CN210381728U

CN210381728U - Aluminum alloy bar heat dissipation structure for large or multilayer PCB video encoder

Info

Publication number: CN210381728U
Application number: CN201921007191.9U
Authority: CN
Inventors: 刘瑛; 李朕煜
Original assignee: Changsha Kiloview Electronics Co ltd
Current assignee: Changsha Kiloview Electronics Co ltd
Priority date: 2019-07-01
Filing date: 2019-07-01
Publication date: 2020-04-21
Anticipated expiration: 2029-07-01

Abstract

The utility model discloses an aluminum alloy rod heat radiation structure for large-scale or multilayer PCB board video encoder, include: the section bar comprises a section bar shell, wherein two ends of the section bar shell are provided with guide grooves; the radiating support sheet metal part is arranged on the inner wall of the profile shell, a main PCB is connected onto the radiating support sheet metal part, and a main chip is arranged on the main PCB; the two types of aluminum bars are divided into large aluminum bars and small aluminum bars which are connected to the radiating support sheet metal part, heat-conducting silica gel is filled between the large aluminum bars and the main PCB, the main PCB is also connected with an encoding plate, an encoding chip is arranged on the encoding plate, and the heat-conducting silica gel is filled between the small aluminum bars and the encoding chip; the two baffles are connected on the guide groove in a matching way. The utility model provides a pair of an aluminum alloy rod heat radiation structure for large-scale or multilayer PCB board video encoder does not increase radiator fan and does not arrange the condition at the PCB reverse side with the chip, has solved the difficult problem of conducting the chip heat to the shell.

Description

Aluminum alloy bar heat dissipation structure for large or multilayer PCB video encoder

Technical Field

The utility model belongs to the technical field of heat radiation structure technique and specifically relates to an aluminum alloy rod heat radiation structure for large-scale or multilayer PCB board video encoder.

Background

The existing aluminum alloy section shell has three heat dissipation structure schemes:

(1) the heat radiating fins are adhered to the chip (heat can not be conducted between the chip and the shell), and the main board assembly is pushed into the main board assembly through the guide grooves of the shell sectional materials for installation. The structure mode is simple enough and easy to assemble, but the heat dissipation effect is not ideal;

(2) the heat radiating fins are adhered on the chip (heat can not be conducted with the shell), the mainboard assembly is pushed into the shell through the guide grooves of the shell profiles for installation, then the heat radiating fan is added to push air to flow, so that the purpose of heat radiation is achieved, the heat radiating effect is good, but the requirement on a space structure is high due to the addition of the fan, and the cost is relatively high;

(3) the shell section is split into an upper section and a lower section, and the radiating fins/the heat-conducting silica gel are adhered to the chips. Owing to the structure that two parts are detained about the shell, fin/heat conduction silica gel can direct and shell contact, reaches the purpose of heat conduction, but the section bar shell is divided into two, because there is inevitable error in shaping and the equipment manufacturing procedure, at first influences the outward appearance, secondly increases the equipment degree of difficulty, indirectly has raised manufacturing cost.

(1) In the two schemes and (2), as the shell is an integrated section bar, the PCB plate component is installed by pushing in from two ends of the section bar through the guide grooves. In the production process, if the error of the forming of the shell, such as the error of the chip mounting of the PCB, if the amount of white glue is too large or too small, and the thickness manufacturing error of the heat sink/the heat-conducting silica gel, the height of the heat sink/the heat-conducting silica gel is uncertain.

The height is lower than the inner surface of the shell, and heat cannot be conducted in a contact mode; the height is higher than the inner surface of the shell, interference occurs, and the profile cannot be pushed into and installed from the two ends of the profile; the only thing that must be done is that it is difficult to do so in view of process difficulties and production costs. In addition, under certain conditions, the equipment is required to have no heat dissipation holes, and a heat dissipation fan needs to maintain a relatively closed shell space, so that another scheme is required.

(3) In the scheme, because the shell is split formula section bar, divide into upper and lower two parts, there is the screw post on the inferior valve, and the PCB board passes through the screw post and installs in advance in the inferior valve, need not the guide slot and slides and push. And (4) cushioning a layer of elastic buffering silica gel above the heat dissipation plate, and then covering the upper shell to finish the assembly. Thanks to the elasticity of the buffering silica gel, the height error of products in the processing and production processes is counteracted, and the screws are fixed without sliding and pushing in the guide grooves, so the structure can realize the heat conduction from the chip to the shell.

But the defect is obvious, the splicing position of the upper shell and the lower shell has obvious section difference, and the appearance color difference is possible between the upper shell and the lower shell; the assembly difficulty is higher than that of an integrated section bar.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides an aluminum alloy rod heat radiation structure for large-scale or multilayer PCB board video encoder.

The technical scheme of the utility model is that: an aluminum alloy bar heat dissipation structure for a large or multi-layer PCB video encoder, comprising:

the section bar comprises a section bar shell, wherein two ends of the section bar shell are provided with guide grooves;

the heat dissipation support sheet metal part is fixedly arranged on the inner wall of the profile shell, a main PCB is connected onto the heat dissipation support sheet metal part, and a main chip is arranged on the reverse side of the main PCB;

the two types of aluminum bars are divided into large aluminum bars and small aluminum bars which are connected to the radiating support sheet metal part, heat-conducting silica gel is filled between the large aluminum bars and the main PCB, the main PCB is also connected with an encoding plate, the front side of the encoding plate is provided with an encoding chip, and the heat-conducting silica gel is filled between the small aluminum bars and the encoding chip;

and the two baffles are respectively connected to the guide grooves in a matching manner.

Preferably, the profile housing is of a cubic structure.

Preferably, the profile housing is made of aluminum alloy 6063 plate.

Preferably, two ends of each baffle are locked and fixed on the profile shell through screws.

Preferably, the main PCB is located inside the profile housing, leaving a certain distance from the inner wall of the profile housing.

Preferably, the heat dissipation support sheet metal part is an aluminum alloy heat dissipation support sheet metal.

Preferably, be connected with main PCB board through the spliced pole on the heat dissipation supports the sheet metal component, spliced pole one end is riveting on the heat dissipation supports the sheet metal component for the riveting screw post, the other end is hexagonal copper post screw spiro union on main PCB board.

Preferably, the large aluminum bar and the small aluminum bar are fixed on the heat dissipation support sheet metal part through flat-head self-tapping screws.

Preferably, the main PCB board is connected with an encoding board through a screw post.

Preferably, both of the baffles are made of aluminum alloy 6063 plate.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) compared with the traditional single radiating fin, the radiating fin has larger radiating area, can conduct heat to the shell, has better radiating performance, does not need to be glued, and has higher production efficiency;

(2) the structure is relatively simple and the cost is more advantageous without adding a cooling fan;

(3) the heat-conducting PCB properly solves the problem that the chip can not be arranged on the back surface of the PCB, and can conduct heat to the shell from the front surface.

Drawings

Fig. 1 is the utility model discloses a medical teaching video encoder overall structure sketch map.

Fig. 2 is a schematic view of the heat dissipation structure of the aluminum alloy rod of the present invention.

Fig. 3 is a flow chart of the heat conduction transmission principle of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

As shown in fig. 1 to 3, an aluminum alloy bar heat dissipation structure for a large or multi-layer PCB video encoder includes a profile housing 1, a heat dissipation support sheet metal part 2, two types of aluminum bars 3, and two baffles 4.

Two ends of the section bar shell 1 are provided with guide grooves, two baffle plates 4 are respectively connected to the guide grooves in a matching way, and two ends of each baffle plate 4 are fixed on the section bar shell 1 through screws in a locking way; the section bar shell 1 is of a cubic structure. The profile housing 1 is made of an aluminium alloy 6063 plate. The two baffle plates 4 are also made of aluminum alloy 6063 plate.

This heat dissipation supports sheet metal component 2 and supports the panel beating for the aluminum alloy heat dissipation. The fixed inner wall of locating section bar shell 1 of aluminum alloy heat dissipation support sheet metal component 2, the aluminum alloy heat dissipation support sheet metal component 2 is gone up and is connected with main PCB board 5 through the spliced pole, and wherein spliced pole one end is 6 riveting on the heat dissipation support sheet metal component for riveting screw, and the other end is 7 spiro couplings on main PCB board 5 for hexagonal copper post screw. The reverse side of the main PCB 5 is provided with a main chip 8.

The main PCB 5 is positioned inside the section bar shell 1, and a certain distance is reserved between the main PCB and the inner wall of the section bar shell 1, so that heat circulation and heat dissipation are facilitated.

These two kinds of aluminium bars divide into big aluminium bar 31 and small-size aluminium bar 32, all fix on aluminum alloy heat dissipation supports sheet metal component 2 through crew cut self tapping screw 13. Heat conducting silica gel 9 is filled between the large aluminum bar 31 and the main PCB 5; the main PCB 5 is further connected with an encoding plate 10 through a screw post 14, an encoding chip 11 is arranged on the front face of the encoding plate 10, and heat-conducting silica gel 12 is filled between the small aluminum bar 22 and the encoding chip 11.

The utility model provides an aluminum alloy rod heat radiation structure for large-scale or multilayer PCB board video encoder, has satisfied some special industry requirements (such as medical industry), and equipment can not have the louvre, can not take the radiator fan, needs to keep equipment shell a relatively airtight space, and the condition that the chip has a good heat dissipation way in the during operation needs to be guaranteed again simultaneously; in addition, the problem that chips cannot be arranged on the reverse side of some PCBs or the inner PCBs are stacked with a multilayer structure, and only heat conducting parts can be added from the front side is solved.

The utility model discloses a theory of operation does: aiming at the condition that chips on a PCB board cannot be arranged on the reverse side (below) and multiple layers of PCBs are stacked, an aluminum alloy heat dissipation supporting sheet metal part is added, and a screw column is riveted on the aluminum alloy heat dissipation supporting sheet metal part and used for supporting and fixing the PCB board. And cutting an aluminum bar with a proper length, fixing the aluminum bar on the sheet metal part through screws, and filling elastic heat-conducting silica gel between the chip and the aluminum bar. 2 guide grooves are designed on the outer shell of the section bar, an aluminum sheet metal part/PCB is pushed into the shell along the guide grooves, and the left end and the right end of the section bar are locked by screws to form a left baffle and a right baffle so as to complete installation.

The utility model discloses a novel structural style of heat conduction transmission, promptly: solid aluminium bar absorbs the heat fast, conducts the heat through large tracts of land sheet metal component to fully contact with the shell and give metal casing heat transfer.

The technical scheme is verified through actual assembly, is convenient to assemble, does not need to increase too much cost, and is suitable for mass production; the technical scheme is also verified by actual heat dissipation tests, and compared with the traditional single-radiating-fin mode, the heat dissipation performance is improved by more than one time. This solution heat conduction may be from the front (top) side and may be applicable to multi-layer PCB board stacking.

The above-mentioned embodiments are only preferred embodiments of the present invention, and the scope of the right of the present invention should not be limited thereby, and therefore, modifications, equivalent changes, improvements, etc. made in the claims of the present invention are still included in the scope of the present invention.

Claims

1. The utility model provides an aluminum alloy rod heat radiation structure for large-scale or multilayer PCB board video encoder which characterized in that includes:

2. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders of claim 1, wherein the profile housing is a cube structure.

3. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders of claim 1, wherein the profile housing is made of aluminum alloy 6063 plate.

4. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders as claimed in any one of claims 1 to 3, wherein each of the two ends of the baffle is fixed to the profile housing by screws.

5. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders as claimed in any one of claims 1 to 3, wherein the main PCB is located inside the profile housing with a certain distance from the inner wall of the profile housing.

6. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders of claim 1, wherein the heat dissipation support sheet metal part is an aluminum alloy heat dissipation support sheet metal.

7. The aluminum alloy bar heat dissipation structure for the large-scale or multilayer PCB video encoder as recited in claim 1 or 6, wherein the heat dissipation support sheet metal part is connected with a main PCB through a connection column, one end of the connection column is riveted on the heat dissipation support sheet metal part through a riveting screw column, and the other end of the connection column is screwed on the main PCB through a hexagonal copper column screw.

8. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders as claimed in claim 1 or 6, wherein the large aluminum bar and the small aluminum bar are fixed on the heat dissipation support sheet metal part by flat self-tapping screws.

9. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders as claimed in claim 1, wherein the main PCB is connected with an encoding plate through screw posts.

10. The aluminum alloy bar heat dissipation structure for large or multi-layer PCB video encoders of claim 1, wherein two of the baffles are made of aluminum alloy 6063 plate.