due to uneven concentration of the liquid medicine in the prior art is solved, and the quality consistency of wafer production and the production efficiency are improved.

Referring to fig. 7, the spray opening 511 in this embodiment is disposed outward in an arc shape along the radial direction of the spray pipe 51, so that in the spraying process of the spray opening 511, the pressure of the liquid flowing from the spray opening 511 acts on the spray pipe 51 to drive the spray pipe 51 to rotate circumferentially, and the spray pipe 51 may be driven to rotate without a device.

Further, referring to fig. 4 and 5, the flushing device 5 further includes a liquid guide tube 53, the liquid guide tube 53 is communicated with the liquid conveying tube and rotatably connected, the liquid guide tube 53 is sleeved into the shower tube 51 from the opening end of the shower tube 51 and forms a spraying gap 54 with the shower tube 51, the shower tube 51 is provided with an inner cavity 512, a side wall of the inner cavity 512 opposite to the opening end of the liquid guide tube 53 is provided with a driving part for driving the shower tube 51 to rotate under impact, the driving part of the embodiment is a vortex projection 513 axially arranged around the shower tube 51, it can be understood that, based on the technical principle, a person skilled in the art can set the driving part as the vortex projection 513 or a vortex groove, the liquid guide tube 53, the inner cavity 512 and the spraying gap 54 are sequentially communicated with the spraying opening 511, and the liquid sprayed from the liquid guide tube 53 impacts the vortex projection 513 to push the shower tube 51 to rotate, thereby, the rotating stability of the spray pipe 51 is improved, the liquid reflected after impacting the vortex bulge 513 enters the spray gap 54 and is sprayed out from the spray opening 511, and the liquid flow speed in the spray gap 54 is high, so that when the liquid is sprayed out from the spray opening 511, the pressure of the liquid sprayed out from the spray opening 511 is further enhanced, the force for pushing the spray pipe 51 to rotate is enhanced, the liquid medicine in the working box 2 is conveniently driven to form 360-degree liquid medicine flow, and the wafer washing efficiency is improved.

In addition, the inner cavity 512 is provided with a guide inclined surface 514, and the guide inclined surface 514 is inclined toward the axial direction of the shower pipe 51 to further guide the liquid to the shower gap 54, thereby improving the stability of the liquid flow.

In this embodiment, the shower pipe 51 is connected to the liquid guide pipe 53 through the roller bearing 531, so that the starting resistance of the shower pipe 51 is small, and the shower pipe 51 can perform a shower operation in a quick response, and the roller bearing 531 in this embodiment is made of polytetrafluoroethylene, thereby preventing corrosion of the liquid medicine and prolonging the service life.

Referring to fig. 4-6, in the present embodiment, the stabilizing frame 55 is installed in the lumen 512, the stabilizing frame 55 is provided with a flow guiding inclined plane 552, specifically, the stabilizing frame 55 is provided with a tapered sleeve 551, the outer side surface of the tapered sleeve 551 forms the flow guiding inclined plane 552, the tapered sleeve 551 is disposed at the liquid outlet end of the liquid guide tube 53, on one hand, when the liquid sprayed from the liquid guide tube 53 hits the inner wall of the lumen 512 and is reflected, the liquid is diffused to the periphery of the lumen 512 through the flow guiding inclined plane 552, thereby avoiding the impact between the liquid reflected from the impacting lumen 512 and the liquid sprayed from the liquid guide tube 53 to generate large amplitude vibration and resonance, which is helpful for improving the flowing stability of the liquid medicine in the spraying process of the spraying tube 51, on the other hand, when the end with smaller inner diameter of the tapered sleeve 551, the pressure of the sprayed liquid is improved, so as to drive the shower pipe 51 to rotate. Wherein, a gap is arranged between the liquid outlet end of the liquid guide pipe 53 and the conical sleeve 551, so that the vibration and impurity hidden troubles caused by collision and abrasion between the stabilizing frame 55 and the liquid outlet end of the liquid guide pipe 53 when rotating are avoided, and the liquid sprayed by the spray pipe 51 is prevented from being unstable and mixed with impurities.

In addition, a plurality of supporting arms 553 are arranged in the circumferential direction of the conical sleeve 551, an abutting plate 554 used for abutting against the inner wall of the inner cavity is arranged at one end of the supporting arm 553 opposite to the conical sleeve 551, the abutting plate abuts against the inner wall of the inner cavity 512, the using stability of the conical sleeve 551 is improved, and the supporting arms 553 are light and thin guide plates in the embodiment and help to reduce the resistance of liquid flowing.

The two sets of flushing devices 5 are respectively arranged on the upper side and the lower side of the wafer fixing frame 3 for fixing the wafer, so that the wafer can be corroded in all directions.

Referring to fig. 1 and 2, further, the embodiment further includes a flushing liquid tank 7, the flushing liquid tank 7 is connected to the spraying pipe 51 through a flushing pump set 52, and after the spraying of the liquid medicine from the spraying pipe 51 corrodes the wafer, the flushing pump set 52 pumps the flushing liquid into the spraying pipe 51, so that the flushing liquid flow is sprayed by 360 degrees, and the wafer is cleaned.

This embodiment is still including the liquid medicine case 8 that is used for depositing the liquid medicine, work box 2 communicates with liquid medicine case 8 through liquid medicine pump package 4 and leakage fluid dram 21 respectively, on the one hand, when work box 2 discharges the liquid medicine, discharge the liquid medicine through leakage fluid dram 21 and keep in liquid medicine case 8, when the liquid medicine in liquid medicine case 8 can cyclic utilization, accessible liquid medicine pump package 4 is gone into the liquid medicine to work box 2 pump in the liquid medicine case 8, realize the cyclic utilization of liquid medicine, the cost is reduced consumes, pollution abatement, on the other hand, liquid medicine case 8 is connected with the blow off pipe and is used for discharging the liquid medicine that can't continue to use, conveniently change the liquid medicine.

Still include liquid medicine proportioning device 9, liquid medicine proportioning device 9 includes a plurality of head tanks and a plurality of measuring pumps that correspond with head tank quantity, the head tank passes through the measuring pump and is connected with liquid medicine case 8, the measuring pump is connected with 1 electricity of controller, switch through 1 control measuring pump of controller, the medicine that realizes letting in preset proportion in to liquid medicine case 8 automatically dispenses, the efficiency and the precision of dispensing have been improved, artificial unstable factor has been eliminated, the efficiency of dispensing is improved, and in the use, can dispense immediately as required, reduce the waste that too much dispenses and cause, the inefficiency problem of dispensing many times when dispensing few quantity and causing is avoided.

Further, washing unit 6 includes flush pump and a plurality of flushing pipes 61 that set up and be used for spraying the flush fluid to the wafer in work box 2 on work box 2, and the liquid outlet of a plurality of flushing pipes 61 is the dot matrix and arranges, evenly sprays the flush fluid, and the flush pump is connected with 1 electricity of controller, sprays the flush fluid cooperation with shower 51, improves the efficiency that the wafer corrodes the back of accomplishing and washes, dilutes fast and remain the liquid medicine on wafer surface, improves wafer production quality.

Wherein, work box 2 is equipped with case lid 22, and flush tube 61 sets up in case lid 22 inboard, and on the one hand, case lid 22 can be covered and locate work box 2, makes the corrosion process of wafer go on in sealed environment, prevents that the corrosive harmful gas that produces from corroding the in-process of wafer from causing occupational hazard, improves equipment safety in utilization.

Example 2:

referring to fig. 8-11, the difference between the embodiment and embodiment 1 is that the flushing device 5 of the embodiment further includes a driving mechanism 56 for driving the shower pipe 51 to rotate circumferentially, specifically, the driving mechanism 56 includes a first absorbing member 562, a second absorbing member 563, a swinging magnet 561 and a power supply 564, the first absorbing member 562 and the second absorbing member 563 are respectively disposed at two ends of the swinging magnet 561, the swinging magnet 561 is fixedly connected to the shower pipe 51 and swings around the axis of the shower pipe 51, the power supply 564 is electrically connected to the first absorbing member 561 and the second absorbing member 562 respectively, the controller 1 is connected to the power supply 564 in a communication manner, the controller 1 controls the power supply 564 to alternately "power on-off" to make the first absorbing member and the second absorbing member exchange and absorb the swinging magnet 561 so as to drive the shower pipe 51 to swing, the swinging angle of the shower pipe 51 is set to be 30-60 °, so that the liquid medicine is sprayed from the shower port 511 to form a liquid medicine flow to act on the wafer, the wafer is etched so that the shower ports 511 in this embodiment extend in the axial and radial directions of the shower pipe 51.

The utility model discloses an operating procedure does:

the method comprises the following steps: preparing a corrosion material, namely putting corresponding raw materials into different raw material tanks, and mounting the wafer on a wafer fixing frame 3;

step two: the controller 1 controls the metering pump to pump raw materials in different raw material tanks according to a proportion, and the raw materials are introduced into the liquid medicine tank 8 to be mixed to form liquid medicine;

step three: starting a liquid medicine pump set 4, introducing liquid medicine into the working box 2, starting a flushing pump set 52 after the liquid medicine submerges the wafer and the spray pipe 51, and enabling the spray pipe 51 to spray the liquid medicine to form liquid medicine flow to carry out corrosion operation on the wafer;

step four: after the corrosion is finished, opening a liquid outlet 21 of the working box 2, and quickly emptying the liquid medicine from the working box 2 into the liquid medicine box 8;

step five: after the liquid medicine evacuation in the work box 2, start washing unit 6, spray the flush fluid through flushing pipe 61, dilute the liquid medicine of remaining on the wafer surface fast, wash pump package 52 simultaneously and follow flushing fluid tank 7 and extract the flush fluid pump and go into the flush fluid that shower 51 produced the fine and close injection and continue to spray the wafer, further improve the efficiency of diluting wafer surface liquid medicine, realize the washing to the wafer.

After the working box 2 finishes a corrosion working cycle, the working box 2 discharges the liquid medicine to the liquid medicine box 8 through the liquid discharge port 21 for temporary storage so that the emptying working box 2 can clean the wafer, and after the lens after the corrosion cleaning is taken out, the liquid medicine temporarily stored in the liquid medicine box 8 can be pumped back to the working box 2 through the liquid medicine pump unit 4 for the next corrosion working cycle.

In conclusion, the utility model places the wafer on the wafer fixing frame 3, and introduces the liquid medicine into the working box 2 through the liquid medicine pump group 4, when the liquid medicine submerges the wafer, the liquid medicine is disturbed by the flushing device 5 to form a liquid medicine flow to flush the wafer, so as to realize the corrosion to the surface of the wafer, the liquid medicine is discharged to the liquid medicine box through the liquid discharge port 21, after the liquid discharge port is closed, the flushing device 6 immediately sprays flushing liquid to dilute the liquid medicine remained on the surface of the wafer, the liquid medicine is prevented from continuously corroding the wafer, the wafer liquid medicine is flushed and flushed without manual operation, can be set by the controller 1 to work, on one hand, the liquid medicine is prevented from hurting the body of a worker, meanwhile, the manual input is reduced, on the other hand, the problem of poor quality stability caused by manual operation is avoided, the consistency of products is improved, the automation degree of wafer production is improved, and the production efficiency is improved.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.

Claims (13)

1. The utility model provides a wafer automatic corrosion spraying equipment, its characterized in that includes controller, work box, wafer mount and the liquid medicine pump package, flushing device and the washing unit that are connected with the controller electricity, the wafer mount sets up and is used for the fixed wafer of putting into the work box in the work box, the liquid medicine pump package is connected with the work box and is used for to the interior pump sending liquid medicine of work box, the leakage fluid dram has been seted up to the work box and is used for discharging the liquid medicine, flushing device installs and is used for making the liquid medicine flow formation liquid medicine that the work box was used for making to flow to erode the wafer in the work box, washing unit installs and is used for spraying flush fluid washing wafer to.

2. The automatic wafer etching spraying device of claim 1, wherein the flushing device comprises a spraying pipe with an opening at one end and a flushing pump set used for conveying liquid medicine or flushing liquid to the spraying pipe, the spraying pipe is provided with a plurality of spraying ports along the circumferential direction, the spraying ports extend along the axial direction of the spraying pipe, the flushing pump set is connected with a liquid conveying pipe, and the spraying pipe is communicated with the liquid conveying pipe and is rotatably connected with the liquid conveying pipe.

3. The automatic wafer etching spraying device of claim 2, wherein the liquid inlet end of the scouring pump set is connected to the inside of the working box, and the liquid outlet end of the scouring pump set is communicated with the spraying pipe through a liquid conveying pipe.

4. The automatic wafer etching spraying apparatus of claim 2, wherein the spraying openings are arcuate outward in a radial direction of the spray pipe.

5. The automatic wafer etching spraying device as claimed in claim 2, wherein the flushing device further comprises a liquid guide tube, the liquid guide tube is communicated with the liquid conveying tube, the liquid guide tube is sleeved into the spraying tube from the opening end of the spraying tube and forms a spraying gap with the spraying tube, the spraying tube is provided with an inner cavity, a side wall of the inner cavity opposite to the opening end of the liquid guide tube is provided with a driving part for driving the spraying tube to rotate under impact, and the liquid guide tube, the inner cavity and the spraying gap are sequentially communicated with the spraying port.

6. The automatic wafer etching spraying apparatus of claim 5, wherein the cavity is provided with a stabilizing frame, and the stabilizing frame is provided with a flow guiding inclined surface for diffusing the liquid sprayed from the liquid guiding pipe to the periphery of the cavity through the flow guiding inclined surface when the liquid impacts the inner wall of the cavity and is reflected.

7. The automatic wafer etching spraying apparatus of claim 6, wherein the stabilizing frame is provided with a tapered sleeve, the outer side surface of the tapered sleeve forms the diversion inclined surface, and the liquid outlet end of the liquid guide pipe is arranged in the tapered sleeve.

8. The automatic wafer etching spraying apparatus of claim 2, wherein the flushing device further comprises a driving mechanism for driving the spraying pipe to rotate circumferentially.

9. The automatic wafer etching spraying device of claim 8, wherein the driving mechanism comprises a first absorbing part, a second absorbing part, a swinging magnet and a power supply, the first absorbing part and the second absorbing part are respectively arranged at two ends of the swinging magnet, the swinging magnet is fixedly connected with the spraying pipe and swings around the axis of the spraying pipe, the power supply is respectively and electrically connected with the first absorbing part and the second absorbing part, and the controller is in communication connection with the power supply.

10. The automatic wafer etching spraying apparatus of claim 2, further comprising a rinse tank connected to the spray pipe through a rinse pump set.

11. The automatic wafer etching spraying device according to claim 1, further comprising a chemical liquid tank for storing chemical liquid, wherein the working tank is communicated with the chemical liquid tank through a chemical liquid pump set and a liquid discharge port, respectively.

12. The automatic wafer etching spraying device according to claim 1, further comprising a chemical solution proportioning device, wherein the chemical solution proportioning device comprises a plurality of raw material tanks and a plurality of metering pumps corresponding to the raw material tanks in number, the raw material tanks are connected with the chemical solution tank through the metering pumps, and the metering pumps are electrically connected with the controller.

13. The automatic wafer etching spraying device according to claim 1, wherein the flushing device comprises a flushing pump and a plurality of flushing pipes arranged on the work box and used for spraying flushing liquid to the wafers in the work box, and the flushing pump is electrically connected with the controller.

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