CN210401764U - Heat radiation structure for optical module - Google Patents

Heat radiation structure for optical module Download PDF

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Publication number
CN210401764U
CN210401764U CN201921722087.8U CN201921722087U CN210401764U CN 210401764 U CN210401764 U CN 210401764U CN 201921722087 U CN201921722087 U CN 201921722087U CN 210401764 U CN210401764 U CN 210401764U
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optical module
fixedly connected
heat dissipation
casing
cavity
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CN201921722087.8U
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Chinese (zh)
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张彦
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Hubei Douniu Technology Co ltd
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Hubei Douniu Technology Co ltd
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Abstract

The utility model discloses a heat radiation structure for optical module relates to the electronic communication field. This heat radiation structure for optical module, which comprises a housin, the cavity has been seted up to the inside of casing, wiring mouth and connector have been seted up respectively to the both sides of casing, just wiring mouth and connector all are linked together with the cavity, fixedly connected with support frame on the diapire of cavity, the top fixedly connected with conducting strip of support frame, the louvre that link up from top to bottom is seted up to the support frame, the inside fixedly connected with ventilation net of casing roof, the cavity is linked together through ventilation net and external world, the top fixedly connected with radiator of casing, just the radiator sets up directly over ventilation net, the top fixedly connected with miniature fan of radiator. The heat dissipation structure for the optical module increases the contact area of air with an electronic element, so that the air can flow conveniently, and the internal air forms vertical convection, thereby greatly improving the heat dissipation efficiency of the optical module.

Description

Heat radiation structure for optical module
Technical Field
The utility model relates to an electronic communication technical field specifically is a heat radiation structure for optical module.
Background
The optical module is composed of an optoelectronic device, a functional circuit, an optical interface and the like, wherein the optoelectronic device comprises a transmitting part and a receiving part, the optical module is used for photoelectric conversion, a transmitting end converts an electric signal into an optical signal, and a receiving end converts the optical signal into the electric signal after the optical signal is transmitted through an optical fiber.
The optical module is usually bulky, and its heat dissipation has a problem consequently, and its inside electronic component of optical module commonly used closely offsets with the casing, even if be provided with radiator, because the unable circulation of inside air, can't form the convection current air, lead to the low of radiating efficiency, to prior art's not enough, the utility model discloses a heat radiation structure for optical module.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model discloses a heat radiation structure for optical module to solve the problem that proposes in the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a heat radiation structure for optical module, includes the casing, the cavity has been seted up to the inside of casing, wiring mouth and connector have been seted up respectively to the both sides of casing, just wiring mouth and connector all are linked together with the cavity, fixedly connected with support frame on the diapire of cavity, the top fixedly connected with conducting strip of support frame, the louvre that link up from top to bottom is seted up to the support frame, the inside fixedly connected with ventilation net of casing roof, the cavity is linked together through ventilation net and external world, the top fixedly connected with radiator of casing, just the radiator sets up directly over ventilation net, the top fixedly connected with miniature fan of radiator.
Preferably, the radiator includes two fixed blocks, two the diapire and the diapire of fixed block respectively fixed connection on the diapire of casing and miniature fan, two the welding has the connecting block between the fixed block, fixedly connected with heat dissipation tooth on the surface of connecting block.
Preferably, four supporting blocks are symmetrically welded to the bottom of the shell.
Preferably, the bottom wall of the shell is provided with a ventilation opening which is communicated up and down, a dust screen is arranged right below the ventilation opening, and the top of the dust screen is fixedly connected to the bottom wall of the shell.
Preferably, both sides of the shell are provided with elastic clamping pieces.
Preferably, the wiring interface is clamped with a dustproof cap.
The utility model discloses a heat radiation structure for optical module, its beneficial effect who possesses as follows:
1. this heat radiation structure for optical module blows in the casing with the external air through the miniature fan that sets up, and the air is at first through the heat dissipation tooth in the radiator, makes the great increase of air flow area through the heat dissipation tooth that sets up, lets the air of capacity pass through to cool down the air, then the inside that the cold air got into the casing through the ventilation net cools down the heat dissipation.
2. This heat radiation structure for optical module, through the conducting strip that sets up, absorb the heat that electronic component produced, and in the work of miniature fan, the cold air that drives gets into the inside of casing, cool down the heat, and the air passes through louvre and vent and discharges, through the support frame and the supporting shoe that set up, thereby make the electronic component of placing on the support frame and the diapire of cavity have the space, the diapire of casing also does not offset with the external world, thereby increased the area of contact with the air, be convenient for dispel the heat, and be convenient for the flow of air, the convection current of air about the easy formation, and then the radiating efficiency has been improved greatly.
3. According to the heat dissipation structure for the optical module, the dust screen is arranged, so that external dust and sundries are prevented from entering the shell, and the dust and sundries are prevented from entering the shell and damaging internal electronic components.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is an internal cross-sectional view of the housing 1 of the present invention;
fig. 3 is a schematic structural diagram of the heat sink of the present invention.
In the figure: the heat dissipation device comprises a shell 1, a wiring port 101, a connection port 102, a supporting block 103, a ventilation port 104, a dust screen 105, an elastic clamping sheet 106, a dust cap 107, a cavity 2, a supporting frame 201, a heat conducting sheet 202, a heat dissipation hole 203, a ventilation screen 204, a heat radiator 3, a fixing block 301, a connecting block 302, heat dissipation teeth 303 and a miniature fan 4.
Detailed Description
The embodiment of the utility model discloses heat radiation structure for optical module, as shown in fig. 1-3, including casing 1, cavity 2 has been seted up to casing 1's inside, and wiring mouth 101 and connector 102 have been seted up respectively to casing 1's both sides, and wiring mouth 101 and connector 102 all are linked together with cavity 2, install the electronic component, functional circuit and the optical interface of optical module in cavity 2, and be convenient for be connected with external device through the wiring mouth 101 and the connector 102 that set up.
More specifically, fixedly connected with support frame 201 on the diapire of cavity 2, the top fixedly connected with conducting strip 202 of support frame 201, the louvre 203 that link up from top to bottom is seted up to support frame 201, through setting up electronic component on conducting strip 202, thereby can absorb the heat that electronic component produced, and place electronic component on support frame 201 and cavity 2's diapire and have the space, the thermal discharge of being convenient for on the one hand, on the other hand has made things convenient for the flow of air, thereby make the upper and lower easy air convection that produces, and then great increase the radiating efficiency.
Further, the inside fixedly connected with ventilation net 204 of casing 1 roof, cavity 2 is linked together with the external world through ventilation net 204, the top fixedly connected with radiator 3 of casing 1, and radiator 3 sets up directly over ventilation net 204, the miniature fan 4 of top fixedly connected with of radiator 3, blow in the casing 1 with the outside air through the miniature fan 4 that sets up, and the air at first passes through radiator 3, through the radiator 3 that sets up, cool down to the air, then the inside that the cold air got into casing 1 through ventilation net 204 cools down the heat dissipation.
In this embodiment, the heat sink 3 includes two fixed blocks 301, the bottom wall and the top wall of two fixed blocks 301 are respectively fixed connection on the top wall of the casing 1 and the bottom wall of the micro fan 4, the welding has the connecting block 302 between two fixed blocks 301, fixedly connected with heat dissipation teeth 303 on the outer surface of the connecting block 302, make the great increase of air through-flow area through the heat dissipation teeth 303 that set up, let the sufficient air pass through, thereby cool down the air, send a large amount of cold air into the inside of the casing 1 when the micro fan 4 works, thereby the temperature of the electronic component inside the cavity 2 has been reduced.
Furthermore, four supporting blocks 103 are symmetrically welded at the bottom of the shell 1, a ventilation opening 104 which is through up and down is arranged on the bottom wall of the shell 1, a dust screen 105 is arranged right below the ventilation opening 104, and the top of the dust screen 105 is fixedly connected to the bottom wall of the housing 1, and through the four supporting blocks 103, so that the bottom wall of the shell 1 is not propped against the outside, the contact area between the shell 1 and the air is increased, the heat dissipation of the shell 1 is facilitated, the air flow is facilitated, when the micro fan 4 works, the heat is discharged through the heat dissipation holes 203 and the ventilation openings 104 under the driving of the cold air, the convection of the upper air and the lower air is easily formed, the heat dissipation efficiency is greatly improved, and through the dust screen 105, the external dust and sundries are prevented from entering the shell 1, and the dust and sundries are prevented from entering the shell 1 to damage the internal electronic components.
More specifically, casing 1's both sides all are provided with elasticity card 106, and wiring mouth 101 joint has dustproof cap 107, through the elasticity card 106 that sets up to be convenient for casing 1 and external device's installation and dismantlement, the clearance of being convenient for, and protect wiring mouth 101 through the dustproof cap 107 that sets up on the one hand, on the other hand has avoided dust debris to enter into casing 1's inside, causes the harm to its inside electronic component.
In addition, the micro-fan 4 may be a micro heat dissipation fan disclosed in publication No. CN102287384B, and the heat conductive sheet 202 may be a heat conductive silicone sheet disclosed in publication No. CN209085412U, and the above-mentioned kind of heat conductive silicone sheet is only one of them, and other various structures may be provided for adjustment and fastening.
The working principle is as follows: in the using process, firstly, the electronic element, the functional circuit and the optical interface of the optical module are arranged on the supporting frame 201 of the cavity 2, meanwhile, the electronic element is arranged on the top wall of the heat conducting sheet 202 and is tightly abutted against the heat conducting sheet 202, the dustproof cap 107 is drawn out, and then the wiring port 101 and the connecting port 102 are connected with an external device;
under the driving of the micro fan 4 in the working state, the outside air is brought into the shell 1, and the outside air firstly passes through the heat dissipation teeth 303 in the heat sink 3, the air flow area is greatly increased through the arranged heat dissipation teeth 303, and sufficient air passes through the heat dissipation teeth 303 to cool the air, and then the cold air enters the shell 1 after passing through the ventilation net 204 to cool and dissipate the heat;
meanwhile, the electronic component of the working state generates a large amount of heat, and is absorbed by the heat-conducting strip 202 which is tightly abutted against the electronic component, at this moment, in the work of the micro fan 4, the driven cold air enters the inside of the shell 1, the heat-conducting strip 202 and the electronic component are cooled, then the air is discharged through the heat-radiating holes 203 and the ventilation openings 104, and the air passes through the supporting frame 201 and the supporting block 103 which are arranged, so that the electronic component placed on the supporting frame 201 and the bottom wall of the cavity 2 have gaps, the bottom wall of the shell 1 is not abutted against the outside, so that the contact area between the electronic component and the shell 1 and the air is increased, thereby facilitating the heat dissipation, facilitating the air flowing, easily forming the convection of the air from top to bottom, and further greatly improving the heat-radiating efficiency.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A heat radiation structure for an optical module comprises a shell (1), and is characterized in that: a cavity (2) is arranged in the shell (1), a wiring port (101) and a connecting port (102) are respectively arranged on two sides of the shell (1), and the wiring port (101) and the connecting port (102) are both communicated with the cavity (2), the bottom wall of the cavity (2) is fixedly connected with a support frame (201), the top of the support frame (201) is fixedly connected with a heat-conducting fin (202), the supporting frame (201) is provided with a heat dissipation hole (203) which is communicated up and down, the inside of the top wall of the shell (1) is fixedly connected with a ventilation net (204), the cavity (2) is communicated with the outside through a ventilation net (204), the top of the shell (1) is fixedly connected with a radiator (3), and the radiator (3) is arranged right above the ventilation net (204), and the top of the radiator (3) is fixedly connected with a micro fan (4).
2. The heat dissipation structure for an optical module according to claim 1, wherein: radiator (3) include two fixed blocks (301), two the diapire and the diapire of roof fixed connection respectively of fixed block (301) are on the roof of casing (1) and the diapire of miniature fan (4), two the welding has connecting block (302) between fixed block (301), fixedly connected with heat dissipation tooth (303) on the surface of connecting block (302).
3. The heat dissipation structure for an optical module according to claim 1, wherein: four supporting blocks (103) are symmetrically welded at the bottom of the shell (1).
4. The heat dissipation structure for an optical module according to claim 1, wherein: the ventilating opening (104) that link up from top to bottom is seted up to the diapire of casing (1), be provided with dust screen (105) under ventilating opening (104), and the top fixed connection of dust screen (105) is on the diapire of casing (1).
5. The heat dissipation structure for an optical module according to claim 1, wherein: elastic clamping pieces (106) are arranged on two sides of the shell (1).
6. The heat dissipation structure for an optical module according to claim 1, wherein: the wiring port (101) is clamped with a dustproof cap (107).
CN201921722087.8U 2019-10-15 2019-10-15 Heat radiation structure for optical module Active CN210401764U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921722087.8U CN210401764U (en) 2019-10-15 2019-10-15 Heat radiation structure for optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921722087.8U CN210401764U (en) 2019-10-15 2019-10-15 Heat radiation structure for optical module

Publications (1)

Publication Number Publication Date
CN210401764U true CN210401764U (en) 2020-04-24

Family

ID=70343773

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921722087.8U Active CN210401764U (en) 2019-10-15 2019-10-15 Heat radiation structure for optical module

Country Status (1)

Country Link
CN (1) CN210401764U (en)

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