CN210381432U - Circuit board with water-cooling plate - Google Patents
Circuit board with water-cooling plate Download PDFInfo
- Publication number
- CN210381432U CN210381432U CN201920777489.1U CN201920777489U CN210381432U CN 210381432 U CN210381432 U CN 210381432U CN 201920777489 U CN201920777489 U CN 201920777489U CN 210381432 U CN210381432 U CN 210381432U
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- Prior art keywords
- circuit board
- plate
- water
- sets
- heat
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- 238000001816 cooling Methods 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 11
- 239000006096 absorbing agent Substances 0.000 abstract description 4
- 230000007246 mechanism Effects 0.000 abstract description 3
- 230000002146 bilateral effect Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a circuit board with water-cooling board, including the circuit board that is the rectangle structure, the inner groovy has been seted up at the top of circuit board, and the inboard slip of inner groovy has inlayed the absorber plate, two sets of cardboard that are the horizontal distribution of the outside bilateral symmetry fixedly connected with of absorber plate, the top of circuit board is located two sets of cardboard outside fixedly connected with and is the spacing buckle of side L type structure, and the interior table wall of spacing buckle laminates with the exterior wall of cardboard each other. The utility model discloses in, at first, inside water cycle heat dissipation mechanism that is provided with, this kind of structure can spill the heat circulation that the circuit board produced, has both prolonged electronic component's on the circuit board life, has also promoted the heat dispersion of circuit board simultaneously, secondly, inside mosaic structure that is provided with, the concatenation and the fixed processing of the circuit board of being convenient for of this kind of structure, the operating personnel's of both being convenient for operation is used, has also promoted the fixed stability of circuit board concatenation simultaneously.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board with water-cooling board.
Background
The circuit board has the name: a PCB, an ultra-thin circuit board, a printed circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, the English name is PCB, FPC circuit board and rigid-flex board, the birth and development of FPC and PCB have promoted the new product of rigid-flex board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
However, the existing circuit board still has the defects that: firstly, inside does not have the heat dissipation mechanism that sets up, and the thermal diffusivity is relatively poor, and electronic component on the circuit board during operation easily produces the heat, and the heat is difficult to the life that the effluvium can directly influence electronic component, and secondly, inside does not have the mosaic structure that sets up, and the concatenation installation and the fixed processing of circuit board of being not convenient for operate and get up to waste time and energy, and the stability of concatenation is relatively poor simultaneously.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the circuit board with the water-cooling plate is provided in order to solve the problems that the heat performance is poor, the heat of the circuit board is difficult to dissipate, and the circuit board is inconvenient to splice, install and fix.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a circuit board with a water-cooling plate comprises a circuit board with a rectangular structure, wherein an inner groove is formed in the top of the circuit board, a heat absorbing plate is embedded in the inner side of the inner groove in a sliding manner, two groups of clamping plates which are horizontally distributed are symmetrically and fixedly connected to two sides of the outer portion of the heat absorbing plate, a limiting buckle plate which is in a side L-shaped structure is fixedly connected to the outer side of each group of clamping plates at the top of the circuit board, the inner surface wall of each limiting buckle plate is attached to the outer surface wall of each clamping plate, two groups of water inlet pipes are symmetrically installed on two sides of the front end face of the heat absorbing plate, a heat radiating plate which is in an inverted U-shaped structure is installed on the outer side of the heat absorbing plate at the top of the circuit board, a water pump is installed inside the horizontal end of each heat radiating plate, two groups of installation buckle plates which are in a, the splicing sleeve which is of a C-shaped structure is installed on the outer side of the installation buckle plate arranged on the other side, and the splicing sleeve and the splicing block are in transition fit.
As a further description of the above technical solution:
the top center of the limiting buckle plate is vertically screwed and connected with a first stud penetrating through the limiting buckle plate through threads.
As a further description of the above technical solution:
the inside of cardboard is located the below of first double-screw bolt and is the first screw that the first double-screw bolt of multiunit cooperation used of level equidistance was seted up.
As a further description of the above technical solution:
liquid guide hoses are mounted on the inner sides of the two vertical ends of the heat dissipation plate, and the heat dissipation plate is communicated with the two water inlet pipes through the two groups of liquid guide hoses.
As a further description of the above technical solution:
the center of the top of the splicing sleeve is vertically screwed and connected with a second stud penetrating through the splicing sleeve through threads.
As a further description of the above technical solution:
the splicing blocks are characterized in that a plurality of groups of second screw holes matched with the second studs are horizontally formed in the horizontal ends and positioned below the second studs.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. in the utility model, the water circulation heat dissipation mechanism is arranged inside, the heat absorbing plate is arranged in the inner groove of the circuit board, the front end surface of the heat absorbing plate is communicated with two groups of water inlet pipes, the top of the circuit board is provided with the heat dissipating plate with an inverted U-shaped structure, and the heat dissipating plate is communicated with the water inlet pipes through the liquid guiding hose, when the heat absorbing plate is used in daily life, the heat generated by electronic elements on the circuit board can be transmitted and absorbed by the heat absorbing plate, and the heat absorbed cooling liquid in the heat absorbing plate can enter the heat dissipating plate through the liquid guiding hose under the action of the water pump to be dissipated, meanwhile, the cooling liquid after heat dissipation in the heat dissipating plate can enter the heat absorbing plate through the liquid guiding hose to be dissipated for heat absorption treatment, the structure can circularly dissipate the heat generated by the circuit board, thereby prolonging the service life of the electronic elements on the circuit board, meanwhile, the heat dissipation performance of the circuit board is improved.
2. The utility model discloses in, inside is provided with mosaic structure, install two sets of installation buckles that are C type structure at the outside bilateral symmetry of circuit board, and the splice cover that is T type structure splice piece and be C type structure is installed respectively in the outside of two sets of installation buckles, when needing to carry out the concatenation processing between the circuit board, with the splice piece on the circuit board of one side, in the splice cover on the circuit board of the other side of slipping into, when slipping into completely, alright with the second double-screw bolt screw in on the splice cover to the second screw of the inside assigned position department of splice piece, the concatenation and the fixed processing of circuit board have just been accomplished, the concatenation and the fixed processing of circuit board of being convenient for of this kind of structure, the operating personnel's of both being convenient for operation is used, the fixed stability of circuit board concatenation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic perspective view of a circuit board with a water-cooling plate according to the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
fig. 3 is a schematic view of the connection structure of the middle splicing block and the splicing sleeve of the present invention.
Illustration of the drawings:
1. a circuit board; 2. an inner groove; 3. a heat absorbing plate; 4. clamping a plate; 5. a limiting buckle plate; 6. a first stud; 7. a first screw hole; 8. a water inlet pipe; 9. a heat dissipation plate; 10. a water pump; 11. a liquid guiding hose; 12. mounting a buckle plate; 13. splicing blocks; 14. a second screw hole; 15. splicing sleeves; 16. a second stud.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides a technical solution: a circuit board with a water-cooling plate comprises a circuit board 1 which is of a rectangular structure, wherein the top of the circuit board 1 is provided with an inner groove 2, the inner groove 2 is arranged to facilitate sliding connection installation processing of a heat absorbing plate 3 and transmission heat dissipation processing of the circuit board 1, the heat absorbing plate 3 is embedded in the inner side of the inner groove 2 in a sliding manner, two groups of clamping plates 4 which are horizontally distributed are symmetrically and fixedly connected to the two sides of the outer portion of the heat absorbing plate 3, a limiting buckle plate 5 which is of a side L-shaped structure is fixedly connected to the outer side of the two groups of clamping plates 4 at the top of the circuit board 1, the inner surface wall of the limiting buckle plate 5 is mutually attached to the outer surface wall of the clamping plates 4, the limiting buckle plate 5 and the clamping plates 4 are arranged to facilitate installation and fixation processing of the heat absorbing plate 3, two groups of water inlet pipes 8 are symmetrically installed on the two sides of the front end, the horizontal end internally mounted of heating panel 9 has water pump 10, the outside both sides of circuit board 1 are horizontal symmetry through the screw and install two sets of installation buckle 12 that are C type structure, splice 13 that is side T type structure is installed in the outside of the installation buckle 12 that one side set up, splice 15 that is C type structure is installed in the outside of the installation buckle 12 that the opposite side set up, and splice 15 and splice 13 are transition fit, the chooseing for use of this kind of cooperation mode has promoted splice 13 and the fixed stability of splice 15 joint of splice.
Specifically, as shown in fig. 1 and 2, the top center of the limiting buckle plate 5 is vertically screwed with a first stud 6 penetrating through the limiting buckle plate 5 through threads, the inside of the clamping plate 4 is located below the first stud 6 and is provided with a plurality of groups of first screw holes 7 matched with the first studs 6 at equal intervals, the first studs 6 and the plurality of groups of first screw holes 7 are arranged, the heat absorbing plate 3 can be conveniently clamped and mounted further for fixing, and the stability of mounting and fixing of the heat absorbing plate 3 is improved.
Specifically, as shown in fig. 1, the inner sides of two vertical ends of the heat dissipation plate 9 are respectively provided with a liquid guiding hose 11, wherein the heat dissipation plate 9 is respectively communicated with the two sets of water inlet pipes 8 through the two sets of liquid guiding hoses 11, and the arrangement of the liquid guiding hoses 11 facilitates the water path connection between the heat dissipation plate 9 and the heat absorbing plate 3.
Specifically, as shown in fig. 1-3, the top center of the splicing sleeve 15 is vertically screwed and connected with a second stud 16 penetrating through the splicing sleeve 15 through threads, the inside of the horizontal end of the splicing block 13 is located below the second stud 16 and horizontally provided with a plurality of groups of second screw holes 14 used for matching with the second stud 16, and the splicing block 13 and the splicing sleeve 15 are convenient to further fix after being clamped, so that the stability of splicing and fixing the circuit board 1 is improved.
The working principle is as follows: when in use, the electronic element is arranged on the back of the circuit board 1, the cooling liquid is added into the heat absorbing plate 3 and the heat radiating plate 9, the liquid guide hose 11 on the heat radiating plate 9 is connected to the water inlet pipe 8 on the heat absorbing plate 3, so that the connection processing of the water path between the heat radiating plate 9 and the heat absorbing plate 3 is completed, when the splicing processing of the circuit board 1 is needed, the splicing block 13 in the T-shaped structure on the circuit board 1 on one side is slid into the splicing sleeve 15 in the C-shaped structure on the circuit board 1 on the other side, after the adjustment is completed, the second stud 16 on the splicing sleeve 15 can be screwed into the second screw hole 14 at the designated position inside the splicing block 13, so that the splicing and fixing processing of the circuit board 1 are completed, when in daily work, the cooling liquid inside the heat absorbing plate 3 can transfer and absorb the heat generated by the electronic element on the circuit board 1, under the action of the water pump 10, the inside heat absorption back coolant liquid of absorber plate 3 just can be through drain hose 11 and inlet tube 8, enters into the inside that is the type of falling U structure heating panel 9, carries out the heat dissipation and handles, simultaneously because the effect of liquid flow, the coolant liquid after the inside heat dissipation of heating panel 9 just can enter into the inside of absorber plate 3 through drain hose 11 and inlet tube 8, continue to transmit the heat on the circuit board 1 and absorb, just accomplished the hydrologic cycle heat dissipation of circuit board 1 and handled.
It should be understood that the above-described embodiments are merely illustrative of the preferred embodiments of the present invention and the technical principles thereof. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, these modifications are within the scope of the present invention as long as they do not depart from the spirit of the present invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.
Claims (6)
1. A circuit board with a water-cooling plate comprises a circuit board (1) which is of a rectangular structure and is characterized in that an inner groove (2) is formed in the top of the circuit board (1), a heat absorbing plate (3) is embedded in the inner side of the inner groove (2) in a sliding mode, two groups of clamping plates (4) which are horizontally distributed are symmetrically and fixedly connected to the two sides of the outer portion of the heat absorbing plate (3), a limiting buckle plate (5) which is of a side L-shaped structure is fixedly connected to the outer side of the two groups of clamping plates (4) at the top of the circuit board (1), the inner surface wall of the limiting buckle plate (5) is attached to the outer surface wall of the clamping plates (4), two groups of water inlet pipes (8) are symmetrically installed on the two sides of the front end face of the heat absorbing plate (3), a heat radiating plate (9) which is of an inverted U-shaped structure is installed on the outer side of the heat absorbing plate, the outside both sides of circuit board (1) are horizontal symmetry through the screw and install two sets of installation buckle (12) that are C type structure, and one side sets up splice (13) that are side T type structure are installed in the outside of installation buckle (12), and the opposite side sets up splice cover (15) that are C type structure are installed in the outside of installation buckle (12), and splice cover (15) and splice (13) are transition fit.
2. The circuit board with the water-cooling plate is characterized in that a first stud (6) penetrating through the limiting buckle plate (5) is vertically screwed and connected to the center of the top of the limiting buckle plate (5) through threads.
3. The circuit board with the water-cooling plate as claimed in claim 1 or 2, wherein the inside of the clamping plate (4) is located below the first stud (6) and is horizontally provided with a plurality of groups of first screw holes (7) which are used in cooperation with the first stud (6) at equal intervals.
4. The circuit board with the water-cooling plate as claimed in claim 1, wherein the liquid guiding hoses (11) are mounted on the inner sides of the two vertical ends of the heat dissipation plate (9), and the heat dissipation plate (9) is respectively communicated with the two sets of water inlet pipes (8) through the two sets of liquid guiding hoses (11).
5. The circuit board with the water-cooling plate as claimed in claim 1, wherein a second stud (16) penetrating through the splicing sleeve (15) is connected to the center of the top of the splicing sleeve (15) in a vertically screwed manner through threads.
6. The circuit board with the water-cooling plate as claimed in claim 1 or 5, wherein a plurality of groups of second screw holes (14) matched with the second studs (16) are horizontally formed in the horizontal ends of the splicing blocks (13) and below the second studs (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920777489.1U CN210381432U (en) | 2019-05-27 | 2019-05-27 | Circuit board with water-cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920777489.1U CN210381432U (en) | 2019-05-27 | 2019-05-27 | Circuit board with water-cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210381432U true CN210381432U (en) | 2020-04-21 |
Family
ID=70261891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920777489.1U Expired - Fee Related CN210381432U (en) | 2019-05-27 | 2019-05-27 | Circuit board with water-cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210381432U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111913540A (en) * | 2020-07-30 | 2020-11-10 | 河南职业技术学院 | Novel computer motherboard's antivibration support |
| CN112105148A (en) * | 2020-09-16 | 2020-12-18 | 广州共望贸易有限公司 | Concatenation formula PCB circuit board and processingequipment thereof |
-
2019
- 2019-05-27 CN CN201920777489.1U patent/CN210381432U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111913540A (en) * | 2020-07-30 | 2020-11-10 | 河南职业技术学院 | Novel computer motherboard's antivibration support |
| CN112105148A (en) * | 2020-09-16 | 2020-12-18 | 广州共望贸易有限公司 | Concatenation formula PCB circuit board and processingequipment thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 |