CN210352024U - Paster device and colloid forming device thereof - Google Patents
Paster device and colloid forming device thereof Download PDFInfo
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- CN210352024U CN210352024U CN201920483199.6U CN201920483199U CN210352024U CN 210352024 U CN210352024 U CN 210352024U CN 201920483199 U CN201920483199 U CN 201920483199U CN 210352024 U CN210352024 U CN 210352024U
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Abstract
The utility model discloses a chip mounter, the absorption side of the chip mounter body of the chip mounter is provided with a first absorption surface, the first absorption surface is provided with colloid, and a second absorption surface formed by the colloid and the first absorption surface jointly form an absorption part for adapting different high-speed chip mounter suction nozzles; and a patch surface is arranged on one side opposite to the adsorption part, and the vertical projection surface of the adsorption part to the direction of the patch surface is coplanar with the patch surface. The chip mounting device designed by the structure can effectively meet the adsorption of suction nozzles of different high-speed chip mounters through the arrangement of the adsorption part, and the product has light weight and is not easy to have abnormity such as material throwing and the like; the utility model also provides a colloid forming device, this colloid forming device can be through the nimble adjustment to non-stick glue mould shaping chamber, and the shape of nimble efficient adjustment adsorption portion satisfies the absorption of different high-speed chip mounter suction nozzles then.
Description
Technical Field
The utility model relates to a high-speed paster technical field especially relates to a paster device and colloid forming device thereof.
Background
When the SMT paster component is subjected to SMT paster, the SMT paster component is adsorbed by the SMT paster machine through the suction nozzle, and then the SMT paster component is quickly transferred to a bonding pad which corresponds to the PCB and is scraped with solder paste. It is required to have an adsorption surface matching the suction nozzle surface at the center of the upper plane of the patch surface. The larger the adsorption surface is, the more inosculation is made between the patch adsorption surface and the patch surface of the suction nozzle, the lighter the weight of the patch device is, the more difficult the patch is to throw materials, and the speed of the chip mounter can also be improved.
In the prior art, the cover plate is added by welding or colloid bonding, special requirements are provided for the quality and the dosage of glue or solder and the appearance size of the ceramic chip, special requirements are provided for the bonding position of the cover plate and the curing process, the process is complex, and the cost is high; due to aging of glue or temperature resistance and thermal expansion of the cover plate and the device body, the cover plate is easy to fall off, and production is affected. This method is only suitable for plane suction nozzles, not for cambered surface suction nozzles.
The method can increase the volume and weight of the patch device, is not beneficial to high-speed patch, improves the design requirement of the patch device, and increases the processing difficulty and cost of the component. This method is only suitable for plane suction nozzles, not for cambered surface suction nozzles.
In summary, it is a problem to be solved urgently to design a patch device with light weight and large absorption surface.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a paster device and a colloid forming device thereof, which can effectively meet the adsorption of suction nozzles of different high-speed paster machines through the arrangement of an adsorption part, and the product has light weight and is not easy to have abnormity such as material throwing; meanwhile, the adsorption part can be flexibly adjusted through the non-adhesive mould, and the adsorption part is conveniently and quickly arranged and used for meeting the requirements of suction nozzles of different high-speed chip mounters.
To achieve the purpose, the utility model adopts the following technical proposal:
a first adsorption surface is arranged on the adsorption side of a chip mounter body of the chip mounter, a colloid is arranged on the first adsorption surface, and a second adsorption surface formed by the colloid and the first adsorption surface jointly form an adsorption part used for adapting to suction nozzles of different high-speed chip mounters; and a patch surface is arranged on one side opposite to the adsorption part, and the vertical projection surface of the adsorption part to the direction of the patch surface is coplanar with the patch surface.
Wherein the second adsorption surface is provided as a plane, which is coplanar with the first adsorption surface.
The second adsorption surface is an arc surface, and the arc surface is different from the first adsorption surface.
The chip mounter body is at least provided with two welding feet and/or electrodes, and the chip surface where at least two welding feet and/or electrodes are located is coplanar with the vertical projection surface of the adsorption part in the direction of the chip surface.
Wherein the ratio of the weight of the patch device to the effective adsorption area of the patch device is less than 0.1g/mm2。
Wherein, with the tangent one side in the absorption side of paster body is provided with adsorbs the arch, adsorb protruding keeping away from a side of paster body sets up to plane or cambered surface.
Wherein, the vertical projection surface of the adsorption bulge towards the patch surface direction is coplanar with the patch surface
The utility model provides a colloid forming device, includes the non-viscose mould, the non-viscose mould with form after the absorption side cooperation of paster body and be used for the fashioned shaping chamber of colloid.
And liquid glue for forming the colloid after natural curing is filled in the forming cavity.
And powder for forming the colloid after heating and curing is filled in the forming cavity.
The colloid is epoxy resin, and the inner wall of the molding cavity is provided with a fluorine-containing high polymer layer or a silicon-containing rubber layer.
The utility model has the advantages that: the utility model provides a paster device suitable for high-speed chip mounter, the absorption side of the paster device body of this paster device is provided with the first adsorption plane, the first adsorption plane is provided with the colloid, the second adsorption plane that the colloid formed constitutes the absorption portion that is used for adapting different high-speed chip mounter suction nozzles together with the first adsorption plane; and a patch surface is arranged on one side opposite to the adsorption part, and the vertical projection surface of the adsorption part to the direction of the patch surface is coplanar with the patch surface. The chip mounting device designed by the structure can effectively meet the adsorption of suction nozzles of different high-speed chip mounters through the arrangement of the adsorption part, and the product has light weight and is not easy to have abnormity such as material throwing and the like; the utility model also provides a colloid forming device, this colloid forming device can be through the nimble adjustment to non-stick glue mould shaping chamber, and the shape of nimble efficient adjustment adsorption portion satisfies the absorption of different high-speed chip mounter suction nozzles then.
Drawings
Fig. 1 is an axonometric view of the chip device before being filled with the gel in the first embodiment of the present invention.
Fig. 2 is an isometric view of the patch device of fig. 2 after filling with gel.
Fig. 3 is an isometric view of a patch device in a second embodiment of the invention.
Fig. 4 is an isometric view of a patch device in a third embodiment of the present invention.
Fig. 5 is an isometric view of a patch device in a fourth embodiment of the present invention.
Fig. 6 is an exploded view of the colloid forming apparatus of the present invention.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1 to fig. 2, this embodiment provides a chip mounter, in which a first adsorption surface 1 is disposed on an adsorption side of a chip mounter body of the chip mounter, the first adsorption surface 1 is disposed with a colloid, and a second adsorption surface 2 formed by the colloid and the first adsorption surface 1 together form an adsorption part for adapting to different high-speed chip mounter nozzles; and a patch surface is arranged on one side opposite to the adsorption part, and the vertical projection surface of the adsorption part to the direction of the patch surface is coplanar with the patch surface.
Further, in this embodiment, the second suction surface 2 may be configured as a plane according to the shape of the high-speed chip mounter nozzle, and the plane may be coplanar with the first suction surface 1. According to the material throwing device, the adsorption area of the adsorption part is effectively enlarged, and the material throwing problem caused by small adsorption area is avoided.
In this embodiment, the second adsorption surface 2 may also be set as an arc surface according to the shape of the suction nozzle of the high-speed chip mounter, and as shown in fig. 1, when the second adsorption surface 2 is set, the annular groove and the plane in the middle of the annular groove may be subjected to colloid molding, so that the arc surface of the colloid after molding is set to be different from the first adsorption surface (i.e., not in one plane), thereby conveniently and flexibly meeting the adsorption requirement of the arc-shaped suction nozzle.
Further, in this embodiment, the chip mounter body is provided with at least two solder pads and/or electrodes, taking fig. 1 and fig. 2 as an example, a first solder pad 3 extends from one side of the upper surface of the chip mounter body, a second solder pad is disposed in the middle of a side surface opposite to the first absorption surface, and the lower bottom surfaces of the first solder pad 3 and the second solder pad are coplanar to form a chip surface. In order to increase the stability of the chip device during chip mounting, the chip surface where the first welding foot 3 and the second welding foot are located and the vertical projection plane of the adsorption part towards the direction of the chip surface are arranged in a coplanar manner.
By adopting the adsorption device with the structural design, in order to effectively reduce the weight of the whole product filled with colloid, the ratio of the weight of the patch device to the effective adsorption area of the patch device is less than 0.1g/mm2Preferably, the value is set to 0.06g/mm2.. The effective adsorption area in this embodiment is an area where an adsorption portion of the suction nozzle of the high-speed chip mounter coincides with an adsorption portion of the adsorption device.
Further, convenient swift colloid shaping that carries on, it is shown in combination figure 6 to combine, and this embodiment provides a colloid forming device, and this colloid forming device includes on-stick glue cylinder mould 6, on-stick glue cylinder mould 6 with form after the absorption side cooperation of paster body and be used for the shaping chamber that colloid 11 was filled, later to pouring into liquid colloid in the shaping chamber and treat its solidification back, can be according to the absorption portion of the shaping shape shaping play required shape in shaping chamber, in addition, can also adsorb the shape requirement according to the suction nozzle, the shape in the shaping chamber at 6 tops of nimble adjustment on-stick glue cylinder mould, convenient and fast iterates the product, makes it satisfy different suction nozzle and adsorbs the requirement.
When carrying out the colloid shaping through above-mentioned colloid forming device, can fill in the shaping intracavity and be used for forming behind the natural curing colloid 11 liquid glue also can fill and be used for forming behind the heating curing colloid 11's powder, specifically use actual demand as the standard, do not do here and specifically give unnecessary detail.
As the second, third and fourth embodiments of the present application, as shown in fig. 3 to 5, one side of the chip mounter body tangent to the adsorption side is provided with the adsorption protrusions 41, 42 and 43, one side of the adsorption protrusion away from the chip mounter body is provided with a plane or an arc surface, as shown in fig. 3 to 5, the chip surface where the two solder feet 51 and 52 of the product formed on the basis of the product shown in fig. 1 and 2 are located is coplanar with the vertical projection plane of the adsorption protrusion to the chip surface direction, and with this design, the vertical welding of the chip device can be effectively satisfied on the basis of the horizontal welding of the chip device.
In this embodiment, in order to make the colloid have certain shock-absorbing capacity, effectively protect paster device inner wall chip, colloid 11 sets up to epoxy, simultaneously, in order to make things convenient for the colloid shaping back drawing of patterns, the inner wall of shaping chamber is provided with fluorine-containing high polymer layer or silicon-containing rubber layer.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (11)
1. A patch device, characterized by: the suction side of a chip mounter body of the chip mounter is provided with a first suction surface, the first suction surface is provided with a colloid, and a second suction surface formed by the colloid and the first suction surface jointly form a suction part for adapting to suction nozzles of different high-speed chip mounters; and a patch surface is arranged on one side opposite to the adsorption part, and the vertical projection surface of the adsorption part to the direction of the patch surface is coplanar with the patch surface.
2. A patch device as claimed in claim 1, wherein: the second adsorption surface is arranged to be a plane, and the plane is coplanar with the first adsorption surface.
3. A patch device as claimed in claim 1, wherein: the second adsorption surface is an arc surface, and the arc surface is different from the first adsorption surface.
4. A patch device as claimed in claim 1, wherein: the chip mounter body is at least provided with two welding feet and/or electrodes, and the chip surface where at least two welding feet and/or electrodes are located is coplanar with the vertical projection surface of the adsorption part in the direction of the chip surface.
5. A patch device as claimed in claim 1, wherein: the ratio of the weight of the patch device to the effective adsorption area of the patch device is less than 0.1g/mm2。
6. A patch device as claimed in claim 1, wherein: and an adsorption bulge is arranged on one side tangent to the adsorption side of the paster body, and a side surface of the adsorption bulge, far away from the paster body, is arranged to be a plane or an arc surface.
7. A patch device as claimed in claim 6, wherein: the vertical projection plane of the adsorption bulge towards the patch surface is coplanar with the patch surface.
8. A paste forming apparatus for a patch device according to any one of claims 1 to 7, characterized in that: including the non-viscose mould, the non-viscose mould with form after the absorption side cooperation of paster body and be used for the fashioned shaping chamber of colloid.
9. The colloid forming apparatus of claim 8, wherein: and liquid glue for forming the colloid after natural curing is filled in the forming cavity.
10. The colloid forming apparatus of claim 8, wherein: and the molding cavity is filled with powder for forming the colloid after heating and curing.
11. The colloid forming apparatus of claim 8, wherein: the colloid is epoxy resin, and the inner wall of the molding cavity is provided with a fluorine-containing high polymer layer or a silicon-containing rubber layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920483199.6U CN210352024U (en) | 2019-04-10 | 2019-04-10 | Paster device and colloid forming device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920483199.6U CN210352024U (en) | 2019-04-10 | 2019-04-10 | Paster device and colloid forming device thereof |
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| Publication Number | Publication Date |
|---|---|
| CN210352024U true CN210352024U (en) | 2020-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920483199.6U Active CN210352024U (en) | 2019-04-10 | 2019-04-10 | Paster device and colloid forming device thereof |
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| CN (1) | CN210352024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862774A (en) * | 2019-04-10 | 2019-06-07 | 深圳市槟城电子有限公司 | A kind of surface-mounted device and its colloid molding machine |
-
2019
- 2019-04-10 CN CN201920483199.6U patent/CN210352024U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862774A (en) * | 2019-04-10 | 2019-06-07 | 深圳市槟城电子有限公司 | A kind of surface-mounted device and its colloid molding machine |
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| GR01 | Patent grant | ||
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Address after: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Patentee after: Shenzhen Penang Electronics Co.,Ltd. Address before: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Patentee before: Shenzhen Bencent Electronics Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |