CN210406014U - Thin temperature-uniforming plate with circuit unit - Google Patents
Thin temperature-uniforming plate with circuit unit Download PDFInfo
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- CN210406014U CN210406014U CN201920980564.4U CN201920980564U CN210406014U CN 210406014 U CN210406014 U CN 210406014U CN 201920980564 U CN201920980564 U CN 201920980564U CN 210406014 U CN210406014 U CN 210406014U
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- flexible substrate
- circuit unit
- substrate structure
- working fluid
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Abstract
The utility model discloses a thin type temperature equalization plate with a circuit unit, which comprises a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively surround a working fluid, and at least two wicking spaces are formed between the first flexible substrate structure and the second flexible substrate structure; the first flexible substrate structure or the second flexible substrate structure forms a circuit unit at least partially on the side opposite to the working fluid. Therefore, the electronic assembly and the circuit unit are integrated, and the heat energy generated by the electronic assembly and the circuit unit is uniformly heated and dissipated, so that the space utilization rate of the electronic equipment is effectively improved.
Description
Technical Field
The present invention relates to a thin heat dissipation structure, and more particularly to a thin temperature equalization plate with a circuit unit.
Background
The temperature equalizing plate is a heat energy transfer structure applied to electronic equipment, and comprises a base plate and a cover plate which are connected with each other, wherein a cavity is formed between the base plate and the cover plate, a working fluid and a wicking structure are arranged in the cavity, the working fluid is used for absorbing and releasing heat energy, the wicking structure is used for guiding the working fluid to flow, at least two wicking spaces are formed in the cavity through the wicking structure, the base plate and the cover plate are respectively formed by laminating a heat conducting film, a polymer film and an outer film, the polymer film is formed between a metal film and a protective film, and the heat conducting films of the base plate and the cover plate are respectively positioned on one side facing the cavity.
The temperature equalizing plate guides the working fluid to flow through the wicking structure, and the working fluid is matched with the working fluid to generate phase change when absorbing and releasing heat, so that a large amount of heat energy can be quickly absorbed, and the heat energy can be quickly dispersed to form the temperature equalizing.
It is known that electronic components or circuit units such as a processor, a battery, an antenna …, etc. generate a large amount of heat energy when operating, and various electronic devices such as mobile phones, tablet computers, notebook computers, etc. are often provided with a plurality of the electronic components and circuit units which are easy to generate heat energy, each of the electronic components and circuit units respectively form a heat source in the electronic device, and the electronic components and circuit units which can generate a large amount of heat energy, such as the processor, the battery, the antenna …, etc. are respectively provided with a temperature equalization plate, and each temperature equalization plate can respectively equalize and diffuse the heat energy generated by each electronic component and circuit unit, so that the electronic device can operate.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a thin temperature-uniforming plate with circuit units, which is to solve the technical problem of how to develop a novel temperature-uniforming plate structure pattern that can integrate a plurality of electronic components and circuit units, improve the space utilization of electronic equipment, and have more ideal practicability.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a thin temperature-uniforming plate with a circuit unit comprises a flat first flexible substrate structure and a flat second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure oppositely surround a working fluid, and the first flexible substrate structure and the second flexible substrate structure are subjected to low-temperature hot melting or low-temperature sintering, so that the working fluid is hermetically packaged between the first flexible substrate structure and the second flexible substrate structure;
the first flexible substrate structure forms a first heat-conducting metal film on one side facing the working fluid, and the second flexible substrate structure forms a second heat-conducting metal film on one side facing the working fluid;
a wicking structure is arranged between the first flexible substrate structure and the second flexible substrate structure, so that at least two wicking spaces are formed between the first flexible substrate structure and the second flexible substrate structure;
the wicking structure is mainly composed of a mesh, at least two first copper columns and at least two second copper columns, wherein each first copper column is respectively formed on one side of the first heat-conducting metal film facing the working fluid, each second copper column is respectively formed on one side of the second heat-conducting metal film facing the working fluid, and the mesh is connected with each first copper column and each second copper column so as to form each wicking space;
the mesh is selected from the group consisting of metal mesh, polymer mesh, hydrophilic coating-wrapped mesh, and hydrophobic coating-wrapped mesh;
the first flexible substrate structure forms a first polymer film on the side back to the working fluid, the second flexible substrate structure forms a second polymer film on the side back to the working fluid, and the first polymer film and the second polymer film are respectively composed of insulating polymers with high thermal stability;
the first polymer film forms a circuit unit at least partially on the side opposite to the working fluid, the circuit unit is provided with circuit contacts, and the circuit unit is coupled with a control circuit of the electronic equipment so as to improve the space utilization rate of the electronic equipment.
By this innovative unique design, make the utility model discloses contrast prior art, can integrate electronic component and circuit unit to with the produced heat energy samming heat dissipation of electronic component and circuit unit, effectively improve electronic equipment's space utilization.
Drawings
Fig. 1 is a cross-sectional view of a first embodiment of the present invention.
Fig. 2 is a top view of a first embodiment of the present invention, showing a circuit of the first circuit unit.
Fig. 3 is a top view of the second embodiment of the present invention, showing the circuit of the second circuit unit.
Fig. 4 is a top view of a third embodiment of the present invention, showing the circuits of the first circuit unit and the second circuit unit.
Fig. 5 is a cross-sectional view of a fourth embodiment of the present invention.
Fig. 6 is a cross-sectional view of a fifth embodiment of the present invention.
Fig. 7 is a sectional view of a sixth embodiment of the present invention.
Detailed Description
The drawings show several practical embodiments of the thin temperature-uniforming plate with circuit unit of the present invention, but these embodiments are only for illustrative purpose and are not limited by the structure in the patent application.
As shown in fig. 1, the first embodiment of the thin temperature equalization plate with circuit unit of the present invention includes a first flexible substrate structure 10 and a second flexible substrate structure 20, wherein the first flexible substrate structure 10 and the second flexible substrate structure 20 surround a working fluid 30 relatively, and the first flexible substrate structure 10 and the second flexible substrate structure 20 are combined at the periphery to form a sealing edge 42, and the working fluid 30 is hermetically sealed between the first flexible substrate structure 10 and the second flexible substrate structure 20.
The first flexible substrate structure 10 forms a first heat conductive metal film 11 on a side facing the working fluid 30, the first flexible substrate structure 10 forms a first polymer film 12 on a side facing away from the working fluid 30, the first heat conductive metal film 11 is formed by forming a heat conductive metal on a surface of the first polymer film 12, and the first polymer film 12 is formed by an insulating polymer with high thermal stability.
The second flexible substrate structure 20 forms a second heat conductive metal film 21 on a side facing the working fluid 30, the second flexible substrate structure 20 forms a second polymer film 22 on a side facing away from the working fluid 30, the second heat conductive metal film 21 is formed by forming a heat conductive metal on a surface of the second polymer film 22, and the second polymer film 22 is formed by an insulating polymer with high thermal stability.
The first heat-conducting metal film 11 and the second heat-conducting metal film 21 are hot-melted and combined at a low temperature of 170-350 ℃ by a low-temperature hot-melting method to form the edge seal 42, and the first heat-conducting metal film 11 and the second heat-conducting metal film 21 can also be sintered and combined at a temperature of 250-300 ℃ by a sintering method to form the edge seal 42.
A wicking structure 50 is disposed between the first flexible substrate structure 10 and the second flexible substrate structure 20, such that at least two wicking spaces 44 are formed between the first flexible substrate structure 10 and the second flexible substrate structure 20.
The wicking structure 50 is mainly composed of a mesh 51, at least two first copper pillars 52 and at least two second copper pillars 53, wherein each first copper pillar 52 is formed on a side of the first heat conductive metal film 11 facing the working fluid 30, each second copper pillar 53 is formed on a side of the second heat conductive metal film 21 facing the working fluid 30, and the mesh 51 is connected to each first copper pillar 52 and each second copper pillar 53, thereby forming each wicking space 44.
The structure is the same as the existing thin temperature-equalizing plate.
The mesh 51 is selected from the group consisting of a metal mesh, a polymer mesh, a mesh covered with a hydrophilic coating layer, and a mesh covered with a hydrophobic coating layer, and further, the metal mesh is composed of one or at least two of a copper mesh, a stainless steel mesh, and a copper-clad mesh.
As shown in fig. 2, the first polymer film 12 forms a first circuit unit 62 on a side facing away from the working fluid 30, the first circuit unit 62 is provided with a first circuit contact 622, the first circuit unit 62 is coupled to a control circuit (not shown) of the electronic device through the first circuit contact 622, the first circuit unit 62 is a coil through which a current for charging or discharging the electronic device passes, accordingly, when the first circuit unit 62 is located in a magnetic field environment, the first circuit unit 62 can generate an induced current as a current for charging a secondary battery (not shown) of the electronic device, and when the secondary battery provides a discharging current through the first circuit unit 62, the first circuit unit 62 generates a magnetic field to wirelessly charge other electronic devices.
When the current passes through the first circuit unit 62, so that the first circuit unit 62 heats up and generates heat, the heat energy generated by the first circuit unit 62 is transmitted to the working fluid 30 through the first flexible substrate structure 10, and the working fluid 30 is used for uniform temperature heat dissipation.
The first heat conductive metal film 11 and the second heat conductive metal film 21 can shield the electromagnetic wave generated when the current passes through the first circuit unit 62, and the first heat conductive metal film 11 and the second heat conductive metal film 21 can form the electromagnetic wave protection function in the predetermined direction and angle range by using the spatial arrangement of the electronic device.
In an embodiment, the second flexible substrate structure 20 may be disposed on an electronic component (not shown) of an electronic device, where the electronic component may be an arithmetic unit, a processor, a battery or other electronic components that are prone to heat generation, and at this time, the second flexible substrate structure 20 is attached to a heat outlet surface of the electronic component, and heat generated by the electronic component is transferred to the working fluid 30 through the second flexible substrate structure 20, and is dissipated by the working fluid 30.
In an embodiment, the portion of the first flexible substrate structure 10 not forming the first circuit unit 62 may also be in contact with another electronic component (not shown) that is prone to heat generation, and the first flexible substrate structure 10 is utilized to transfer the heat energy generated by the other electronic component to the working fluid 30, so as to dissipate the heat through the working fluid 30.
Further, the first Polymer film 12 and the second Polymer film 22 are each made of Polyimide (PI), Modified Polyimide (MPI), or Liquid Crystal Polymer (LCP).
Because the first flexible substrate structure 10 is mainly composed of the first heat-conducting metal film 11 and the first polymer film 12, and the second flexible substrate structure 20 is mainly composed of the second heat-conducting metal film 21 and the second polymer film 22, the first flexible substrate structure 10 and the second flexible substrate structure 20 respectively have the characteristic of small-amplitude deflection deformation, and accordingly, when the first flexible substrate structure 10 or the second flexible substrate structure 20 is attached to the heat output surface of the electronic component, the first flexible substrate structure 10 or the second flexible substrate structure 20 can be matched with the shape of the heat output surface and closely attached to the heat output surface; on the other hand, the first flexible substrate structure 10 and the second flexible substrate structure 20 respectively have the characteristic of small-amplitude deflection deformation, and the first flexible substrate structure 10 or the second flexible substrate structure 20 can also be deformed appropriately according to the space requirement of the electronic device.
The second embodiment is obtained by changing the first embodiment, and the second embodiment has the same structure as the first embodiment, which is not repeated; as shown in fig. 3, the second embodiment is different from the first embodiment in that a second circuit unit 64 is formed on a side of the first polymer film 12 facing away from the working fluid (not shown), the second circuit unit 64 is provided with a second circuit contact 642, so that the second circuit unit 64 is coupled to a control circuit (not shown) of the electronic device through the second circuit contact 642, and the second circuit unit 64 is an antenna loop, accordingly, when the second circuit unit 64 transmits or receives a radio wave signal, a current passes through the second circuit unit 64, so that the second circuit unit 64 is heated, and heat generated by the second circuit unit 64 is transferred to the working fluid through the first flexible substrate structure 10, and is uniformly heated and dissipated through the working fluid.
Further, when the second circuit unit 64 is an antenna loop, the first heat-conducting metal film (not shown) of the first flexible substrate structure may form a ground of the second circuit unit 64, and the first heat-conducting metal film and the second heat-conducting metal film (not shown) of the second flexible substrate structure may shield the electromagnetic wave generated by the radio wave emitted by the second circuit unit 64, so as to adjust the field pattern of the radio wave emitted by the second circuit unit 64, and the first heat-conducting metal film and the second heat-conducting metal film may form an electromagnetic wave protection function in a predetermined direction and angle range by using the spatial arrangement of the electronic device.
The third embodiment is obtained by changing the first embodiment and the second embodiment, and the third embodiment has the same structure as the first embodiment and the second embodiment, and the description thereof will not be repeated; as shown in fig. 4, the third embodiment is different from the first and second embodiments in that the first polymer film 12 of the first flexible substrate structure forms a first circuit unit 62 and a second circuit unit 64 on a side facing away from the working fluid (not shown), the first circuit unit 62 is provided with a first circuit contact 622, the second circuit unit 64 is provided with a second circuit contact 642, so that the first circuit unit 62 and the second circuit unit 64 are respectively coupled to a control circuit (not shown) of the electronic device, the first circuit unit 62 is a coil through which a current for charging or discharging the electronic device passes, and the second circuit unit 64 is an antenna loop, and accordingly, the heat energy generated by the first circuit unit 62 and the second circuit unit 64 is respectively transmitted to the working fluid through the first flexible substrate structure, and is uniformly cooled by the working fluid.
Further, the first circuit unit 62 and the second circuit unit 64 are formed by etching conductive metal films, respectively.
Example four is obtained by changing example one, and the composition of example four is the same as that of example one, which is not repeated; as shown in fig. 5, the fourth embodiment is different from the first embodiment in that an insulating film 66 is formed on a side of the first circuit unit 62 opposite to the first flexible substrate structure 10, so as to protect the first circuit unit 62 from short circuit, and the insulating film 66 optionally does not cover the first circuit contact (not shown) of the first circuit unit 62, so as to prevent the insulating film 66 from affecting the convenience of coupling the first circuit unit 62 with a control circuit (not shown) of the electronic device.
Example five is obtained by changing the first example, and the fifth example has the same structure as the first example, and the description is forbidden; as shown in fig. 6, the fifth embodiment is different from the first embodiment in that a reinforcing film 23 is formed on the second polymer film 22 at a side opposite to the second heat-conductive metal film 21, and the reinforcing film 23 is made of a heat-conductive material, thereby reinforcing the strength of the second polymer film 22.
The reinforced film 23 is preferably made of a heat conductive metal; preferably, the height between the top edge of the first polymer film 12 and the bottom edge of the reinforcement film 23 is less than 2 mm.
Example six is obtained by changing the first example, and the composition of example six is the same as that of example one, which is not repeated; as shown in fig. 7, a sixth embodiment is different from the first embodiment in that a first circuit unit 62 is formed on a side of the first polymer film 12 of the first flexible substrate structure 10 facing away from the working fluid 30, the first circuit unit 62 is provided with a first circuit contact (not shown), a second circuit unit 64 is formed on a side of the second polymer film 22 of the second flexible substrate structure 20 facing away from the working fluid 30, the second circuit unit 64 is provided with a second circuit contact (not shown), so that the first circuit unit 62 and the second circuit unit 64 are respectively coupled to a control circuit (not shown) of the electronic device, the first circuit unit 62 is a coil through which a current for charging or discharging the electronic device passes, the second circuit unit 64 is an antenna loop, the heat energy generated by the first circuit unit 62 is transmitted to the working fluid 30 through the first flexible substrate structure 10, the working fluid 30 is used for temperature equalization and heat dissipation, and the heat energy generated by the second circuit unit 64 is transferred to the working fluid 30 through the second flexible substrate structure 20, and is used for temperature equalization and heat dissipation through the working fluid 30.
The first circuit unit 62 and the second circuit unit 64 are specific examples of circuit units, and those skilled in the art can select at least two quantities and forms of the conversion circuit unit according to the requirements, without limiting the coil and the antenna loop, and such alternatives can be easily conceived by those skilled in the art according to the present disclosure.
According to the foregoing, the utility model discloses can integrate electronic component and circuit unit to with the produced heat samming heat dissipation of electronic component and circuit unit, and can effectively improve electronic equipment's space utilization.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A thin temperature-uniforming plate with a circuit unit comprises a first flat flexible substrate structure and a second flat flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure oppositely surround a working fluid, the first flexible substrate structure and the second flexible substrate structure are combined through low-temperature hot melting or low-temperature sintering to form a seal edge, and the working fluid is hermetically filled between the first flexible substrate structure and the second flexible substrate structure;
the first flexible substrate structure forms a first heat-conducting metal film on one side facing the working fluid, and the second flexible substrate structure forms a second heat-conducting metal film on one side facing the working fluid;
a wicking structure is arranged between the first flexible substrate structure and the second flexible substrate structure, and at least two wicking spaces are formed between the first flexible substrate structure and the second flexible substrate structure;
the wicking structure is mainly composed of a mesh, at least two first copper columns and at least two second copper columns, wherein each first copper column is respectively formed on one side of the first heat-conducting metal film facing the working fluid, each second copper column is respectively formed on one side of the second heat-conducting metal film facing the working fluid, and the mesh is connected with each first copper column and each second copper column so as to form each wicking space;
the mesh is selected from the group consisting of metal mesh, polymer mesh, hydrophilic coating-wrapped mesh, and hydrophobic coating-wrapped mesh;
the first flexible substrate structure forms a first polymer film on the side back to the working fluid, the second flexible substrate structure forms a second polymer film on the side back to the working fluid, and the first polymer film and the second polymer film are respectively composed of insulating polymers with high thermal stability; the first polymer film forms a circuit unit at least partially on the side opposite to the working fluid, and the circuit unit is provided with circuit contacts.
2. The thin temperature-uniforming plate with circuit unit as claimed in claim 1, wherein the circuit unit is a coil for passing current for charging or discharging the electronic device.
3. The thin temperature-uniforming plate with circuit unit as claimed in claim 1, wherein the circuit unit is an antenna loop.
4. The thin temperature-uniforming plate with circuit unit as claimed in claim 1, wherein the first polymer film forms two circuit units on a side facing away from the working fluid, each circuit unit being an antenna loop and a coil for passing a current for charging or discharging the electronic device.
5. The thin temperature-uniforming plate with circuit unit as claimed in any one of claims 1 to 4, wherein the first polymer film and the second polymer film are respectively made of polyimide or modified polyimide or liquid crystal high molecular polymer.
6. The thin vapor chamber with circuit unit as claimed in claim 5, wherein the circuit unit is formed by etching a conductive metal film.
7. The thin temperature-uniforming plate with circuit unit as claimed in claim 5, wherein the circuit unit has an insulating film formed on a side thereof facing away from the first flexible substrate structure.
8. The thin temperature-uniforming plate with circuit unit as claimed in claim 1, wherein the second polymer film is formed with a reinforcing film on a side thereof facing away from the second heat-conductive metal film, the reinforcing film being made of a heat-conductive material.
9. The thin vapor chamber with circuit unit as claimed in claim 8, wherein the reinforcing film is made of a heat conductive metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920980564.4U CN210406014U (en) | 2019-06-27 | 2019-06-27 | Thin temperature-uniforming plate with circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920980564.4U CN210406014U (en) | 2019-06-27 | 2019-06-27 | Thin temperature-uniforming plate with circuit unit |
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| Publication Number | Publication Date |
|---|---|
| CN210406014U true CN210406014U (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920980564.4U Active CN210406014U (en) | 2019-06-27 | 2019-06-27 | Thin temperature-uniforming plate with circuit unit |
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| CN (1) | CN210406014U (en) |
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- 2019-06-27 CN CN201920980564.4U patent/CN210406014U/en active Active
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