CN210359850U - Wafer cutting positioning device - Google Patents

Abstract

The utility model belongs to the technical field of cutting positioning, in particular to a wafer cutting positioning device, which comprises a reciprocating servo motor and a laser cutting head, wherein an output shaft of the reciprocating servo motor is fixed with a rotating plate through a bolt, one end of the rotating plate is fixed with a hydraulic cylinder through a bolt, a chute is arranged inside the rotating plate, an output shaft of the hydraulic cylinder is fixed with a moving plate through a bolt, the moving plate is arranged inside the chute, two ends of the moving plate are both welded with a limiting block, and a sliding rod is welded inside the chute; make laser cutting head and commentaries on classics board be connected through spout, movable plate, stopper and slide bar, the movable plate passes through the stopper and the slide bar is installed in the inside of spout, and the stopper cup joints on the surface of slide bar simultaneously, has increased the stability that the movable plate removed inside the spout, has improved the balanced degree that the laser cutting head removed, and the laser cutting head passes through the output shaft of movable plate and hydraulic cylinder simultaneously, has improved the convenience that the laser cutting head removed.

Description

Wafer cutting positioning device

Technical Field

The utility model belongs to the technical field of the cutting location, concretely relates to wafer cutting positioner.

Background

The wafer cutting and positioning device is used for cutting and positioning a wafer to cut the wafer in a fixed diameter mode, the wafer cutting machine is also called a silicon wafer laser cutting machine and a laser scribing machine, the working principle is that high-energy laser beams are used for irradiating the surface of a workpiece, the irradiated area is locally melted and gasified, and therefore cutting of silicon materials is achieved.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a wafer cutting positioner has the laser cutting head and removes stable convenient characteristics.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer cutting positioner, includes reciprocal servo motor and laser cutting head, reciprocal servo motor's output shaft has the commentaries on classics board through the bolt fastening, the one end of commentaries on classics board has the hydraulic cylinder through the bolt fastening, the spout has been seted up to the inside of commentaries on classics board, the output shaft of hydraulic cylinder has the movable plate through the bolt fastening, the inside at the spout is installed to the movable plate, the stopper has all been welded at the both ends of movable plate, the inside welding of spout has the slide bar, the hole with slide bar looks adaptation is seted up on the surface of stopper, the other end of commentaries on classics board has laser displacement sensor through the bolt fastening, the upper end of laser cutting head run through the commenta.

As the utility model discloses a preferred technical scheme of wafer cutting positioner, the last surface mounting who changes the board has the control box, the internally mounted of control box has signal reception module, signal processing module, digital analog conversion module and control module.

As the utility model discloses a preferred technical scheme of wafer cutting positioner, the feeder ear of reciprocal servo motor, hydraulic cylinder, laser displacement sensor and laser cutting head all is connected with the control module electricity, signal processing module respectively with signal reception module, digital analog conversion module and control module electric connection, digital analog conversion module and laser displacement sensor electric connection.

As the utility model discloses a preferred technical scheme of wafer cutting positioner, the commentaries on classics board is square platelike structure.

As the utility model discloses a preferred technical scheme of wafer cutting positioner, spout inside weld's slide bar is provided with two altogether, the stopper cup joints the outside at the slide bar through the hole that the surface was seted up.

As the utility model discloses a preferred technical scheme of wafer cutting positioner, laser displacement sensor is located the one end of spout, just laser displacement sensor and movable plate center are in on the same straight line.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through the spout, the movable plate, stopper and slide bar make the laser cutting head be connected with the commentaries on classics board, the movable plate passes through the stopper and the slide bar is installed in the inside of spout, the stopper cup joints the surface at the slide bar simultaneously, the stability of movable plate at the inside removal of spout has been increased, the balance degree that the laser cutting head removed has been improved, the output shaft that the laser cutting head passes through movable plate and hydraulic cylinder simultaneously, the convenience that the laser cutting head removed has been improved, the stability and the convenience that the laser cutting head cut the wafer board have been increased.

2. Through installing the control box on commentaries on classics board surface for control box internally mounted's control module controls reciprocal servo motor, hydraulic cylinder and laser displacement sensor, and digital analog conversion module carries out the analysis through signal processing module after receiving the signal that laser displacement sensor uploaded simultaneously, makes control module control the output shaft of hydraulic cylinder is flexible, has improved the accurate nature that the laser cutting head removed.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of a rotating plate and a hydraulic cylinder in the present invention;

FIG. 3 is a schematic view of a connection structure between the rotating plate and the laser cutting head of the present invention;

fig. 4 is a schematic structural diagram of a control box in the present invention;

fig. 5 is a flow chart of the present invention;

in the figure: 1. a reciprocating servo motor; 2. rotating the plate; 3. a hydraulic cylinder; 4. a chute; 5. moving the plate; 6. a limiting block; 7. a slide bar; 8. a laser displacement sensor; 9. a laser cutting head; 10. a control box; 11. a signal receiving module; 12. a signal processing module; 13. a digital-to-analog conversion module; 14. and a control module.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a wafer cutting positioner, including reciprocal servo motor 1 and laser cutting head 9, the output shaft of reciprocal servo motor 1 passes through the bolt fastening and has changeed board 2, the one end of changeing board 2 is passed through the bolt fastening and has hydraulic cylinder 3, spout 4 has been seted up to the inside of changeing board 2, the output shaft of hydraulic cylinder 3 passes through the bolt fastening and has movable plate 5, movable plate 5 is installed in the inside of spout 4, stopper 6 has all been welded at the both ends of movable plate 5, the inside welding of spout 4 has slide bar 7, the hole with 7 looks adaptations of slide bar is seted up on the surface of stopper 6, the other end of changeing board 2 passes through the bolt fastening and has laser displacement sensor 8, the upper end of laser cutting head 9 run through changeing board 2.

In this embodiment, through spout 4, the movable plate 5, stopper 6 and slide bar 7 make laser cutting head 9 be connected with commentaries on classics board 2, movable plate 5 passes through stopper 6 and slide bar 7 and installs in the inside of spout 4, stopper 6 cup joints the surface at slide bar 7 simultaneously, the stability of movable plate 5 at the inside removal of spout 4 has been increased, the equilibrium degree that laser cutting head 9 removed has been improved, laser cutting head 9 is connected through the output shaft of movable plate 5 with hydraulic cylinder 3 simultaneously, the convenience that laser cutting head 9 removed has been improved, the stability and the convenience that laser cutting head 9 cut the round brilliant board have been increased.

Specifically, the upper surface of the rotating plate 2 is provided with a control box 10, the control box 10 is internally provided with a signal receiving module 11, a signal processing module 12, a digital-to-analog conversion module 13 and a control module 14, the power supply ends of the reciprocating servo motor 1, the hydraulic cylinder 3, the laser displacement sensor 8 and the laser cutting head 9 are electrically connected with the control module 14, the signal processing module 12 is respectively electrically connected with the signal receiving module 11, the digital-to-analog conversion module 13 and the control module 14, and the digital-to-analog conversion module 13 is electrically connected with the laser displacement sensor 8.

In this embodiment, through installing the control box 10 on the surface of commentaries on classics board 2 for control module 14 of control box 10 internally mounted controls reciprocal servo motor 1, hydraulic cylinder 3 and laser displacement sensor 8, and digital-to-analog conversion module 13 carries out the analysis through signal processing module 12 after receiving the signal that laser displacement sensor 8 uploaded simultaneously, makes control module 14 control the output shaft of hydraulic cylinder 3 is flexible, has improved the accurate nature that laser cutting head 9 removed.

Specifically, the rotating plate 2 is a square plate-shaped structure.

In this embodiment, the rotating plate 2 with a square plate-shaped structure is convenient for the rotating plate 2 to drive the laser cutting head 9 to rotate.

Specifically, two sliding rods 7 welded inside the sliding groove 4 are arranged, and the limiting block 6 is sleeved outside the sliding rods 7 through holes formed in the surface.

In this embodiment, the limiting block 6 is sleeved outside the sliding rod 7 through a hole formed in the surface, so that the stability of the moving plate 5 moving inside the sliding groove 4 is improved.

Specifically, the laser displacement sensor 8 is located at one end of the sliding chute 4, and the centers of the laser displacement sensor 8 and the moving plate 5 are located on the same straight line.

In this embodiment, the accuracy of position detection when the moving plate 5 moves is improved by the laser displacement sensor 8 which is located on the same straight line with the center of the moving plate 5.

The utility model provides a, the model that reciprocating servo motor 1 chooseed dongguan market shenlong electromechanical limited company to produce is the ESA-10S type, hydraulic cylinder 3 chooses the DSBC type of Guangdong philis exhibition intelligent science and technology share limited company production for use, laser displacement sensor 8 chooses the model that Shenzhen market morning sufficient electromechanical device limited company produced for use to be LV-NH32 type, signal receiving module 11 chooses the model that Shenzhen market yunli science and technology share limited company produced for use to be MS49SF2B type, signal processing module 12 chooses the model that Shenzhen market east shengxing technology limited company produced for use to be LQFP64 type, digital-to-analog conversion module 13 chooses the signal that Shenzhen market Tianshi kai electronic limited company produced for use to be PCF8591 type, control module 14 chooses the model that Shenzhen market Shendi scientific and technology development limited company produced for use to be A33 type.

The utility model discloses a theory of operation and use flow: during installation, the reciprocating servo motor 1 is fixed inside the wafer cutting machine, the laser cutting head 9 is fixed on the surface of the movable plate 5, the movable plate 5 is fixed on the output shaft of the hydraulic cylinder 3, the movable plate 5 is installed inside the sliding groove 4, the limiting blocks 6 welded at two ends of the movable plate 5 are sleeved outside the sliding rods 7 at the moment, the hydraulic cylinder 3 is fixed at one end of the rotating plate 2 through bolts, the laser displacement sensor 8 is fixed at the other end of the rotating plate 2, the control box 10 is installed on the surface of the rotating plate 2, during operation, the wafer cutting machine outputs signals to the signal receiving module 11, the signals received by the signal receiving module 11 are uploaded to the signal processing module 12, the signal processing module 12 analyzes the received signals and issues a command control module 14, so that the control module 14 controls the hydraulic cylinder 3 to stretch, and the movable plate 5 moves inside the sliding groove 4 at the, meanwhile, the limiting block 6 slides on the surface of the sliding rod 7, the laser displacement sensor 8 uploads a signal to the signal processing module 12 through the digital-to-analog conversion module 13 after detecting the position change of the moving plate 5, and when the signal received by the signal processing module 12 reaches a set value, the signal processing module 12 controls the hydraulic cylinder 3 to stop moving through the control module 14, and the control module 14 controls the reciprocating servo motor 1 and the laser cutting head 9 to start, so that the laser cutting head 9 moves circularly and reciprocally.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a wafer cutting positioner, includes reciprocal servo motor (1) and laser cutting head (9), its characterized in that: the output shaft of reciprocal servo motor (1) has commentaries on classics board (2) through the bolt fastening, the one end of commentaries on classics board (2) has hydraulic cylinder (3) through the bolt fastening, spout (4) have been seted up to the inside of commentaries on classics board (2), the output shaft of hydraulic cylinder (3) has movable plate (5) through the bolt fastening, the inside at spout (4) is installed in movable plate (5), stopper (6) have all been welded at the both ends of movable plate (5), the inside welding of spout (4) has slide bar (7), the hole with slide bar (7) looks adaptation is seted up on the surface of stopper (6), the other end of commentaries on classics board (2) has laser displacement sensor (8) through the bolt fastening, the upper end of laser cutting head (9) runs through commentaries on classics board (2) and with movable plate (5) fixed.

2. The wafer cutting positioning device as set forth in claim 1, wherein: the upper surface of the rotating plate (2) is provided with a control box (10), and a signal receiving module (11), a signal processing module (12), a digital-to-analog conversion module (13) and a control module (14) are arranged in the control box (10).

3. The wafer cutting positioning device as set forth in claim 2, wherein: the power supply ends of the reciprocating servo motor (1), the hydraulic cylinder (3), the laser displacement sensor (8) and the laser cutting head (9) are electrically connected with the control module (14), the signal processing module (12) is electrically connected with the signal receiving module (11), the digital-to-analog conversion module (13) and the control module (14) respectively, and the digital-to-analog conversion module (13) is electrically connected with the laser displacement sensor (8).

4. The wafer cutting positioning device as set forth in claim 1, wherein: the rotating plate (2) is of a square plate-shaped structure.

5. The wafer cutting positioning device as set forth in claim 1, wherein: the two sliding rods (7) welded in the sliding groove (4) are arranged, and the limiting block (6) is sleeved outside the sliding rods (7) through holes formed in the surface.

6. The wafer cutting positioning device as set forth in claim 1, wherein: the laser displacement sensor (8) is located at one end of the sliding groove (4), and the centers of the laser displacement sensor (8) and the moving plate (5) are located on the same straight line.

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