CN210386747U - Semiconductor-grade silicon wafer surface pre-cleaning device - Google Patents
Semiconductor-grade silicon wafer surface pre-cleaning device Download PDFInfo
- Publication number
- CN210386747U CN210386747U CN201921157906.9U CN201921157906U CN210386747U CN 210386747 U CN210386747 U CN 210386747U CN 201921157906 U CN201921157906 U CN 201921157906U CN 210386747 U CN210386747 U CN 210386747U
- Authority
- CN
- China
- Prior art keywords
- cleaning
- silicon wafer
- semiconductor
- spacer
- seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 104
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000004744 fabric Substances 0.000 claims abstract description 14
- 230000008093 supporting effect Effects 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 125000006850 spacer group Chemical group 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 13
- 238000005406 washing Methods 0.000 abstract description 7
- 239000004677 Nylon Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a semiconductor level silicon chip surface belt cleaning device in advance, include the washing tank and arrange in belt cleaning device in the washing tank, belt cleaning device is including supporting the groove and fixing support the fixing base on the groove, be provided with on the fixing base and can the pivoted clean bench, the inside cavity of clean bench, and one end opening, one end is closed, the clean bench with the outer wall of the junction of fixing base is the sphere form, the confession has been seted up on the fixing base the clean bench pivoted rotates the hole, the open end of clean bench with it communicates with each other to support the groove. The utility model coats the cleaning cloth on the cleaning platform and is matched with the water pipe, so that the particles on the surface of the silicon chip can be removed, and the hollow structure of the cleaning platform facilitates the discharge of water and particles; in addition, the cleaning table can rotate, so that the direction of the silicon wafer can be changed during cleaning, water flow forms a certain washing included angle, and removal of particles is promoted.
Description
Technical Field
The utility model relates to a semiconductor cleaning device technical field specifically is a semiconductor level silicon chip surface belt cleaning device in advance.
Background
In the processing process of the semiconductor-grade silicon wafer, some dust particles exist on the surface, the conventional common cleaning device is cleaned by ultrasonic waves and matched with cleaning liquid, the cleaning effect of the equipment is good, but the cost is high; for the pre-cleaning of the semiconductor grade silicon wafer, the cleaning requirement is not particularly high, and only dust particles on the surface need to be removed, so that the cost of ultrasonic cleaning is high for some enterprises with small scale.
SUMMERY OF THE UTILITY MODEL
The technique that exists is not enough to the aforesaid, the utility model aims at providing a semiconductor level silicon chip surface belt cleaning device in advance utilizes belt cleaning device and washs cloth and combines together, reduction in production cost when realizing wasing in advance.
In order to solve the technical problem, the utility model adopts the following technical scheme:
the utility model provides a semiconductor level silicon chip surface belt cleaning device in advance, include the washing tank and arrange in belt cleaning device in the washing tank, belt cleaning device is including supporting the groove and fixing support the fixing base on the groove, be provided with on the fixing base and can the pivoted clean bench, the inside cavity of clean bench, and one end opening, one end is closed, the clean bench with the outer wall of the junction of fixing base is the sphere form, the confession has been seted up on the fixing base the clean bench pivoted rotates the hole, the open end of clean bench with it communicates with each other to support the groove.
Preferably, the closed end of the cleaning table is arc-shaped and is provided with a plurality of third drain holes which are uniformly distributed, and the closed end of the cleaning table is wrapped with cleaning cloth; and an annular spacer is arranged at the joint of the cleaning table and the fixed seat.
Preferably, the material of dottle pin is 30% glass fiber nylon 66, the internal perisporium of dottle pin with the wash platform is tangent, the periphery wall of dottle pin with it is tangent to rotate the hole, the dottle pin is fixed it is downthehole to rotate.
Preferably, the upper end and the lower end of the fixing seat are respectively fixed with a pressing sleeve, and two ends of the spacer respectively abut against the two pressing sleeves.
Preferably, the fixed seat comprises an upper seat and a lower seat which are butted together, and the upper seat and the lower seat are fixed together through bolts; the isolating pad is formed by closing two semi-ring pads, and a plurality of fourth drain holes which are uniformly distributed are formed in the semi-ring pads.
Preferably, the bottom of the cleaning tank is provided with a first drainage hole, and the bottom of the supporting tank is provided with a second drainage hole; and three water pipes are also arranged on the cleaning tank.
The beneficial effects of the utility model reside in that: the utility model coats the cleaning cloth on the cleaning platform and is matched with the water pipe, so that the particles on the surface of the silicon chip can be removed, and the hollow structure of the cleaning platform facilitates the discharge of water and particles; in addition, the cleaning table can rotate, so that the direction of the silicon wafer can be changed during cleaning, water flow forms a certain washing included angle, and removal of particles is promoted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view (partially cut away) of a semiconductor-grade silicon wafer surface pre-cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is an enlarged view of portion A of FIG. 1;
FIG. 4 is a schematic view of the structure of the spacer;
fig. 5 is a schematic structural view of the cleaning table after rotating a certain angle.
Description of reference numerals: 1-a cleaning tank, 11-a first water drainage hole, 2-a cleaning device, 21-a fixed seat, 211-an upper seat, 212-a lower seat, 22-a supporting tank, 221-a second water drainage hole, 23-a pressing sleeve, 3-a cleaning table, 31-a third water drainage hole, 32-a limiting plate, 4-cleaning cloth, 5-a spacer, 51-a semi-ring pad and 6-a water pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b):
as shown in fig. 1, the utility model provides a semiconductor-grade silicon wafer surface pre-cleaning device, including cleaning tank 1 and cleaning device 2 arranged in cleaning tank 1, wherein cleaning tank 1 is rectangular, first drain hole 11 has been seted up to the bottom of cleaning tank 1, cleaning device 2 is arranged in the center of cleaning tank 1, three water pipes 6 are arranged on cleaning tank 1, one of them is located in the middle of cleaning tank 1, the other two are located on both sides of middle water pipe 6, water pipe 6 adopts the machine tool cooling water pipe, that is, this kind of water pipe can be bent and shaped, has certain supporting effect;
the cleaning device 2 comprises a supporting groove 22 and a fixed seat 21 fixed on the supporting groove 22, the fixed seat 21 is provided with a rotatable cleaning table 3, the fixed seat 21 and the cleaning table 3 are made of stainless steel, the cleaning table 3 is hollow, one end of the cleaning table is open, the other end of the cleaning table is closed, the outer wall of the joint of the cleaning table 3 and the fixed seat 21 is spherical, the fixed seat 21 is provided with a rotating hole for the rotation of the cleaning table 3 (the inner wall of the rotating hole is spherical, the spherical center of the spherical surface is superposed with the spherical center of the cleaning table 3), and the open end of the cleaning table 3 is communicated with the supporting groove 22; the closed end of the cleaning table 3 is arc-shaped and is provided with a plurality of third drain holes 31 which are uniformly distributed, the closed end of the cleaning table 3 is fixed with cleaning cloth 4, the cleaning cloth 4 is K51 non-woven wiping cloth produced by Tianjin Keli macro, the cleaning capability of the cloth is good, the color and the scraps are not easy to fade, the marks are not easy to leave after wiping, and the cloth can be cleaned by high-pressure water flow; an annular spacer 5 is arranged at the joint of the cleaning table 3 and the fixed seat 21, the spacer 5 is made of nylon 66 added with 30% of glass fiber, the inner peripheral wall of the spacer 5 is tangent to the cleaning table 3, the outer peripheral wall of the spacer 5 is tangent to the rotating hole, and the spacer 5 is fixed in the rotating hole;
in order to fix the spacer 5 conveniently, referring to fig. 1 and 3, the upper and lower ends of the fixing seat 21 are respectively fixed with a pressing sleeve 23, the two ends of the spacer 5 respectively abut against the two pressing sleeves 23, that is, the upper and lower ends of the fixing seat 21 are respectively fixed with the spacer 5 in the rotating hole by using the pressing sleeves 23, and the pressing sleeves 23 are fixed on the fixing seat 21 by bolts;
further, for convenience of installation, as shown in fig. 1, the fixing base 21 is of a sectional structure, that is, the fixing base 21 includes an upper base 211 and a lower base 212 which are coupled together, and the upper base 211 and the lower base 212 are fixed together by bolts; as shown in fig. 4, the spacer 5 is formed by two half-ring pads 51, and a plurality of fourth drainage holes are uniformly distributed on the half-ring pads 51.
In addition, in order to prevent wash platform 3 from rotating transitionally, as shown in fig. 1 and 5, two limiting plates 32 are symmetrically arranged at the open end of wash platform 3, as shown in fig. 5, after wash platform 3 rotates, limiting plates 32 can abut against the lower end of fixing seat 21, and then limit the rotation thereof, and prevent transitional rotation thereof.
In the using process, particles exist on the surface of the silicon wafer, and in the rotating process of the cleaning table 3, a part of particles enter between the cleaning table 3 and the rotating hole, which may affect the rotation, such as scratches and particle aggregation, and affect the rotation, therefore, a spacer 5 made of nylon plastics is arranged between the cleaning table 3 and the rotating hole, on one hand, the low friction coefficient of nylon is utilized to ensure the rotation, on the other hand, after the particles enter, the particles preferentially abrade the nylon due to the different hardness between the nylon and stainless steel, and further the abrasion to the rotating hole or the cleaning table 3 is reduced, and the nylon can be replaced when the abrasion is large, thereby reducing the use cost; meanwhile, the third drain hole 31 at the closed end of the cleaning platform 3 and the fourth drain hole on the spacer 5 facilitate the drainage and the discharge of particulate matters, and reduce the accumulation of the particulate matters on the cleaning cloth 4.
When in use, the three water pipes 6 are adjusted (as shown in fig. 1 and fig. 2), and the three water pipes 6 and the cleaning platform 3 form an inclination, so that water flows in an inclined manner during washing; after the water flow is opened, a silicon wafer to be cleaned is placed on the cleaning table 3, the silicon wafer is manually pressed on the cleaning cloth 4 to move back and forth, the cleaning table 3 can rotate along with the silicon wafer in the moving process, the included angle between the silicon wafer and the water flow is further changed, the cleaning effect is improved, and the trouble that the included angle between the water flow and the silicon wafer is changed by moving the water pipe 6 is avoided; after the cleaning work is finished, the cleaning cloth 4 can be cleaned by high-pressure water flow; when the spacer 5 is worn seriously, the upper seat 211 and the pressing sleeve 23 can be removed, the cleaning table 3 can be taken out, and then the spacer 5 can be replaced again.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The semiconductor-grade silicon wafer surface pre-cleaning device comprises a cleaning tank and a cleaning device arranged in the cleaning tank, and is characterized in that the cleaning device comprises a supporting groove and a fixing seat fixed on the supporting groove, a cleaning table capable of rotating is arranged on the fixing seat, the cleaning table is hollow, one end of the cleaning table is open, the other end of the cleaning table is closed, the outer wall of the joint of the cleaning table and the fixing seat is spherical, a rotating hole for rotating the cleaning table is formed in the fixing seat, and the opening end of the cleaning table is communicated with the supporting groove.
2. The device for pre-cleaning the surface of the semiconductor-grade silicon wafer as claimed in claim 1, wherein the closed end of the cleaning platform is arc-shaped and is provided with a plurality of third drain holes which are uniformly distributed, and the closed end of the cleaning platform is coated with cleaning cloth; and an annular spacer is arranged at the joint of the cleaning table and the fixed seat.
3. The device for pre-cleaning the surface of the semiconductor-grade silicon wafer according to claim 2, wherein the spacer is made of 30% glass fiber nylon 66, the inner peripheral wall of the spacer is tangent to the cleaning table, the outer peripheral wall of the spacer is tangent to the rotating hole, and the spacer is fixed in the rotating hole.
4. The device for pre-cleaning the surface of the semiconductor grade silicon wafer as claimed in claim 3, wherein the upper end and the lower end of the fixing seat are respectively fixed with a pressing sleeve, and two ends of the spacer are respectively abutted against the two pressing sleeves.
5. The device for pre-cleaning the surface of the semiconductor-grade silicon wafer as claimed in any one of claims 2 to 4, wherein the fixed seat comprises an upper seat and a lower seat which are butted together, and the upper seat and the lower seat are fixed together through bolts; the isolating pad is formed by closing two semi-ring pads, and a plurality of fourth drain holes which are uniformly distributed are formed in the semi-ring pads.
6. The device for pre-cleaning the surface of a semiconductor-grade silicon wafer as claimed in claim 5, wherein the bottom of the cleaning tank is provided with a first drainage hole, and the bottom of the supporting tank is provided with a second drainage hole; the cleaning tank is also provided with three water pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921157906.9U CN210386747U (en) | 2019-07-23 | 2019-07-23 | Semiconductor-grade silicon wafer surface pre-cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921157906.9U CN210386747U (en) | 2019-07-23 | 2019-07-23 | Semiconductor-grade silicon wafer surface pre-cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210386747U true CN210386747U (en) | 2020-04-24 |
Family
ID=70356092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921157906.9U Active CN210386747U (en) | 2019-07-23 | 2019-07-23 | Semiconductor-grade silicon wafer surface pre-cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210386747U (en) |
-
2019
- 2019-07-23 CN CN201921157906.9U patent/CN210386747U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1863645B (en) | Methods and materials for making a monolithic porous pad cast onto a rotatable base | |
| EP0598190B1 (en) | Apparatus for polishing wafer | |
| CN100449704C (en) | Device for cleaning grinding head | |
| CN207204743U (en) | A kind of bearing outer ring ultrasonic cleaning equipment | |
| CN109676515B (en) | Semiconductor wafer grinding device with cleaning function | |
| CN207103298U (en) | A kind of diamond layered vibration cleaning device | |
| CN206997305U (en) | A kind of Sapphire wafer surface cleaning device for different roughness and size | |
| CN210386747U (en) | Semiconductor-grade silicon wafer surface pre-cleaning device | |
| CN216327350U (en) | Polisher is used in processing of environment-friendly stone material with function of making an uproar falls in automatic collection dirt | |
| CN206277261U (en) | Grinding assembly | |
| CN108907978A (en) | Surface polishing device is used in a kind of production of metal product | |
| CN201894999U (en) | Cleaning device | |
| CN205734269U (en) | A kind of dedusting sander | |
| CN106216274A (en) | A kind of glass substrate edge brushing device and control method thereof | |
| CN114649245B (en) | Device for bearing and cleaning silicon wafer | |
| CN205734215U (en) | A kind of sealing member polisher | |
| CN205734280U (en) | A kind of arc-shaped surface automatic grinding stone device | |
| CN213136176U (en) | Plastic slab surface grinding device is used in bill-board processing | |
| CN208614549U (en) | A kind of Furniture manufacturing surface processing device | |
| CN202825548U (en) | Grinding pad adjustor washing equipment and chemical machinery grinding device | |
| CN206677704U (en) | LCD glass grinders are used in a kind of LCD MODULE manufacture | |
| CN214817171U (en) | Polishing and grinding equipment for concave surface in pot body | |
| CN213380767U (en) | Prosthetic belt cleaning device of pneumatic cylinder that cleaning efficiency is high | |
| CN210701396U (en) | Spare part scrubbing equipment in mechanical engineering field of environmental protection | |
| CN109531309A (en) | A kind of equipment for grinding for complex spring manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |