CN111948298A - Welding type probe, intelligent bolt and assembly process of intelligent bolt - Google Patents

Abstract

The invention discloses a welding type probe, an intelligent bolt and an assembly process thereof, wherein the welding type probe comprises a downward-concave secondary step groove arranged in the center of the bolt, a contact and a ceramic wafer, the secondary step groove comprises a lower layer of first step groove and an upper layer of second step groove, a conductive connecting layer is arranged in the first step groove, the ceramic wafer is arranged in the second step groove, a gap is formed between the ceramic wafer and the inner wall of the second step groove, an insulating damping layer is arranged in the gap, the upper surface of the ceramic wafer is in conductive connection with the contact, and the lower surface of the ceramic wafer is in conductive connection with the bolt through the conductive connecting layer. The invention has the advantages of rapid packaging mode, simple packaging structure, fewer processing steps, short construction period, greatly reduced processing difficulty, greatly reduced production cost, high detection precision, contribution to mass production and popularization and wider application range compared with the existing stress detection equipment.

Description

Welding type probe, intelligent bolt and assembly process of intelligent bolt

Technical Field

The invention relates to the technical field of ultrasonic stress, in particular to a welding type probe, an intelligent bolt and an assembly process of the intelligent bolt.

Background

With the modern construction and the further deepening of international cooperation of China, a large amount of infrastructure engineering needs to be invested in construction urgently, such as water conservancy and hydropower facilities, houses, bridges and the like. In the construction process and the operation stage of the engineering structures, necessary stability and health monitoring needs to be carried out on the engineering structures in order to ensure the safety of engineering objects and guarantee the lives and properties of personnel and the surrounding environment. At present, as a connecting part used in a large amount, bolts mainly exist in the field of equipment manufacturing in a traditional mode structure and design, the tightness degree of the bolts is adjusted in a manual mode, thousands of bolts are used on the equipment, and users and maintainers cannot effectively master specific information of the bolts. The consequence of this kind of mode is that very easily because artificial installation is unreasonable to and equip and can't effectual early warning and cause the trouble of equipment under operating condition, after the trouble takes place, again can't obtain information effectively and handle and solve the problem.

For the reasons mentioned above, it is common practice in many modern industries to periodically inspect fasteners comprising bolts and nuts, or bolts and corresponding threaded holes, to ensure that they do not loosen. The current intelligent bolt of passing through monitors as the node, and the embedded sensor of the most adoption of current intelligent bolt, this kind of intensity that can destroy bolt itself in the mode of embedding the sensor in inside, and the specification and the intensity of bolt have clear and definite standard requirement in the in-service use, have both to implant the part in the cavity of bolt, will satisfy relevant standard requirement again, and the processing degree of difficulty is very big, is unfavorable for mass production.

Disclosure of Invention

The invention aims to provide a welding type probe, an intelligent bolt and an assembly process thereof, which are low in processing difficulty and high in production efficiency, aiming at the defects of the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a welded probe, is including locating second grade step groove, contact and the ceramic wafer of the recessed formula of bolt central authorities, second grade step groove includes the first step groove of lower floor and the second step groove of upper strata, be equipped with electrically conductive connecting layer in the first step groove, be equipped with the ceramic wafer in the second step groove, the ceramic wafer has the clearance with the inner wall of second step groove, be equipped with insulating damping layer in the clearance, ceramic wafer upper surface and contact electrically conductive connection, ceramic wafer lower surface and bolt pass through electrically conductive connecting layer electrically conductive connection.

Further, the height of the insulating damping layer does not exceed the height of the upper surface of the contact.

Further, the diameter of the contact is 6 mm, and the height of the contact is 1-2 mm.

Furthermore, the upper surface and the lower surface of the ceramic wafer are both provided with silver plating layers.

Furthermore, the conductive connecting layer is solder, and the insulating damping layer is insulating glue.

Further, the depth of the first step groove is 1 mm,

further, the depth of the second step groove is 1 mm.

The invention also comprises a welding type intelligent bolt, wherein the upper surface of the bolt is fixedly connected with the bottom surface of the probe through a welding conductive connecting layer.

Furthermore, the probe and the bolt are coaxially arranged.

The invention also comprises an assembly process of the welding type probe, which comprises the following steps:

s1, filling solder into the first step groove of the downward-concave secondary step groove in the center of the bolt;

s2, fixing the ceramic wafer in a second step groove in the downward concave secondary step groove through the solder;

s3, welding the contact with the center of the upper surface of the ceramic wafer;

and S4, filling a gap between the ceramic wafer and the second step groove with an insulating damping layer, wherein the height of the insulating damping layer does not exceed the height of the upper surface of the contact.

By adopting the technical scheme of the invention, the invention has the beneficial effects that: the invention has the advantages of rapid packaging mode, simple packaging structure, fewer processing steps, short construction period, greatly reduced processing difficulty, greatly reduced production cost, high detection precision, contribution to mass production and popularization and wider application range compared with the existing stress detection equipment.

Drawings

FIG. 1 is a block diagram of a bolt with a welded probe package according to the present invention;

FIG. 2 is a cross-sectional structural view of a bolt with a welded probe package according to the present invention;

fig. 3 is an enlarged view of the soldered probe package at a in fig. 2.

The device comprises a bolt 1, a bolt 2, a conductive connecting layer 3, a ceramic wafer 4, a contact 5, an insulating damping layer 6, a first step groove 7 and a second step groove.

Detailed Description

Specific embodiments of the present invention will be further described with reference to the accompanying drawings.

As shown in the figure, the welding type probe package comprises a concave secondary step groove arranged at the center of a bolt 1, a contact 4 and a ceramic wafer 3, wherein the secondary step groove comprises a lower first step groove 6 and an upper second step groove 7, a conductive connecting layer 2 is arranged in the first step groove 6, the ceramic wafer 3 is arranged in the second step groove 7, a gap is formed between the ceramic wafer 3 and the inner wall of the second step groove 7, an insulating damping layer 5 is arranged in the gap, the upper surface of the ceramic wafer 3 is in conductive connection with the contact 4, and the lower surface of the ceramic wafer 3 is in conductive connection with the bolt 1 through the conductive connecting layer 2.

The height of the insulating damping layer 5 does not exceed the height of the upper surface of the contact, so that the failure of the contact 4 is effectively avoided.

The diameter of the contact 4 is 6 mm, the height of the contact 4 is 1-2 mm, and the contact 4 is usually made of red copper.

And silver coatings are arranged on the upper surface and the lower surface of the ceramic wafer 3, so that the ceramic wafer can be conveniently welded with the contact 4 at the upper part and the conductive connecting layer 2 at the lower part.

The conductive connection layer 2 is solder, typically solder or other material.

Insulating damping layer 5 is the insulating cement, uses the jelly not only easy operation, and the cost is lower moreover, and the jelly can also provide good insulating and fixed effect.

The depth of the first stepped groove 6 is 1 mm, the depth of the second stepped groove 7 is 1 mm, and the depth of the first stepped groove can just accommodate the ceramic wafer 3 and the solder, so that the space distribution is reasonable.

During installation, the solder is filled in the first step groove 6, the ceramic wafer 3 is welded in the second step, the contact 4 is welded on the upper surface of the ceramic wafer 3, and finally the insulating damping layer 5 is filled in the gap between the inner walls of the ceramic wafer 3 and the second step groove 7, and meanwhile, the insulating damping layer 5 is prevented from being higher than the upper surface of the contact 4.

The embodiment also comprises a welding type intelligent bolt, wherein the upper surface of the bolt 1 is fixedly connected with the bottom surface of the probe through a conductive connecting layer 2.

The probe and the bolt 1 are coaxially arranged.

Embodiments also include an assembly process that also includes a welding-type probe, comprising the steps of:

s1, filling solder into the first step groove 6 in the downward-concave secondary step groove in the center of the bolt 1;

s2, fixing the ceramic wafer 3 in the second step groove 7 in the concave secondary step groove through the solder;

s3, welding the contact 4 with the center of the upper surface of the ceramic wafer 3;

and S4, filling the gap between the ceramic wafer 3 and the second step groove 7 with the insulating damping layer 5, wherein the height of the insulating damping layer 5 does not exceed the height of the upper surface of the contact 4.

Although the terms sheath 1, solder layer 2, ceramic wafer 3, contact 4, insulating damping layer 5, first step groove 6, second step groove 7, etc. are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. The utility model provides a welded probe, its characterized in that, including the second grade step groove, contact and the ceramic wafer of the recessed formula of locating bolt central authorities, the second grade step groove includes the first step groove of lower floor and the second step groove of upper strata, be equipped with the electrically conductive articulamentum in the first step groove, be equipped with the ceramic wafer in the second step groove, the ceramic wafer has the clearance with the inner wall of second step groove, be equipped with insulating damping layer in the clearance, ceramic wafer upper surface and contact electrically conductive connection, ceramic wafer lower surface and bolt pass through electrically conductive articulamentum electrically conductive connection.

2. A welding-type probe according to claim 1 wherein the insulating damping layer has a height that does not exceed the height of the upper surface of the contact.

3. A welding probe according to claim 1 wherein the diameter of the contact is 6 mm and the height of the contact is 1-2 mm.

4. A welding probe according to claim 1 wherein the upper and lower surfaces of the ceramic wafer are provided with silver plating.

5. A welding-type probe according to claim 1 wherein the conductive connecting layer is solder and the insulating damping layer is insulating glue.

6. A welding-type probe as in claim 1 wherein said first step groove depth is 1 mm.

7. A welding probe according to claim 1 wherein said second step groove depth is 1 mm.

8. A welded intelligent bolt, characterized in that, comprises a bolt and a welded probe according to any one of claims 1-7, wherein the upper surface of the bolt is fixedly connected with the bottom surface of the probe through a conductive connecting layer.

9. A welded smart bolt according to claim 8, wherein the probe is arranged coaxially with the bolt.

10. An assembly process for carrying out the welding-type probe of any one of claims 1 to 7, comprising the steps of:

s1, filling solder into the first step groove of the downward-concave secondary step groove in the center of the bolt;

s2, fixing the ceramic wafer in a second step groove in the downward concave secondary step groove through the solder;

s3, welding the contact with the center of the upper surface of the ceramic wafer;

and S4, filling a gap between the ceramic wafer and the second step groove with an insulating damping layer, wherein the height of the insulating damping layer does not exceed the height of the upper surface of the contact.

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