CN210425391U - Cold and warm air conditioner - Google Patents
Cold and warm air conditioner Download PDFInfo
- Publication number
- CN210425391U CN210425391U CN201921575327.6U CN201921575327U CN210425391U CN 210425391 U CN210425391 U CN 210425391U CN 201921575327 U CN201921575327 U CN 201921575327U CN 210425391 U CN210425391 U CN 210425391U
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- Prior art keywords
- liquid
- box
- frame
- heat dissipation
- cooling
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 95
- 230000017525 heat dissipation Effects 0.000 claims description 54
- 238000001816 cooling Methods 0.000 claims description 40
- 238000010408 sweeping Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 2
- 239000002826 coolant Substances 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 40
- 239000003507 refrigerant Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 2
- 241000237983 Trochidae Species 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a cold and warm air conditioner, which comprises a refrigerating and heating module, wherein the refrigerating and heating module comprises a frame-shaped radiating frame, at least one side surface of the frame-shaped radiating frame is attached with a semiconductor refrigerating sheet, a plurality of radiating sheets which are arranged in a grid shape are connected in the frame-shaped radiating frame, and a first radiating fan is arranged close to the radiating sheets; and the other side of the semiconductor refrigerating sheet is connected with a temperature conduction module in a laminating manner. The utility model discloses a semiconductor refrigeration piece refrigeration heats, has overcome the drawback that traditional refrigerant equipment structure is complicated, polluted environment, and in time derives waste energy through leading the temperature module, promotes refrigeration heating efficiency.
Description
Technical Field
The utility model relates to a refrigeration plant especially relates to an utilize cold warm air conditioner of semiconductor refrigeration.
Background
The existing air conditioner mostly performs circulating refrigeration through a compressor and a refrigerant, the structure is complex, the cost is higher, and the refrigerant has certain damage to the environment, such as the damage of Freon to ozone.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a novel cold and warm air conditioner that structure is simpler, and is little to the environmental impact.
In order to solve the technical problem, the utility model provides a cooling and heating air conditioner, including the refrigeration heating module, the refrigeration heating module includes frame shape heat dissipation frame, the laminating of at least one side of frame shape heat dissipation frame has the semiconductor refrigeration piece, a plurality of arrange in the frame shape heat dissipation frame and be the grid form heat dissipation piece, be close to the heat dissipation piece and install first heat dissipation fan; and the other side of the semiconductor refrigerating sheet is connected with a temperature conduction module in a laminating manner.
Furthermore, the temperature guide module comprises a temperature guide box, a temperature guide liquid box, a liquid pump and a temperature dissipation box which are connected through pipelines, liquid inlets and liquid outlets are formed in the temperature guide box, the temperature guide liquid box, the liquid pump and the temperature dissipation box, the temperature guide liquid circularly flows among the temperature guide box, the temperature guide liquid box and the temperature dissipation box under the action of the liquid pump, and the temperature guide box is attached to the semiconductor refrigerating sheet.
Further, two semiconductor refrigeration pieces are attached to the frame-shaped heat dissipation frame on opposite side faces, the other side of each semiconductor refrigeration piece is connected with a temperature guide box, liquid inlets of the two temperature guide boxes are connected with liquid outlets of a liquid pump through a tee pipeline, liquid outlets of the two temperature guide boxes are connected with liquid inlets of the heat dissipation boxes through tee pipelines, liquid outlets of the heat dissipation boxes are connected with liquid inlets of the heat dissipation boxes through pipelines, and liquid outlets of the heat dissipation boxes are connected with liquid inlets of the liquid pump through pipelines.
Further, a second heat dissipation fan is installed close to the heat dissipation box.
Further, still including shell subassembly, shell subassembly is including preceding shell, backshell and top shell, preceding shell is opened there is the air outlet, the air outlet is installed and is swept the wind unit, it is equipped with indulges, violently sweeps wind leaf piece to sweep the wind unit.
Further, an air filter screen is arranged at the position, corresponding to the first heat dissipation fan and/or the second heat dissipation fan, of the shell component.
Further, the top shell is matched with the tops of the front shell and the rear shell in a sliding mode through a sliding rod, and a lighting assembly is installed on the lower portion, opposite to the protruding portion of the other shell assembly, of the top shell after the top shell slides out.
Furthermore, the side of the frame-shaped heat dissipation frame is wrapped with a heat insulation layer.
Furthermore, the temperature guide box and the semiconductor refrigeration sheet are in screw joint with the side face of the frame-shaped heat dissipation frame through the pressing sheet.
Further, the heat conducting liquid is cooling liquid.
The utility model discloses a semiconductor refrigeration piece refrigeration heats, has overcome the drawback that traditional refrigerant equipment structure is complicated, polluted environment, and in time derives waste energy through leading the temperature module, promotes refrigeration heating efficiency.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is an exploded view of a portion of the assembly of the present invention.
Fig. 2 is a connection diagram of the thermal module of the present invention.
Fig. 3 is an exploded view of the inner assembly and the outer shell of the present invention.
Fig. 4 is an exploded view of a part of the components of the cooling and heating module of the present invention.
Fig. 5 is an assembly view of the present invention.
In the figure: 10, a refrigerating and heating module; 11, a frame-shaped heat dissipation frame; 12, semiconductor refrigerating sheets; 13, cooling tablets; 14, a first cooling fan; 15, a heat-insulating and moisture-preserving layer; 16, tabletting; 20, a temperature conduction module; 21, a temperature-conducting box; 211, a liquid inlet of the heat conducting box; 212, a liquid outlet of the temperature guide box; 22, a temperature conduction liquid box; 221, a liquid inlet of the heat transfer liquid tank; 222, a liquid outlet of the thermal conductivity liquid tank; 23, a liquid pump; 231, a liquid inlet of the liquid pump; 232, a liquid outlet of the liquid pump; 24, a heat dissipation box; 241, a liquid inlet of the heat dissipation box; 242, a liquid outlet of the heat dissipation box; 25. 26, a three-way pipeline; 27, a second cooling fan; 28, a pipeline; 30, a housing assembly; 31, a front shell; 32, a rear shell; 33, a top shell; 34, an air outlet; 35, a wind sweeping unit; 36, an air filter screen; 37, a slide bar.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
As shown in fig. 1, fig. 3 and fig. 4, the cooling and heating air conditioner of the present invention at least comprises a cooling and heating module 10, the cooling and heating module comprises a frame-shaped heat dissipation frame 11, at least one side of the frame-shaped heat dissipation frame is attached with a semiconductor cooling plate 12, a plurality of heat dissipation plates 13 arranged in a grid shape are connected in the frame-shaped heat dissipation frame, the grid-shaped heat dissipation plates can make the heat and cold conduction faster and be blown out by a heat dissipation fan more easily, and a first heat dissipation fan 14 is installed near the grid-shaped heat dissipation plates; the other side of the semiconductor refrigeration sheet 12 is connected with a temperature conduction module 20 in a fitting manner.
The utility model discloses a peltier effect of semiconductor refrigeration piece 12 realizes refrigerating and heating, and after the power was gone up to the semiconductor refrigeration piece, the heat of cold junction was moved to the hot junction, leads to the cold junction temperature to reduce, and the hot junction temperature risees, realizes temperature variation's effect. During refrigeration, the cold end is attached to the frame-shaped heat dissipation frame and guides cold air into the frame-shaped heat dissipation frame and the heat dissipation sheet 13, the cold air is blown out by the first heat dissipation fan 14, and the hot end is attached to the heat conduction module and continuously guides out excessive heat. When heating is needed, the current direction of the semiconductor refrigerating sheet is changed, and the switching of the cold end and the hot end of the semiconductor refrigerating sheet can be realized. It should be noted that the connection between the semiconductor refrigeration chip and the power supply and the direction control of the current applied to the semiconductor refrigeration chip are well-established technologies in the art, and are not described herein again. Preferably, in order to realize good heat conductivility, the utility model discloses a frame shape heat dissipation frame should be the metal heat dissipation frame, preferably more light aluminum product heat dissipation frame.
The utility model discloses a preferred temperature conduction module 20 embodiment, refer to fig. 1 and fig. 2, temperature conduction module 20 includes through pipeline 28 connection lead incubator 21, lead warm liquid case 22, liquid pump 23 and cooling box 24, lead incubator, lead warm liquid case, liquid pump and cooling box and all be equipped with into liquid mouth and liquid outlet, lead warm liquid circulation flow between lead warm case 21, lead warm liquid case 22 and cooling box 24 under the liquid pump 23 effect, lead incubator 21 and laminate in semiconductor refrigeration piece 12.
The utility model discloses power is connected to lead temperature module 20's liquid pump 23, and the during operation, liquid pump will lead temperature liquid and transmit to leading temperature case 21 from leading temperature liquid case 22, lead temperature case 21 and the laminating of semiconductor refrigeration piece 12 and carry out the heat conduction. Taking refrigeration as an example, during refrigeration, cold air at the cold end of the semiconductor refrigeration sheet is blown out by the first heat dissipation fan 14, heat is gathered at the hot end and conducted into the temperature guiding liquid in the temperature guiding box 21, the liquid pump continues to work, the hotter temperature guiding liquid in the temperature guiding box is transmitted to the temperature guiding box 24 through the pipeline 28, the second heat dissipation fan 27 is installed close to the temperature guiding box to dissipate heat and cool the temperature guiding liquid in the temperature guiding box 24, and the cooled temperature guiding liquid flows into the temperature guiding liquid box 22 through the pipeline 28 and continues to circulate, so that continuous refrigeration is realized. When heating, the hot junction that the switching current direction made the semiconductor refrigeration piece is laminated with frame type heat dissipation frame 11, the cold junction is laminated with leading warm case 21, the heat conduction that the hot junction produced is blown off to frame type heat dissipation frame and by first cooling fan 14, the cold junction constantly cools down to the leading warm liquid temperature that is less than the normal atmospheric temperature, the heat conduction of leading warm liquid makes leading warm liquid temperature in leading the warm case reduce to the cold junction, colder leading warm liquid flows into cooling case 24 through pipeline 28, under the effect of second cooling fan 27, leading warm liquid and ambient atmospheric temperature carry out the heat conduction and resume to the normal atmospheric temperature, then flow into leading warm liquid case 22 through the pipeline and continue the circulation, realize continuously heating. It should be pointed out especially that, the utility model discloses a cooling box is not necessary, and cooling box's technological effect lies in realizing quick cooling, and technical personnel in the field realize quick cooling through the structural change of leading warm liquid case, if adopt thinner leading warm liquid case, adopt modes such as grid form leading warm liquid case cooperation cooling fan or second grade heat abstractor, lead warm liquid case and realize quick cooling promptly to do not adopt cooling box, can not regard as to surpassing the utility model discloses a protection scope.
For improving refrigeration heating efficiency, also heat more evenly for making the refrigeration, the utility model provides a plurality of semiconductor refrigeration piece mounting structure, use two semiconductor refrigeration pieces as an example, the laminating has two semiconductor refrigeration pieces 12 on relative side on frame shape cooling frame, every semiconductor refrigeration piece another side all is connected with lead incubator 21, the liquid outlet 232 of liquid pump 23 is connected through tee bend pipeline 25 to the income liquid mouth 211 of two lead incubators, the income liquid mouth 241 of liquid outlet 212 of two lead incubators connects the cooling box through tee bend pipeline 26, the income liquid mouth 221 of leading the incubators is connected through pipeline 28 to the liquid outlet 242 of cooling box, the liquid outlet 222 of leading the incubators passes through the income liquid mouth 231 of tube coupling liquid pump 23. The two semiconductor refrigerating pieces 12 which are oppositely arranged cool and heat from two sides of the frame-shaped heat dissipation frame 11, so that the cooling and heating are more uniform, the working efficiency is improved, the specific working principle is as shown in the foregoing, and the detailed description is omitted here. Preferably, the liquid inlets and outlets of the two thermal conduction boxes 21 are connected with a pipeline through a tee joint to form a tee pipeline, so that the structure is simplified, and the problem that each thermal conduction box is separately connected with the upper stream and the lower stream to cause the complex pipeline and the leakage is easy to occur is avoided.
For preventing that frame type cooling frame 11 absorptive semiconductor refrigeration piece conduction's air conditioning or steam from leaking, the utility model discloses can have thermal-insulated heat preservation 15, preferably thermal-insulated cotton, for example thermal-insulated asbestos in the sideslip cladding of frame type cooling frame. More preferably, the utility model discloses to lead incubator 21 and pass through preforming 16 along with semiconductor refrigeration piece 12 and connect in frame shape heat dissipation frame 11 side, this structure can make the better laminating in incubator 21 and frame shape heat dissipation frame 11 of leading in the cold and hot both ends of semiconductor refrigeration piece 12, leads temperature efficiency and is higher. The preforming preferred is the metal preforming, is difficult to damage and takes place plastic deformation, and the preferred spiro union of connected mode is convenient dismantlement and change. Preferably, the temperature guiding liquid is cooling liquid, the existing mature cooling liquid can be selected, and water can be directly selected as the cooling liquid, so that the manufacturing cost is saved.
The utility model discloses a refrigeration heating module and lead temperature module can be integrated the installation, in the embodiment of an integrated installation, still including shell subassembly 30, refer to FIG. 3 and FIG. 5, shell subassembly is including preceding shell 31, backshell 32 and top shell 33, and preceding shell 31 is opened there is air outlet 34, and the air outlet is installed and is swept wind unit 35, sweeps the wind unit and is equipped with indulgively, violently sweep the wind leaf piece. The longitudinal and transverse air sweeping blades of the air sweeping unit can flexibly adjust the air outlet direction. Preferably, the utility model discloses shell subassembly is equipped with airstrainer 36 corresponding to first cooling fan and/or second cooling fan department to dust in the filtered air makes the wind that cooling fan blew off comparatively clean.
As a preferred embodiment, the top case 33 of the present invention is slidably fitted to the top of the front case 31 and the rear case 32 through the sliding rod 37, and forms a protruding portion relative to other case components after the top case slides out, and a lighting assembly (not shown) is installed at the lower portion of the protruding portion for ambient lighting, and the lighting assembly is preferably an LED lamp. It needs to point out very much, the utility model discloses not only can be used to make high-power air conditioner, more important, because adopt the refrigeration of semiconductor refrigeration piece, the subassembly is less and simple structure, can effectively reduce the air conditioner volume, so be used for producing more on-vehicle air conditioner, laboratory with wait little miniature air conditioner.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (10)
1. A cold and warm air conditioner comprises a refrigerating and heating module and is characterized in that the refrigerating and heating module comprises a frame-shaped heat dissipation frame, at least one side surface of the frame-shaped heat dissipation frame is attached with a semiconductor refrigerating sheet, a plurality of heat dissipation sheets which are arranged in a grid shape are connected in the frame-shaped heat dissipation frame, and a first heat dissipation fan is arranged close to the heat dissipation sheets; and the other side of the semiconductor refrigerating sheet is connected with a temperature conduction module in a laminating manner.
2. The cooling-heating air conditioner according to claim 1, wherein the temperature guiding module comprises a temperature guiding box, a temperature guiding liquid box, a liquid pump and a temperature dissipating box which are connected through pipelines, the temperature guiding box, the temperature guiding liquid box, the liquid pump and the temperature dissipating box are respectively provided with a liquid inlet and a liquid outlet, the temperature guiding liquid circularly flows among the temperature guiding box, the temperature guiding liquid box and the temperature dissipating box under the action of the liquid pump, and the temperature guiding box is attached to the semiconductor refrigerating sheet.
3. The cooling-heating air conditioner according to claim 2, wherein the frame-shaped heat dissipation frame is attached with two semiconductor cooling fins on opposite sides, an insulating box is connected to the other side of each semiconductor cooling fin, liquid inlets of the two insulating boxes are connected with liquid outlets of the liquid pump through a tee pipeline, liquid outlets of the two insulating boxes are connected with the liquid inlet of the heat dissipation box through a tee pipeline, the liquid outlet of the heat dissipation box is connected with the liquid inlet of the heat dissipation box through a pipeline, and the liquid outlet of the heat dissipation box is connected with the liquid inlet of the liquid pump through a pipeline.
4. A cooling and heating air conditioner according to claim 3, characterized in that a second cooling fan is installed near the cooling box.
5. An air conditioner according to claim 4, characterized in that it further comprises a casing assembly, said casing assembly comprises a front casing, a rear casing and a top casing, said front casing is provided with an air outlet, said air outlet is provided with a wind sweeping unit, said wind sweeping unit is provided with longitudinal and transverse wind sweeping blades.
6. An air conditioner according to claim 5, characterized in that an air filter is provided at the housing assembly corresponding to the first and/or second heat-radiating fans.
7. A cooling/heating air conditioner according to claim 5, characterized in that the top casing is slidably fitted to the top of the front casing and the rear casing by means of slide rods, and a lighting unit is installed under the protruding portion with respect to the other casing units after the top casing is slid out.
8. A cooling and heating air conditioner according to any one of claims 1 to 7, characterized in that the frame-shaped heat-radiating frame is surrounded on its side by a heat-insulating layer.
9. An air conditioner according to any one of claims 2 to 7, wherein the heat conducting box together with the semiconductor cooling plate is screwed to a side surface of the frame-shaped heat radiating frame through a pressing plate.
10. A cooling/heating air conditioner according to any one of claims 2 to 7, wherein the heat conducting liquid is a coolant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921575327.6U CN210425391U (en) | 2019-09-21 | 2019-09-21 | Cold and warm air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921575327.6U CN210425391U (en) | 2019-09-21 | 2019-09-21 | Cold and warm air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210425391U true CN210425391U (en) | 2020-04-28 |
Family
ID=70367413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921575327.6U Expired - Fee Related CN210425391U (en) | 2019-09-21 | 2019-09-21 | Cold and warm air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210425391U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110469931A (en) * | 2019-09-21 | 2019-11-19 | 佛山市顺德区云贝电器有限公司 | A kind of cooling and heating air conditioner |
-
2019
- 2019-09-21 CN CN201921575327.6U patent/CN210425391U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110469931A (en) * | 2019-09-21 | 2019-11-19 | 佛山市顺德区云贝电器有限公司 | A kind of cooling and heating air conditioner |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200428 |