CN210375076U - Wafer measuring device based on aperture gauge - Google Patents
Wafer measuring device based on aperture gauge Download PDFInfo
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- CN210375076U CN210375076U CN201921753252.6U CN201921753252U CN210375076U CN 210375076 U CN210375076 U CN 210375076U CN 201921753252 U CN201921753252 U CN 201921753252U CN 210375076 U CN210375076 U CN 210375076U
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Abstract
The utility model discloses a wafer measuring device based on an aperture gauge, which comprises an aperture gauge and an automatic wafer positioning mechanism, wherein the automatic wafer positioning mechanism is used for positioning and conveying a wafer to a measuring point of the aperture gauge; the automatic wafer positioning mechanism comprises a horizontal X-direction electric cylinder; the X-direction electric cylinder comprises an X-direction action piece which linearly reciprocates along the X direction; a horizontal Y-direction electric cylinder; the Y-direction electric cylinder is fixed on the X-direction action piece; the Y-direction electric cylinder comprises a Y-direction action piece which linearly reciprocates along the Y direction; a Z-direction lifting base; the Z-direction lifting base is fixed at the upper end of the Y-direction linear reciprocating action piece; the Z-direction lifting base can be lifted along a Z-direction straight line; a horizontal positioning plate is fixed on the Z-direction lifting base; a slide holder is arranged above the positioning plate; a plurality of threaded through holes are formed in the positioning plate; each threaded through hole is screwed with a bolt from the lower end. The utility model discloses can fix a position the wafer to the measuring point of aperture appearance automatically, improve the accuracy of aperture appearance measurement wafer, convenient operation.
Description
Technical Field
The utility model belongs to the technical field of the engineering survey, especially, relate to a wafer measuring device based on aperture appearance.
Background
The quality of the wafer, which is the most basic semiconductor material for manufacturing integrated circuits, will directly determine the quality of the finished integrated circuits. Due to the different process levels, the wafer may be defective during the production phase.
In order to provide a high-reliability wafer, a plurality of parameters such as the outer diameter and the height uniformity of the wafer need to be accurately measured, and the quality of the wafer needs to be inspected. Currently, wafer measurement is usually performed by an aperture gauge. The aperture gauge is a non-contact high-precision length measuring instrument which takes a long grating as a standard and utilizes photoelectric aiming to measure, is mainly used for measuring the diameter of a precise straight-through hole, the outer diameter of a cylinder and the distance between two parallel planes and can also carry out height exploration. However, before the measurement by the aperture gauge, a worker is required to manually center the wafer on the stage to adjust the wafer to the measurement position. The manual operation error is large, and the measurement precision of the aperture gauge is reduced; and the measurement point of the wafer is not fixed, the operation is complicated, and the difficulty of measuring the wafer by using the aperture gauge is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a wafer measuring device based on aperture appearance can fix a position the wafer to the measuring point of aperture appearance automatically, has improved the accuracy that the wafer was measured to the aperture appearance, convenient operation, great improvement work efficiency.
The technical scheme is as follows: the utility model provides a wafer measuring device based on an aperture gauge, which comprises an aperture gauge; the automatic positioning mechanism is used for positioning and conveying the wafer to a measuring point of the aperture gauge; the automatic wafer positioning mechanism comprises a horizontal X-direction electric cylinder; the X-direction electric cylinder comprises an X-direction action piece which linearly reciprocates along the X direction;
a horizontal Y-direction electric cylinder; the Y-direction electric cylinder is fixed on the X-direction action piece; the Y-direction electric cylinder comprises a Y-direction action piece which linearly reciprocates along the Y direction; wherein the Y direction is perpendicular to the X direction;
a Z-direction lifting base; the Z-direction lifting base is fixed at the upper end of the Y-direction linear reciprocating action piece; the Z-direction lifting base can be lifted along a Z-direction straight line; the Z direction is vertical to the X direction, and the Z direction is vertical to the Y direction;
a horizontal positioning plate is fixed on the Z-direction lifting base; a slide holder is arranged above the positioning plate; the bottom of the slide holder is provided with a plurality of blind holes; a plurality of threaded through holes are formed in the positioning plate; the plurality of threaded through holes are correspondingly positioned right below the plurality of blind holes one by one, and the external diameter of the threads of the threaded through holes is smaller than the diameter of the blind holes; each threaded through hole is screwed with a bolt from the lower end; each bolt extends into one blind hole and is connected with the top wall of the blind hole.
Furthermore, a cooling water circulation pipeline is arranged inside the slide holder; the external cooling water enters the cooling water circulation pipeline from a water inlet of the cooling water circulation pipeline and flows out from a water outlet of the cooling water circulation pipeline.
Furthermore, a heat insulation plate is arranged between the slide holder and the positioning plate.
Furthermore, a plurality of circular grooves which are concentric and have different diameters are formed in the upper end face, used for placing the wafer, of the wafer carrying table; the circular groove is used for embedding wafers with corresponding diameters.
Further, a linear groove for taking the wafer is arranged between the outer edge of the circular groove and the outer edge of the wafer carrying platform.
Further, the X-direction electric cylinder also comprises an X-direction motor and an X-direction lead screw; the X-direction action part is sleeved outside the X-direction lead screw in a threaded manner; the X-direction motor drives the X-direction lead screw to rotate; the X-direction lead screw rotates to drive the X-direction action piece to linearly reciprocate along the X-direction lead screw;
the Y-direction electric cylinder also comprises a Y-direction motor and a Y-direction lead screw; the Y-direction action part is sleeved outside the Y-direction lead screw in a threaded manner; the Y-direction motor drives the Y-direction lead screw to rotate; the Y-direction screw rod rotates to drive the Y-direction action piece to linearly reciprocate along the Y-direction screw rod.
Further, the system also comprises a PLC control system, an X-direction motor controller and a Y-direction motor controller; the PLC control system outputs a control signal to the X-direction motor controller, and the X-direction motor controller outputs a control signal to control the X-direction motor to act; the PLC control system outputs a control signal to the Y-direction motor controller, and the Y-direction motor controller outputs a control signal to control the Y-direction motor to act.
Further, the device also comprises a drag chain for laying cables and externally connecting cooling water pipelines; the drag chain comprises an X-direction drag chain arranged along the X direction and a Y-direction drag chain arranged along the Y direction.
Has the advantages that: the utility model adjusts the three-dimensional coordinate position of the wafer through the X-direction electric cylinder, the Y-direction electric cylinder and the Z-direction lifting base, automatically positions and conveys the wafer to the measuring point of the aperture gauge through adjusting the levelness of the slide holder by the bolt, improves the accuracy of measuring the wafer by the aperture gauge, and greatly improves the working efficiency of measuring the wafer by the aperture gauge; cooling water circulation pipeline, circular recess and the sharp recess of slide holder setting make the utility model discloses be particularly useful for the wafer and measure convenient operation.
Drawings
Fig. 1 is a schematic structural view of a first view angle of the automatic wafer positioning mechanism of the present invention;
fig. 2 is a schematic structural view of a second viewing angle of the automatic wafer positioning mechanism of the present invention;
FIG. 3 is a schematic structural view of the slide holder of the present invention;
FIG. 4 is a cross-sectional view of the slide holder of the present invention;
fig. 5 is a schematic diagram of the arrangement structure of the present invention.
Detailed Description
As shown in fig. 1 and 2, the present invention provides a device for measuring a wafer based on an aperture gauge, which includes an aperture gauge; the automatic positioning mechanism is used for positioning and conveying the wafer to a measuring point of the aperture gauge.
The automatic wafer positioning mechanism comprises a horizontal X-direction electric cylinder; the X-direction electric cylinder comprises an X-direction motor 24, an X-direction lead screw and an X-direction action piece 7. The X-direction action piece 7 is sleeved outside the X-direction lead screw in a threaded manner; the X-direction motor 24 drives the X-direction lead screw to rotate; the X-direction lead screw rotates to drive the X-direction action piece 7 to linearly reciprocate along the X-direction lead screw.
The device also comprises a horizontal Y-direction electric cylinder; and the Y-direction electric cylinder is fixed on the X-direction action piece. The Y-direction electric cylinder comprises a Y-direction motor 18, a Y-direction lead screw and a Y-direction action piece 14, wherein the Y direction is vertical to the X direction. The Y-direction action piece 14 is sleeved outside the Y-direction lead screw in a threaded manner; the Y-direction motor 18 drives the Y-direction lead screw to rotate; the Y-direction screw rotates to drive the Y-direction action piece 14 to linearly reciprocate along the Y-direction screw.
Also comprises a Z-direction lifting base 23; the Z-direction lifting base 23 is fixed at the upper end of the Y-direction action piece 14; the Z-direction lifting base 23 can be lifted along a Z-direction straight line; the Z direction is perpendicular to the X direction and the Z direction is perpendicular to the Y direction.
A horizontal positioning plate 21 is fixed on the Z-direction lifting base 23; a slide holder 10 is arranged above the positioning plate 21; the bottom of the slide holder 10 is provided with a plurality of blind holes; a plurality of threaded through holes are formed in the positioning plate 21; the plurality of threaded through holes are correspondingly positioned right below the plurality of blind holes one by one, and the external diameter of the threads of the threaded through holes is smaller than the diameter of the blind holes; each threaded through hole is screwed with a bolt 11 from the lower end; each bolt 11 extends into the blind hole and is connected with the top wall of the blind hole.
As shown in fig. 5, the present invention further includes a PLC control system 27, an X-direction motor controller 25 and a Y-direction motor controller 26; the PLC control system 27 outputs a control signal to the X-direction motor controller 25, and the X-direction motor controller 25 outputs a control signal to control the X-direction motor 24 to act; the PLC control system 27 outputs a control signal to the Y-direction motor controller 26, and the Y-direction motor controller 26 outputs a control signal to control the operation of the Y-direction motor 18. The invention also comprises a casing 1; the bore diameter gauge, the wafer automatic positioning mechanism, the PLC control system 27, the X-direction motor controller 25 and the Y-direction motor controller 26 are all arranged on the machine shell 1.
As shown in fig. 4, since the wafer is in a high temperature state during the processing, in order to rapidly cool the wafer during the measurement and avoid the influence of an excessive temperature on the wafer quality, a cooling water circulation pipeline 30 is arranged inside the stage; the external cooling water enters the cooling water circulation pipeline 30 from the water inlet of the cooling water circulation pipeline 30 and flows out from the water outlet of the cooling water circulation pipeline 30. In order to prevent the wafer from scalding the positioning plate 21, a thermal insulation plate 20 is arranged between the slide holder 10 and the positioning plate 21.
As shown in fig. 3, the upper end surface of the slide holder 10 for placing the wafer is provided with a plurality of concentric circular grooves 29 with different diameters; the wafer can be firmly embedded into the circular groove 29 with the corresponding diameter, so that the wafer can be positioned on the slide holder 10.
A linear groove 28 for taking the wafer is arranged between the outer edge of the circular groove 29 and the outer edge of the wafer carrier 10, so that the wafer can be conveniently lifted from the circular groove 29.
In order to arrange the cables and the external cooling water pipeline regularly and avoid the disorder of the pipeline caused by the movement of the electric cylinder, the embodiment also comprises a drag chain for laying the cables and the external cooling water pipeline; the drag chain comprises an X-direction drag chain 5 arranged along the X direction and a Y-direction drag chain 13 arranged along the Y direction.
The wafer measuring device based on the aperture gauge comprises the following working steps: the wafer is placed in the corresponding circular groove 29 through the linear groove 28 formed on the slide holder 10; the PLC control system 27 outputs a control signal to the X-direction motor controller 25, and the X-direction motor controller 25 outputs a control signal to control the X-direction motor 24 to act; the PLC control system 27 outputs a control signal to the Y-direction motor controller 26, and the Y-direction motor controller 26 outputs a control signal to control the action of the Y-direction motor 18; the X-direction motor 24 drives the X-direction lead screw to rotate; the X-direction lead screw rotates to drive the X-direction action piece 7 to linearly reciprocate along the X-direction lead screw; the Y-direction motor 18 drives the Y-direction lead screw to rotate; the Y-direction screw rod rotates to drive the Y-direction action piece 14 to linearly reciprocate along the Y-direction screw rod; so that the wafer can be accurately positioned in the horizontal direction.
Then adjusting the lifting base 23 to enable the wafer to reach a measuring point in the Z direction; the bolt 11 is rotated to adjust the length of the bolt 11 extending out of the positioning plate 21, and the levelness of the slide holder 10 is adjusted.
And (4) the wafer reaches the measuring point of the aperture gauge through the steps, and the wafer is measured by the aperture gauge.
Claims (8)
1. The utility model provides a wafer measuring device based on aperture appearance, includes the aperture appearance, its characterized in that: the automatic positioning mechanism is used for positioning and conveying the wafer to a measuring point of the aperture gauge; the automatic wafer positioning mechanism comprises a horizontal X-direction electric cylinder; the X-direction electric cylinder comprises an X-direction action piece (7) which linearly reciprocates along the X direction;
a horizontal Y-direction electric cylinder; the Y-direction electric cylinder is fixed on the X-direction action piece; the Y-direction electric cylinder comprises a Y-direction operating piece (14) which linearly reciprocates along the Y direction; wherein the Y direction is perpendicular to the X direction;
a Z-direction lifting base (23); the Z-direction lifting base (23) is fixed at the upper end of the Y-direction action piece (14); the Z-direction lifting base (23) can be lifted along a Z-direction straight line; the Z direction is vertical to the X direction, and the Z direction is vertical to the Y direction;
a horizontal positioning plate (21) is fixed on the Z-direction lifting base (23); a slide holder (10) is arranged above the positioning plate (21); the bottom of the slide holder (10) is provided with a plurality of blind holes; a plurality of threaded through holes are formed in the positioning plate (21); the plurality of threaded through holes are correspondingly positioned right below the plurality of blind holes one by one, and the external diameter of the threads of the threaded through holes is smaller than the diameter of the blind holes; each threaded through hole is screwed with a bolt (11) from the lower end; each bolt (11) extends into one blind hole and is connected with the top wall of the blind hole.
2. The Aperture gauge-based wafer measurement device of claim 1, wherein: a cooling water circulation pipeline (30) is arranged in the slide holder; the external cooling water enters the cooling water circulation pipeline (30) from the water inlet of the cooling water circulation pipeline (30) and flows out from the water outlet of the cooling water circulation pipeline (30).
3. The Aperture gauge-based wafer measurement device of claim 2, wherein: and a heat insulation plate (20) is arranged between the slide holder (10) and the positioning plate (21).
4. The Aperture gauge-based wafer measurement device of claim 3, wherein: the upper end surface of the slide holder (10) for placing the wafer is provided with a plurality of circular grooves (29) with the same circle center and different diameters; the circular groove (29) is used for embedding wafers with corresponding diameters.
5. The Aperture gauge-based wafer measurement device of claim 4, wherein: a linear groove (28) for taking the wafer is arranged between the outer edge of the circular groove (29) and the outer edge of the wafer carrying table (10).
6. The apparatus of any of claims 1-5, wherein: the X-direction electric cylinder also comprises an X-direction motor (24) and an X-direction lead screw; the X-direction action piece (7) is sleeved outside the X-direction lead screw in a threaded manner; the X-direction motor (24) drives the X-direction lead screw to rotate; the X-direction lead screw rotates to drive the X-direction action piece (7) to linearly reciprocate along the X-direction lead screw;
the Y-direction electric cylinder also comprises a Y-direction motor (18) and a Y-direction lead screw; the Y-direction action piece (14) is sleeved outside the Y-direction lead screw in a threaded manner; the Y-direction motor (18) drives the Y-direction lead screw to rotate; the Y-direction lead screw rotates to drive the Y-direction action piece (14) to linearly reciprocate along the Y-direction lead screw.
7. The Aperture gauge-based wafer measurement device of claim 6, wherein: the system also comprises a PLC control system (27), an X-direction motor controller (25) and a Y-direction motor controller (26); the PLC control system (27) outputs a control signal to the X-direction motor controller (25), and the X-direction motor controller (25) outputs a control signal to control the X-direction motor (24) to act; the PLC control system (27) outputs a control signal to the Y-direction motor controller (26), and the Y-direction motor controller (26) outputs a control signal to control the Y-direction motor (18) to act.
8. The Aperture gauge-based wafer measurement device of claim 7, wherein: the device also comprises a drag chain for laying cables and externally connecting cooling water pipelines; the drag chain comprises an X-direction drag chain (5) arranged along an X direction and a Y-direction drag chain (13) arranged along a Y direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921753252.6U CN210375076U (en) | 2019-10-18 | 2019-10-18 | Wafer measuring device based on aperture gauge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921753252.6U CN210375076U (en) | 2019-10-18 | 2019-10-18 | Wafer measuring device based on aperture gauge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210375076U true CN210375076U (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921753252.6U Active CN210375076U (en) | 2019-10-18 | 2019-10-18 | Wafer measuring device based on aperture gauge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210375076U (en) |
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2019
- 2019-10-18 CN CN201921753252.6U patent/CN210375076U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Luwen Instrument Co.,Ltd. Address before: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: JIANGSU LEUVEN INSTRUMMENTS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |