CN210374290U - Semiconductor heat pipe heat dissipation cold and hot food all-in-one - Google Patents
Semiconductor heat pipe heat dissipation cold and hot food all-in-one Download PDFInfo
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- CN210374290U CN210374290U CN201920908112.5U CN201920908112U CN210374290U CN 210374290 U CN210374290 U CN 210374290U CN 201920908112 U CN201920908112 U CN 201920908112U CN 210374290 U CN210374290 U CN 210374290U
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Abstract
The utility model relates to a cold and hot food processing equipment, in particular to a semiconductor heat pipe heat dissipation cold and hot food all-in-one machine, which solves the structural problem of the semiconductor cold and hot food equipment, comprising an outer host, a movable inner container and a heat preservation sealing cover, wherein the outer host is provided with a slot for the movable inner container to be sleeved in, the outer host, the movable inner container and the heat preservation sealing cover are sequentially arranged along the vertical direction, the machine also comprises a power supply, a fixed inner container, a heat dissipation component and a control component, the fixed inner container is arranged between the slot and the movable inner container, the fixed inner container is made of a heat insulation material, the other end of the semiconductor component passes through the fixed inner container to be contacted with the movable inner container, the inner side wall or the inner bottom of the fixed inner container is provided with a temperature controller, the heat generated by the semiconductor is transferred to an air outlet through a, in addition, the structure layout is reasonable and ingenious, the carrying and the use are convenient, and the practicability and the economy are realized.
Description
Technical Field
The utility model relates to a cold and hot food processing equipment, in particular to cold and hot food all-in-one of semiconductor heat pipe heat dissipation.
Background
Generally, food is kept warm through temperature and air isolated equipment on the market, so that heat or cold loss is prevented, but the duration is relatively limited, and the heat preservation time is shortened due to the fact that the food is easily influenced by opening and closing. There is a kind of refrigeration or heating equipment, its function is comparatively single, can only process single type food, or can only refrigerate or heat. There are also semiconductor related devices in the market, but the refrigeration or heating efficiency is lower, often energy loss is great, the radiating effect is poor, or some heat dissipation effect that the structure is complicated is better, but the cost is too high, is not convenient for promote.
SUMMERY OF THE UTILITY MODEL
Not enough to current technique, the utility model provides a semiconductor heat pipe heat dissipation cold and hot food all-in-one.
In order to realize the purpose, the utility model adopts the technical scheme that: the integrated machine comprises an outer host, a movable inner container, a heat-preservation sealing cover, a power supply, a fixed inner container, a heat dissipation assembly and a control assembly, wherein a groove for the movable inner container to be sleeved in is formed in the outer host, the movable inner container and the heat-preservation sealing cover are sequentially arranged along the vertical direction, the fixed inner container is arranged between the groove and the movable inner container, the fixed inner container and the groove wall of the groove are fixedly assembled, the fixed inner container is made of a thermal insulation material, semiconductor assemblies are arranged on the outer side wall and the outer bottom of the fixed inner container, one end of each semiconductor assembly is fixedly assembled with the fixed inner container, the other end of each semiconductor assembly penetrates through the fixed inner container to be in contact with the movable inner container, and a temperature controller is arranged on the inner side;
the outer main machine is internally provided with a cavity, the heat dissipation assembly is arranged in the cavity and comprises a heat exhaust fan, a side heat pipe radiator and a bottom heat pipe radiator, the side heat pipe radiator is connected with a semiconductor assembly positioned on the side surface of the fixed inner container for heat transfer, the bottom heat pipe radiator is connected with a semiconductor assembly positioned at the bottom of the fixed inner container for heat transfer, and the heat exhaust fan is arranged on the outer sides of the side heat pipe radiator and the bottom heat pipe radiator;
the outer main engine upper portion is equipped with the air intake, and outer main engine lateral wall is equipped with the air outlet, air intake, cavity and air outlet form the wind channel of intercommunication, the power is located in the wind channel.
The semiconductor assembly comprises a cold-conducting fixed aluminum block and a semiconductor refrigeration chip.
The movable inner container, the cold-conducting fixed aluminum block and the semiconductor refrigeration chip are in contact with each other in sequence for heat transfer.
The control assembly comprises a control panel arranged on the surface of the outer host and a control module arranged in the outer host.
The external host is provided with an external interface on the outer wall, the external interface is electrically connected with a power supply, the external host also comprises a power line connected with an external power supply, and the power line is connected with the external interface.
The heat-preservation sealing cover is provided with a stirring motor and a stirring frame, the stirring motor and the stirring frame are assembled in a linkage mode through a stirring connector, and the stirring motor is fixedly assembled with the heat-preservation sealing cover through a motor support.
The wine bottle heat preservation sealing structure is characterized in that a hole for inserting a wine bottle is formed in the heat preservation sealing cover, a movable silica gel ring, a roller and a rolling motor which are sleeved on the wine bottle are further arranged at the hole of the heat preservation sealing cover, and the movable silica gel ring, the roller and the rolling motor are sequentially assembled in a linkage mode.
The bottom is equipped with movable silica gel pad in the removal inner bag, and is equipped with the silica gel guard ring on the inside wall in the removal.
And a multi-purpose ice lolly ice cube model is arranged in the movable inner container.
The heat-preservation sealing cover and the external host are movably connected through a rotating mechanism to form a rotating pair.
The utility model has the advantages that: the utility model provides a pair of semiconductor simple structure, simple to operate shift the heat that the semiconductor produced to air outlet department through the heat pipe, are favorable to improving the radiating rate greatly, improve semiconductor work efficiency and life, and structural layout is reasonable in addition, ingenious, conveniently carries and uses, has practicality and economic nature.
Drawings
Fig. 1 is a schematic front view of embodiment 1 of the present invention;
fig. 2 is a schematic front sectional view of embodiment 1 of the present invention;
fig. 3 is a front view structure diagram of the embodiment 2 of the present invention;
fig. 4 is a schematic top view of the embodiment 2 of the present invention;
fig. 5 is a schematic structural view of embodiment 2 of the present invention in a normal state;
fig. 6 is a schematic front view of embodiment 3 of the present invention.
Detailed Description
Example 1: as shown in fig. 1-2, the semiconductor heat pipe heat dissipation cold and hot food all-in-one machine comprises an outer host 1, a movable inner container 2 and a heat preservation sealing cover 3, wherein a slot for the movable inner container 2 to be sleeved is formed in the outer host 1, the movable inner container 2 and the heat preservation sealing cover 3 are sequentially arranged along the vertical direction, the machine further comprises a power supply 4, a fixed inner container 5, a heat dissipation assembly and a control assembly, the fixed inner container 5 is arranged between the slot and the movable inner container 2 and fixedly assembled between the fixed inner container 5 and the slot wall of the slot, the fixed inner container 5 is made of a heat insulation material, the fixed inner container 5 is made of the heat insulation material, and the existing similar products basically comprise the outer host 1, the movable inner container 2 and the heat preservation sealing cover 3, and the assembling sequence and the like are not described in more detail in the existing. Set up fixed inner bag 5 in this application, it itself plays the effect of thermal isolation and protection, can supply to remove inner bag 2 simultaneously and place. In addition, the assembly or fixing mode of the fixed inner container 5 is various and depends on the actual production.
The outer side wall and the outer bottom of the fixed inner container 5 are provided with semiconductor components, one end of each semiconductor component is fixedly assembled with the fixed inner container 5, the other end of each semiconductor component penetrates through the fixed inner container 5 to be in contact with the movable inner container 2, and the inner side wall or the inner bottom of the fixed inner container 5 is provided with a temperature controller 6. One end of the semiconductor component refrigerates and the other end heats, and heat or cold is transferred through direct contact.
A cavity is arranged in the outer host 1, the heat dissipation assembly is arranged in the cavity and comprises a heat exhaust fan 7, a side heat pipe radiator 8 and a bottom heat pipe radiator 9, the side heat pipe radiator 8 is connected with a semiconductor assembly positioned on the side surface of the fixed inner container 5 for heat transfer, the bottom heat pipe radiator 9 is connected with a semiconductor assembly positioned at the bottom of the fixed inner container 5 for heat transfer, and the heat exhaust fan 7 is arranged on the outer sides of the side heat pipe radiator 8 and the bottom heat pipe radiator 9; the heat exhausting fans 7 are at least provided with two groups, and the side heat pipe radiators 8 and the bottom heat pipe radiator 9 are arranged in parallel, so that the heat exhausting fans 7 are arranged on the outer side, and heat is exhausted by concentrating wind power. The heat pipes on the side heat pipe radiator 8 or the bottom heat pipe radiator 9 are extended and connected with the semiconductor component, and heat transfer is performed by utilizing the heat conductivity of metal. The semiconductor assemblies are arranged at the bottom and the side faces to improve the refrigerating or heating effect, and meanwhile, the semiconductor assemblies are matched with the corresponding radiating assemblies to improve the using effect and prolong the service life. The radiator can be a fin-type structure made of metal materials, has a wide radiating area and is favorable for air exhaust and heat dissipation.
Outer 1 upper portions of host computer are equipped with air intake 10, and outer 1 lateral wall of host computer is equipped with air outlet 11, air intake 10, cavity and air outlet 11 form the wind channel of intercommunication, power 4 is located in the wind channel. The hot wind flow direction that the wind channel formed can avoid the impact to the human body, can discharge inside unnecessary heat as far as possible maximize simultaneously, including power 4 self uses and generates heat. The stability and the safety of the circuit and the internal structure are ensured.
The semiconductor assembly comprises a cold conducting fixed aluminum block 12 and a semiconductor refrigeration chip 13. The aluminum has good thermal conductivity, light weight and low cost, and meets the design and use requirements. The cooling or heating of the semiconductor cooling chip 13 is a mature technical principle, and is not set forth or limited herein.
The movable inner container 2, the cold-conducting fixed aluminum block 12 and the semiconductor refrigeration chip 13 are in contact with each other in sequence for heat transfer. The semiconductor refrigeration chip 13 is used for refrigerating or heating, and the cold-conducting fixed aluminum block 12 is used for transferring heat or cold.
The control assembly includes a control panel 24 provided on the surface of the external host 1 and a control module 25 provided inside the external host 1. The control panel 2 is a mature integrated control unit and the internal control module 25 is a conventional technology, which is not limited herein.
The outer host computer 1 outer wall is equipped with external interface 14, external interface 14 and power 4 electric connection, still including the power cord of connecting external power source 4, meet between power cord and the external interface 14. The self-powered portable power supply is provided with an internal power supply 4 and can be externally connected through a power line so as to supplement electric quantity.
Be equipped with agitator motor 15 and stirring frame 16 on the sealed lid 3 that keeps warm, through stirring connector 17 linkage assembly between agitator motor 15 and the stirring frame 16, agitator motor 15 passes through motor support 18 and the sealed lid 3 fixed Assembly that keeps warm. Through a series of structures of the stirring frame 16 and the matching structure thereof, the food in the movable inner container 2 is convenient to stir and process. The manner of assembling the same is well established and not overly elaborated and limited herein.
The heat-preservation sealing cover 3 and the external host 1 are movably connected through a rotating mechanism 26 to form a rotating pair. The rotating mechanism 26 may actually be a hinged structure, and the rotation is smooth to facilitate the opening and closing of the heat-preserving sealing cover 3, which will not be described herein.
Example 2: different from embodiment 1, as shown in fig. 3 to 5, the heat-preserving sealing cover 3 is provided with an opening for inserting a wine bottle, the heat-preserving sealing cover 3 is further provided with a movable silica gel ring 19, a roller 20 and a rolling motor 21 which are sleeved on the wine bottle at the opening, and the movable silica gel ring 19, the roller 20 and the rolling motor 21 are assembled in a linkage manner in sequence.
The bottom is equipped with movable silica gel pad 22 in removing inner bag 2, and removes and is equipped with silica gel guard ring 23 on the inside wall. The movable silica gel ring 19 is sleeved outside the wine bottle, plays a certain sealing role in a gap where the wine bottle is inserted into the opening, and meanwhile, the wine bottle is rotated through the matching of the rolling motor 21 and the rolling wheel 20, so that the refrigeration effect is enhanced. The roller 20 may be movably fitted through a shaft provided on the heat-insulating sealing cover 3, or may be installed by other means. Here, the rolling motor 21 is only used for driving to drive the roller 20 to rotate, and the roller 20 is in contact linkage with the movable silicone ring 19. Generally, the rotating speed is not high, which is beneficial to the uniformity and rapidness of cooling the wine bottle and can also prevent local particle precipitation. The silica gel ring 19 can be added with composite PET to enhance the heat conduction effect, which is a mature technical product and is not described too much here.
When in use, the whole body is inclined, so that the red wine can be conveniently inserted and frozen and can be placed for a long time.
Example 3: different from the embodiments 1 and 2, as shown in fig. 6, a multi-purpose ice lolly ice cube model is arranged in the movable inner container 2, and cold drinks or cold products are made through the ice lolly ice cube model.
The utility model has the advantages that: the utility model provides a pair of semiconductor simple structure, simple to operate shift the heat that the semiconductor produced to air outlet department through the heat pipe, are favorable to improving the radiating rate greatly, improve semiconductor work efficiency and life, and structural layout is reasonable in addition, ingenious, conveniently carries and uses, has practicality and economic nature.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, and are only for convenience of description, and are not intended to indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and therefore, are not to be considered as limitations of the present invention, and the fundamental principles, main features, and advantages of the present invention have been shown and described above, as would be understood by those skilled in the art.
Claims (10)
1. The integrated machine comprises an outer host, a movable inner container and a heat-preservation sealing cover, wherein a groove for the movable inner container to be sleeved is formed in the outer host, the movable inner container and the heat-preservation sealing cover are sequentially arranged along the vertical direction, and the integrated machine is characterized by also comprising a power supply, a fixed inner container, a heat dissipation assembly and a control assembly, wherein the fixed inner container is arranged between the groove and the movable inner container, the fixed inner container is fixedly assembled with the groove wall of the groove, the fixed inner container is made of a heat insulation material, semiconductor assemblies are arranged on the outer side wall and the outer bottom of the fixed inner container, one end of each semiconductor assembly is fixedly assembled with the fixed inner container, the other end of each semiconductor assembly penetrates through the fixed inner container to be contacted with the movable inner container, and a temperature controller is arranged;
the outer main machine is internally provided with a cavity, the heat dissipation assembly is arranged in the cavity and comprises a heat exhaust fan, a side heat pipe radiator and a bottom heat pipe radiator, the side heat pipe radiator is connected with a semiconductor assembly positioned on the side surface of the fixed inner container for heat transfer, the bottom heat pipe radiator is connected with a semiconductor assembly positioned at the bottom of the fixed inner container for heat transfer, and the heat exhaust fan is arranged on the outer sides of the side heat pipe radiator and the bottom heat pipe radiator;
the outer main engine upper portion is equipped with the air intake, and outer main engine lateral wall is equipped with the air outlet, air intake, cavity and air outlet form the wind channel of intercommunication, the power is located in the wind channel.
2. The integrated semiconductor heat pipe heat sink, cold, hot, and food machine of claim 1, wherein said semiconductor package comprises a cold conductive fixed aluminum block and a semiconductor refrigeration chip.
3. The semiconductor heat pipe integrated machine for heat dissipation of cold, hot and food as claimed in claim 2, wherein the movable inner container, the cold-conducting fixed aluminum block and the semiconductor refrigeration chip are in contact with each other in sequence for heat transfer.
4. The integrated machine of claim 3, wherein the control assembly comprises a control panel disposed on the surface of the external main unit and a control module disposed inside the external main unit.
5. The integrated machine of claim 4, wherein the external host has an external interface on the outer wall, the external interface is electrically connected to a power source, and further comprising a power cord connected to an external power source, the power cord is connected to the external interface.
6. The integrated machine of claim 5, wherein the heat-insulating sealing cover is provided with a stirring motor and a stirring frame, the stirring motor and the stirring frame are assembled in a linkage manner through a stirring connector, and the stirring motor is fixedly assembled with the heat-insulating sealing cover through a motor support.
7. The integrated machine of claim 5, wherein the heat-insulating sealing cover has an opening for inserting a wine bottle, the heat-insulating sealing cover further has a movable silicone ring, a roller, and a rolling motor sleeved on the wine bottle at the opening, and the movable silicone ring, the roller, and the rolling motor are sequentially assembled in a linkage manner.
8. The integrated machine of claim 7, wherein the movable inner container has a movable silicone pad at the bottom and a silicone protective ring on the inner wall.
9. The integrated machine of claim 5, wherein a multipurpose ice cube model is provided in the movable inner container.
10. The integrated machine of claim 1, wherein the heat-insulating sealing cover and the external main body are movably connected by a rotating mechanism to form a revolute pair.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920908112.5U CN210374290U (en) | 2019-06-17 | 2019-06-17 | Semiconductor heat pipe heat dissipation cold and hot food all-in-one |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920908112.5U CN210374290U (en) | 2019-06-17 | 2019-06-17 | Semiconductor heat pipe heat dissipation cold and hot food all-in-one |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210374290U true CN210374290U (en) | 2020-04-21 |
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ID=70265123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920908112.5U Active CN210374290U (en) | 2019-06-17 | 2019-06-17 | Semiconductor heat pipe heat dissipation cold and hot food all-in-one |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210374290U (en) |
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2019
- 2019-06-17 CN CN201920908112.5U patent/CN210374290U/en active Active
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