CN210325854U

CN210325854U - LED micro-bracket with built-in IC

Info

Publication number: CN210325854U
Application number: CN201921836004.8U
Authority: CN
Inventors: 林宪登; 陈建华
Original assignee: Boluo Chengchuang Precision Industry Co ltd
Current assignee: Boluo Chengchuang Precision Industry Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2020-04-14
Anticipated expiration: 2029-10-29

Abstract

The utility model discloses a built-in IC's LED micro-support, including support main part, G paster, R paster, B paster, IC chip and more than 2 soldering tin feet, be provided with in the support main part with soldering tin foot quantity the same and the pad of one-to-one correspondence, built-in IC chip can control single LED alone, therefore can make more changeable color and combination, and this LED support can make littleer illusion-colour lamp decoration; wherein two of G paster, R paster and B paster are located same pad with the IC chip, and the IC chip passes through the conductor line and all is connected with other pads, can reduce the pad clearance through this design, effectively improves the relative area of pad, and the product appearance is little, and the lamp strip interval can be designed littleer, more saves lamp strip space of mating formation. The cup type of support main part is the fillet square, compares in the round cup type, and the square cup type of fillet can effectively increase solid brilliant bonding wire region, can reach higher luminous light virtual value.

Description

LED micro-bracket with built-in IC

Technical Field

The application belongs to the technical field of LED supports, and particularly relates to an LED micro-support with an internal IC.

Background

The RGB three-color LED light source of encapsulation generally is applied to the open air, all has the application in places such as advertising light boxes, display screen, and RGB three-color light source comprises the paster of three kinds of colours red (R), green (G), blue (B), and conventional LED support has LED5050 (overall dimension is 5.0mm), LED3535 (overall dimension is 3.5mm) on the market to and miniature money (overall dimension is no more than 2.0mm) etc..

Traditional full-color LED directly encapsulates the paster of three kinds of colours of red, green and blue, and the external IC chip of rethread drives LED and sends the light of different colours, but external IC can make the processing cost improve, and the IC is external to receive external influence easily moreover, and complicated changeable external environment leads to the appearance of full-color LED inefficacy scheduling problem easily to influence full-color LED's life. And the external IC can only control a certain module LED bracket, can not control a single LED, and can be made into fewer colors and combinations.

Disclosure of Invention

In order to solve the technical problem, the utility model provides a built-in IC's miniature support of LED embeds the IC chip in the miniature support of LED, realizes single LED independent control, and luminous effect is better.

The technical scheme adopted for realizing the purpose of the utility model is that, the LED micro-bracket with the built-in IC comprises a bracket main body, a G patch, a R patch, a B patch and more than 2 soldering tin feet, wherein the bracket main body is provided with soldering pads which have the same number as the soldering tin feet and are in one-to-one correspondence, and the LED micro-bracket also comprises an IC chip, the IC chip is fixed on one of the soldering pads of the bracket main body, and the IC chip is connected with other soldering pads through conductor wires;

two of the G patch, the R patch and the B patch and the IC chip are positioned on the same bonding pad;

the support main part is for taking the cup support, and the cup type is fillet square.

Preferably, the back of the bracket main body is provided with a notch, and the 4 soldering tin feet are respectively arranged in the notch.

Preferably, the number of the bonding pads in the bracket main body is 4, and the 4 bonding pads are respectively a DIN bonding pad for signal input, a DOUT bonding pad for signal output, a VDD bonding pad for power supply access and a GND bonding pad for grounding.

Preferably, two of the G patch, the R patch, and the B patch and the IC chip are located on the VDD pad.

Preferably, the G patch, the R patch, and the IC chip are located on the VDD pad.

Preferably, the B patch is located on the DOUT pad.

Preferably, the R patch is located between the G patch and the B patch.

Preferably, the bonding pad where the IC chip is located is L-shaped and has the largest area.

Preferably, the unilateral size of the LED micro-bracket is not more than 2.0 mm.

Preferably, one corner of the front surface of the bracket main body is provided with a direction mark.

According to the above technical scheme, the utility model provides a built-in IC's LED micro-support directly sets up the IC chip in the support main part, can single LED of independent control, therefore can make more changeable color and combination, and this LED support can make littleer illusion-colour lamp decoration. The built-in IC chip saves the later processing of (external) IC chip, reduces the processing cost, eliminates the loss that causes because of external IC chip simultaneously, saves the maintenance in most later stages, can also prolong LED's life-span.

The utility model provides a built-in IC's LED micro-bracket designs for four-legged support, IC chip and wherein two luminous paster are located same pad, can reduce the pad clearance through this design, effectively improve the relative area of pad (for support main part surface), consequently the built-in IC's of this application LED micro-bracket can make unilateral size and be no longer than 2.0 mm's miniature money LED support, the product appearance is little, lamp strip interval can design ground littleer, more save lamp strip space of mating formation.

The utility model provides a built-in IC's LED micro-support designs for taking the cup support, and the cup type is the fillet square, compares in the circle cup type, and the square cup type in fillet can effectively increase solid brilliant bonding wire region, can reach higher luminous light virtual value.

Drawings

Fig. 1 is a schematic structural view of an LED micro-mount with an IC built therein according to an embodiment of the present invention;

FIG. 2 is a front view of FIG. 1;

FIG. 3 is a side view of FIG. 1;

FIG. 4 is a rear view of FIG. 1;

description of reference numerals: 1-a stent body; 2-G patch; 3-R patch; 4-B patch; 5-IC chip; a 6-DIN pad; a 7-DOUT pad; an 8-VDD pad; a 9-GND pad; 10-soldering tin feet; 11-a light-gathering cup; 12-direction identification; 13-a conductor line; 14-notch.

Detailed Description

In order to make the present application more clearly understood by those skilled in the art to which the present application pertains, the following detailed description of the present application is made with reference to the accompanying drawings by way of specific embodiments.

The embodiment of the utility model provides an in, LED micro-support of built-in IC, its structure is as shown in figure 1, including support main part 1, G paster 2, R paster 3, B paster 4, IC chip 5 and more than 2 soldering tin feet 10.

The structure of the IC-embedded LED micro mount is described in detail below:

the LED light source bracket is characterized in that the bracket main body 1 is a plastic bracket, the LED bracket is small in overall dimension, the dimension of an internal electronic patch is smaller than that of a conventional specification, the bracket main body 1 adopts a bracket with a cup to ensure a light emitting effect, the structure is two layers, the center of the upper layer is provided with a light-gathering cup 11, and one corner of the upper layer is provided with a direction mark 12, such as a notch, for identifying the direction of a product; the upper surface of lower floor sets up the pad, and the quantity of pad is the same with soldering tin foot 10 quantity, and each pad and each soldering tin foot 10 one-to-one.

Referring to fig. 2, in this embodiment, the cup shape of the light-gathering cup 11 is round-cornered and square, and the surface of the cup body is provided with a reflective coating, so that the round-cornered and square cup shape can effectively increase the die bonding area, and is particularly suitable for a micro LED support. For example, if the cup diameter of the conventional round cup LED support is r, the area of the die bonding wire area is pi r²The die bonding wire area of the present application is about 4r²。

Referring to fig. 2, in the present embodiment, the LED micro-mount is a four-pin LED, the number of the corresponding bonding pads in the mount body 1 is 4, and the 4 bonding pads are respectively a DIN bonding pad 6 for signal input, a DOUT bonding pad 7 for signal output, a VDD bonding pad 8 for power supply access, and a GND bonding pad 9 for ground.

The IC chip 5 is fixed on one of the bonding pads of the bracket main body 1, the IC chip 5 is connected with other bonding pads through conductor wires 13 (preferably gold wires), and two of the G patch 2, the R patch 3 and the B patch 4 and the IC chip 5 are positioned on the same bonding pad.

Specifically, referring to fig. 2, in this embodiment, the G patch 2, the R patch 3, and the IC chip 5 are all located on the VDD pad 8, the B patch 4 is located on the DOUT pad 7, and the remaining two pads are empty pads. The G paster 2, the R paster 3, the B paster 4 and the IC chip 5 are all fixed in a glue dispensing connection mode, and the R paster 3 is located between the G paster 2 and the B paster 4.

This VDD pad 8 area is the biggest in 4 pads, and for convenient arrangement, this VDD pad 8 designs for the L type, and R paster 3 and IC chip 5 distribute in the vertical part of L type, and G paster 2 distributes in the horizontal part of L type.

Referring to fig. 3 and 4, in the present embodiment, the back surface of the bracket body 1 is provided with a notch 14, the notch 14 can be obtained by retracting two sides of the bracket inward to form two inward-retracted recessed areas, and 4 solder legs 10 are respectively disposed in the inward-retracted recessed areas on the two sides. Through the arrangement of the notch 14, the solder feet 10 are improved from being exposed outside the plastic main body to being hidden inside the plastic main body conventionally, the packaging size of the whole LED support is obviously reduced, the area of the lamp bead welding plate required by a single LED is reduced, the number of the lamp beads can be increased by 5% by the same welding plate, and the cost of the mask cannot be increased. As can be seen from fig. 3, the solder foot 10 of the LED micro-mount with the IC built therein of the present embodiment is flush with the side surface of the mount body 1, so that compared with the conventional exposed solder foot, the solder foot of the present embodiment is not easily touched by foreign objects, and has a longer service life.

In other embodiments, the LED micro-mount may also be a six-pin LED, the R patch 3, the B patch 4 and the IC chip 5 are located on the same pad, the G patch 2 is located on another pad, and the remaining 4 pads are empty pads. Or the G patch 2, the B patch 4 and the IC chip 5 are located on the same pad, the R patch 3 is located on another pad, and the remaining 4 pads are empty pads.

The specification of the IC-embedded LED micro mount of this embodiment may be set to a micro size with a single side size of 2.0mm or less, for example, a single side size of 2.0mm, 1.5mm, 1.0mm, etc., and a power of 0.1 w. Because LED support size is little, compare in jumbo size supports such as LED3535, LED5050, the LED support heat dissipation space of this application is little, adopts lower power can reduce the lamp pearl heat, guarantees lamp pearl normal use.

Through the embodiment, the utility model has the following beneficial effect or advantage:

1) the utility model provides a built-in IC's LED micro-support directly sets up the IC chip in the support main part, can single LED of independent control, therefore can make more changeable color and combination, and this LED support can make littleer illusion-colour lamp decoration. And the built-in IC chip saves the later processing of (external) IC chip, reduces the processing cost, eliminates the loss caused by the external IC chip simultaneously, saves most later maintenance, and can also prolong the service life of the LED.

2) The utility model provides a built-in IC's LED micro-bracket designs for four-legged support, IC chip and wherein two luminous paster are located same pad, can reduce the pad clearance through this design, effectively improve the relative area of pad (for support main part surface), consequently the built-in IC's of this application LED micro-bracket can make unilateral size and be no longer than 2.0 mm's miniature money LED support, the product appearance is little, lamp strip interval can design ground littleer, more save lamp strip space of mating formation.

3) The utility model provides a built-in IC's LED micro-support designs for taking the cup support, and the cup type is the fillet square, compares in the circle cup type, and the square cup type in fillet can effectively increase solid brilliant bonding wire region, can reach higher luminous light virtual value.

4) The application provides a built-in IC's LED micro-support, soldering tin foot by conventional expose outside the plastic main part improve for hiding in the plastic main part, have obviously reduced the encapsulation size of whole LED support to reduce the required lamp pearl of single LED and weld the board area, same welding plate can increase 5% lamp pearl quantity, and can not increase the cost of face guard. The soldering tin foot flushes with support main part side, consequently compares in current type soldering tin foot that exposes, and the soldering tin foot of this application is difficult touched by foreign object, and life is longer.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. The utility model provides a built-in IC's miniature support of LED, includes support main part, G paster, R paster, B paster and more than 2 soldering tin feet, be provided with in the support main part with soldering tin foot quantity is the same and the pad of one-to-one, its characterized in that: the IC chip is fixed on one of the bonding pads of the bracket main body and is connected with other bonding pads through conductor wires;

2. The IC-embedded LED micro-mount of claim 1, wherein: the back of support main part is provided with the breach, 4 the soldering tin foot sets up respectively in the breach.

3. The IC-embedded LED micro-mount of claim 1 or 2, wherein: the number of the bonding pads in the bracket main body is 4, and the 4 bonding pads are DIN bonding pads for signal input, DOUT bonding pads for signal output, VDD bonding pads for power supply access and GND bonding pads for grounding respectively.

4. The IC-embedded LED micro-mount of claim 3, wherein: two of the G patch, the R patch and the B patch and the IC chip are located on the VDD bonding pad.

5. The IC-embedded LED micro-mount of claim 4, wherein: the G patch, the R patch and the IC chip are located on the VDD bonding pad.

6. The IC-embedded LED micro-mount of claim 5, wherein: the B patch is located on the DOUT pad.

7. The IC-embedded LED micro-mount of claim 6, wherein: the R patch is located between the G patch and the B patch.

8. The IC-embedded LED micro-mount according to any one of claims 1, 2, 4 to 7, wherein: the bonding pad where the IC chip is located is L-shaped and has the largest area.

9. The IC-embedded LED micro-mount according to any one of claims 1, 2, 4 to 7, wherein: the unilateral size of the LED micro-bracket is not more than 2.0 mm.

10. The IC-embedded LED micro-mount according to any one of claims 1, 2, 4 to 7, wherein: one corner of the front face of the support main body is provided with a direction mark.