CN210424853U - Electronic unit - Google Patents

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Publication number
CN210424853U
CN210424853U CN201921853400.1U CN201921853400U CN210424853U CN 210424853 U CN210424853 U CN 210424853U CN 201921853400 U CN201921853400 U CN 201921853400U CN 210424853 U CN210424853 U CN 210424853U
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CN
China
Prior art keywords
housing
outer cover
electronic unit
cover
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921853400.1U
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Chinese (zh)
Inventor
漆畑干雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
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Publication of CN210424853U publication Critical patent/CN210424853U/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25Projection lenses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32Optical layout thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10Use or application of lighting devices on or in particular types of vehicles for land vehicles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The utility model provides an electronic unit that can maintain the thermal diffusivity and realize low cost and light-dutyization. The electronic unit (1) comprises: an electronic component (4); a case (2) for housing an electronic component (4); and an outer cover (5) for covering the opening of the housing (2). A seal groove (55) is provided in the outer cover (5), and a seal member (56) for ensuring waterproofing between the outer cover (5) and the housing (2) is disposed in the seal groove (55). The seal groove 55 is formed by press working.

Description

Electronic unit
Technical Field
The utility model relates to an electronic unit.
Background
Patent document 1 discloses an electronic unit configured as a lamp ECU including an LED drive circuit for causing an LED to emit light. The electronic unit includes: a housing including a housing main body having an upper opening and a cover attached to the opening of the housing main body; and an electronic structure and a heat diffusion sheet which are incorporated in the housing.
[ Prior art documents ]
[ patent document ]
Patent document 1: japanese patent laid-open No. 2014-82147
SUMMERY OF THE UTILITY MODEL
[ problems to be solved by the utility model ]
In the electronic unit as described in patent document 1, there is room for improvement in cost reduction or weight reduction of the cover attached to the opening of the case main body.
Therefore, an object of the present invention is to provide an electronic unit that can maintain heat dissipation and achieve cost reduction or weight reduction.
[ means for solving the problems ]
To achieve the above object, an electronic unit according to one aspect of the present invention includes:
a case which houses the electronic component, and
an outer cover for covering the opening of the housing;
a seal groove provided in the outer cover, the seal groove being provided with a seal member for securing waterproofing between the outer cover and the housing;
the seal groove is formed by press working.
According to the above configuration, since the seal groove of the outer cover is formed by press working, heat radiation performance can be maintained, and cost reduction and weight reduction can be achieved, as compared with a conventional product in which the seal groove is formed by die casting.
In addition, in the electronic unit of the present invention, it is also possible,
the seal groove is formed between a 1 st projection projecting in an assembling direction with the housing at an outer edge of the outer cover and a 2 nd projection projecting in the assembling direction at an inner side of the 1 st projection;
the 2 nd protrusion has a shorter protruding length in the assembling direction than the 1 st protrusion.
According to the above configuration, since the inner 2 nd protrusion is formed to be lower than the outer 1 st protrusion, the seal groove can be easily formed by press working.
In addition, in the electronic unit of the present invention, it is also possible,
the 2 nd protrusion is formed so as not to interfere with the electronic component in a state where the external cover is attached to the housing.
According to the above configuration, since the 2 nd protrusion does not interfere with the electronic component, the sizes of the housing and the outer cover can be minimized. This can further reduce the cost and weight of the electronic unit.
In addition, the electronic unit of the present invention may be
An inner cover which is accommodated in the housing;
the inner cover includes:
a planar portion extending so as to cover the mounting surface of the electronic component,
a bent portion bent from the planar portion to the 2 nd projecting portion at least at a position opposing the 2 nd projecting portion, an
An extension portion extending in a direction from the bent portion toward the 2 nd protrusion portion;
the length of the extending portion in the direction toward the 2 nd protrusion is longer than the protruding length of the 2 nd protrusion.
According to the above configuration, by making the length of the extension portion of the inner cover facing the 2 nd protrusion longer than the 2 nd protrusion, the gap between the 2 nd protrusion and the extension portion can be reduced as much as possible, and adverse effects due to electromagnetic noise can be suppressed.
In addition, in the electronic unit of the present invention, it is also possible,
a resin film is adhered to an outer surface of the outer cover.
According to the above configuration, the heat radiation performance of the outer cover can be further improved.
[ effects of utility model ]
According to the utility model discloses, can provide one kind and can maintain the thermal diffusivity to realize the electronic unit of low cost and light-dutyization.
Drawings
Fig. 1 is a schematic cross-sectional view showing an example of a headlamp to which the present invention is applied.
Fig. 2 is a perspective view showing an electronic unit according to the present invention.
Fig. 3 is an exploded perspective view of the electronic unit shown in fig. 2.
Fig. 4 is a sectional view taken along line a-a of fig. 2.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, in the description of the present embodiment, members having the same reference numerals as those already described are omitted. For convenience of explanation, the dimensions of the respective members shown in the drawings may be different from the actual dimensions of the respective members.
In the description of the present embodiment, for convenience of description, the terms "left-right direction", "front-back direction", and "up-down direction" are appropriately mentioned. These directions are opposite directions set for the headlight shown in fig. 1. Here, the "up-down direction" is a direction including the "up direction" and the "down direction". The "front-rear direction" is a direction including the "front direction" and the "rear direction". The "left-right direction" is a direction including the "left direction" and the "right direction".
Fig. 1 is a sectional view showing a headlamp 100 of an automobile including an electronic unit 1 according to the present embodiment.
As shown in fig. 1, a lamp housing 101 of a headlamp 100 is composed of a lamp body 102 and a front cover 103. The extension portion 104 and the light source unit 110 are provided in the lamp housing 101. As a lighting control means for controlling the lighting state of the light source (LED112) mounted on the light source unit 110, the electronic unit 1 is mounted on the outer bottom surface of the lamp body 102, for example, outside the lamp housing 101. The electronic unit 1 is electrically connected to the light source unit 110 via a wire harness HA.
The light source unit 110 is a so-called projection type lamp unit including: a unit substrate 111; and an LED112 provided as a light source on the unit base 111. The light source unit 110 further includes: a reflector 113 provided in such a manner as to cover the LED 112; and a projection lens 114 disposed in front of the LED 112. Light emitted from the LED112 and reflected by the reflector 113 and direct light from the LED112 are partially shielded by the light shielding portion 115 formed on the unit base 111 and are irradiated forward by the projection lens 114. Thus, the light source unit 110 realizes light irradiation determined by a desired light distribution pattern.
Fig. 2 is a perspective view of the electronic unit 1 as viewed from above. Fig. 3 is an exploded perspective view of the electronic unit 1 shown in fig. 2.
The Electronic Unit 1 is configured as a lamp ECU (Electronic Control Unit) including an LED drive circuit for supplying power to the light source Unit 110 to cause the LEDs 112 to emit light. As shown in fig. 2 and 3, the electronic unit 1 includes: a case 2, an inner cover 3, an electronic component 4, and an outer cover 5.
The housing 2 is made of, for example, resin, and is formed in a substantially rectangular box shape having an open lower portion. The inner cover 3 and the electronic component 4 are housed in the case 2 through an opening 21 in the lower portion. Further, a cylindrical opening 22 is provided in an upper portion of the housing 2. A connector portion 24 is provided at the rear portion of the case 2, and the connector portion 24 is electrically connected to an external power supply such as an in-vehicle battery or a vehicle ECU that controls the entire vehicle. In order to ensure the required mechanical strength, the case 2 may be made of a resin such as polybutylene terephthalate or polyphenylene sulfide containing glass powder. Further, the case 2 may be made of metal.
The electronic component (electronic circuit board) 4 is constituted by a wiring board 41, a plurality of semiconductor elements 42 mounted on the wiring board 41, and the like. The semiconductor element 42 and the like mounted on the wiring substrate 41 constitute a lamp ECU. Further, a connector 43 (an example of the 1 st connector) is soldered to the wiring board 41. A connector housing 44 capable of housing an external connector (an example of a 2 nd connector), not shown, engaged with the connector 43 is attached to the connector 43.
The inner cover 3 has: a planar portion 31 extending so as to cover the mounting surface of the electronic component 4; a bent portion 32 bent downward from the flat surface portion 31; and an extension 33 extending downward from the bent portion 32.
An opening 34 is formed in the planar portion 31. The opening 34 is formed at a position corresponding to the cylindrical opening 22 of the case 2 when the inner cover 3 is housed in the case 2. The opening 34 is formed at a position corresponding to the connector 43 and the connector housing 44 mounted on the wiring board 41 of the electronic component 4. Therefore, the structure is as follows: when the inner cover 3 and the electronic component 4 are accommodated in the housing 2, the connector housing 44 is inserted through the opening 34 of the inner cover 3 and positioned in the cylindrical opening 22 of the housing 2. The inner cover 3 and the electronic component 4 housed in the case 2 are fixed to the case 2 by screws 11.
The inner cover 3 is made of, for example, a metal having high shielding properties and heat dissipation properties (thermal conductivity). The inner cover 3 is screwed to the housing 2 together with the electronic component 4, and thereby is electrically connected to the ground of the electronic component 4 through the screw hole 35 of the inner cover 3.
The outer cover 5 has: a substantially rectangular bottom plate 51; side walls 52 (an example of the 1 st projecting portion) provided on each side of the bottom plate 51; and an inner wall portion 53 (an example of the 2 nd projection portion) provided inside the side wall portion 52 along each side wall portion 52.
The side wall portion 52 is formed on the outer edge of the outer cover 5 so as to protrude upward from the bottom plate portion 51 in the assembling direction with the housing 2. The inner wall portion 53 is formed so as to protrude upward from the bottom plate portion 51 on the inner side of the side wall portion 52, similarly to the side wall portion 52. The outer cover 5 is made of, for example, metal having high heat dissipation. As the metal used for the outer cover 5, for example, a galvanized steel sheet, a stainless steel sheet, and an aluminum alloy sheet can be used. Further, a resin film 13 having heat radiation (radiation) properties is laminated on the outer surface of the outer cover 5. As the resin film 13, for example, a polyolefin sheet such as Polyethylene (PE) or polypropylene (PP), or a sheet of vinyl chloride material can be used. The surface of the resin film 13 may be embossed.
The outer cover 5 is assembled to the lower side of the housing 2 so as to cover the opening 21 of the housing 2. For example, the outer cover 5 is assembled to the housing 2 by engaging the mounting holes 54 provided in the left and right side wall portions 52 with the protrusions 23 provided in the housing 2. Between the electronic component 4 and the outer cover 5, an insulating material 12 for ensuring insulation between the electronic component 4 and the outer cover 5 is adhesively provided on the bottom plate portion 51 of the outer cover 5.
Fig. 4 is a sectional view a-a of the electronic unit 1 shown in fig. 2. As shown in fig. 4, a side wall portion 52 is provided on the outer edge of the outer cover 5, and an inner wall portion 53 is provided inside the side wall portion 52. The inner wall portion 53 is formed such that the height L2 thereof is lower than the height L1 of the side wall portion 52. That is, the length of projection of the inner wall portion 53 in the assembling direction of the housing 2 and the outer cover 5 (height L2) is formed shorter than the length of projection of the side wall portion 52 in the assembling direction (height L1).
The height L2 of the inner wall 53 is formed so as not to interfere with the mounting position of the electronic component 4 in a state where the external cover 5 is attached to the housing 2. For example, the height L2 of the inner wall portion 53 is set to a height that can form the gap S between the upper end portion of the inner wall portion 53 and the lower end portion of the electronic component 4.
A sealing groove 55 recessed downward is provided between the side wall portion 52 and the inner wall portion 53. The seal groove 55 is formed by press working a plate-like member for forming the outer cover 5. Specifically, a plate-like metal material constituting the outer cover 5 is applied with force by 2 or more paired tools to be formed into a predetermined shape, thereby forming the side wall portion 52 and the inner wall portion 53, and the seal groove 55 between the side wall portion 52 and the inner wall portion 53. The thickness of the flat plate-like metal material constituting the outer cover 5 is about 1.2 mm.
A seal member 56 is disposed in the seal groove 55, and the seal member 56 bonds the outer cover 5 and the housing 2 to each other and secures waterproofing between the outer cover 5 and the housing 2. The sealing member 56 may be made of an adhesive such as silicone resin, for example. In a state where the outer cover 5 is assembled to the housing 2, the distal end 25a of the sidewall 25 of the housing 2 enters the seal groove 55 of the outer cover 5. Thereby, the side wall 25 of the case 2 and the outer cover 5 are bonded by the sealing member 56 such as an adhesive agent flowing into the sealing groove 55. As the seal member 56, for example, a gasket having adhesiveness or elasticity (substantially rectangular shape) formed in a shape corresponding to the shape of the seal groove 55 of the outer cover 5 may be used.
In a state where the inner cover 3 is housed in the housing 2, the bent portion 32 of the inner cover 3 is bent from the flat portion 31 toward the inner wall portion 53 at a position facing the inner wall portion 53 of the outer cover 5. In a state where the inner cover 3 is housed in the housing 2, the extending portion 33 of the inner cover 3 is provided so as to extend in a direction from the bent portion 32 toward the inner wall portion 53 of the outer cover 5. The length L3 of the extension 33 is formed longer than the height L2 (projection length) of the inner wall 53. For example, the length L3 of the extension 33 is preferably formed such that the position of the distal end thereof is the same as the position of the lower end of the electronic component 4 or is lower than the position of the lower end of the electronic component 4.
As shown in fig. 1, the electronic unit 1 having such a configuration is attached to the outer bottom surface of the lamp housing 101, and communicates with the inside of the lamp housing 101 through the cylindrical opening 22 of the housing 2. The connector 43 housed in the case 2 passes through the cylindrical opening 22 and is connected to the wire harness HA electrically connected to the light source unit 110 via the connector. The electronic unit 1 side of the wire harness HA is attached to an external connector (an example of a 2 nd connector) not shown, and the external connector is connected to the connector 43 of the electronic unit 1. Connector portion 24 provided at the rear portion of case 2 is connected to a harness HB (see fig. 1) electrically connected to an external power source or a vehicle ECU via a connector.
As described above, the electronic unit 1 of the present embodiment includes: a housing 2; an electronic component 4 and an inner cover 3 housed in the case 2; and an outer cover 5 covering the opening 21 of the housing 2. A seal groove 55 is formed in the outer cover 5 by press working, and a seal member 56 for securing waterproofing between the outer cover 5 and the case 2 is disposed in the seal groove 55. Therefore, the thickness of the cover plate for forming the outer cover 5 can be reduced as compared with a conventional electronic unit in which the sealing groove of the outer cover is formed by die casting such as die casting. For example, the thickness of the outer cover formed by die casting is about 1.5mm, whereas the thickness of the outer cover 5 formed by press working of the present embodiment is about 1.2 mm. This can reduce the weight and cost of the outer cover 5, and can ensure heat dissipation equivalent to that of an outer cover formed by die casting.
In the present embodiment, a resin film 13 is attached to the outer surface of the outer cover 5. This can improve the heat emissivity (heat radiation rate) of the outer surface of the outer cover 5, and thus can further improve the heat radiation performance of the outer cover 5.
In the present embodiment, the height L2 of the inner wall portion 53 of the outer cover 5 is set to be lower than the height L1 of the side wall portion 52. Since the upward projecting length of the inner wall portion 53 is short in this way, the cover plate is not damaged even in the portion where the inner wall portion 53 is formed by press working, and the seal groove 55 can be easily formed.
In the present embodiment, the inner wall portion 53 of the outer cover 5 is formed to a height (height L2) that does not contact (does not interfere with) the electronic component 4 when the outer cover 5 is assembled to the housing 2. Therefore, the electronic component 4 can be disposed above the inner wall portion 53 so as to overlap the inner wall portion 53 (see fig. 4). For example, when the inner wall portion of the outer cover is formed to a height that can contact the electronic component, the inner wall portion must be disposed outside the electronic component, and the outer cover or the housing must be increased in size. In contrast, according to the electronic unit 1 of the present embodiment in which the height L2 of the inner wall portion 53 is set to a height that does not contact the electronic component 4, the sizes of the housing 2 and the outer cover 5 can be minimized, and weight and cost reduction of the electronic unit 1 can be achieved.
In the present embodiment, the length L3 of the extension 33 of the inner cover 3 facing the inner wall portion 53 is configured to be longer than the height L2 (protruding length) of the inner wall portion 53. By thus increasing the length L3 of the extension 33 of the inner cover 3 by the amount of lowering of the height L2 of the inner wall portion 53 of the outer cover 5, the gap between the inner wall portion 53 and the extension 33 can be reduced as much as possible. This can reduce leakage of electromagnetic noise generated from various circuit elements mounted on the electronic component 4, and can suppress an adverse effect of the electronic unit 1 on the outside. In addition, the electronic component 4 can be protected from noise from outside the electronic unit 1.
While the embodiments of the present invention have been described above, it is needless to say that the technical scope of the present invention should not be construed restrictively in accordance with the description of the embodiments. It should be understood by those skilled in the art that this embodiment is merely an example, and various modifications of the embodiment can be made within the scope of the claims. The technical scope of the present invention should be determined based on the scope of protection recited in the claims and the equivalent scope thereof.
In the above embodiment, the electronic unit 1 is configured as the lamp ECU for controlling lighting of the headlight 100 of the automobile using the LED112 as the light source, but the present invention is not limited to this example. The electronic unit 1 may be an electronic unit for controlling lighting of a vehicle lamp other than a headlight. Alternatively, the electronic unit 1 may be an electronic unit for rotation control or leveling of the headlamp. That is, the present invention can be applied to an electronic unit in which an external cover attached to an opening of a case for housing an electronic component is formed by press working.
In the above embodiment, the resin film 13 is attached to the outer surface of the metal plate constituting the outer cover 5, but a metal plate in a state of a base body to which the resin film 13 is not attached may be used as the outer cover.
[ description of reference numerals ]
1: electronic unit, 2: a housing, 3: inner cover, 4: electronic component, 5: outer cover, 12: insulating material, 13: resin film, 21: opening, 22: cylindrical opening, 24: connector portion, 31: planar portion, 32: bend, 33: extension, 34: opening, 41: wiring board, 42: semiconductor element, 43: connector, 44: connector housing, 51: bottom plate portion, 52: side wall portion (example of the 1 st projection), 53: inner wall portion (example of 2 nd projection), 55: seal groove, 56: sealing member, 100: head lamp, 110: light source unit, 112: LED, 114: a projection lens.

Claims (6)

1. An electronic unit, comprising:
an electronic part having a plurality of electronic components,
a case which houses the electronic component, and
an outer cover for covering the opening of the housing;
it is characterized in that the preparation method is characterized in that,
a seal groove provided in the outer cover, the seal groove being provided with a seal member for securing waterproofing between the outer cover and the housing;
the seal groove is formed by press working.
2. The electronic unit of claim 1,
the seal groove is formed between a 1 st projection projecting in an assembling direction with the housing at an outer edge of the outer cover and a 2 nd projection projecting in the assembling direction at an inner side of the 1 st projection;
the 2 nd protrusion has a shorter protruding length in the assembling direction than the 1 st protrusion.
3. The electronic unit of claim 2,
the 2 nd protrusion is formed so as not to interfere with the electronic component in a state where the external cover is attached to the housing.
4. The electronic unit according to claim 2 or 3,
an inner cover which is accommodated in the housing;
the inner cover includes:
a planar portion extending so as to cover the mounting surface of the electronic component,
a bent portion bent from the planar portion to the 2 nd projecting portion at least at a position opposing the 2 nd projecting portion, an
An extension portion extending in a direction from the bent portion toward the 2 nd protrusion portion;
the length of the extending portion in the direction toward the 2 nd protrusion is longer than the protruding length of the 2 nd protrusion.
5. The electronic unit according to any of claims 1 to 3,
a resin film is adhered to an outer surface of the outer cover.
6. The electronic unit of claim 4,
a resin film is adhered to an outer surface of the outer cover.
CN201921853400.1U 2018-11-06 2019-10-31 Electronic unit Active CN210424853U (en)

Applications Claiming Priority (2)

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JP2018208829A JP7261564B2 (en) 2018-11-06 2018-11-06 electronic unit
JP2018-208829 2018-11-06

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Publication Number Publication Date
CN210424853U true CN210424853U (en) 2020-04-28

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JP2022086255A (en) * 2020-11-30 2022-06-09 株式会社小糸製作所 Vehicular lamp fitting

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JP4353186B2 (en) * 2006-01-06 2009-10-28 株式会社デンソー Electronic equipment
JP2014061821A (en) * 2012-09-21 2014-04-10 Hitachi Automotive Systems Ltd Electronic controller
JP6110217B2 (en) 2013-06-10 2017-04-05 ソニーセミコンダクタソリューションズ株式会社 Method for manufacturing light emitting device
JP6238198B2 (en) * 2013-10-02 2017-11-29 パナソニックIpマネジメント株式会社 Power supply device, lamp and vehicle
CN204372591U (en) * 2014-12-13 2015-06-03 王定锋 The direct-injection type LED lamp that a kind of flexible board LED module makes
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JP7261564B2 (en) * 2018-11-06 2023-04-20 株式会社小糸製作所 electronic unit

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111207359A (en) * 2018-11-06 2020-05-29 株式会社小糸制作所 Electronic unit

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