CN112135433A - Pre-prepared semi-cured polymer material structure - Google Patents
Pre-prepared semi-cured polymer material structure Download PDFInfo
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- CN112135433A CN112135433A CN201910554139.3A CN201910554139A CN112135433A CN 112135433 A CN112135433 A CN 112135433A CN 201910554139 A CN201910554139 A CN 201910554139A CN 112135433 A CN112135433 A CN 112135433A
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- cured polymer
- material layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a prefabricated semi-cured polymer material structure which comprises a film-shaped carrier and a semi-cured polymer material layer, wherein a coating surface on the film-shaped carrier is provided with a coating area and a hollow area, and the semi-cured polymer material layer is coated on the coating area of the coating surface but does not cover the hollow area.
Description
Technical Field
The invention relates to a prefabricated semi-cured polymer material structure which can be laminated on a circuit substrate after being prepared.
Background
The general dry film solder mask product is similar to the traditional method of coating the solder mask layer by screen printing, and is characterized in that after a complete solder mask layer is formed on a whole circuit substrate, a negative film is used for contact exposure, an image on the negative film is copied to the surface of the solder mask layer to form a photomask, then the part of the solder mask layer which is not covered by the photomask is completely solidified, and then a chemical agent is used for washing off the solder mask layer structure in the photomask area. In such a coating-then-cleaning process, a lot of solder resist is actually consumed, and the shift in the mask copying process also reduces the manufacturing yield.
Disclosure of Invention
In view of the above, the present invention is directed to a prefabricated solder mask structure capable of reducing the amount of semi-cured polymer material.
In order to achieve the above and other objects, the present invention provides a pre-fabricated semi-cured polymer material structure, comprising a film-shaped carrier and a semi-cured polymer material layer, wherein the film-shaped carrier has a coating surface, and the coating surface has a coating area and a hollow area; the semi-solidified polymer material layer is coated on the coating area of the coating surface but does not cover the hollow area.
Through the design, the corresponding hollow-out area can be formed on the film-shaped carrier according to the position of the circuit board without forming the solder mask layer, so that the consumption of solder mask materials can be saved, and the subsequent removal operation for removing the redundant solder mask layer can be simplified.
Other effects and embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic cross-sectional view of a pre-prepared semi-cured polymeric material structure of the present invention;
FIG. 2 is an exemplary illustration of a longitudinal bama textured polymeric material layer according to a first embodiment of the invention;
FIG. 3 is an exemplary illustration of a second embodiment of a transverse bama textured polymeric material layer in accordance with the present invention;
FIG. 4 is a diagram illustrating an example of polymer material layers in a block array according to a third embodiment of the present invention;
fig. 5 is a schematic side view of the pre-prepared semi-cured polymer material structure of the present invention, wherein the film-shaped carrier, the semi-cured polymer material layer and the protective film are represented by a single outer profile due to the relationship of the drawing ratio.
Description of the symbols
10 film-like carrier 11 coating surface
101 coating area 102 longitudinal hollow area
103 lateral hollow-out regions 20 of semi-cured polymer material layer
21 first side 22 second side
30 protective film 40 take-up roll
Detailed Description
Referring to the structure of fig. 1, the pre-prepared semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area and a hollow area are formed on a coating surface 11 of the film-shaped carrier 10, and the semi-cured polymer material layer 20 is coated on the coating area of the coating surface but does not cover the hollow area. A first side 21 of the layer of semi-cured polymer material 20 is formed on the coated side 11 and a second, opposite side 22 thereof may subsequently be laminated to the circuit substrate. In some embodiments, the structure of the semi-cured polymer material further includes a protective film 30, wherein the protective film 30 is strippably coated on the second surface 22 of the semi-cured polymer material layer 20, and the protective film 30 is removed before being laminated on the circuit board.
Referring to the structure shown in fig. 1 and 2, the pre-prepared semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area 101 is formed on a coating surface 11 of the film-shaped carrier 10, and a longitudinal hollow area 102 extending in a length direction of the film-shaped carrier, the semi-cured polymer material layer 20 is coated on the coating area 101 of the coating surface 11 but does not cover the hollow area 102, and the longitudinal hollow area 102 divides the semi-cured polymer material layer 20 into a plurality of areas (gray portions) that are not connected to each other in a width direction of the film-shaped carrier, so as to form a longitudinal zebra stripe as shown in fig. 2.
Referring to the structure shown in fig. 1 and 3, the pre-prepared semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area 101 is formed on a coating surface 11 of the film-shaped carrier 10, and a lateral hollow area 103 extending in a width direction of the film-shaped carrier, the semi-cured polymer material layer 20 is coated on the coating area 101 of the coating surface 11 but does not cover the hollow area 103, and the lateral hollow area divides the semi-cured polymer material layer 20 into a plurality of areas (gray portions) that are not connected to each other in a length direction of the film-shaped carrier, so as to form a lateral zebra stripe as shown in fig. 3.
Referring to the structure shown in fig. 1 and 4, the pre-prepared semi-cured polymer material structure of the present invention comprises a film-shaped carrier 10 and a semi-cured polymer material layer 20, wherein a coating area 101 is formed on a coating surface 11 of the film-shaped carrier 10, a longitudinal hollow area 102 extending in a length direction of the film-shaped carrier, and a transverse hollow area 103 extending in a width direction of the film-shaped carrier, the semi-cured polymer material layer 20 is coated on the coating area 101 of the coating surface 11 but does not cover the hollow areas 102, 103, and the longitudinal hollow area and the transverse hollow area divide the polymer material layer into a plurality of areas (gray portions) that are not connected with each other in the length direction and the width direction of the film-shaped carrier, so as to form a block array shown in fig. 4.
Referring to the structure shown in fig. 5, the pre-prepared semi-cured polymer material structure of the present invention further includes a rolling bar 40, and in the case of the protective film 30, the semi-cured polymer material layer 20 combined with the film carrier 10 and the protective film 30 is rolled on the rolling bar 40 for storage, and then the rolled semi-cured polymer material structure can be rolled by a vacuum film pressing leveling machine and cut into pieces for on-line operation.
Referring to the structure of fig. 1, in some embodiments, the center line average roughness (Ra) of the coating surface 11 on the film-shaped carrier 10 is 200-600nm, wherein the center line average roughness of the coating surface 11 is replicated on the first surface 21 of the semi-cured polymer material layer, so that the polymer material layer has better bonding property, can be firmly bonded with the die and the packaging material to be attached later, and exhibits good bonding strength.
The film-shaped carrier 10 of the present invention may be a polyethylene terephthalate (PET) or other polyester film, a polyimide film, a polyamideimide film, a polypropylene film, a polystyrene film, etc., and the thickness thereof is preferably 10 to 150 μm. The surface of the film-like carrier may be a smooth surface or a matte surface (rough surface).
The semi-cured polymer material layer 20 of the present invention may be made of conventional solder mask materials, dielectric materials and packaging materials, and in one possible non-limiting embodiment, the semi-cured polymer material layer is coated on a film-shaped carrier by a coater while the material is still uncured, and then dried in a dryer to form the semi-cured polymer material layer, wherein the polymer material in the semi-cured polymer material layer is not completely cured but has a touch-dry property, and the polymer material has, for example, a photo-curing property, a thermal curing property or both a photo-curing property and a thermal curing property. The second surface of the semi-cured polymer material layer can be laminated on the circuit substrate, and then the semi-cured polymer material layer is completely cured on the circuit substrate by selecting a corresponding curing mode according to the characteristics of the semi-cured polymer material layer to form permanent connection with the circuit substrate. After laminating the semi-cured polymer material layer on the circuit substrate, the film carrier can be peeled off and removed. The manner in which the semi-cured polymer material layer is formed on the film-shaped carrier is not limited to the above-described embodiments.
The solder mask material may be a thermosetting solder mask ink, a photo-curable solder mask ink, or a combination thereof. The solder resist resin can be a photoimageable solder resist resin, preferably a carboxyl-containing photoimageable resin, or an epoxy resin and a carboxyl-containing photoimageable resin are used together, or other thermosetting resins, photo-curable resins and carboxyl-containing photoimageable resins are used together. The cure accelerator may comprise a photopolymerization initiator, a curing aid, a curing catalyst, or a combination thereof.
The protective film of the invention can be a polyethylene film, a tetrafluoroethylene film, a polypropylene film or surface-treated paper. In the case of a protective film, the protective film is removed from the semi-cured polymer material structure of the present invention before lamination.
In a possible embodiment, the semi-cured polymer material structure of the present invention is directly laminated on the surface of the circuit board without a protective film after being dried. In a possible embodiment, the semi-cured polymer material structure of the present invention is wound after being coated with the protective film, and then is moved to the production line of the laminating machine to perform the laminating operation. In a possible embodiment, after being rolled up as described above, it is kept at a temperature above 0 ℃ for a period of time, preferably between 15 and 25 ℃, and then transferred to the line of the press for said lamination.
When the semi-cured polymer material layer needs to be windowed, the semi-cured polymer material layer can be further exposed and developed, the exposure operation can be performed before or after the film-shaped carrier is removed, and when the exposure operation is performed before the film-shaped carrier is removed, the film-shaped carrier is transparent or semitransparent, so that light irradiated by the exposure operation can pass through the film-shaped carrier. Depending on the thermal curing and/or photo-curing properties of the semi-cured polymer material layer, the circuit board may be baked or irradiated with ultraviolet rays to completely cure the semi-cured polymer material layer.
First embodiment
In this example, a product model PSR-2000 WT500 sold by taiwan taiyang ink corporation was used as a first reagent, and a product model Ca-25 KX50 sold by taiwan taiyang ink corporation was used as a second reagent, and the first reagent and the second reagent were mixed together, and then an appropriate amount of a diluent was added to blend the mixture into a liquid solder resist material, the viscosity was adjusted to 80dPa · s, and the liquid solder resist material was passed through a lip coater.
The film-shaped support used in this example was a PET film. During coating, several outlets are cut off in the die lip gap, so that the coating machine has several sections of gaps in the width direction of the PET film, and the PET film moves relative to the lip coating machine continuously in the length direction, so that the longitudinal hollowed-out area is formed in the length direction of the PET film.
And sequentially drying the PET film coated with the liquid solder mask material in a step-by-step manner by a dryer with the temperature of 70 ℃, 80 ℃, 90 ℃ and 80 ℃ to dry the liquid solder mask material into a semi-solidified solder mask layer, wherein the longitudinal Brahman pattern is formed on the dried solder mask layer as shown in figure 2. And laminating the dried PET film coated with the solder mask layer on a circuit board with a pre-manufactured circuit by using a laminating machine, laminating the solder mask layer on the surface of the circuit board, and finally removing the PET film carrier, wherein the surface of the solder mask layer of the processed circuit board is extremely flat, and the processing error is less than +/-1 mu m.
Second embodiment
The preparation method of this embodiment is the same as that of the first embodiment, and is different from the method of coating the liquid solder mask material. During coating, the feeding time of the coating machine is adjusted, so that the liquid solder mask material is intermittently arranged on the PET film, and meanwhile, the PET film continuously moves relative to the lip-shaped coating machine in the length direction, so that the transverse hollow area is formed by extending in the width direction of the PET film. The dried weld mask layer forms a transverse bama pattern as shown in fig. 3.
Third embodiment
The preparation method of this embodiment is the same as that of the first embodiment, and is different from the method of coating the liquid solder mask material. During coating, several outlets are blocked in the die lip gap, so that the coating machine has a plurality of sections of gaps in the width direction of the PET film, and meanwhile, the PET film continuously moves relative to the lip-shaped coating machine in the length direction, so that a longitudinal hollow-out area is formed in the length direction of the PET film in an extending manner; and adjusting the feeding time of the coating machine to ensure that the liquid solder mask material is intermittently arranged on the PET film, so that a transverse hollow area is formed by extending in the width direction of the PET film. The dried solder mask layer forms a square array as shown in FIG. 4.
Comparative example evaluation of the subsequent Process of solder mask
(1) Die Attach yield (evaluation 1)
The circuit board obtained in the first embodiment was subjected to die bonding on the solder mask surface, and the die bonding yield was evaluated by the following criteria.
O: the yield rate exceeds 70 percent.
And (delta): the yield is between 50 and 70 percent.
X: the yield is lower than 50%.
(2) Molding Compound bond Strength (evaluation 2)
The epoxy resin sealant is cured on the surface of the solder mask layer of the circuit board obtained in the first embodiment, the cured epoxy resin sealant is removed from the circuit board, and the sealant bonding strength is evaluated by the following criteria.
O: the proportion of the solder mask layer pulled out together with the sealing glue exceeds 90 percent.
And (delta): the proportion of the solder mask layer pulled out along with the sealing glue is between 60 and 90 percent.
X: the proportion of the solder mask layer pulled out together with the sealing glue is less than 60.
In the evaluation, the PET film carriers selected in example one were the following five types:
evaluation example one: the center line average roughness (Ra) of the contact surface of the film-like support was 242 nm.
Evaluation example two: the center line average roughness (Ra) of the contact surface of the film-like support was 276 nm.
Evaluation example three: the center line average roughness (Ra) of the contact surface of the film-like support was 419 nm.
Evaluation comparative example one: the center line average roughness (Ra) of the contact surface of the film-like support was 121 nm.
Evaluation comparative example two: the center line average roughness (Ra) of the contact surface of the film-like support was 76 nm.
Watch 1
| Contact surface Ra value (nm) | Evaluation 1 | Evaluation 2 | |
| Evaluation example 1 | 242 | ○ | ○ |
| Evaluation example two | 276 | ○ | ○ |
| Evaluation example III | 419 | ○ | ○ |
| Evaluation comparative example 1 | 121 | △ | △ |
| Evaluation comparative example 2 | 76 | × | × |
As shown in the above description, the solder mask layer formed on the circuit board by using the film-shaped carrier (corresponding to the coated surface being a relatively rough surface) with the contact surface Ra value of 200-600nm is superior to the solder mask layer formed on the circuit board by using the film-shaped carrier (corresponding to the coated surface being a relatively smooth surface) with the contact surface Ra value of less than 200 nm. Therefore, the film-shaped carrier with the preset Ra value is selected, so that the solder mask layer of the circuit board can be endowed with better bonding performance, the circuit board can be firmly bonded with the crystal grains and the packaging materials which are attached later, and good bonding strength is shown.
Comparative example II
According to the semi-cured solder mask structure prepared in the first embodiment, after the solder mask layer is in a semi-cured state, the solder mask layer is stored at 20 ℃ and 20 ℃ below zero respectively, and after 24 hours, whether the appearance of the semi-cured solder mask layer and the appearance of the PET film are stripped or not is observed. The results showed that the samples stored at 20 ℃ did not peel, while the samples stored at-20 ℃ had peeling.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art can make many modifications or changes without departing from the scope of the technology disclosed in the present disclosure, but should be construed as technology or implementations that are substantially the same as the present technology.
Claims (6)
1. A pre-prepared semi-cured polymeric material structure, comprising:
the film-shaped carrier is provided with a coating surface, and the coating surface is provided with a coating area and a hollow area; and
and the semi-cured polymer material layer is coated on the coating area of the coating surface but does not cover the hollow area.
2. The structure of claim 1, wherein the hollow areas comprise at least one longitudinal hollow area extending in the longitudinal direction of the film-shaped carrier, and the longitudinal hollow area divides the polymer material layer into a plurality of areas that are not connected to each other in the width direction of the film-shaped carrier.
3. The structure according to claim 1 or 2, wherein the hollow-out areas include at least one lateral hollow-out area extending in the width direction of the film-like carrier, and the lateral hollow-out area divides the polymer material layer into a plurality of areas that are not connected to each other in the length direction of the film-like carrier.
4. The structure of claim 1, further comprising a protective film that is strippably disposed on the other side of the semi-cured polymer material layer opposite to the film carrier.
5. The structure of claim 1, wherein the coated surface has a centerline roughness average of 200-600nm, wherein the semi-cured polymer material layer has a first surface formed on the coated surface, and the first surface of the semi-cured polymer material layer replicates the centerline roughness average of the coated surface.
6. The structure of claim 1, 4 or 5, further comprising a take-up roll, wherein the pre-prepared structure is taken up on the take-up roll.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554139.3A CN112135433A (en) | 2019-06-25 | 2019-06-25 | Pre-prepared semi-cured polymer material structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554139.3A CN112135433A (en) | 2019-06-25 | 2019-06-25 | Pre-prepared semi-cured polymer material structure |
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| Publication Number | Publication Date |
|---|---|
| CN112135433A true CN112135433A (en) | 2020-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910554139.3A Pending CN112135433A (en) | 2019-06-25 | 2019-06-25 | Pre-prepared semi-cured polymer material structure |
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| CN (1) | CN112135433A (en) |
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- 2019-06-25 CN CN201910554139.3A patent/CN112135433A/en active Pending
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