CN210328188U - Pre-prepared semi-cured polymer material structure - Google Patents
Pre-prepared semi-cured polymer material structure Download PDFInfo
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- CN210328188U CN210328188U CN201920961729.3U CN201920961729U CN210328188U CN 210328188 U CN210328188 U CN 210328188U CN 201920961729 U CN201920961729 U CN 201920961729U CN 210328188 U CN210328188 U CN 210328188U
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Abstract
The utility model provides a semi-solid polymer material structure of prefabricated equipment contains a membranous carrier and the semi-solid polymer material layer of semi-solid, and the coating face on the membranous carrier has coating district and fretwork district, and the coating district of this coating face is coated but does not cover this fretwork district to the semi-solid polymer material layer.
Description
Technical Field
The utility model relates to a pre-prepared semi-solid polymer material structure can supply to laminate on circuit substrate after the preparation is accomplished.
Background
The general dry film solder mask product is similar to the traditional method of coating the solder mask layer by screen printing, and is characterized in that after a complete solder mask layer is formed on a whole circuit substrate, a negative film is used for contact exposure, an image on the negative film is copied to the surface of the solder mask layer to form a photomask, then the part of the solder mask layer which is not covered by the photomask is completely solidified, and then a chemical agent is used for washing off the solder mask layer structure in the photomask area. In such a coating-then-cleaning process, a lot of solder resist is actually consumed, and the shift in the mask copying process also reduces the manufacturing yield.
SUMMERY OF THE UTILITY MODEL
In view of this, the main objective of the present invention is to provide a prefabricated anti-welding structure capable of reducing the amount of semi-cured polymer material.
In order to achieve the above and other objects, the present invention provides a pre-fabricated semi-cured polymer material structure, comprising a film-shaped carrier and a semi-cured polymer material layer, wherein the film-shaped carrier has a coating surface, and the coating surface has a coating area and a hollow area; the semi-solidified polymer material layer is coated on the coating area of the coating surface but does not cover the hollow area.
Through the design, the utility model discloses can need not form the position of solder mask according to the circuit board, form corresponding fretwork district at membranous carrier, one can save the use amount of solder mask material, two come also to simplify the follow-up removal operation of removing unnecessary solder mask.
Other functions and embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic cross-sectional view of a pre-prepared semi-cured polymer material structure according to the present invention;
fig. 2 is an exemplary view of a longitudinal bama textured polymeric material layer according to a first embodiment of the present invention;
fig. 3 is an exemplary view of a second embodiment of the transverse bama textured polymeric material layer of the present invention;
FIG. 4 is a diagram illustrating an example of a polymer material layer with square arrays according to a third embodiment of the present invention;
fig. 5 is a schematic side view of the pre-fabricated semi-cured polymer material structure of the present invention, wherein the membrane-shaped carrier, the semi-cured polymer material layer and the protective film are represented by a single outer contour due to the relationship of the drawing scale.
Description of the symbols
10 film-like carrier 11 coating surface
101 coating area 102 longitudinal hollow area
103 lateral hollow-out regions 20 of semi-cured polymer material layer
21 first side 22 second side
30 protective film 40 take-up roll
Detailed Description
Referring to the structure of fig. 1, the structure of the pre-fabricated semi-cured polymer material of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area and a hollow area are formed on a coating surface 11 of the film-shaped carrier 10, and the semi-cured polymer material layer 20 is coated on the coating area of the coating surface but does not cover the hollow area. A first side 21 of the layer of semi-cured polymer material 20 is formed on the coated side 11 and a second, opposite side 22 thereof may subsequently be laminated to the circuit substrate. In some embodiments, the structure of the present invention further includes a protective film 30, wherein the protective film 30 is strippably coated on the second surface 22 of the semi-cured polymer material layer 20, and the protective film 30 is removed before laminating on the circuit board.
Referring to the structure shown in fig. 1 and 2, the pre-prepared semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area 101 is formed on a coating surface 11 of the film-shaped carrier 10, and a longitudinal hollow area 102 extending in a length direction of the film-shaped carrier, the semi-cured polymer material layer 20 is coated on the coating area 101 of the coating surface 11 but does not cover the hollow area 102, and the longitudinal hollow area 102 divides the semi-cured polymer material layer 20 into a plurality of areas (gray portions) that are not connected to each other in a width direction of the film-shaped carrier, so as to form the longitudinal zebra stripes shown in fig. 2.
Referring to the structure shown in fig. 1 and 3, the pre-fabricated semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area 101 is formed on a coating surface 11 of the film-shaped carrier 10, and a horizontal hollow area 103 extending in a width direction of the film-shaped carrier, the semi-cured polymer material layer 20 is coated on the coating area 101 of the coating surface 11 but does not cover the hollow area 103, and the horizontal hollow area divides the semi-cured polymer material layer 20 into a plurality of areas (gray portions) that are not connected to each other in a length direction of the film-shaped carrier, so as to form the horizontal zebra stripes shown in fig. 3.
Referring to the structure shown in fig. 1 and 4, the pre-fabricated semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area 101 is formed on a coating surface 11 of the film-shaped carrier 10, a longitudinal hollow area 102 extending in a length direction of the film-shaped carrier, and a transverse hollow area 103 extending in a width direction of the film-shaped carrier, the semi-cured polymer material layer 20 is coated on the coating area 101 of the coating surface 11 but does not cover the hollow areas 102, 103, and the longitudinal hollow area and the transverse hollow area divide the polymer material layer into a plurality of areas (gray portions) that are not connected to each other in the length direction and the width direction of the film-shaped carrier, thereby forming a block array as shown in fig. 4.
Referring to the structure of fig. 5, the pre-prepared semi-cured polymer material structure of the present invention further includes a rolling bar 40, under the condition of the protective film 30, the semi-cured polymer material layer 20 combined with the film carrier 10 and the protective film 30 is rolled on the rolling bar 40, so as to facilitate preservation, and the rolled semi-cured polymer material structure can be subsequently rolled and processed by a vacuum film pressing leveling machine, and can be cut into pieces for connecting lines.
Referring to the structure of fig. 1, in some embodiments, the center line average roughness (Ra) of the coating surface 11 on the film-shaped carrier 10 is 200-600nm, wherein the center line average roughness of the coating surface 11 is replicated on the first surface 21 of the semi-cured polymer material layer, so that the polymer material layer has better bonding property, can be firmly bonded with the die and the packaging material to be attached later, and exhibits good bonding strength.
The film carrier 10 of the present invention can be polyethylene terephthalate (PET) or other polyester films, polyimide films, polyamide-imide films, polypropylene films, polystyrene films, etc., and the thickness thereof is preferably between 10 to 150 μm. The surface of the film-like carrier may be a smooth surface or a matte surface (rough surface).
Semi-solid polymer material layer 20 can be made by conventional solder mask material, dielectric material and packaging material, and in a possible non-limiting implementation mode, semi-solid polymer material layer utilizes aforementioned material to utilize coating machine to apply to membranous carrier when it still is in uncured state, then gets into the desiccator and dries into semi-solid polymer material layer, the polymer material in semi-solid polymer material layer is not totally cured, but has the dry nature of finger touch, and these polymer materials have for example photocuring characteristic, thermocuring characteristic or have photocuring and thermocuring characteristic concurrently simultaneously. The second surface of the semi-cured polymer material layer can be laminated on the circuit substrate, and then the semi-cured polymer material layer is completely cured on the circuit substrate by selecting a corresponding curing mode according to the characteristics of the semi-cured polymer material layer to form permanent connection with the circuit substrate. After laminating the semi-cured polymer material layer on the circuit substrate, the film carrier can be peeled off and removed. The manner in which the semi-cured polymer material layer is formed on the film-shaped carrier is not limited to the above-described embodiments.
The solder mask material may be a thermosetting solder mask ink, a photo-curable solder mask ink, or a combination thereof. The solder resist resin can be a photoimageable solder resist resin, preferably a carboxyl-containing photoimageable resin, or an epoxy resin and a carboxyl-containing photoimageable resin are used together, or other thermosetting resins, photo-curable resins and carboxyl-containing photoimageable resins are used together. The cure accelerator may comprise a photopolymerization initiator, a curing aid, a curing catalyst, or a combination thereof.
The protective film of the utility model can be a polyethylene film, a tetrafluoroethylene film, a polypropylene film or paper subjected to surface treatment. In the occasion that has the protection film, the utility model discloses a semi-solid polymer material structure needs to remove the protection film before the lamination.
In a possible embodiment, the semi-cured polymer material structure of the present invention is directly laminated on the surface of the circuit board without being attached with a protective film after being dried. In a possible embodiment, the utility model discloses a semi-solid polymer material structure is covered the protection film in the subsides and is earlier by the rolling, then displaces to the pressfitting machine and belongs to the production line and go on laminating operation again. In a possible embodiment, after being rolled up as described above, it is kept at a temperature above 0 ℃ for a period of time, preferably between 15 and 25 ℃, and then transferred to the line of the press for said lamination.
When the semi-cured polymer material layer needs to be windowed, the semi-cured polymer material layer can be further exposed and developed, the exposure operation can be performed before or after the film-shaped carrier is removed, and when the exposure operation is performed before the film-shaped carrier is removed, the film-shaped carrier is transparent or semitransparent, so that light irradiated by the exposure operation can pass through the film-shaped carrier. Depending on the thermal curing and/or photo-curing properties of the semi-cured polymer material layer, the circuit board may be baked or irradiated with ultraviolet rays to completely cure the semi-cured polymer material layer.
First embodiment
In this example, the product model sold by Taiwan Sun ink GmbH was used
PSR-2000WT500 was used as a first reagent, and Ca-25KX50, a commercial product of taiwan taiyang ink corporation, was used as a second reagent, and the two were mixed and mixed, and an appropriate amount of a diluent was added to prepare a liquid solder resist material, the viscosity was adjusted to 80dPa · s, and then the liquid solder resist material was passed through a lip coater.
The film-shaped support used in this example was a PET film. During coating, several outlets are cut off in the die lip gap, so that the coating machine has several sections of gaps in the width direction of the PET film, and the PET film moves relative to the lip coating machine continuously in the length direction, so that the longitudinal hollowed-out area is formed in the length direction of the PET film.
And sequentially drying the PET film coated with the liquid solder mask material in a step-by-step manner by a dryer with the temperature of 70 ℃, 80 ℃, 90 ℃ and 80 ℃ to dry the liquid solder mask material into a semi-solidified solder mask layer, wherein the longitudinal Brahman pattern is formed on the dried solder mask layer as shown in figure 2. And laminating the dried PET film coated with the solder mask layer on a circuit board with a pre-manufactured circuit by using a laminating machine, laminating the solder mask layer on the surface of the circuit board, and finally removing the PET film carrier, wherein the surface of the solder mask layer of the processed circuit board is extremely flat, and the processing error is less than +/-1 mu m.
Second embodiment
The preparation method of this embodiment is the same as that of the first embodiment, and is different from the method of coating the liquid solder mask material. During coating, the feeding time of the coating machine is adjusted, so that the liquid solder mask material is intermittently arranged on the PET film, and meanwhile, the PET film continuously moves relative to the lip-shaped coating machine in the length direction, so that the transverse hollow area is formed by extending in the width direction of the PET film. The dried weld mask layer forms a transverse bama pattern as shown in fig. 3.
Third embodiment
The preparation method of this embodiment is the same as that of the first embodiment, and is different from the method of coating the liquid solder mask material. During coating, several outlets are blocked in the die lip gap, so that the coating machine has a plurality of sections of gaps in the width direction of the PET film, and meanwhile, the PET film continuously moves relative to the lip-shaped coating machine in the length direction, so that a longitudinal hollow-out area is formed in the length direction of the PET film in an extending manner; and adjusting the feeding time of the coating machine to ensure that the liquid solder mask material is intermittently arranged on the PET film, so that a transverse hollow area is formed by extending in the width direction of the PET film. The dried solder mask layer forms a square array as shown in FIG. 4.
Comparative example evaluation of the subsequent Process of solder mask
(1) Die Attach yield (evaluation 1)
The circuit board obtained in the first embodiment was subjected to die bonding on the solder mask surface, and the die bonding yield was evaluated by the following criteria.
○, the yield rate exceeds 70%.
△, yield is 50-70%.
X: the yield is lower than 50%.
(2) Molding Compound bond Strength (evaluation 2)
The epoxy resin sealant is cured on the surface of the solder mask layer of the circuit board obtained in the first embodiment, the cured epoxy resin sealant is removed from the circuit board, and the sealant bonding strength is evaluated by the following criteria.
○ the proportion of the solder mask layer removed together with the sealing compound is more than 90%.
△ the proportion of the solder mask layer removed with the sealant is 60-90%.
X: the proportion of the solder mask layer pulled out together with the sealing glue is less than 60.
In the evaluation, the PET film carriers selected in example one were the following five types:
evaluation example one: the center line average roughness (Ra) of the contact surface of the film-like support was 242 nm.
Evaluation example two: the center line average roughness (Ra) of the contact surface of the film-like support was 276 nm.
Evaluation example three: the center line average roughness (Ra) of the contact surface of the film-like support was 419 nm.
Evaluation comparative example one: the center line average roughness (Ra) of the contact surface of the film-like support was 121 nm.
Evaluation comparative example two: the center line average roughness (Ra) of the contact surface of the film-like support was 76 nm.
Watch 1
| Contact surface Ra value (nm) | Evaluation 1 | Evaluation 2 | |
| Evaluation example 1 | 242 | ○ | ○ |
| Evaluation example two | 276 | ○ | ○ |
| Evaluation example III | 419 | ○ | ○ |
| Evaluation comparative example 1 | 121 | △ | △ |
| Evaluation comparative example 2 | 76 | × | × |
As described above, the present invention utilizes the film-shaped carrier (corresponding to the coating surface being a relatively rough surface) with the contact surface Ra value between 200 and 600nm to form the solder mask layer on the circuit board, which has a die bonding yield and a sealant bonding strength far superior to the solder mask layer formed on the circuit board by the film-shaped carrier (corresponding to the coating surface being a relatively smooth surface) with the contact surface Ra value lower than 200 nm. Therefore, the film-shaped carrier with the preset Ra value is selected, so that the solder mask layer of the circuit board can be endowed with better bonding performance, the circuit board can be firmly bonded with the crystal grains and the packaging materials which are attached later, and good bonding strength is shown.
Comparative example II
According to the semi-cured solder mask structure prepared in the first embodiment, after the solder mask layer is in a semi-cured state, the solder mask layer is stored at 20 ℃ and 20 ℃ below zero respectively, and after 24 hours, whether the appearance of the semi-cured solder mask layer and the appearance of the PET film are stripped or not is observed. The results showed that the samples stored at 20 ℃ did not peel, while the samples stored at-20 ℃ had peeling.
The above-described embodiments and/or implementations are merely illustrative of preferred embodiments and implementations for implementing the technology of the present invention, and are not intended to limit the implementations of the technology of the present invention in any way, and those skilled in the art can make modifications or changes without departing from the scope of the technology disclosed in the present invention.
Claims (6)
1. A pre-prepared semi-cured polymeric material structure, comprising:
the film-shaped carrier is provided with a coating surface, and the coating surface is provided with a coating area and a hollow area; and
and the semi-cured polymer material layer is coated on the coating area of the coating surface but does not cover the hollow area.
2. The structure of claim 1, wherein the hollow areas comprise at least one longitudinal hollow area extending in the longitudinal direction of the film-shaped carrier, and the longitudinal hollow area divides the polymer material layer into a plurality of areas that are not connected to each other in the width direction of the film-shaped carrier.
3. The structure according to claim 1 or 2, wherein the hollow-out areas include at least one lateral hollow-out area extending in the width direction of the film-like carrier, and the lateral hollow-out area divides the polymer material layer into a plurality of areas that are not connected to each other in the length direction of the film-like carrier.
4. The structure of claim 1, further comprising a protective film that is strippably disposed on the other side of the semi-cured polymer material layer opposite to the film carrier.
5. The structure of claim 1, wherein the coated surface has a centerline roughness average of 200-600nm, wherein the semi-cured polymer material layer has a first surface formed on the coated surface, and the first surface of the semi-cured polymer material layer replicates the centerline roughness average of the coated surface.
6. The structure of claim 1, 4 or 5, further comprising a take-up roll, wherein the pre-prepared structure is taken up on the take-up roll.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920961729.3U CN210328188U (en) | 2019-06-25 | 2019-06-25 | Pre-prepared semi-cured polymer material structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920961729.3U CN210328188U (en) | 2019-06-25 | 2019-06-25 | Pre-prepared semi-cured polymer material structure |
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| Publication Number | Publication Date |
|---|---|
| CN210328188U true CN210328188U (en) | 2020-04-14 |
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| CN201920961729.3U Active CN210328188U (en) | 2019-06-25 | 2019-06-25 | Pre-prepared semi-cured polymer material structure |
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Address after: Luzhu District, Taoyuan, Taiwan, China Patentee after: Eagle International Co., Ltd Address before: Luzhu District, Taoyuan, Taiwan, China Patentee before: Yingke Industrial Co.,Ltd. |