CN210394505U - Variable magnetic field cathode device of magnetron sputtering device - Google Patents
Variable magnetic field cathode device of magnetron sputtering device Download PDFInfo
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- CN210394505U CN210394505U CN201920866102.XU CN201920866102U CN210394505U CN 210394505 U CN210394505 U CN 210394505U CN 201920866102 U CN201920866102 U CN 201920866102U CN 210394505 U CN210394505 U CN 210394505U
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- magnetic field
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- water cooler
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- bulge
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- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 19
- 239000010935 stainless steel Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000013077 target material Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000012803 optimization experiment Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- 238000004088 simulation Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
A variable magnetic field cathode device of a magnetron sputtering device is characterized in that the back surface of a water cooler is sequentially divided into a center area, a middle area and an outer area from the center to the edge, and the middle part of the back surface of the water cooler is provided with a circular bulge; a cake-shaped main coil with the radius equal to that of the copper back plate is arranged in a gap between the bulge and the front surface of the stainless steel cover; a cake-shaped core coil is arranged between the back part of the water cooler in the bulge and the main coil, and a cake-shaped external coil is arranged between the back part of the water cooler outside the bulge and the main coil. The device can realize stepless regulation of the magnetic field intensity of the target surface, and the radial magnetic field intensity of the target surface is uniformly distributed, and the utilization rate of the target material is high; the method for performing the parameter optimization experiment of the magnetron sputtering coating has high efficiency and low cost, and the obtained experimental data is more complete and accurate and has high precision.
Description
Technical Field
The utility model relates to a component of a magnetron sputtering coating device, in particular to a cathode device of a magnetron sputtering coating device.
Background
Magnetron sputtering is a main technology for preparing films in current industrial production, is widely applied to electronic and information industries, such as liquid crystal storage, liquid crystal displays, integrated circuits, electronic control devices and the like, can also be applied to the field of glass coating, and can also be applied to industries of wear-resistant materials, corrosion-resistant materials, high-grade decorative articles and the like.
Before the film products are produced in batches in various industries, various sputtering parameters are always adjusted to obtain the optimized process conditions. These parameters include mainly sputtering power, substrate temperature, sputtering gas pressure and magnetic field strength. The sputtering power and the substrate temperature of the magnetron sputtering equipment can be changed by adjusting the parameters of the power supply, the sputtering gas pressure can be changed by adjusting the gas flow rate, and the parameters are convenient and simple to adjust. The magnetic field regulation of the magnetron sputtering equipment is inconvenient and difficult: the magnetic field of the magnetron sputtering equipment is mostly provided by using a permanent magnet, and the permanent magnet behind the target needs to be removed and another batch of permanent magnets needs to be replaced again when the magnetic field needs to be changed; the disassembly and replacement work amount is large, and time and labor are wasted; the vacuum system may also be damaged by the disassembly and replacement process. The magnetic field intensity and the number of the permanent magnets are limited, and the adjusting range is limited. And stepless, continuous adjustment of the magnetic field strength cannot be achieved. In a word, the magnetic field intensity of the magnetron sputtering equipment is difficult to adjust, time and labor are wasted, the adjusting range is small, and the precision is low; the experimental efficiency of the parameter optimization of the magnetron sputtering coating is low, and the cost is high.
In addition, although a small amount of magnetron sputtering equipment adopts an electromagnetic cathode target, namely, a central electromagnetic (excitation) coil is arranged at the center of the back surface of the copper back plate, a middle electromagnetic coil is arranged outside the central electromagnetic coil, and the middle electromagnetic coil is reversely connected in series with the central electromagnetic coil to form a balance coil; an external electromagnetic coil (unbalanced coil) is arranged outside the middle electromagnetic coil. By adjusting the current of the three electromagnetic coils, the magnetic field intensity of the working surface (target surface) of the copper back plate can be continuously adjusted. However, the central electromagnetic coil and the central electromagnetic coil are reversely connected in series, the directions of magnetic lines of force of the central electromagnetic coil and the central electromagnetic coil are the same, the magnetic field intensity is multiplied after superposition, a large magnetic field peak value can be formed at the center of the target surface, but the magnetic field peak value is rapidly reduced outside the center, and a small magnetic field peak value can be formed at the radial outer position of the target surface near the outer electromagnetic coil. In conclusion, the target surface radial magnetic field distribution curve is a steep one-large two-small three-peak curve, which results in poor radial magnetic field distribution uniformity of the target surface. The magnetic field intensity at the center of the target surface is too high, the center of the target material is quickly etched and penetrated, the target material is quickly replaced, and the utilization rate of the target material is lower; the cost of magnetron sputtering coating is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a variable magnetic field cathode device of a magnetron sputtering device, which can realize the continuous stepless adjustment of the magnetic field intensity of a target surface, and the radial magnetic field intensity of the target surface is evenly distributed and the target utilization rate is high; the method for performing the parameter optimization experiment of the magnetron sputtering coating has high efficiency and low cost, and the obtained experimental data is more complete and accurate and has high precision.
The utility model adopts the technical scheme that the variable magnetic field cathode device of the magnetron sputtering device comprises a disc-shaped copper back plate, a target material is fixed in a groove on the front side of the copper back plate through a target support, the back edge of the copper back plate is attached to the cover edge of a cylindrical stainless steel cover, the outer peripheral surface of the stainless steel cover is in threaded connection with the inner side wall of the annular target cover, and the target cover is sleeved on the target support; a stainless steel water cooler is arranged in the inner cavity of the stainless steel cover and is fixed on the back of the copper back plate; the method is characterized in that:
the back surface of the water cooler is sequentially divided into a center area, a middle area and an outer area from the center to the edge, and the middle part of the back surface of the water cooler is provided with an annular bulge; a cake-shaped main coil with the radius equal to that of the copper back plate is arranged in a gap between the top of the bulge and the front surface of the stainless steel cover; a cake-shaped core coil is arranged between the back part of the water cooler in the bulge and the main coil, and a cake-shaped external coil is arranged between the back part of the water cooler outside the bulge and the main coil.
The utility model discloses a working process and principle are:
the circulating cooling water in the water cooler cools the target through the copper back plate with high heat conductivity coefficient and cools the core coil, the external coil and the main coil.
After the main coil distributed in the whole area of the back of the copper back plate is connected with current, an arc main magnetic field is formed in the whole area of the front of the copper back plate, and main magnetic force for restraining plasma in front of a target is generated, so that the plasma bombards a cathode target, and atoms or ions of the sputtered target fly to a substrate to form a film. Meanwhile, when the core coil and the external coil are electrified with currents with different intensities, a core auxiliary magnetic field and an external auxiliary magnetic field are generated; the main magnetic field, the core auxiliary magnetic field and the external auxiliary magnetic field are superposed to form a magnetic field which is uniformly distributed in the radial direction in the whole target area on the front surface of the copper back plate, the magnetic force of each part of the target is uniform, and each part of the target is uniformly utilized.
Compared with the prior art, the beneficial effects of the utility model are that:
firstly, the main body of the restricted magnetic field provided by the device of the utility model is provided by a cake-type main body coil distributed in the whole area of the back of the target surface; through the control of the current introduced into the main coil, the stepless, large-range and continuous adjustment of the intensity of the sputtering magnetic field can be conveniently and accurately realized. The efficiency of the parameter optimization experiment for magnetron sputtering coating is high, and the obtained experimental data are more complete and accurate and have high precision.
Theoretical analysis and test show that: the magnetic lines of force of the pie-shaped main body coil distributed in the whole area of the back of the target surface start from the center of the target surface, diverge to the outside of the target surface and then return to the center of the target surface; the magnetic force lines are distributed and concentrated in the central area in the radial direction of the target surface (the radius direction of the target surface), and are less distributed in the central area and the outer area in the radial direction of the target surface (the radius direction of the target surface), so that the magnetic field intensity is unevenly distributed in the radial direction of the target surface, the central area is strong, and the central area and the outer area are weak. The utility model adds the cake-type core coil and the external coil in the core area and the external area on the back of the target surface, the magnetic fields generated by the core coil and the external coil are respectively and intensively distributed in the radial core area and the external area of the target surface, and the magnetic field intensity of the radial core area and the external area of the target surface is reinforced; by adjusting the combination proportion relation of the current passing through the core coil, the external coil and the main body coil, the radial magnetic field intensity of each area of the target surface can be basically equal, namely the radial magnetic field intensity of the whole area of the target surface is uniformly distributed. The consumption speed of the target material in each area of the target surface is uniform, and the utilization rate of the target material is high; the experimental cost of the magnetron sputtering coating parameter optimization experiment can be effectively reduced.
Further, the utility model discloses a radial length homogeneous phase of core coil, arch and external coil equals.
Therefore, the processing and the manufacturing are convenient, and the calculation and the adjustment of the current and magnetic field distribution combination relation of the core coil, the external coil and the main coil are also convenient.
Furthermore, the utility model discloses a be equipped with insulating backing plate between main part coil and the stainless steel cover.
Thus, even if the coil current leaks, the external part of the equipment is not electrified, and the safety of the equipment is ensured.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field in the radial direction of the target surface after the magnetic field of the core coil, the magnetic field of the external coil, the magnetic field of the main body coil and the three coils are superimposed, in the diagram, a curve strung by a symbol "△" is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field of the core coil, a curve strung by a symbol "○" is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field of the external coil, a curve of a dotted line is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field of the main body coil, and a curve of a solid line is a simulation diagram of normalized.
Detailed Description
Examples
Fig. 1 shows that, according to a specific embodiment of the present invention, a variable magnetic field cathode device of a magnetron sputtering device includes a disc-shaped copper back plate 3, a target material 1 is fixed in a groove on the front surface of the circular copper back plate 3 through a target holder 9, the back edge of the copper back plate 3 is attached to the cover edge of a cylindrical stainless steel cover 5, the outer peripheral surface of the stainless steel cover 5 is in threaded connection with the inner side wall of an annular target cover 2, and the target cover 2 is externally sleeved on the target holder 9; a stainless steel water cooler 6 is arranged in the inner cavity of the stainless steel cover 5, and the water cooler 6 is fixed on the back of the copper back plate 3; the method is characterized in that:
the back surface of the water cooler 6 is sequentially divided into a center area, a middle area and an outer area from the center to the edge, and the middle part of the back surface of the water cooler 6 is provided with an annular bulge 6 a; a cake-shaped main coil 4a with the radius equal to that of the copper back plate 3 is arranged in a gap between the top of the bulge 6a and the front surface of the stainless steel cover 5; a pancake-shaped core coil 4b is provided between the back surface of the water cooler 6 inside the boss 6a and the main body coil 4a, and a pancake-shaped outer coil 4c is provided between the back surface of the water cooler 6 outside the boss 6a and the main body coil 4 a.
The radial lengths of the core coil 4b, the protrusion 6a and the outer coil 4c are all equal in this example.
In this example, an insulating spacer 7 is provided between the main body coil 4a and the stainless steel cover 5.
Obviously, the front surface of the present invention refers to the surface facing the target material, and the back surface refers to the surface facing away from the target material; inner means a portion near the center, and outer means a portion far from the center.
Fig. 2 is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field in the radial direction of the target surface after the magnetic field of the core coil, the magnetic field of the external coil, the magnetic field of the main body coil and the three coils are superimposed, in the diagram, a curve strung by a symbol "△" is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field of the core coil, a curve strung by a symbol "○" is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field of the external coil, a curve of a dotted line is a simulation diagram of normalized magnetic field intensity distribution of the magnetic field of the main body coil, and a curve of a solid line is a simulation diagram of normalized.
FIG. 2 shows that: the magnetic field of the body coil is high in intensity in the central region in the radial direction of the target surface, and is low in intensity in the central region and the outer region in the radial direction of the target surface. The magnetic field of the core coil and the magnetic field of the outer coil are high in intensity in the core region and the outer region in the radial direction of the target surface, respectively, and low in intensity in the other regions. The superimposed magnetic field after the superposition of core coil, external coil and main body coil magnetic field is all high in the radial magnetic field intensity in each region of target surface, and is basically equal, the description the utility model discloses the device has obviously improved the radial magnetic field intensity distribution homogeneity in each region of target surface.
Claims (3)
1. A variable magnetic field cathode device of magnetron sputtering equipment comprises a disc-shaped copper back plate (3), a target (1) is fixed in a groove on the front surface of the copper back plate (3) through a target support (9), the back edge of the copper back plate (3) is attached to the cover edge of a cylindrical stainless steel cover (5), the outer peripheral surface of the stainless steel cover (5) is in threaded connection with the inner side wall of a circular target cover (2), and the target cover (2) is sleeved on the target support (9); a stainless steel water cooler (6) is arranged in the inner cavity of the stainless steel cover (5), and the water cooler (6) is fixed on the back of the copper back plate (3); the method is characterized in that:
the back surface of the water cooler (6) is sequentially divided into a center area, a middle area and an outer area from the center to the edge, and the middle part of the back surface of the water cooler (6) is provided with a circular bulge (6 a); a pie-shaped main coil (4a) with the radius equal to that of the copper back plate (3) is arranged in a gap between the top of the bulge (6a) and the front surface of the stainless steel cover (5); a pie-shaped core coil (4b) is arranged between the back part of the water cooler (6) inside the bulge (6a) and the main coil (4a), and a pie-shaped external coil (4c) is arranged between the back part of the water cooler (6) outside the bulge (6a) and the main coil (4 a).
2. The variable magnetic field cathode device of a magnetron sputtering device as claimed in claim 1, characterized in that the radial lengths of the core coil (4b), the protrusions (6a) and the outer coil (4c) are all equal.
3. The variable magnetic field cathode device of a magnetron sputtering device according to claim 1, characterized in that an insulating backing plate (7) is provided between the body coil (4a) and the stainless steel cover (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920866102.XU CN210394505U (en) | 2019-06-11 | 2019-06-11 | Variable magnetic field cathode device of magnetron sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920866102.XU CN210394505U (en) | 2019-06-11 | 2019-06-11 | Variable magnetic field cathode device of magnetron sputtering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210394505U true CN210394505U (en) | 2020-04-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920866102.XU Expired - Fee Related CN210394505U (en) | 2019-06-11 | 2019-06-11 | Variable magnetic field cathode device of magnetron sputtering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210394505U (en) |
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2019
- 2019-06-11 CN CN201920866102.XU patent/CN210394505U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200424 |