CN210403663U

CN210403663U - Chip rotating device of destressing corrosion machine

Info

Publication number: CN210403663U
Application number: CN201920944405.9U
Authority: CN
Inventors: 李勇刚; 周浩; 刘凯; 李宗颖; 张萍
Original assignee: Hebei Guangchuang Electronic Technology Co Ltd
Current assignee: Hebei Guangchuang Electronic Technology Co Ltd
Priority date: 2019-05-22
Filing date: 2019-06-21
Publication date: 2020-04-24
Anticipated expiration: 2029-06-21

Abstract

The utility model belongs to the field of semiconductor chip processing equipment, in particular to a chip rotating device of a destressing corrosion machine, which solves the defect of uneven chip corrosion of the destressing corrosion machine in the prior art and comprises a flower basket, a wafer box supporting plate, a horizontal rotating shaft, a horizontal rotating gear, a chip rotating part, a motor, a vertical rotating shaft and a vertical rotating shaft bracket; the vertical rotating shaft is positioned in the cavity of the vertical rotating shaft support, the top end of the vertical rotating shaft is connected with the motor, and the bottom end of the vertical rotating shaft is provided with threads; the bottom end of the vertical rotating shaft is meshed with the horizontal rotating gear; the chip rotating member is the cam structure, the utility model discloses the structure can control chip and throw from top to bottom at the pivoted in-process, the better processing of the chip of being convenient for, and this structural seal is effectual, and the power part can not suffer to corrode long service life.

Description

Chip rotating device of destressing corrosion machine

Technical Field

The utility model belongs to semiconductor chip processing equipment field, concretely relates to chip rotary device of destressing corrosion machine.

Background

During the fabrication of semiconductor integrated circuits, semiconductor wafers are typically subjected to a number of process steps, such as film deposition, etching, polishing, etc. These process steps become important sites for contamination generation. In order to maintain the wafer surface clean and remove contaminants deposited on the wafer surface during the various process steps, the wafer surface after each process step must be cleaned. Therefore, the cleaning process becomes the most common process step in the integrated circuit fabrication process, and aims to effectively control the contamination level of each step to achieve the goal of each process step.

In the wet etching and wet cleaning processes, a large amount of chemical liquid is used, and the purpose of removing specific materials or removing pollutants is achieved by utilizing the corrosion characteristics of the chemical liquid. On single-chip wet equipment, a spraying arm structure is utilized to spray chemical liquid medicine to the surface of a rotating wafer, so that the aim of corrosion or cleaning is fulfilled.

The chip rotating mechanism of the existing destressing corrosion machine generally makes the chip and the rotating shaft perform concentric rotation work, namely, the chip is directly driven to rotate by the rotation of the motor. The mode of directly driving the wafer to rotate through the motor shaft has the defect that the processing quality of the wafer chip is influenced finally because the chip rotates concentrically all the time, the linear velocity of the rotating motion of the position of the chip close to the center of the circle is lower, and compared with the periphery of the chip, the central position of the chip is difficult to corrode, and the concentric rotation mode is adopted to move. Uneven corrosion on the surface of the wafer can directly affect the quality of the subsequent process, thereby causing the performance of an integrated circuit chip to be poor and the product yield to be reduced. Therefore, solving the problem of non-uniformity of chip etching is an urgent issue to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In order to solve the uneven defect of chip corrosion of the destressing corrosion machine among the prior art, the utility model provides a chip rotating device of the destressing corrosion machine of non-concentric rotation is done to spool box.

The utility model provides a technical scheme that its technical problem adopted as follows: a chip rotating device of a destressing corrosion machine comprises a flower basket, a wafer box supporting plate, a horizontal rotating shaft, a horizontal rotating gear, a chip rotating piece, a motor, a vertical rotating shaft, wherein the top end of the vertical rotating shaft is connected with the motor, and the bottom end of the vertical rotating shaft is provided with threads; the wafer box supporting plate is in a plate shape with hollow grooves, and the hollow grooves are positioned on two sides of the connecting part of the wafer box supporting plate and the vertical rotating shaft support; the bottom of the wafer box supporting plate is provided with a transverse rotating shaft groove, the horizontal rotating shaft is nested in the transverse rotating shaft groove, the horizontal rotating gear is positioned in the middle of the horizontal rotating shaft, and the bottom end of the vertical rotating shaft is meshed with the horizontal rotating gear; the flower basket is connected with the wafer box supporting plate in an inserting and embedding mode, the chip rotating piece is embedded on the horizontal rotating shaft, and the chip rotating piece is located below the flower basket.

The horizontal rotating shaft comprises a horizontal bearing and a horizontal shaft; the two ends of the horizontal bearing are nested in a transverse rotating shaft groove at the bottom of the wafer box supporting plate, the horizontal shaft is nested and fixed in the middle of the horizontal bearing, and the horizontal rotating gear is carved on the horizontal shaft and is a helical gear.

The vertical rotating shaft bracket is also included; the vertical rotating shaft support is in a column shape with a cavity and is perpendicular to the wafer box supporting plate, the bottom of the vertical rotating shaft support is fixedly connected with the wafer box supporting plate, the top end of the vertical rotating shaft support is connected with the motor, and the vertical rotating shaft is located in the cavity of the vertical rotating shaft support.

The chip rotating piece is of a cam structure, and the cam structure preferably has any one of a long strip and an eccentric wheel with circular arcs at two ends; the cam structure is preferably a structure formed by combining two semicircles with the same diameter and rectangular width at two rectangular ends.

The chip rotating device of the stress-relief etching machine also comprises a bottom rotating shaft gland, wherein the bottom rotating shaft gland is fixed at the bottom end of the supporting plate of the wafer box and at a position opposite to the transverse rotating shaft groove; the bottom rotating shaft gland further limits the operation of the horizontal rotating shaft and plays a role in fixing. Furthermore, the bottom rotating shaft gland and the transverse rotating shaft groove form a circular ring-shaped cavity, the number of the bottom rotating shaft gland and the number of the transverse rotating shaft groove are two, the two bottom rotating shaft gland and the two transverse rotating shaft groove are respectively positioned at two ends of the bottom of the wafer box supporting plate, and two ends of the horizontal rotating shaft are positioned in the cavity formed by the bottom rotating shaft gland and the transverse rotating shaft groove.

The horizontal rotating shaft is characterized by further comprising fixed shaft tile covers, wherein the fixed shaft tile covers are nested on the outer walls of two ends of the horizontal rotating shaft, and two ends of the horizontal rotating shaft are protected from rotating smoothly in a cavity formed by the bottom rotating shaft gland and the transverse rotating shaft groove.

The hollow-out groove is a groove with the width larger than the maximum diameter of the chip rotating piece.

Still include the basket of flowers recess, the basket of flowers recess is located the spool box layer board, and in the recess on the spool box layer board was put into to the basket of flowers at the during operation, the recess was strictly according to basket of flowers size design, and the basket of flowers nestification can not appear droing or shifting when moving in the recess.

The beneficial effects of the utility model reside in that:

the utility model discloses among the chip rotary device of destressing corrosion machine, the rotatory gear revolve that drives drive mechanism of motor to rotary mechanism in the drive mechanism rotates, finally drives the spool box and does non-concentric rotary motion. The utility model discloses an improve mechanical structure and make the chip do with the rotation of rotation axis decentraction, and do the throwing about rotatory in-process and move, all have the linear velocity when making the not radius department of chip rotatory to guarantee that the chip ization plates evenly.

The utility model discloses among the chip rotary device of destressing corrosion machine, adopt vertical axis of rotation and horizontal axis of rotation to mutually support, it is rotatory to drive the chip rotating member to drive the mode that the chip rotated and the up-and-down motion and carry out work, such structure makes power unit can keep away from the liquid that has the corrosivity, guarantees whole smooth and easy operation of mechanism and guarantees whole mechanism's life.

Drawings

FIG. 1 is a schematic structural view of example 1;

in the figure: 1-flower basket, 2-horizontal rotating shaft, 3-bottom rotating shaft gland, 4-chip rotating member, 6-chip, 7-box supporting plate, 11-motor, 9-vertical rotating shaft and 15-transverse rotating shaft groove;

FIG. 2 is a schematic view of the structure of the bottom surface of embodiment 1;

8-horizontal bearing; 5-a horizontal shaft, 3-a bottom rotating shaft gland, 4-a chip rotating piece, 7-a wafer box supporting plate and 10-a horizontal rotating tooth;

FIG. 3 is a schematic view of the operation principle of the chip rotating device of the present invention;

fig. 4 is a schematic structural view of a chip rotator according to embodiment 2.

Detailed Description

Embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Example 1:

referring to fig. 1-3, the chip rotating device of the present embodiment of the corrosion removing machine is schematically shown in structure:

a chip rotating device of a destressing corrosion machine comprises a flower basket 1, a wafer box supporting plate 7, a horizontal rotating shaft 2, a horizontal rotating gear, a chip rotating part 4, a motor 11, a vertical rotating shaft 9 and a vertical rotating shaft support 13; the vertical rotating shaft support 13 is in a column shape with a cavity, is perpendicular to the wafer box supporting plate 7, is fixedly connected with the wafer box supporting plate 7 at the bottom, the top end of the vertical rotating shaft support 13 is connected with the motor 11, the vertical rotating shaft 9 is positioned in the cavity of the vertical rotating shaft support 13, the top end of the vertical rotating shaft support is connected with the motor 11, and the bottom end of the vertical rotating shaft support is provided with threads; the wafer box supporting plate 7 is in a plate shape with hollow grooves, and the hollow grooves are positioned on two sides of the connecting part of the wafer box supporting plate 7 and the vertical rotating shaft support; the bottom of the wafer box supporting plate 7 is provided with a transverse rotating shaft groove 15, the horizontal rotating shaft 2 is nested in the transverse rotating shaft groove 15, the horizontal rotating gear 10 is positioned in the middle of the horizontal rotating shaft 2, and the bottom end of the vertical rotating shaft is meshed with the horizontal rotating gear; the flower basket 1 is connected with the wafer box supporting plate 7 in an inserting and embedding mode, the chip rotating piece 4 is embedded on the horizontal rotating shaft 2, and the chip rotating piece 4 is located below the flower basket 1.

The horizontal rotating shaft 2 comprises a horizontal bearing 8 and a horizontal shaft 5; the two ends of the horizontal bearing are nested in a transverse rotating shaft groove at the bottom of the wafer box supporting plate 7, the horizontal shaft is nested and fixed in the middle of the horizontal bearing, and the horizontal rotating gear is carved on the horizontal shaft and is a helical gear.

The chip rotating part 4 is of a cam structure, and the cam structure preferably has any one of a long strip and an eccentric wheel with circular arcs at two ends; the cam structure is preferably a structure formed by combining two semicircles with the same diameter and rectangular width at two rectangular ends.

A chip rotating device of a destressing corrosion machine further comprises a bottom rotating shaft gland 3, wherein the bottom rotating shaft gland 3 is fixed at the bottom end of a wafer box supporting plate 7 and at a position opposite to a transverse rotating shaft groove; the bottom shaft gland 3 further restricts the operation of the horizontal rotation shaft 2 and plays a role of fixing. Furthermore, the bottom rotating shaft gland 3 and the transverse rotating shaft groove form a circular cavity, the number of the bottom rotating shaft gland 3 and the number of the transverse rotating shaft groove are two, the two bottom rotating shaft gland 3 and the two transverse rotating shaft groove are respectively positioned at two ends of the bottom of the wafer box supporting plate 7, and two ends of the horizontal rotating shaft 2 are positioned in the cavity formed by the bottom rotating shaft gland 3 and the transverse rotating shaft groove.

The horizontal rotating shaft is characterized by further comprising a fixed shaft tile cover 12, wherein the fixed shaft tile cover is nested on the outer walls of two ends of the horizontal rotating shaft 2, and the two ends of the horizontal rotating shaft 2 are protected to rotate smoothly in a cavity formed by the bottom rotating shaft gland 3 and the transverse rotating shaft groove.

The hollow groove 14 is a groove having a width larger than the maximum diameter of the chip rotary 4. Of course, the width of the hollow-out groove 14 can be determined by the distance between the chip rotating member 4 and the hollow-out groove, and the width of the hollow-out groove 14 is greater than the minimum diameter of the chip rotating member 4, which can also realize the function of the present invention, however, the width is greater than the maximum diameter of the chip rotating member 4, which is the most preferable scheme.

The utility model discloses chip rotary device structure motor of destressing corrosion machine is rotatory to drive mechanism's gear revolve to rotary mechanism in the drive mechanism rotates, finally drives the spool box and does non-concentric rotary motion. The utility model adopts the improved mechanical structure to lead the chip to rotate eccentrically with the rotating shaft, in the embodiment, (length-width)/2 of the chip rotating piece 4 is equal to the height difference of the chip motion; in the embodiment, the upper and lower 30mm throwing is carried out in the rotating process, so that linear velocities exist at different radiuses of the chip during rotation, and the uniformity of chip chemical plating is ensured. This embodiment is preferably applied to 4-8 inch chips.

Referring to fig. 3, the operation principle of the present invention is as follows:

as shown in the figure, the chip rotating piece 4 rotates to drive the chip to rotate non-concentrically, and the chip is thrown up and down simultaneously in the rotating process, so that the chip has linear velocity everywhere, and the chip can be guaranteed to be corroded uniformly.

The flower basket 1 is a common device in the prior art in the field, and is in an inverted trapezoid shape, the bottom end of the flower basket is open, and the transverse distance of the opening is smaller than the minimum width of the chip, so that the chip 6 can be stably placed in the flower basket 1 and can rotate in the flower basket 1 under the action of the chip rotating piece 4. The utility model discloses in the motor is the common equipment of this area in prior art, does not do here and gives unnecessary details. The horizontal rotary gear is depicted in the figures and the form of the vertical rotary shaft gear in mesh therewith is common knowledge in the prior art, or, depending on the form of the horizontal rotary gear, a person skilled in the art can select the gear in mating mesh therewith without any inventive effort.

In the case of the example 2, the following examples are given,

referring to fig. 4, the chip rotating member 4 is an eccentric wheel, and the rest is the same as embodiment 1.

Of course, the foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations are also considered to be the protection scope of the present invention.

Claims

1. A chip rotating device of a stress-relief etching machine is used for processing chips and is characterized in that: comprises a flower basket, a wafer box supporting plate, a horizontal rotating shaft, a horizontal rotating gear, a chip rotating piece, a motor and a vertical rotating shaft; the top end of the vertical rotating shaft is connected with the motor, and the bottom end of the vertical rotating shaft is provided with threads; the wafer box supporting plate is in a plate shape with hollow grooves, and the hollow grooves are positioned on two sides of the connecting part of the wafer box supporting plate and the vertical rotating shaft support; the bottom of the wafer box supporting plate is provided with a transverse rotating shaft groove, the horizontal rotating shaft is nested in the transverse rotating shaft groove, the horizontal rotating gear is positioned in the middle of the horizontal rotating shaft, and the bottom end of the vertical rotating shaft is meshed with the horizontal rotating gear; the flower basket is connected with the wafer box supporting plate in an inserting and embedding mode, the chip rotating piece is embedded on the horizontal rotating shaft, and the chip rotating piece is located below the flower basket.

2. The chip rotating apparatus of the stress-relief etching machine according to claim 1, wherein: the chip rotating piece is of a cam structure.

3. The chip rotating apparatus of the stress-relief etching machine according to claim 2, wherein: the cam structure is any one of a strip and an eccentric wheel with circular arcs at two ends.

4. The chip rotating apparatus of the stress-relief etching machine according to claim 3, wherein: the cam structure is a structure that two semicircular combinations with the same diameter and rectangular width are arranged at two rectangular ends.

5. The chip rotating apparatus of the stress-relief etching machine according to claim 1, wherein: still include bottom pivot gland, bottom pivot gland is fixed in spool box layer board bottom, the position relative with the transverse rotation axle groove.

6. The chip rotating apparatus of the stress-relief etching machine according to claim 5, wherein: the bottom rotating shaft gland and the transverse rotating shaft groove form a circular ring-shaped cavity, the two bottom rotating shaft glands and the two transverse rotating shaft grooves are respectively located at two ends of the bottom of the wafer box supporting plate, and two ends of the horizontal rotating shaft are located in the cavity formed by the bottom rotating shaft gland and the transverse rotating shaft groove.

7. The chip rotating apparatus of the stress-relief etching machine according to claim 6, wherein: the horizontal rotating shaft is characterized by further comprising fixed shaft tile covers, wherein the fixed shaft tile covers are nested on the outer walls of two ends of the horizontal rotating shaft and used for protecting two ends of the horizontal rotating shaft to rotate smoothly in a cavity formed by the bottom rotating shaft gland and the transverse rotating shaft groove.

8. The chip rotating apparatus of the stress-relief etching machine according to claim 1, wherein: the vertical rotating shaft support is in a column shape with a cavity, is perpendicular to the wafer box supporting plate, is fixedly connected with the wafer box supporting plate at the bottom, is connected with the motor at the top end and is positioned in the cavity of the vertical rotating shaft support.

9. The chip rotating apparatus of the stress-relief etching machine according to claim 1, wherein: the hollow-out groove is a groove with the width larger than the maximum diameter of the chip rotating piece.