TWM586788U - Temperature equalization plate with circuit unit - Google Patents

Abstract

The present invention provides a temperature-equalizing plate having a circuit unit, including a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively surround a working fluid, and the first A plurality of wicking spaces are formed between a flexible substrate structure and the second flexible substrate structure; the first flexible substrate structure at least partially forms a circuit unit on a side facing away from the working fluid.
Accordingly, the electronic component and the circuit unit are integrated, and the thermal energy generated by the electronic component and the circuit unit is evenly radiated, which effectively improves the space utilization rate of the electronic device.

Description

Temperature equalizing board with circuit unit

This creation relates to a thin heat-dissipating structure, and particularly to an innovative structure type revealer with a temperature equalizing plate having a circuit unit.

A temperature equalizing plate is a thermal energy transfer structure applied to electronic equipment, and includes a substrate and a cover plate connected to each other. A cavity is formed between the substrate and the cover plate, and a working fluid and a wick are provided inside the cavity. Structure, the working fluid is used to absorb and release thermal energy, the wicking structure is used to guide the flow of the working fluid, and the chamber forms a plurality of wicking spaces by the wicking structure. The substrate and the cover plate are respectively formed by A thermally conductive film, a polymer film, and an outer film are laminated, and the polymer film is formed between the metal film and the protective film, and the thermally conductive film of the substrate and the cover plate are respectively located facing the cavity. The side.

The temperature equalizing plate guides the working fluid to flow through the wicking structure, and cooperates with the working fluid to generate a phase change when it absorbs and releases heat, quickly and massively absorbing thermal energy, and quickly dispersing the thermal energy to form an average temperature.

For example, electronic components or circuit units such as processors, batteries, antennas, etc., will generate a large amount of thermal energy during operation. Various electronic devices such as mobile phones, tablets, and notebook computers are often seen at the same time with multiple electronic components that easily generate heat and Circuit unit, each of the electronic components and circuit units respectively forms a heat source inside the electronic equipment, and a temperature equalization plate is provided for each of the electronic components and circuit units that can generate a large amount of thermal energy, such as a processor, a battery, an antenna, etc. The temperature plate can uniformly diffuse the thermal energy generated by each electronic component and the circuit unit, so that the electronic device can operate.

The main purpose of this creation is to provide a temperature-equalizing board with circuit units. The technical problem to be solved is how to develop a type that can integrate multiple electronic components and circuit units, improve the space utilization of electronic equipment, and more A new type of temperature equalizing plate structure with ideal practicability is the goal to make an innovative breakthrough.

Based on the foregoing object, the present invention provides a temperature-equalizing plate having a circuit unit, which includes a flat first flexible substrate structure, a flat second flexible substrate structure, a working fluid, and a wicking structure, wherein The first flexible substrate structure and the second flexible substrate structure relatively surround the working fluid, and the first flexible substrate structure and the second flexible substrate structure are combined by low temperature hot melting or low temperature sintering to form an edge, and accordingly, Hermetically seal the working fluid between the first flexible substrate structure and the second flexible substrate structure;

The first flexible substrate structure forms a first thermally conductive metal film on a side facing the working fluid, and the first flexible substrate structure forms a first polymer film on a side facing away from the working fluid, the first polymer Thin film is made of insulating polymer with high thermal stability;

The second flexible substrate structure is a thin plate body made of metal;

The wicking structure is disposed between the first flexible substrate structure and the second flexible substrate structure, and a plurality of wicking spaces are formed between the first flexible substrate structure and the second flexible substrate structure;

The wicking structure is mainly composed of a mesh, a plurality of first copper pillars, and a plurality of second copper pillars. Each of the first copper pillars is respectively formed on a side of the first thermally conductive metal film facing the working fluid. Each of the second copper pillars is formed on a side of the flexible substrate structure facing the working fluid, and the mesh is connected to each of the first copper pillars and each of the second copper pillars, thereby forming each of the wicking spaces. ;

The mesh is selected from the group consisting of a metal mesh, a polymer mesh, a mesh coated with a hydrophilic coating, and a mesh coated with a hydrophobic coating;

The first polymer film further forms a circuit unit at least partially on a side facing away from the working fluid, and the circuit unit is provided with a circuit contact. According to this, the circuit unit is coupled to a control circuit of an electronic device. Improve the space utilization of the electronic equipment.

With this innovative and unique design, compared to the previous technology, this creation can integrate electronic components and circuit units, and uniformly dissipate the thermal energy generated by the electronic components and circuit units, effectively improving the space utilization of electronic equipment. Achieved practical and progressive.

The drawings show several practical and practical embodiments of the temperature-equalizing plate with circuit units in the present invention. However, these embodiments are for illustrative purposes only and are not limited by this structure in patent applications.

As shown in FIG. 1, the first embodiment of the temperature equalizing plate with circuit units in the present invention includes a flat first flexible substrate structure 10 and a flat second flexible substrate structure 20, a working fluid 30 and a The wicking structure 50, wherein the first flexible substrate structure 10 and the second flexible substrate structure 20 relatively surround the working fluid 30, and the first flexible substrate structure 10 and the second flexible substrate structure 20 are combined at the periphery to form an envelope. The edge 42 is configured to hermetically seal the working fluid 30 between the first flexible substrate structure 10 and the second flexible substrate structure 20.

The first flexible substrate structure 10 forms a first thermally conductive metal film 11 on a side facing the working fluid 30, and the first flexible substrate structure 10 forms a first polymer film 12 on a side facing away from the working fluid 30. The first thermally conductive metal film 11 is formed of a thermally conductive metal on the surface of the first polymer film 12. The first polymer film 12 is an insulating polymer with high thermal stability.

The second flexible substrate structure 20 is a thin plate made of metal, so that the thickness of the second flexible substrate structure 20 is t2, the thickness of the first thermally conductive metal film 11 is t1, and t2 = 2t1 to 2.5t1, further In particular, the thickness t2 of the second flexible substrate structure 20 is preferably 0.08 mm <t2 ≦ 0.22 mm, and the second flexible substrate structure 20 is selected from the group consisting of iron, titanium, aluminum, copper, and alloys of the foregoing metals and Made of a metal in stainless steel.

The first thermally conductive metal film 11 and the second flexible substrate structure 20 are thermally fusion-bonded at a low temperature of 170 ° C. to 350 ° C. to form the edge seal 42. The first thermally conductive metal film 11 and the second flexible The substrate structure 20 may also be sintered and combined at 250 ° C to 300 ° C to form the edge seal 42, and the working fluid 30 is hermetically sealed between the first flexible substrate structure 10 and the second flexible substrate structure 20. .

The wicking structure 50 is disposed between the first flexible substrate structure 10 and the second flexible substrate structure 20, and a plurality of wicking spaces are formed between the first flexible substrate structure 10 and the second flexible substrate structure 20. 44.

The wicking structure 50 is mainly composed of a mesh 51, a plurality of first copper pillars 52, and a plurality of second copper pillars 53, wherein each of the first copper pillars 52 is formed on the first thermally conductive metal film 11 toward the On one side of the working fluid 30, each of the second copper pillars 53 is formed on a side of the second flexible substrate structure 20 facing the working fluid 30, the mesh 51, each of the first copper pillars 52, and each of the first The two copper pillars 53 are connected to form each of the wicking spaces 42 accordingly.

The mesh 51 is selected from the group consisting of a metal mesh, a polymer mesh, a mesh coated with a hydrophilic coating, and a mesh coated with a hydrophobic coating. Further, the metal mesh is One or several types selected from copper mesh, stainless steel mesh, and copper clad mesh are used in combination.

The first polymer film 12 further forms a first circuit unit 62 on a side facing away from the working fluid 30. As shown in FIG. 2, the first circuit unit 62 is provided with a first circuit contact 622. A circuit unit 62 is coupled to a control circuit (not shown) of an electronic device through the first circuit contact 622. The first circuit unit 62 is a coil through which a current for charging or discharging the electronic device is passed. Therefore, when the first circuit unit 62 is located in a magnetic field environment, the first circuit unit 62 can form an induced current, and the induced current is used as a current for charging a secondary battery (not shown) of the electronic device. When the secondary battery provides a discharge current to pass through the first circuit unit 62, the first circuit unit 62 generates a magnetic field, and can wirelessly charge other electronic devices.

A current passes through the first circuit unit 62 such that the first circuit unit 62
When the temperature is increased, the thermal energy generated by the first circuit unit 62 is transmitted to the working fluid 30 through the first flexible substrate structure 10, and the working fluid 30 dissipates heat at a uniform temperature.

The first thermally conductive metal film 11 and the second flexible substrate structure 20 can shield the electromagnetic waves generated when a current passes through the first circuit unit 62. Using the space arrangement of the electronic device can make the first thermally conductive The metal film 11 and the second flexible substrate structure 20 form an electromagnetic wave protection effect in a predetermined direction and an angular range.

In the first embodiment, the second flexible substrate structure 20 may be used to install an electronic component (not shown in the figure) of the electronic device. The electronic component may be an arithmetic unit, a processor, a battery, or other electronic components that are easy to generate heat. At this time, The second flexible substrate structure 20 is in close contact with the heat-dissipating surface of the electronic component, and the thermal energy generated by the electronic component is transmitted to the working fluid 30 through the second flexible substrate structure 20, and the working fluid 30 is uniformly radiated.

In the first embodiment, a portion of the first flexible substrate structure 10 where the first circuit unit 62 is not formed may be in contact with another electronic component (not shown) that is liable to generate heat. The thermal energy generated by another electronic component is transferred to the working fluid 30, and the working fluid 30 dissipates heat evenly.

Further, the first polymer film 12 is made of polyimide (commonly referred to as PI) or modified polyimide (commonly referred to as MPI) or liquid crystal polymer (Liquid Crystal Polymer, (Commonly known as LCP).

Since the first flexible substrate structure 10 is mainly composed of the first thermally conductive metal film 11 and the first polymer film 12, the first flexible substrate structure 10 has characteristics of being able to be flexibly deformed to a small extent, so as to cooperate with the second flexibility. The thickness t2 of the substrate structure 20 is 0.08 mm <t2 ≦ 0.22 mm. The second flexible substrate structure 20 also has the characteristics of being able to be flexibly deformed to a small extent. According to this, the first flexible substrate structure 10 or the second flexible substrate structure When the 20 is attached to the heat-dissipating surface of the electronic component, the first flexible substrate structure 10 or the second flexible substrate structure 20 can closely fit the heat-dissipating surface according to the shape of the heat-dissipating surface; In other words, the first flexible substrate structure 10 and the second flexible substrate structure 20 each have characteristics of being able to be flexibly deformed to a small extent, so that the first flexible substrate structure 10 or the second flexible substrate structure 20 can meet the space requirements of electronic equipment. Moderate deformation.

The second embodiment is obtained by changing the first embodiment. The second embodiment has the same structure as the first embodiment, and will not be described repeatedly. As shown in FIG. 3, the structure of the second embodiment is different from that of the first embodiment mainly in that the first The first polymer film 12 of the flexible substrate structure forms a second circuit unit 64 on the side facing away from the working fluid (not shown). The second circuit unit 64 is provided with a second circuit contact 642. The second circuit unit 642 is coupled to a control circuit (not shown) of an electronic device through the second circuit contact 642. The second circuit unit 64 is an antenna circuit. Accordingly, when the second circuit unit 64 When transmitting or receiving a radio wave signal, a current passes through the second circuit unit 64, which causes the second circuit unit 64 to heat up and generate heat. The thermal energy generated by the second circuit unit 64 is transmitted to the working fluid through the first flexible substrate structure. The working fluid dissipates heat at a uniform temperature.

Further, when the second circuit unit 64 is an antenna circuit, the first thermally conductive metal film (not shown) of the first flexible substrate structure can form the ground of the second circuit unit 64, and the first thermally conductive metal The film and the second flexible substrate structure (not shown) can shield the electromagnetic waves formed by the radio waves emitted by the second circuit unit 64, thereby adjusting the field type of the radio waves emitted by the second circuit unit 64, and using the electronic device The space arrangement arrangement can make the first thermally conductive metal film and the second flexible substrate structure form electromagnetic wave protection effect in a preset direction and angle range.

The third embodiment is obtained by changing the first and second embodiments. The third embodiment is the same as the first and second embodiments, and will not be described repeatedly. As shown in FIG. 4, the third embodiment is different from the first embodiment. The structure of the first and second embodiments is mainly that the first polymer film 12 of the first flexible substrate structure forms a first circuit unit 62 and a second circuit unit 64 on the side facing away from the working fluid (not shown). The first circuit unit 62 is provided with a first circuit contact 622, and the second circuit unit 64 is provided with a second circuit contact 642. According to this, the first circuit unit 62 and the second circuit unit 64 are respectively connected with the electronic device. A control circuit (not shown) is coupled. The first circuit unit 62 is a coil through which the current of the electronic device is charged or discharged, and the second circuit unit 64 is an antenna circuit. Accordingly, the first circuit The thermal energy generated by the unit 62 and the second circuit unit 64 is transmitted to the working fluid through the first flexible substrate structure, and the working fluid dissipates heat evenly.

Further, the first circuit unit 62 and the second circuit unit 64 are respectively formed by etching a conductive metal film.

The fourth embodiment is obtained by changing the first embodiment. The fourth embodiment has the same structure as the first embodiment, and will not be described repeatedly. As shown in FIG. 5, the fourth embodiment is different from the first embodiment in that the first An insulating film 66 is formed on the circuit unit 62 on the side facing away from the first flexible substrate structure 10, thereby protecting the first circuit unit 62 from forming a short circuit, and the insulating film 66 may choose not to cover the first circuit unit 62 as required. The first circuit contact (not shown) prevents the insulating film 66 from affecting the convenience of coupling the first circuit unit 62 with a control circuit (not shown) of an electronic device.

Further, the height between the top edge of the first polymer film 12 and the bottom edge of the second flexible substrate structure of the first flexible substrate structure is preferably less than 2 mm.

The first circuit unit 62 and the second circuit unit 64 are specific examples of the circuit unit respectively. According to the foregoing description, a person skilled in the art may select the number and form of the circuit unit as needed, and does not use the coils and antenna circuits listed above as However, these replacement options are easily conceivable by those skilled in the art based on this creative description.

According to the foregoing, this creation can integrate electronic components and circuit units, and evenly dissipate the thermal energy generated by the electronic components and circuit units, which can effectively improve the space utilization of electronic equipment.

10‧‧‧ first flexible substrate structure 11‧‧‧ first thermally conductive metal film 12‧‧‧ first polymer film 20‧‧‧ second flexible substrate structure 30‧‧‧ working fluid 42‧‧‧ edge banding 44‧ ‧‧Wicking space 50‧‧‧Wicking structure 51‧‧‧Mesh 52 · ‧‧First copper post 53 · ‧‧Second copper post 62‧‧‧First circuit unit 622‧‧‧First circuit Contact 64‧‧‧Second circuit unit 642‧‧‧Second circuit contact 66‧‧‧Insulation film

Fig. 1 is a sectional view of the first embodiment of the present invention.
Figure 2 is a top view of the first embodiment of the present invention, showing the circuit of the first circuit unit.
Figure 3 is a top view of the second embodiment of the present invention, showing the circuit of the second circuit unit.
Figure 4 is a top view of the third embodiment of the present invention, showing the circuits of the first circuit unit and the second circuit unit.
Fig. 5 is a sectional view of the fourth embodiment of the present invention.

Claims (9)

A temperature-equalizing plate having a circuit unit is composed of a flat first flexible substrate structure, a flat second flexible substrate structure, a working fluid, and a wicking structure, wherein the first flexible substrate structure and the first flexible substrate structure Two flexible substrate structures surround the working fluid relatively, and the first flexible substrate structure and the second flexible substrate structure are combined by low temperature hot melting or low temperature sintering to form an edge, and the working fluid is hermetically sealed in the first fluid substrate. Between a flexible substrate structure and the second flexible substrate structure;
The first flexible substrate structure forms a first thermally conductive metal film on a side facing the working fluid, and the first flexible substrate structure forms a first polymer film on a side facing away from the working fluid, the first polymer Thin film is made of insulating polymer with high thermal stability;
The second flexible substrate structure is a thin plate body made of metal;
The wicking structure is disposed between the first flexible substrate structure and the second flexible substrate structure, and a plurality of wicking spaces are formed between the first flexible substrate structure and the second flexible substrate structure;
The wicking structure is mainly composed of a mesh, a plurality of first copper pillars, and a plurality of second copper pillars. Each of the first copper pillars is respectively formed on a side of the first thermally conductive metal film facing the working fluid. Each of the second copper pillars is formed on a side of the flexible substrate structure facing the working fluid, and the mesh is connected to each of the first copper pillars and each of the second copper pillars, thereby forming each of the wicking spaces. ;
The mesh is selected from the group consisting of a metal mesh, a polymer mesh, a mesh coated with a hydrophilic coating, and a mesh coated with a hydrophobic coating;
The first polymer film further forms a circuit unit at least partially on a side facing away from the working fluid, and the circuit unit is provided with a circuit contact. According to this, the circuit unit is coupled to a control circuit of an electronic device. Improve the space utilization of the electronic equipment. The temperature equalizing plate with a circuit unit according to item 1 of the scope of the patent application, wherein the circuit unit is a coil through which a current for charging or discharging an electronic device is passed, and the circuit unit is uniformly cooled by the working fluid according to the temperature. The temperature-equalizing plate with a circuit unit according to item 1 of the scope of the patent application, wherein the circuit unit is an antenna circuit, and the circuit unit is radiated by the working fluid at an even temperature. As described in item 1 of the patent application, the temperature-equalizing plate with a circuit unit, wherein the first polymer film forms two circuit units on a side facing away from the working fluid, and each circuit unit is an antenna circuit and A coil that provides a current for charging or discharging the electronic equipment, according to which each circuit unit is cooled by the working fluid evenly. The temperature-equalizing plate with circuit units according to any one of claims 1 to 4, wherein the first polymer film is made of polyimide or modified polyimide or liquid crystal polymer . The temperature-equalizing plate with a circuit unit according to item 5 of the scope of the patent application, wherein the circuit unit is formed by etching a conductive metal film. The temperature-equalizing plate with a circuit unit according to item 5 of the scope of the patent application, wherein the circuit unit forms an insulating film on a side facing away from the first flexible substrate structure, thereby protecting the circuit unit from forming a short circuit. As described in item 1 of the patent application, the temperature-equalizing plate with circuit units, wherein the thickness of the second flexible substrate structure is t2, and the thickness of the first thermally conductive metal film is t1, t2 = 2t1 to 2.5t1. The temperature-equalizing plate with a circuit unit according to item 1 or 8 of the scope of the patent application, wherein the thickness t2 of the second flexible substrate structure is 0.08 mm <t2 ≦ 0.22 mm.