CN210341100U - Electroplating device for electroplating copper plate of CSP crystallizer - Google Patents
Electroplating device for electroplating copper plate of CSP crystallizer Download PDFInfo
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- CN210341100U CN210341100U CN201921141506.9U CN201921141506U CN210341100U CN 210341100 U CN210341100 U CN 210341100U CN 201921141506 U CN201921141506 U CN 201921141506U CN 210341100 U CN210341100 U CN 210341100U
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Abstract
The utility model provides an electroplating device for CSP crystallizer copper is electroplated relates to electroplating technique, an electroplating device for CSP crystallizer copper is electroplated, hold the chamber including electroplating, electroplating and holding the chamber including enclosing fender portion and electroplating platform, wherein: the inner surface of the surrounding baffle part is the side surface of the electroplating containing cavity, and the surface to be plated of the CSP crystallizer copper plate is part or all of the inner surface of the surrounding baffle part; the upper surface of electroplating platform is the bottom surface in electroplating appearance chamber, be provided with the feed liquor hole and the play liquid hole that the intercommunication was electroplated and is held the chamber on the electroplating platform. Electroplate the CSP crystallizer copper through this electroplating device, need not process the working face of copper with traditional repair mode, can prolong the life of copper, reduce cost improves operating efficiency and income simultaneously, realizes the sustainable use of crystallizer copper.
Description
Technical Field
The utility model relates to an electroplate technical field, especially relate to an electroplating device that is used for CSP crystallizer copper to electroplate.
Background
The CSP production line is a production mode of continuous casting and rolling in ferrous metallurgy, a CSP crystallizer copper plate is a core component of a continuous casting machine part, the copper plate is used after being connected with a water tank and is subjected to offline repair after passing through a steel 150 furnace, the repair mode is that the working surface of the copper plate is machined to 1.5mm, no coating is formed on the surface of the copper plate, and the steel passing amount is lower compared with other crystallizer copper plates with coatings on the surfaces. For example, the invention patent with the publication number of CN105921706B "an on-line repair method for copper plate of continuous casting crystallizer" has the technical effects that: the continuous casting crystallizer copper plate is repaired by electroplating, so that the service life of the copper plate can be prolonged, the cost is reduced, the operation efficiency and the benefit are improved, and the continuous use of the crystallizer copper plate is realized.
The problem that exists at present is that CSP crystallizer copper plate surface does not have the plating layer, and the reason for it is that the electroplating degree of difficulty is big, and the copper is placed in the plating bath and is electroplated after taking apart water tank and copper when crystallizer copper plate is restoreed usually, but CSP crystallizer copper plate can not take apart with the water tank after the equipment, takes apart the serious deformation of back copper and can not continue to use. The copper plate with the water tank cannot be placed into a plating bath for electroplating, and has two main reasons, namely, the copper plate with the water tank has a large volume and cannot be placed into the plating bath, and the water tank cannot be fully closed, so that plating solution pollution and water tank corrosion can be caused when the plating solution enters the water tank, therefore, the surface of the crystallizer copper plate of CSP production lines of steel works in China is not repaired in an electroplating mode, and related research, development and reports about any electroplating device for electroplating the copper plate of the CSP crystallizer are not seen.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electroplating device that can be used to CSP crystallizer copper to electroplate for solve the unable electroplating problem of CSP crystallizer copper, it is big to have solved the ordinary repair loss of CSP crystallizer copper simultaneously, compares the problem that logical steel volume is on the low side with other crystallizer copper that have the coating on surface.
To achieve the above objective, the present invention provides the following technical solutions:
the utility model provides an electroplating device for CSP crystallizer copper electroplates, holds the chamber including electroplating, electroplate and hold the chamber including enclosing fender portion and electroplating platform, wherein: the inner surface of the surrounding baffle part is the side surface of the electroplating containing cavity, and the surface to be plated of the CSP crystallizer copper plate is part or all of the inner surface of the surrounding baffle part; the upper surface of electroplating platform is the bottom surface in electroplating appearance chamber, be provided with the feed liquor hole and the play liquid hole that the intercommunication was electroplated and is held the chamber on the electroplating platform.
Because the prior art has no method for electroplating the copper plate of the CSP crystallizer at present, firstly, because a sufficiently large electroplating bath is not provided for placing the CSP crystallizer, and secondly, even if the sufficiently large electroplating bath is designed, the water tank of the CSP crystallizer has insufficient tightness, electroplating liquid placed in the electroplating liquid permeates into the water tank, so that the water tank is corroded and the electroplating liquid is polluted; simultaneously because of the working face that CSP crystallizer copper needs to be electroplated only for corresponding the side that has the sunkenly of installing with the water tank, consequently for solving this problem, the utility model provides a to assemble into an electroplating appearance chamber with enclosing fender portion and electroplating platform together, CSP crystallizer copper is treated the face of plating and can be regarded as enclosing fender portion part or whole, can treat the face of plating and carry out an electroplating device of electroplating to CSP crystallizer copper in this electroplating appearance chamber.
The utility model discloses a treat the plated surface with CSP crystallizer copper and regard as electroplating a part that holds the chamber, can directly electroplate, solved the problem that does not have enough big plating bath, also solved even design enough big plating bath, the CSP crystallizer is whole to put into the plating bath and electroplates the corruption and the plating solution pollution problem that can cause the water tank. Meanwhile, the copper plate of the CSP crystallizer is electroplated, the working surface of the copper plate is not required to be machined in a traditional repairing mode, the service life of the copper plate can be prolonged, meanwhile, the cost is reduced, the operation efficiency and the benefit are improved, and the sustainable use of the copper plate of the crystallizer is realized.
Further, the electroplating device for electroplating the copper plate of the CSP crystallizer is characterized in that the surrounding baffle part further comprises a baffle plate, and the height of the baffle plate is not lower than that of the copper plate of the CSP crystallizer.
In order to meet the requirements of different electroplating areas and ensure the electroplating area maximization of the CSP crystallizer copper plate, the electroplating cavity can be completely filled with electroplating solution, and therefore, the height of the baffle plate is not less than that of the CSP crystallizer copper plate. In actual plating, the size of the plating area can be controlled by adjusting the height of the plating solution.
Further, an electroplating device for electroplating the copper plate of the CSP crystallizer is characterized in that the enclosing part comprises two crystallizer copper plates to be plated and two baffle plates, the two CSP crystallizer copper plates to be plated are oppositely arranged, and two ends of the CSP crystallizer copper plates are hermetically connected with the baffle plates. When the purpose of obtaining the maximum electroplating efficiency is achieved, the four CSP crystallizer copper plates to be plated are designed to be mutually sealed as the side surfaces of the electroplating containing cavity as the baffle plates, and the four CSP crystallizer copper plates can be electroplated simultaneously during electroplating. However, in practical tests, because the weight of the copper plate of the CSP crystallizer is about 5-6 tons, when the copper plate is lifted to be installed on a plating platform after sealing connection, the sealing performance is damaged due to the weight problem of the CSP crystallizer in the lifting process, the copper plates of the CSP crystallizer are scattered, and the sealing performance cannot be ensured.
If the side surface of the electroplating containing cavity is formed by combining three CSP crystallizer copper plates and a baffle plate, firstly, when the CSP crystallizer copper plates and the baffle plate are oppositely connected, serious asymmetry can be caused on the weight, and the situation that the sealing property is damaged can be caused when the CSP crystallizer copper plates and the baffle plate are hung and installed; secondly, the length of the copper plate of the CSP crystallizer is generally 1.81 m or 2.45 m, the height is 1.1 m, equal-length equal-height baffles are correspondingly arranged, the whole electroplating device is large in size, and great difficulty is caused in hoisting and mounting.
For the reasons, during electroplating, the copper plates to be plated of the two CSP crystallizers are preferably oppositely arranged, two ends of the copper plates are connected with the two baffle plates in a sealing mode, and then the copper plates are installed on the electroplating platform. On the premise of ensuring sealing, the two CSP crystallizer copper plates can be electroplated at the same time, so that the maximum electroplating efficiency is obtained.
And further, the electroplating device is used for electroplating the copper plate of the CSP crystallizer, and the shortest distance between the surfaces to be plated of the two oppositely placed copper plates of the CSP crystallizer is 400-500 mm. When two CSP crystallizer copper plates are oppositely arranged on the surfaces to be plated, two ends of the CSP crystallizer copper plates are hermetically connected with two baffle plates and an electroplating platform to form an electroplating containing cavity, the size of an anode basket placed during electroplating and the minimum distance between a cathode and an anode during electroplating are considered, and in order to ensure the electroplating effect of the CSP crystallizer copper plates, the shortest distance between the two oppositely arranged CSP crystallizer copper plates is not less than 400 mm; correspondingly, when the vertical distance between two CSP crystallizer copper plates is too large, the distance between the cathode and the anode is too large, so that a better electroplating effect cannot be ensured, the volume of the electroplating containing cavity is too large, the sealing performance of the electroplating containing cavity can be damaged when the electroplating containing cavity is hoisted for installation, and the shortest distance between the two CSP crystallizer copper plates which are oppositely arranged is not more than 500mm at most.
Preferably, the direction that the definition baffle is on a parallel with electroplating platform is length direction, the length of baffle is greater than the shortest interval between two CSP crystallizer copper plates of placing relatively treating the face of plating, and baffle length direction's both sides all with CSP crystallizer copper plate sealing joint. When the length of baffle is greater than CSP crystallizer copper and treats the shortest interval between the face of plating, the side surface that holds the chamber is held as electroplating to the mid portion, and both sides part all surpasss CSP crystallizer copper and treats the shortest interval between the face of plating, and laminating CSP crystallizer copper to set up sealed pad in baffle and CSP crystallizer copper laminating department, in order to guarantee the leakproofness between baffle and CSP crystallizer copper.
Furthermore, the electroplating device for electroplating the copper plate of the CSP crystallizer is provided with a clamping groove on the electroplating platform according to the sizes of the copper plate of the CSP crystallizer and the bottom of the baffle plate, and the copper plate of the CSP crystallizer and the bottom of the baffle plate are hermetically arranged in the clamping groove of the electroplating platform. In order to ensure the connection tightness and the installation convenience of the CSP crystallizer copper plate, the baffle and the electroplating platform, the electroplating platform is provided with a clamping groove according to the sizes of the CSP crystallizer copper plate and the baffle, and the lower parts of the CSP crystallizer copper plate and the baffle are pasted with sealing pads and then correspondingly installed in the clamping groove of the electroplating platform. The purposes of quick assembly and convenient disassembly are achieved, and meanwhile, a good sealing effect between the electroplating platform and the copper plate and the baffle of the CSP crystallizer is ensured.
In the electrolysis and electroplating processes, due to the high temperature effect and the strong corrosivity of the electroplating solution and the electrolyte, the electroplating platform and the baffle plate as the components of the electroplating containing cavity must meet the requirements of high temperature resistance, acid and alkali corrosion resistance and difficult deformation, and meanwhile, the cost factor and the popularization application are considered. Therefore, preferably, the electroplating device for electroplating the copper plate of the CSP crystallizer, and the material of the electroplating platform and the baffle plate is PCV material.
Has the advantages that:
according to the technical scheme, the utility model discloses a technical scheme provides an electroplating device that is used for CSP crystallizer copper to electroplate.
The utility model relates to an electroplating device for CSP crystallizer copper is electroplated has been built an electroplating appearance chamber through utilizing to treat plating work piece CSP crystallizer copper and treat plated surface, baffle, electroplating platform, has solved the copper of taking the water tank and can't put into the problem of electroplating in the electroplating coating bath because of the volume problem to utilize this electroplating appearance chamber to treat the plated surface to electroplate CSP crystallizer copper, realized the purpose of CSP crystallizer copper increase plating layer. Through electroplating the CSP crystallizer copper plate, the working face of the copper plate does not need to be processed by a traditional repairing mode, the service life of the copper plate can be prolonged, meanwhile, the cost is reduced, the operation efficiency and the income are improved, and the sustainable use of the crystallizer copper plate is realized.
Meanwhile, the practical operation is comprehensively considered, the CSP crystallizer copper plate is adopted to be placed oppositely to the surface to be plated, two ends of the CSP crystallizer copper plate are connected with two baffle plates in a sealing mode, sealing gaskets are pasted at the bottoms of the CSP crystallizer copper plate and the baffle plates, and the electroplating platform is provided with clamping grooves according to the sizes of the bottoms of the CSP crystallizer copper plate and the baffle plates, so that the sealing performance of the mutual connection among the CSP crystallizer copper plate, the baffle plates and the electroplating platform is ensured, the maximum electroplating efficiency is obtained, and the electroplating device is convenient to install and detach due to.
It should be understood that all combinations of the foregoing concepts and additional concepts described in greater detail below can be considered as part of the inventive subject matter of the present disclosure unless such concepts are mutually inconsistent.
The foregoing and other aspects, embodiments and features of the present teachings can be more fully understood from the following description taken in conjunction with the accompanying drawings. Additional aspects of the present invention, such as features and/or advantages of exemplary embodiments, will be apparent from the description which follows, or may be learned by practice of the specific embodiments in accordance with the teachings of the present invention.
Drawings
The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. Embodiments of various aspects of the present invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of a plating device for electroplating a copper plate of a CSP crystallizer.
1-a water tank, 2-a CSP crystallizer copper plate, 3-a baffle and 4-an electroplating containing cavity.
Detailed Description
For a better understanding of the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.
In this disclosure, aspects of the present invention are described with reference to the accompanying drawings, in which a number of illustrative embodiments are shown. Embodiments of the present disclosure are not necessarily intended to include all aspects of the invention. It should be appreciated that the various concepts and embodiments described above, as well as those described in greater detail below, may be implemented in any of numerous ways, as the disclosed concepts and embodiments are not limited to any implementation. Additionally, some aspects of the present disclosure may be used alone or in any suitable combination with other aspects of the present disclosure.
As shown in fig. 1, the electroplating device for electroplating the copper plate 2 of the CSP crystallizer comprises:
the utility model provides an electroplating device for CSP crystallizer copper electroplates, holds the chamber including electroplating, electroplate and hold the chamber including enclosing fender portion and electroplating platform, wherein: the inner surface of the surrounding baffle part is the side surface of the electroplating containing cavity, and the surface to be plated of the CSP crystallizer copper plate is part or all of the inner surface of the surrounding baffle part; the upper surface of electroplating platform is the bottom surface in electroplating appearance chamber, be provided with the feed liquor hole and the play liquid hole that the intercommunication was electroplated and is held the chamber on the electroplating platform.
Because the prior art has no method for electroplating the copper plate of the CSP crystallizer at present, firstly, because a sufficiently large electroplating bath is not provided for placing the CSP crystallizer, and secondly, even if the sufficiently large electroplating bath is designed, the water tank of the CSP crystallizer has insufficient tightness, electroplating liquid placed in the electroplating liquid permeates into the water tank, so that the water tank is corroded and the electroplating liquid is polluted; simultaneously because of the working face that CSP crystallizer copper needs to be electroplated only for corresponding the side that has the sunkenly of installing with the water tank, consequently for solving this problem, the utility model provides a to assemble into an electroplating appearance chamber with enclosing fender portion and electroplating platform together, CSP crystallizer copper is treated the face of plating and can be regarded as enclosing fender portion part or whole, can treat the face of plating and carry out an electroplating device of electroplating to CSP crystallizer copper in this electroplating appearance chamber.
When the electroplating containing cavity is assembled, the electroplating platform is mainly used for placing a CSP crystallizer copper plate with a water tank and a surrounding baffle part, the integral flatness of the platform is ensured firstly, two through holes communicated with the electroplating containing cavity are formed in the middle of the platform and used for liquid inlet and liquid outlet, and pipelines of the liquid inlet and the liquid outlet are communicated with a copper electroplating bath and a copper electrolytic bath after being connected in a switching mode. The enclosure part is mainly used for being assembled with the CSP crystallizer copper plate to form the side surface of the closed electroplating containing cavity, and is vertically arranged on the electroplating platform in a sealing manner.
This application treats the plated surface through treating with CSP crystallizer copper and as electroplating the partly that holds the chamber, can directly electroplate, has solved the problem that does not have enough big plating bath, has also solved even the enough big plating bath of design, and the CSP crystallizer is whole to be put into and electroplates the corruption and the plating solution pollution problem that can lead to the fact the water tank in the plating bath. Meanwhile, the copper plate of the CSP crystallizer is electroplated, the working surface of the copper plate is not required to be machined in a traditional repairing mode, the service life of the copper plate can be prolonged, meanwhile, the cost is reduced, the operation efficiency and the benefit are improved, and the sustainable use of the copper plate of the crystallizer is realized.
When the electroplating device is specifically implemented, the enclosure part further comprises a baffle 3, and the height of the baffle 3 is not lower than that of the CSP crystallizer copper plate 2.
In order to meet the requirements of different electroplating areas and ensure the electroplating area maximization of the CSP crystallizer copper plate, the electroplating cavity can be completely filled with electroplating solution, so the height of the baffle 3 is not lower than that of the CSP crystallizer copper plate 2, and baffles with the same height as the CSP crystallizer copper plate can be adopted. In actual electroplating, the size of the required electroplating area can be controlled by adjusting the height of the injected electroplating solution in electroplating.
When the electroplating device is specifically implemented, the enclosure part comprises two crystallizer copper plates 2 to be plated and two baffles 3, the two CSP crystallizer copper plates 2 to be plated are oppositely arranged, and the two ends of the CSP crystallizer copper plates are hermetically connected with the baffles 3. When the purpose of obtaining the maximum electroplating efficiency is achieved, the to-be-plated surfaces of the four CSP crystallizer copper plates 2 are designed to be used as the baffle plates 3 to be mutually sealed to be used as the side surfaces of the electroplating containing cavity 4, and the four CSP crystallizer copper plates 2 can be simultaneously electroplated during electroplating. However, in practical tests, because the weight of the copper plate 2 of the CSP crystallizer is about 5 tons to 6 tons, when the copper plate is lifted to be installed on a plating platform after sealing connection, the sealing performance is damaged due to the weight problem of the CSP crystallizer in the lifting process, the copper plate 2 of the CSP crystallizer can be scattered, and the sealing performance cannot be ensured.
If the side surface of the electroplating containing cavity 4 is formed by combining the three CSP crystallizer copper plates 2 and the baffle 3, firstly, when the CSP crystallizer copper plates 2 and the baffle 3 are oppositely connected, serious asymmetry can be caused on the weight, and the situation that the sealing property is damaged can be caused when the CSP crystallizer copper plates are hoisted and installed; secondly, the length of the CSP crystallizer copper plate 2 is generally 1.81 m or 2.45 m, the height is 1.1 m, and the equal-length equal-height baffle plates 3 are correspondingly arranged, so that the whole electroplating device is large in volume and has great difficulty in hoisting and mounting.
For the reasons, during specific electroplating, the to-be-plated surfaces of the two CSP crystallizer copper plates 2 are oppositely arranged, and two ends of the two CSP crystallizer copper plates are hermetically connected with the two baffle plates 3 and then are installed on an electroplating platform. On the premise of ensuring sealing, the two CSP crystallizer copper plates 2 can be electroplated at the same time, so that the maximum electroplating efficiency is obtained.
In the specific implementation, the shortest distance between the surfaces to be plated of the two opposite CSP crystallizer copper plates 2 is 400-500 mm. When the surfaces to be plated of the two CSP crystallizer copper plates 2 are oppositely arranged, two ends of the two CSP crystallizer copper plates are hermetically connected with two baffle plates 3 and an electroplating platform to form an electroplating containing cavity 4, the size of an anode basket placed during electroplating and the minimum distance between a cathode and an anode during electroplating are considered, and in order to ensure the electroplating effect of the CSP crystallizer copper plates 2, the minimum distance between the two CSP crystallizer copper plates 2 is not less than 400 mm; correspondingly, when the vertical distance between two CSP crystallizer copper plates 2 is too large, the distance between the cathode and the anode is too large, so that a better electroplating effect cannot be ensured, the volume of the electroplating containing cavity 4 is too large, the sealing performance of the electroplating containing cavity 4 can be damaged during hoisting and installation, and therefore the shortest distance between the two CSP crystallizer copper plates which are oppositely arranged is not more than 500mm at most.
When the electroplating device is specifically implemented, the direction that is used for electroplating of CSP crystallizer copper plate 2 defines baffle 3 to be on a parallel with the electroplating platform is length direction, the length of baffle 3 is greater than the shortest interval between two CSP crystallizer copper plate 2 to-be-plated faces of relative placement, and the both sides of 3 length direction of baffle all seal with CSP crystallizer copper plate 2 and laminate. When the length of the baffle 3 is greater than the shortest distance between the surfaces to be plated of the CSP crystallizer copper plate 2, the middle part serves as the side surface of the electroplating containing cavity 4, the two side parts exceed the shortest distance between the surfaces to be plated of the CSP crystallizer copper plate 2, the baffle is attached to the CSP crystallizer copper plate, a sealing gasket is arranged at the attaching position of the baffle 3 and the CSP crystallizer copper plate 2, and therefore the sealing performance between the baffle and the CSP crystallizer copper plate is guaranteed.
When the electroplating device is specifically implemented, the electroplating device for electroplating the CSP crystallizer copper plate 2 is provided with a clamping groove on the electroplating platform according to the sizes of the bottom parts of the CSP crystallizer copper plate 2 and the baffle plate 3, and the bottom parts of the CSP crystallizer copper plate 2 and the baffle plate 3 are hermetically arranged in the clamping groove of the electroplating platform. In order to ensure the connection tightness and installation convenience of the CSP crystallizer copper plate 2 and the baffle plate 3 with the electroplating platform, the electroplating platform is provided with a clamping groove according to the sizes of the CSP crystallizer copper plate 2 and the baffle plate 3, and the lower parts of the CSP crystallizer copper plate 2 and the baffle plate 3 are correspondingly installed in the clamping groove of the electroplating platform after being pasted with sealing pads. The purposes of quick assembly and convenient disassembly are achieved, and meanwhile, the good sealing effect between the electroplating platform and the CSP crystallizer copper plate 2 and the baffle 3 is ensured.
In the electrolysis and electroplating processes, due to the high temperature effect and the strong corrosivity of the electroplating solution and the electrolyte, the electroplating platform and the baffle 3 as the components of the electroplating containing cavity 4 must meet the requirements of high temperature resistance, acid and alkali corrosion resistance and difficult deformation, and the cost factor and the popularization application are considered at the same time. In the specific implementation, the electroplating device is used for electroplating the copper plate 2 of the CSP crystallizer, and the electroplating platform and the baffle 3 are made of PCV materials.
The present document also provides a plating method for the electroplating of the CSP crystallizer copper plate 2:
an electroplating method for electroplating a copper plate 2 of a CSP crystallizer utilizes a surrounding part and an electroplating platform to assemble an electroplating containing cavity 4, wherein: taking the inner surface of the surrounding baffle part as the side surface of the electroplating containing cavity 4, and taking the surface to be plated of the CSP crystallizer copper plate 2 as part or all of the inner surface of the surrounding baffle part; taking the upper surface of the electroplating platform as the bottom surface of the electroplating containing cavity 4, and arranging a liquid inlet hole and a liquid outlet hole which are communicated with the electroplating containing cavity 4 on the electroplating platform; and injecting a plating solution into the electroplating containing cavity 4 to realize electroplating on the surface to be plated of the copper plate 2 of the CSP crystallizer.
The first step is as follows: assembling a plating chamber 4:
a plating vessel 4 is assembled according to the method described above.
Secondly, cleaning the surface to be plated of the copper plate 2 of the CSP crystallizer
And cleaning the to-be-plated surface of the CSP crystallizer copper plate 2 by using an alkaline cleaning agent, and ensuring the completeness of a water film of the to-be-plated surface of the CSP crystallizer copper plate 2 after cleaning.
Thirdly, electrolyzing the to-be-plated surface of the copper plate 2 of the CSP crystallizer
Placing an electrolytic plate made of stainless steel in the middle of the electroplating containing cavity 4, connecting a copper plate with the anode of a rectifier, connecting the electrolytic plate with the cathode of the rectifier, flowing phosphoric acid with the concentration of 50% in an electrolytic tank into the cavity through a water inlet pipe after connection, adjusting the voltage to 9V after electrification, carrying out electrolysis for 5 minutes, lifting the electrolytic plate away, and discharging the phosphoric acid into the electrolytic tank through a liquid outlet hole.
And fourthly, electroplating the surface to be plated of the CSP crystallizer copper plate 2.
The titanium basket filled with metallic nickel is placed in the middle of the electroplating containing cavity 4, the copper plate is connected with the cathode of the rectifier, the titanium basket is connected with the anode of the rectifier, plating solution enters the cavity through a circulating pipeline, current is adjusted, current density and electroplating time are determined according to the thickness of the plating layer, the electroplating solution flows into the plating tank through a liquid outlet after electroplating is completed, and the copper plate is washed clean and then is detached for surface processing.
The electroplating method for electroplating the copper plate 2 of the CSP crystallizer is mainly based on two reasons that the copper plate 2 of the CSP crystallizer cannot be electroplated in the prior art, namely, a CSP crystallizer is not placed in a sufficiently large electroplating bath, and even if the sufficiently large electroplating bath is designed, the water tank of the CSP crystallizer has insufficient sealing performance, and thick electroplating solution placed in the electroplating solution permeates the water tank to cause corrosion of the water tank and pollution of the electroplating solution, so that the solution is provided.
This application is through treating the face of plating as electroplating the partly that holds chamber 4 with CSP crystallizer copper 2, can directly electroplate, has solved the problem that does not have enough big plating bath, has also solved even the enough big plating bath of design, and the electroplating can lead to the fact corruption and the plating solution pollution problem to the water tank in the CSP crystallizer is whole puts into the plating bath. The CSP crystallizer copper plate 2 is electroplated by a method that the whole or part of the to-be-plated surface of the CSP crystallizer copper plate 2 serving as a surrounding baffle part is assembled with an electroplating platform to form an electroplating containing cavity 4, and the electroplating containing cavity 4 is filled with electroplating solution and then the CSP crystallizer copper plate 2 is electroplated. Meanwhile, the CSP crystallizer copper plate 2 is electroplated, the working surface of the copper plate is not required to be machined in a traditional repairing mode, the service life of the copper plate can be prolonged, meanwhile, the cost is reduced, the operation efficiency and the benefit are improved, and the sustainable use of the crystallizer copper plate is realized.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention. The present invention is intended to cover by those skilled in the art various modifications and adaptations of the invention without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention is subject to the claims.
Claims (7)
1. The utility model provides an electroplating device for CSP crystallizer copper electroplates which characterized in that: hold the chamber including electroplating, electroplating and holding the chamber including enclosing fender portion and electroplating platform, wherein:
the inner surface of the surrounding baffle part is the side surface of the electroplating containing cavity, and the surface to be plated of the CSP crystallizer copper plate is part or all of the inner surface of the surrounding baffle part;
the upper surface of electroplating platform is the bottom surface in electroplating appearance chamber, be provided with the feed liquor hole and the play liquid hole that the intercommunication was electroplated and is held the chamber on the electroplating platform.
2. The plating apparatus for CSP crystallizer copper plate plating according to claim 1 characterized by the following: the baffle surrounding part further comprises a baffle, and the height of the baffle is not lower than that of the CSP crystallizer copper plate.
3. The plating apparatus for CSP crystallizer copper plate plating according to claim 2 characterized by the following: the enclosure part comprises two crystallizer copper plates to be plated and two baffles, the two CSP crystallizer copper plates to be plated are oppositely arranged, and the two ends of the CSP crystallizer copper plates are hermetically connected with the baffles.
4. The plating apparatus for CSP crystallizer copper plate plating according to claim 3 characterized by the following: the shortest distance between the copper plates of the two oppositely-placed CSP crystallizers to be plated is 400-500 mm.
5. The plating apparatus for CSP crystallizer copper plate plating according to claim 4 characterized by the following: the direction that the definition baffle is on a parallel with electroplating platform is length direction, the length of baffle is greater than the shortest interval between two CSP crystallizer copper plates of placing relatively treating the face of plating, and baffle length direction's both sides all with CSP crystallizer copper plate sealing joint.
6. The plating apparatus for CSP crystallizer copper plate plating according to claim 5, characterized in that: and a clamping groove is formed in the electroplating platform according to the sizes of the copper plate of the CSP crystallizer and the bottom of the baffle, and the copper plate of the CSP crystallizer and the baffle are hermetically arranged in the clamping groove of the electroplating platform.
7. The plating apparatus for CSP crystallizer copper plate plating according to any of the claims from 1 to 6 characterized by the fact that: the electroplating platform and the baffle are made of PCV materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921141506.9U CN210341100U (en) | 2019-07-19 | 2019-07-19 | Electroplating device for electroplating copper plate of CSP crystallizer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921141506.9U CN210341100U (en) | 2019-07-19 | 2019-07-19 | Electroplating device for electroplating copper plate of CSP crystallizer |
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| Publication Number | Publication Date |
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| CN210341100U true CN210341100U (en) | 2020-04-17 |
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| CN201921141506.9U Active CN210341100U (en) | 2019-07-19 | 2019-07-19 | Electroplating device for electroplating copper plate of CSP crystallizer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110331429A (en) * | 2019-07-19 | 2019-10-15 | 安徽马钢表面技术股份有限公司 | A kind of electroplanting device and electro-plating method for the plating of CSP copper plate of crystallizer |
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2019
- 2019-07-19 CN CN201921141506.9U patent/CN210341100U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110331429A (en) * | 2019-07-19 | 2019-10-15 | 安徽马钢表面技术股份有限公司 | A kind of electroplanting device and electro-plating method for the plating of CSP copper plate of crystallizer |
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