CN210349793U

CN210349793U - Novel semiconductor wafer bearing table

Info

Publication number: CN210349793U
Application number: CN201921017938.9U
Authority: CN
Inventors: 刘家铭; 张孝仁; 苏华庭
Original assignee: Yuandingfeng Investment Co Ltd
Current assignee: Hefei Core Semiconductor Co Ltd
Priority date: 2019-07-02
Filing date: 2019-07-02
Publication date: 2020-04-17
Anticipated expiration: 2029-07-02

Abstract

The utility model discloses a novel semiconductor wafer plummer relates to the semiconductor field, including the plummer, the top fixedly connected with multiunit of plummer bears the tooth, bears the tooth including fixed tooth and regulation tooth, and the regulation passageway has been seted up to the inside of plummer, and the inside movable mounting who adjusts the passageway has the fly leaf, and a plurality of movable grooves have been seted up at the top of adjusting the passageway, a plurality of spliced poles of top fixedly connected with of fly leaf, a plurality of spliced poles run through the movable groove and respectively with a plurality of bottom fixed connection who adjusts the tooth, and the one end rear side movable mounting who adjusts the passageway has the gear, the top fixedly connected with crank of gear. The utility model discloses a middle part of fixed tooth and regulation tooth supports the wafer, through the double-layered mouthful setting of "Y" style of calligraphy between fixed tooth and the regulation tooth, can carry out the outrigger to the wafer, bears the setting of tooth through the multiunit, can stabilize a plurality of wafers of location on the plummer, and convenient to use is nimble.

Description

Novel semiconductor wafer bearing table

Technical Field

The utility model relates to a semiconductor field, in particular to novel semiconductor wafer plummer.

Background

The wafer is a silicon wafer, which is a silicon wafer used for manufacturing silicon semiconductor integrated circuits, and is called a wafer because the wafer is circular in shape, and various circuit element structures can be manufactured on the silicon wafer, so that an integrated circuit product with specific electrical functions is obtained.

In the wafer production and processing procedure in the prior art, after the wafer is cleaned, the wafer needs to be supported by the bearing table so as to be convenient for the subsequent wafer transfer and further processing by the manipulator.

Therefore, it is desirable to provide a novel semiconductor wafer carrier to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel semiconductor wafer plummer to during the semiconductor wafer production that proposes in solving above-mentioned background art adds man-hour, the plummer supports unstability to the wafer, uses inflexible problem.

In order to achieve the above object, the utility model provides a following technical scheme: a novel semiconductor wafer bearing table comprises a bearing table body, wherein multiple groups of bearing teeth are fixedly connected to the top of the bearing table body, the bearing teeth comprise fixed teeth and adjusting teeth, an adjusting channel is formed in the bearing table body, a movable plate is movably mounted in the adjusting channel, multiple movable grooves are formed in the top of the adjusting channel, multiple connecting columns are fixedly connected to the top of the movable plate, penetrate through the movable grooves and are fixedly connected with the bottoms of the adjusting teeth respectively;

a gear is movably mounted on the rear side of one end of the adjusting channel, a crank is fixedly connected to the top of the gear, and a rack is fixedly connected to the rear surface of the movable plate;

the top of plummer is run through the top and the fixedly connected with fixed block of plummer, the movable hole has been seted up at the middle part of fixed block, the inside swing joint of movable hole has the inserted bar, the spacing groove has been seted up at the middle part of movable hole, the inside swing joint of spacing groove has the limiting plate, the middle part of limiting plate is run through to the bottom of inserted bar, a plurality of jacks have been seted up to the plummer near the one end upper surface of rocker.

Optionally, the fixed teeth and the adjusting teeth have the same structure, and the plurality of groups of bearing teeth are horizontally arranged on the upper surface of the bearing table.

Optionally, the fixed teeth and the adjusting teeth have the same height, and the distances between the fixed teeth and the adjusting teeth in each group of bearing teeth are equal.

Optionally, the movable grooves are matched with the connecting columns, the number of the movable grooves is equal to the number of the bearing teeth, and the movable grooves correspond to the adjusting teeth.

Optionally, the adjusting channel is matched with the movable plate, and the inner surface of the adjusting channel is attached to the outer surface of the movable plate.

Optionally, the front end of the gear is attached to the rear surface of the movable plate, and the front end of the gear is meshed with the rack.

Optionally, the limiting groove is matched with the limiting plate, and the plurality of jacks are distributed in an annular array by taking the central point of the gear as a circle center.

The utility model discloses a technological effect and advantage:

1. the utility model discloses a middle part of fixed tooth and regulation tooth supports the wafer, through the double-layered mouthful setting of "Y" style of calligraphy between fixed tooth and the regulation tooth, can carry out the outrigger to the wafer, bears the setting of tooth through the multiunit, can stabilize a plurality of wafers of location on the plummer, and convenient to use is nimble.

2. The utility model discloses a setting of crank, in the clockwise and anticlockwise pivoted of crank, can control every group and bear the weight of the distance between the tooth fixed tooth and the regulation tooth in the tooth, it is more nimble when using, can adjust according to the thickness of wafer, application range is wider.

Drawings

FIG. 1 is a schematic front sectional view of the structure of the carrier table of the present invention;

FIG. 2 is a schematic top view of the movable plate structure of the present invention;

FIG. 3 is an enlarged schematic view of the structure of the area A in FIG. 1 according to the present invention;

fig. 4 is a schematic top view of the jack structure of the present invention.

In the figure: 1. a bearing table; 2. a load bearing tooth; 3. fixing teeth; 4. adjusting teeth; 5. adjusting the channel; 6. a movable plate; 7. a movable groove; 8. connecting columns; 9. a gear; 10. a rack; 11. a crank; 12. a fixed block; 13. a movable hole; 14. inserting a rod; 15. a limiting groove; 16. a limiting plate; 17. and (4) inserting the jack.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; may be a mechanical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The utility model provides a novel semiconductor wafer bearing platform as shown in figures 1-4, which comprises a bearing platform 1;

as shown in fig. 1, a plurality of groups of bearing teeth 2 are fixedly connected to the top of a bearing table 1, each bearing tooth 2 comprises a fixed tooth 3 and an adjusting tooth 4, an adjusting channel 5 is formed inside the bearing table 1, a movable plate 6 is movably mounted inside the adjusting channel 5, a plurality of movable grooves 7 are formed in the top of the adjusting channel 5, a plurality of connecting columns 8 are fixedly connected to the top of the movable plate 6, the connecting columns 8 penetrate through the movable grooves 7 and are respectively and fixedly connected with the bottoms of the adjusting teeth 4, and the rotating gear 9 drives the movable plate 6 to move and simultaneously drives the connecting columns 8 and the corresponding adjusting teeth 4 to move;

as shown in fig. 2, a gear 9 is movably mounted at the rear side of one end of the adjusting channel 5, a crank 11 is fixedly connected to the top of the gear 9, and a rack 10 is fixedly connected to the rear surface of the movable plate 6;

shown by fig. 3 and 4, top and fixedly connected with fixed block 12 of plummer 1 are run through at the top of rocking handle 11, movable hole 13 has been seted up at the middle part of fixed block 12, the inside swing joint of movable hole 13 has inserted bar 14, spacing groove 15 has been seted up at the middle part of movable hole 13, the inside swing joint of spacing groove 15 has limiting plate 16, the middle part of limiting plate 16 is run through to the bottom of inserted bar 14, plummer 1 has been close to one end upper surface of rocking handle 11 and has been seted up a plurality of jacks 17, setting through a plurality of jacks 17, make 4 adjustments of regulation tooth to suitable position after, grafting through inserted bar 14 and jack 17, make 4 fixed positions of regulation tooth.

This practical theory of operation: firstly, according to the thickness of a wafer, the crank 11 is rotated clockwise and anticlockwise, the horizontal positions of the adjusting teeth 4 in the multiple groups of bearing teeth 2 are synchronously driven through the arrangement of the connecting column 8, so that the distance between the fixed teeth 3 and the adjusting teeth 4 in each group of bearing teeth 2 is controlled, then the inserting rods 14 are downwards inserted, the inserting rods 14 are inserted into the corresponding inserting holes 17, the distance between the fixed teeth 3 and the adjusting teeth 4 is fixed, and then the wafer is vertically placed among the multiple groups of bearing teeth 2 to bear the wafer.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. A novel semiconductor wafer bearing platform comprises a bearing platform (1), and is characterized in that: the top of the bearing table (1) is fixedly connected with a plurality of groups of bearing teeth (2), each bearing tooth (2) comprises a fixed tooth (3) and an adjusting tooth (4), an adjusting channel (5) is formed inside the bearing table (1), a movable plate (6) is movably mounted inside the adjusting channel (5), a plurality of movable grooves (7) are formed in the top of the adjusting channel (5), the top of the movable plate (6) is fixedly connected with a plurality of connecting columns (8), and the connecting columns (8) penetrate through the movable grooves (7) and are respectively and fixedly connected with the bottoms of the adjusting teeth (4);

a gear (9) is movably mounted on the rear side of one end of the adjusting channel (5), a crank (11) is fixedly connected to the top of the gear (9), and a rack (10) is fixedly connected to the rear surface of the movable plate (6);

the top of regulator socket (11) runs through top and fixedly connected with fixed block (12) of regulator socket (1), movable hole (13) have been seted up at the middle part of fixed block (12), the inside swing joint of movable hole (13) has inserted bar (14), spacing groove (15) have been seted up at the middle part of movable hole (13), the inside swing joint of spacing groove (15) has limiting plate (16), the middle part of limiting plate (16) is run through to the bottom of inserted bar (14), a plurality of jacks (17) have been seted up to the one end upper surface that regulator socket (1) is close to regulator socket (11).

2. The novel semiconductor wafer pedestal of claim 1, wherein:

the fixed teeth (3) and the adjusting teeth (4) are identical in structure, and the bearing teeth (2) are horizontally arranged on the upper surface of the bearing table (1).

3. The novel semiconductor wafer pedestal of claim 1, wherein:

the heights of the fixed teeth (3) and the adjusting teeth (4) are the same, and the distances between the fixed teeth (3) and the adjusting teeth (4) in each group of the bearing teeth (2) are equal.

4. The novel semiconductor wafer pedestal of claim 1, wherein:

the movable grooves (7) are matched with the connecting columns (8), the number of the movable grooves (7) is equal to that of the bearing teeth (2), and the movable grooves (7) correspond to the adjusting teeth (4).

5. The novel semiconductor wafer pedestal of claim 1, wherein:

the adjusting channel (5) is matched with the movable plate (6), and the inner surface of the adjusting channel (5) is attached to the outer surface of the movable plate (6).

6. The novel semiconductor wafer pedestal of claim 1, wherein:

the front end of the gear (9) is attached to the rear surface of the movable plate (6), and the front end of the gear (9) is meshed with the rack (10).

7. The novel semiconductor wafer pedestal of claim 1, wherein:

the limiting groove (15) is matched with the limiting plate (16), and the jacks (17) are distributed in an annular array by taking the central point of the gear (9) as the center of a circle.