CN210351002U - DC-DC converter heat radiation structure - Google Patents
DC-DC converter heat radiation structure Download PDFInfo
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- CN210351002U CN210351002U CN201921578253.1U CN201921578253U CN210351002U CN 210351002 U CN210351002 U CN 210351002U CN 201921578253 U CN201921578253 U CN 201921578253U CN 210351002 U CN210351002 U CN 210351002U
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- temperature resistant
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Abstract
The utility model discloses a DC-DC converter heat radiation structure, heat radiation structure set up on the casing of DC-DC converter, heat radiation structure including fixed high temperature resistant heat conduction dope layer and the fixed radiator unit who sets up in the casing bottom of setting on the internal surface of casing, radiator unit includes heat conduction post and heating panel, the fixed setting that the heat conduction post runs through is in the casing bottom for guide the heat of high temperature resistant heat conduction dope layer, the heating panel is fixed to be set up on the bottom surface in the casing outside, and link firmly with the heat conduction post, the utility model discloses can not influence the sealing performance of casing to can reach fine radiating purpose.
Description
Technical Field
The utility model belongs to the technical field of DC-DC converter, specifically be a DC-DC converter heat radiation structure.
Background
The DC/DC converter is a voltage converter that effectively outputs a fixed voltage after converting an input voltage. DC/DC converters are divided into three categories: a step-up DC/DC converter, a step-down DC/DC converter, and a step-up/step-down DC/DC converter. Three types of control can be used as required. The PWM control type is efficient and has good output voltage ripple and noise. The PFM control type has an advantage of low power consumption even when used for a long time, particularly when used under a small load. The PWM/PFM switching type PFM control is carried out at the time of a small load, and is automatically switched to the PWM control at the time of a heavy load. At present, the DC-DC converter is widely used in products such as mobile phones, MP3, digital cameras, portable media players, and the like. Belonging to chopper circuits in circuit type classification.
The heat dissipation of the DC/DC converter is more, and at present, a heat dissipation grid is generally arranged on the outer side of a shell, so that the heat dissipation area is increased, and the temperature is reduced in an air cooling mode.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a DC-DC converter heat radiation structure has solved the unsatisfactory problem of present DC/DC converter radiating effect.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a heat radiation structure of a DC-DC converter is arranged on a shell of the DC-DC converter and comprises a high temperature resistant heat conduction coating layer fixedly arranged on the inner surface of the shell and a heat radiation assembly fixedly arranged at the bottom of the shell, wherein the heat radiation assembly comprises a heat conduction column and a heat radiation plate, the heat conduction column penetrates through the heat conduction column and is fixedly arranged at the bottom of the shell and used for guiding the heat of the high temperature resistant heat conduction coating layer, and the heat radiation plate is fixedly arranged on the bottom surface of the outer side of the shell and fixedly connected with the heat conduction column.
Furthermore, the heat dissipation assembly further comprises a heat absorbing sheet which is fixedly arranged on the bottom surface in the shell and is positioned on the high-temperature-resistant heat conduction coating layer, and the heat conduction column is connected with the heat absorbing sheet.
Further, high temperature resistant heat conduction coating layer includes basic unit and high temperature resistant heat conduction coating adhesive layer, the basic unit be the copper plate, be located the internal surface of casing, high temperature resistant heat conduction coating adhesive layer sets up the upper surface at the copper plate for high temperature resistant heat conduction coating.
Preferably, the heat absorbing sheet is a copper sheet.
Preferably, the heat conduction column is a copper column.
Furthermore, the heat dissipation plate is a copper plate, and heat dissipation grooves are vertically and horizontally formed in the lower surface of the heat dissipation plate.
The utility model has the advantages that:
the high-temperature-resistant heat-conducting coating layer has a good heat absorption effect, can well absorb heat in the DC-DC converter under the condition of ensuring the sealing of the DC-DC converter, and then is guided to the heat dissipation plate by the heat conduction columns, so that the heat absorption efficiency is good, the heat dissipation is rapid, and the sealing performance of the DC-DC converter is not influenced.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a sectional view of the present invention.
Fig. 2 is a bottom view of the heat dissipating plate of the present invention;
fig. 3 is a schematic view of the high temperature resistant heat conducting coating layer of the present invention.
Wherein: the heat-conducting plate comprises a shell body-1, a high-temperature-resistant heat-conducting coating layer-2, a heat-conducting column-3, a heat-radiating plate-4, a heat-radiating groove-5, a heat-absorbing sheet-6, a base layer-7 and a high-temperature-resistant heat-conducting coating adhesion layer-8.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
A heat radiation structure of a DC-DC converter is arranged on a shell 1 of the DC-DC converter, the heat radiation structure comprises a high temperature resistant heat conduction coating layer 2 fixedly arranged on the inner surface of the shell 1 and a heat radiation component fixedly arranged at the bottom of the shell 1, the heat radiation component comprises a heat conduction column 3, a heat radiation plate 4 and a heat absorption plate 6, the heat conduction column 3 is fixedly arranged at the bottom of the shell 1 in a penetrating way and is used for guiding the heat of the high temperature resistant heat conduction coating layer 2, concretely, the heat conduction column 3 is a copper column, the heat radiation plate 4 is a copper plate, heat radiation grooves 5 are vertically and horizontally arranged on the lower surface, the heat absorption plate 6 is fixedly arranged on the bottom surface in the shell 1 and is positioned on the high temperature resistant heat conduction coating layer 2, the heat conduction column 3 is connected with the heat absorption plate 6, and the heat radiation plate 4 is fixedly arranged on the bottom surface outside the shell 1, the heat absorbing sheet 6 is a copper sheet, the high temperature resistant heat conducting coating layer 2 comprises a base layer 7 and a high temperature resistant heat conducting coating adhesion layer 8, the base layer 7 is a copper plated layer and is located on the inner surface of the shell 1, the high temperature resistant heat conducting coating adhesion layer 8 is a high temperature resistant heat conducting coating arranged on the upper surface of the copper plated layer 7, the high temperature resistant heat conducting coating layer 2 is thin and unstable, when the heat conducting column 3 guides heat, the difficulty of connecting the heat conducting column 3 with the high temperature resistant heat conducting coating layer 2 is large, the heat conducting column 3 cannot be stably connected, the arranged heat absorbing sheet 6 can absorb the heat of the high temperature resistant heat conducting coating layer 2 and can be easily connected with the heat conducting column 3, the assembling difficulty is reduced, and the heat radiating speed can be accelerated by the heat radiating groove 5.
The above-described embodiments of the present invention should not be construed as limiting the scope of the present invention, and any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. A heat dissipation structure of a DC-DC converter, the heat dissipation structure is arranged on a casing of the DC-DC converter, and the heat dissipation structure is characterized in that: the heat radiation structure comprises a high-temperature-resistant heat conduction coating layer fixedly arranged on the inner surface of the shell and a heat radiation assembly fixedly arranged at the bottom of the shell, wherein the heat radiation assembly comprises a heat conduction column and a heat radiation plate, the heat conduction column penetrates through the heat conduction column and is fixedly arranged at the bottom of the shell and used for guiding heat of the high-temperature-resistant heat conduction coating layer, and the heat radiation plate is fixedly arranged on the bottom surface of the outer side of the shell and fixedly connected with the heat conduction column.
2. The heat dissipating structure of claim 1, wherein the heat dissipating assembly further comprises a heat sink, the heat sink is fixed on the bottom surface of the housing and is disposed on the high temperature resistant heat conductive coating, and the heat conducting pillar is connected to the heat sink.
3. The heat dissipation structure of claim 1, wherein the high temperature resistant thermal conductive coating layer comprises a base layer and a high temperature resistant thermal conductive coating adhesion layer, the base layer is a copper plating layer and is disposed on an inner surface of the casing, and the high temperature resistant thermal conductive coating adhesion layer is a high temperature resistant thermal conductive coating disposed on an upper surface of the copper plating layer.
4. The heat dissipating structure of claim 2, wherein the heat sink sheet is a copper sheet.
5. The heat dissipating structure of claim 1, wherein the heat conductive pillars are copper pillars.
6. The heat dissipating structure of claim 1, wherein the heat dissipating plate is a copper plate, and heat dissipating grooves are vertically and horizontally formed on a lower surface of the heat dissipating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921578253.1U CN210351002U (en) | 2019-09-21 | 2019-09-21 | DC-DC converter heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921578253.1U CN210351002U (en) | 2019-09-21 | 2019-09-21 | DC-DC converter heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351002U true CN210351002U (en) | 2020-04-17 |
Family
ID=70177867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921578253.1U Active CN210351002U (en) | 2019-09-21 | 2019-09-21 | DC-DC converter heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210351002U (en) |
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2019
- 2019-09-21 CN CN201921578253.1U patent/CN210351002U/en active Active
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