CN210318076U

CN210318076U - Bonding type probe packaging and intelligent bolt

Info

Publication number: CN210318076U
Application number: CN201920705573.2U
Authority: CN
Inventors: 方文平; 刘日明
Original assignee: Hangzhou Jianwei Mechanical & Electrical Technology Co ltd
Current assignee: Hangzhou Jianwei Technology Co ltd
Priority date: 2019-05-17
Filing date: 2019-05-17
Publication date: 2020-04-14
Anticipated expiration: 2029-05-17

Abstract

The utility model provides a bonding formula probe encapsulation and intelligent bolt belongs to supersound stress technical field. It has solved the problem that current intelligent bolt destroys bolt structural strength, the processing degree of difficulty is high, manufacturing cost is high. The utility model discloses a standard bolt and probe encapsulation, probe encapsulation link firmly with standard bolt upper surface, and the probe encapsulation includes the sheath, installs insulating cover in the sheath, installs wafer and contact in the insulating cover, and insulating cover is used for insulating wafer and contact and sheath, is equipped with the insulating layer between wafer and contact, and the wafer two poles of the earth is respectively in being connected with contact and sheath are electrically conductive, and the trompil has all been seted up to sheath and insulating cover, and the trompil is used for making the contact expose, the sealed insulating processing in probe encapsulation bottom surface. The utility model has the advantages of convenient to use, simple structure, the processing assembly degree of difficulty is low, low in production cost, and it is high to detect the precision.

Description

Bonding type probe packaging and intelligent bolt

Technical Field

The utility model belongs to the technical field of the supersound stress, in particular to bonding formula probe encapsulation and intelligent bolt.

Background

With the modern construction and the further deepening of international cooperation of China, a large amount of infrastructure engineering needs to be invested in construction urgently, such as water conservancy and hydropower facilities, houses, bridges and the like. In the construction process and the operation stage of the engineering structures, necessary stability and health monitoring needs to be carried out on the engineering structures in order to ensure the safety of engineering objects and guarantee the lives and properties of personnel and the surrounding environment. At present, as a connecting part used in a large amount, bolts mainly exist in the field of equipment manufacturing in a traditional mode structure and design, the tightness degree of the bolts is adjusted in a manual mode, thousands of bolts are used on the equipment, and users and maintainers cannot effectively master specific information of the bolts. The consequence of this kind of mode is that very easily because artificial installation is unreasonable to and equip and can't effectual early warning and cause the trouble of equipment under operating condition, after the trouble takes place, again can't obtain information effectively and handle and solve the problem.

For the reasons mentioned above, it is common practice in many modern industries to periodically inspect fasteners comprising bolts and nuts, or bolts and corresponding threaded holes, to ensure that they do not loosen. The current intelligent bolt of passing through monitors as the node, and the embedded sensor of the most adoption of current intelligent bolt, this kind of intensity that can destroy bolt itself in the mode of embedding the sensor in inside, and the specification and the intensity of bolt have clear and definite standard requirement in the in-service use, have both to implant the part in the cavity of bolt, will satisfy relevant standard requirement again, and the degree of difficulty is very big, and the processing degree of difficulty is higher moreover, therefore manufacturing cost is higher.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the above-mentioned problem that exists among the prior art, provide a processing degree of difficulty is low, does not influence bonding formula probe encapsulation and the intelligent bolt of bolt intensity.

The purpose of the utility model can be realized by the following technical proposal: the bonding type probe package is characterized by comprising a sheath, a wafer and a contact, wherein the wafer and the contact are both installed in the sheath, an insulating sleeve is further arranged in the sheath and used for insulating the wafer and the contact from the sheath, an insulating damping layer is arranged between the wafer and the contact, the two poles of the wafer are respectively in conductive connection with the contact and the sheath, openings are formed in the sheath and the insulating sleeve, the openings are used for exposing the contact, and the bottom surface of the probe package is subjected to sealing and insulating treatment.

The utility model discloses a theory of operation: during installation, the sheath and the insulating sleeve are fixed, the two poles of the wafer are respectively in conductive connection with the contact and the sheath, the contact is placed in the insulating sleeve and fixed, the part of the contact is exposed through the opening, then the insulating damping layer is placed on the lower surface of an electric shock, then the wafer is placed on the insulating damping layer, and finally sealing and insulating treatment are carried out. By adopting the arrangement, the installation steps are less, the processing difficulty is low, and the production cost is greatly reduced.

In the bonding type probe packaging, the sheath and the insulating sleeve, the insulating sleeve and the sheath and the contact, and the insulating damping layer and the sheath and the contact are fixedly connected in a sealing manner through jelly.

In the above bonding type probe package, a convex edge is arranged at the edge of the opening of the insulating sleeve, and the convex edge is used for insulating the protrusion of the contact from the sheath.

In the bonding type probe package, the sheath is provided with a sealing groove, and the sealing groove is used for placing jelly to seal the sheath and the insulating damping layer.

In the above bonded probe package, the lower surfaces of the die and the insulating damping layer are flush, and the lower surface of the sheath protrudes relative to the lower surfaces of the die and the insulating damping layer.

In the above bonding type probe package, the contact and the sheath are provided with chamfers and gaps, and the chamfers and the gaps are used for filling jelly.

In the bonding type probe package, the wafer and the contact and the wafer and the sheath are connected through cables, and the cables are fixedly connected with the wafer, the contact and the sheath respectively through welding.

The adhesive intelligent bolt comprises a bolt and the adhesive probe package, and is characterized in that the upper surface of the bolt and the bottom surface of the probe package are fixed through jelly.

The utility model has the advantages that: the utility model discloses can compare current intelligent bolt installation simpler, the processing degree of difficulty is low, low in production cost, does not destroy the intensity of bolt itself simultaneously, detects the precision height.

Drawings

Fig. 1 is an isometric schematic view of the present invention;

fig. 2 is an isometric schematic view of a probe package of the present invention;

FIG. 3 is a cross-sectional view of the probe package of the present invention

In the figure, 1, bolt; 2. packaging the probe; 3. a sheath; 4. an insulating sleeve; 5. a wafer; 6. a contact; 7. an insulating damping layer; 8. opening a hole; 9. a convex edge; 10. a sealing groove; 11. chamfering; 12. a gap; 13. an electrical cable.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-3, the bonded probe package comprises a sheath 3, a wafer 5 and a contact 6, wherein the wafer 5 and the contact 6 are both installed in the sheath 3, an insulating sleeve 4 is further arranged in the sheath 3, the insulating sleeve 4 is used for insulating the wafer 5 and the contact 6 from the sheath 3 at the same time, an insulating damping layer 7 is arranged between the wafer 5 and the contact 6, two poles of the wafer 5 are respectively in conductive connection with the sheath 3 of the contact 6, openings 8 are respectively formed in the sheath 3 and the insulating sleeve 4, the openings 8 are used for exposing the contact 6, and the bottom surface of the probe package 2 is subjected to sealing and insulating treatment.

In further detail, the sheath 3 and the insulating sleeve 4, the insulating sleeve 4 and the sheath 3 and the contact 6, and the insulating damping layer 7 and the sheath 3 and the contact 6 are fixedly connected in a sealing manner through jelly. Adopt the setting of above-mentioned structure, can greatly reduced processing degree of difficulty, reduction in production cost, lower to producers' technical requirement simultaneously, but also can guarantee the reliability of structure, can use the jelly of different models to reach not weak in through welding or fixed intensity of connecting piece.

To put it in detail, in order to completely insulate the contact 6 from the outer sleeve and facilitate the installation of the insulating sleeve 4 on the outer sleeve, a flange 9 is provided at the edge of the opening 8 of the insulating sleeve 4, and the flange 9 is used for insulating the protrusion of the contact 6 from the sheath 3.

In order to have enough space for filling the jelly, the jacket 3 is provided with a sealing groove 10, and the sealing groove 10 is used for placing the jelly to seal the jacket 3 and the insulating damping layer 7.

In further detail, in order to ensure that the jelly can completely seal the wafer 5 and the insulating damping layer 7, the lower surfaces of the wafer 5 and the insulating damping layer 7 are flush, and the lower surface of the sheath 3 protrudes relative to the lower surfaces of the wafer 5 and the insulating damping layer 7.

In order to fill more jelly and make the structure more firm, the contact 6 and the sheath 3 are provided with a chamfer 11 and a gap 12, and the chamfer 11 and the gap 12 are used for filling the jelly.

Preferably, the wafer 5 and the contact 6 and the wafer 5 and the sheath 3 are connected through a cable 13, and the cable 13 is fixedly connected with the wafer 5, the contact 6 and the sheath 3 respectively through welding. By adopting the structure, the effective work of the wafer 5 can be ensured, and meanwhile, the mode of connecting the cables 13 is simple to operate, so that the purchasing cost and the production cost are low.

The adhesive intelligent bolt comprises a bolt 1 and the adhesive probe package 2, wherein the upper surface of the bolt 1 and the bottom surface of the probe package 2 are fixed through jelly. The assembly is simple, and the production cost is low.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the terms bolt 1, probe package 2, sheath 3, insulating sleeve 4, wafer 5, contact 6, insulating damping layer 7, opening 8, flange 9, sealing groove 10, chamfer 11, slot 12, cable 13, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims

1. The utility model provides a bonding formula probe encapsulation, its characterized in that includes sheath (3), wafer (5) and contact (6) all install in sheath (3), sheath (3) in still be equipped with insulating cover (4), insulating cover (4) be used for insulating with sheath (3) simultaneously wafer (5) and contact (6), wafer (5) and contact (6) between be equipped with insulating damping layer (7), wafer (5) two poles of the earth be connected in with contact (6) and sheath (3) electrically conductive respectively, sheath (3) and insulating cover (4) all seted up trompil (8), trompil (8) be used for making contact (6) expose, probe encapsulation (2) bottom surface sealing insulation handle.

2. An adhesive probe package according to claim 1, wherein the sheath (3) and the insulating sleeve (4), the insulating sleeve (4) and the sheath (3) and the contact (6), and the insulating damping layer (7) and the sheath (3) and the contact (6) are all sealed and fixedly connected by a jelly.

3. An adhesive intelligent bolt according to claim 1, characterized in that the edge of the opening (8) of the insulating sleeve (4) is provided with a flange (9), and the flange (9) is used for insulating the protrusion of the contact (6) from the sheath (3).

4. The bonded probe package according to claim 2, wherein the sheath (3) is provided with a sealing groove (10), and the sealing groove (10) is used for placing a jelly and sealing the sheath (3) and the insulating damping layer (7).

5. An adhesive probe package according to claim 1, wherein the lower surfaces of the die (5) and the insulating damping layer (7) are flush, and the lower surface of the sheath (3) protrudes relative to the lower surfaces of the die (5) and the insulating damping layer (7).

6. An adhesive probe package according to claim 2, wherein the contact (6) and the sheath (3) are provided with a chamfer (11) and a slit (12), and the chamfer (11) and the slit (12) are used for filling with a gel.

7. An adhesive probe package according to claim 1, wherein the die (5) and the contact (6) and the die (5) and the sheath (3) are connected by a cable (13), and the cable (13) is fixedly connected with the die (5), the contact (6) and the sheath (3) by welding.

8. A bonded smart bolt comprising a bolt (1) and a bonded probe package (2) according to claims 1 to 7, wherein the upper surface of the bolt (1) and the bottom surface of the probe package (2) are fixed by a glue.