CN111103077A - Welding type probe, intelligent bolt and assembly process of intelligent bolt - Google Patents

Welding type probe, intelligent bolt and assembly process of intelligent bolt Download PDF

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Publication number
CN111103077A
CN111103077A CN201910426820.XA CN201910426820A CN111103077A CN 111103077 A CN111103077 A CN 111103077A CN 201910426820 A CN201910426820 A CN 201910426820A CN 111103077 A CN111103077 A CN 111103077A
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China
Prior art keywords
sheath
probe
wafer
contact
bolt
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Pending
Application number
CN201910426820.XA
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Chinese (zh)
Inventor
方文平
刘日明
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Hangzhou Jianwei Mechanical & Electrical Technology Co ltd
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Hangzhou Jianwei Mechanical & Electrical Technology Co ltd
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Priority to CN201910426820.XA priority Critical patent/CN111103077A/en
Publication of CN111103077A publication Critical patent/CN111103077A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/25Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
    • G01L1/255Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons using acoustic waves, or acoustic emission
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B35/00Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws
    • F16B35/04Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws with specially-shaped head or shaft in order to fix the bolt on or in an object
    • F16B35/06Specially-shaped heads

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The invention provides a welding type probe, an intelligent bolt and an assembly process of the intelligent bolt, and belongs to the technical field of ultrasonic stress. It is big that it has solved current intelligent bolt processing degree of difficulty, is unfavorable for mass production's problem. The invention comprises a standard bolt and a probe package, wherein the probe package is fixedly connected with the upper surface of the standard bolt in a welding manner, the probe package comprises a sheath, a contact and a wafer, the sheath is also provided with a mounting groove and a through hole, the mounting groove is used for positioning and mounting the wafer, the upper surface of the wafer is fixedly connected with the sheath in an insulating manner, the through hole is used for mounting the contact, a gap is formed between the contact and the sheath, a damping layer is filled in the gap, and the upper surface of the wafer is fixedly connected with the bottom surface of. The invention has the advantages of convenient use, simple structure, low processing and assembling difficulty, low production cost and high detection precision.

Description

Welding type probe, intelligent bolt and assembly process of intelligent bolt
Technical Field
The invention belongs to the technical field of ultrasonic stress, and particularly relates to a welding type probe, an intelligent bolt and an assembly process of the intelligent bolt.
Background
With the modern construction and the further deepening of international cooperation of China, a large amount of infrastructure engineering needs to be invested in construction urgently, such as water conservancy and hydropower facilities, houses, bridges and the like. In the construction process and the operation stage of the engineering structures, necessary stability and health monitoring needs to be carried out on the engineering structures in order to ensure the safety of engineering objects and guarantee the lives and properties of personnel and the surrounding environment. At present, as a connecting part used in a large amount, bolts mainly exist in the field of equipment manufacturing in a traditional mode structure and design, the tightness degree of the bolts is adjusted in a manual mode, thousands of bolts are used on the equipment, and users and maintainers cannot effectively master specific information of the bolts. The consequence of this kind of mode is that very easily because artificial installation is unreasonable to and equip and can't effectual early warning and cause the trouble of equipment under operating condition, after the trouble takes place, again can't obtain information effectively and handle and solve the problem.
For the reasons mentioned above, it is common practice in many modern industries to periodically inspect fasteners comprising bolts and nuts, or bolts and corresponding threaded holes, to ensure that they do not loosen. The current intelligent bolt of passing through monitors as the node, and the embedded sensor of the most adoption of current intelligent bolt, this kind of intensity that can destroy bolt itself in the mode of embedding the sensor in inside, and the specification and the intensity of bolt have clear and definite standard requirement in the in-service use, have both to implant the part in the cavity of bolt, will satisfy relevant standard requirement again, and the processing degree of difficulty is very big, is unfavorable for mass production.
Disclosure of Invention
The invention aims to provide a welding type probe, an intelligent bolt and an assembly process thereof, which are low in processing difficulty and high in production efficiency, aiming at the problems in the prior art.
The first object of the present invention can be achieved by the following technical solutions: the utility model provides a welded probe, its characterized in that includes sheath, contact and wafer, the sheath on still seted up mounting groove and through-hole, wafer card go into in the mounting groove, wafer upper surface and sheath be provided with the insulating film, the insulating film be used for insulating and linking firmly wafer upper surface and sheath, the contact be located the through-hole, just contact and wafer link firmly, contact and sheath between have the space, the space intussuseption be filled with and be used for with contact and sheath insulating damping layer, the upper surface and the contact conductive connection of wafer, the lower surface and the sheath conductive connection of wafer.
In the above welding type probe, the wafer is fixedly connected with the contact by welding.
In the above welding probe, the damping layer is made of jelly, and the insulating film is made of jelly.
In the above soldering probe, the bottom surface of the wafer is recessed in the bottom surface of the sheath and forms a groove with the side wall of the sheath for accommodating solder.
In the welding type probe, the welding type probe further comprises a waterproof film, and the waterproof film completely covers the upper surface of the damping layer.
The second object of the present invention can be achieved by the following technical solutions:
the welding type intelligent bolt is characterized by comprising a bolt and the welding type probe, wherein the upper surface of the bolt is fixedly connected with the bottom surface of the probe through a welding layer.
In the above welding type intelligent bolt, the probe and the bolt are coaxially arranged.
In the above welding type intelligent bolt, a welding layer is also arranged between the outer wall of the probe and the surface of the bolt.
The third object of the present invention can be achieved by the following technical solutions:
a welding type probe assembling process is characterized by comprising the following steps:
s1: the upper surface of the wafer is welded with the bottom surface of the contact;
s2: the mounting groove is internally coated with jelly, the wafer is clamped into the mounting groove, and the contact enters the through hole;
s3: a damping layer is filled in a gap between the contact and the sheath, and the damping layer is kept flush with the upper surface of the sheath;
s4: and after the damping layer is solidified, covering the upper surfaces of the damping layer and the sheath with a waterproof film to expose the contact.
In the above welding type probe assembling process, the method further comprises the following steps:
s5: placing soldering tin on the upper surface of the bolt, and heating to melt the soldering tin;
s6: the probe is lightly placed on the solder, lifted but the solder is not completely separated from the lower surface of the probe, and then pressed and fixed on the upper surface of the bolt.
The invention has the advantages that: the invention has the advantages of less processing steps, low processing difficulty, greatly reduced production cost, suitability for bolts of various types, no damage to the strength of the bolt, high detection precision and contribution to mass production and popularization.
Drawings
FIG. 1 is an isometric schematic view of the present invention;
FIG. 2 is a cross-sectional block diagram of the probe of the present invention;
FIG. 3 is a schematic view of a groove of the present invention;
in the figure, 1, bolt; 2. a probe; 3. a sheath; 4. a contact; 5. a wafer; 6. mounting grooves; 7. a through hole; 8. a void; 9. a damping layer; 10. a groove; 11. and (7) welding the layers.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1-3, the welding probe includes a sheath 3, a contact 4 and a wafer 5, the sheath 3 is further provided with a mounting groove 6 and a through hole 7, the wafer 5 is clamped into the mounting groove 6, an insulating film is arranged on the upper surface of the wafer 5 and the sheath 3, the insulating film is used for insulating and fixedly connecting the upper surface of the wafer 5 and the sheath 3, the contact 4 is located in the through hole 7, the contact 4 is fixedly connected with the wafer 5, a gap 8 is formed between the contact 4 and the sheath 3, a damping layer 9 used for insulating the contact 4 and the sheath 3 is filled in the gap 8, the upper surface of the wafer 5 is in conductive connection with the contact 4, and the lower surface of the wafer 5 is in.
In more detail, the wafer 5 is fixedly connected with the contact 4 by welding. By adopting the structure, the wafer 5 and the contact 4 can be effectively fixed, and meanwhile, the wafer 5 and the contact 4 are in conductive connection, so that the welding operation difficulty is low, and the cost is low.
More specifically, the damping layer 9 is made of a jelly-like material, and the insulating film is made of a jelly-like material. The jelly with a specific model can ensure firmness and insulation, is simple to operate and cannot damage parts.
To put it more in detail, the bottom surface of the die 5 is recessed in the bottom surface of the sheath 3 and forms a solder receiving recess 10 with the side wall of the sheath 3 to receive more solder.
To be more specific, in order to enhance the waterproof performance, a waterproof film is further included, and the waterproof film completely covers the upper surface of the damping layer 9.
A welded type intelligent bolt 1 comprises a bolt 1 and the welded type probe, wherein the upper surface of the bolt 1 is fixedly connected with the bottom surface of the probe 2 through a welding layer 11.
More specifically, the probe 2 is disposed coaxially with the bolt 1.
To be more specific, a welding layer 11 is also provided between the outer wall of the probe 2 and the surface of the bolt 1 in order to fix the probe 2 more firmly.
A welding type probe assembling process is characterized by comprising the following steps:
s1: the upper surface of the wafer 5 is welded with the bottom surface of the contact 4;
s2: the mounting groove 6 is internally coated with jelly, the wafer 5 is clamped into the mounting groove 6, and the contact 4 enters the through hole 7;
s3: a gap 8 between the contact 4 and the sheath 3 is filled with a damping layer 9, and the damping layer 9 is kept flush with the upper surface of the sheath 3;
s4: after the damping layer 9 is cured, the upper surfaces of the damping layer 9 and the sheath 3 are covered with a waterproof film to expose the contacts 4.
In further detail, the method also comprises the following steps:
s5: placing soldering tin on the upper surface of the bolt 1, and heating to melt the soldering tin;
s6: the probe 2 is lightly placed on the solder, lifted up but the solder is not completely separated from the lower surface of the probe 2, and then pressed and fixed to the upper surface of the bolt 1. This step allows the grooves 10 in the bottom of the wafer 5 to be glued with more solder, making the soldering more robust.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Although the terms bolt 1, probe 2, sheath 3, contact 4, wafer 5, mounting slot 6, through hole 7, void 8, damping layer 9, groove 10, solder layer 11, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

Claims (10)

1. A welding probe is characterized by comprising a sheath (3), a contact (4) and a wafer (5), the sheath (3) is also provided with an installation groove (6) and a through hole (7), the wafer (5) is clamped in the mounting groove (6), the upper surface of the wafer (5) and the sheath (3) are provided with insulating films, the insulating film is used for insulating and fixedly connecting the upper surface of the wafer (5) with the sheath (3), the contact (4) is positioned in the through hole (7), the contact (4) is fixedly connected with the wafer (5), a gap (8) is arranged between the contact (4) and the sheath (3), the gap (8) is filled with a damping layer (9) for insulating the contact (4) and the sheath (3), the upper surface of the wafer (5) is in conductive connection with the contact (4), and the lower surface of the wafer (5) is in conductive connection with the sheath (3).
2. A welding probe according to claim 1, characterised in that the wafer (5) is secured to the contact (4) by welding.
3. A welding probe according to claim 1, in which the damping layer (9) is a gel and the insulating film is a gel.
4. A welding probe according to claim 1, characterised in that the bottom surface of the die (5) is recessed in the bottom surface of the sheath (3) and forms with the side walls of the sheath (3) a recess (10) for receiving solder.
5. A welding probe according to claim 1, further comprising a waterproof membrane completely covering the upper surface of the damping layer (9).
6. A welded intelligent bolt, characterized by comprising a bolt (1) and a welded probe (2) according to any one of claims 1-5, wherein the upper surface of the bolt (1) is fixedly connected with the bottom surface of the probe (2) through a welding layer (11).
7. A welded smart bolt according to claim 6, wherein the probe (2) is arranged coaxially with the bolt (1).
8. A welded smart bolt according to claim 6, wherein a weld layer (11) is also provided between the outer wall of the probe (2) and the bolt surface.
9. A welding type probe assembling process is characterized by comprising the following steps:
s1: the upper surface of the wafer (5) is welded with the bottom surface of the contact (4);
s2: the mounting groove (6) is internally coated with jelly, the wafer (5) is clamped into the mounting groove (6), and the contact (4) enters the through hole (7);
s3: a gap (8) between the contact (4) and the sheath (3) is filled with a damping layer (9), and the damping layer (9) is kept flush with the upper surface of the sheath (3);
s4: after the damping layer (9) is cured, the upper surface of the damping layer (9) is covered with a waterproof film, and the contact (4) is exposed.
10. A welding-type probe assembly process as claimed in claim 9 further comprising the steps of:
s5: placing soldering tin on the upper surface of the bolt (1), and heating to melt the soldering tin;
s6: the probe (2) is lightly placed on the soldering tin, the soldering tin is lifted but is not completely separated from the lower surface of the probe (2), and then the probe is pressed and fixed on the upper surface of the bolt (1).
CN201910426820.XA 2019-05-17 2019-05-17 Welding type probe, intelligent bolt and assembly process of intelligent bolt Pending CN111103077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910426820.XA CN111103077A (en) 2019-05-17 2019-05-17 Welding type probe, intelligent bolt and assembly process of intelligent bolt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910426820.XA CN111103077A (en) 2019-05-17 2019-05-17 Welding type probe, intelligent bolt and assembly process of intelligent bolt

Publications (1)

Publication Number Publication Date
CN111103077A true CN111103077A (en) 2020-05-05

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101526504A (en) * 2008-02-19 2009-09-09 通用电气公司 Fastener with a weld ultrasonic mounting a stress transducer
CN103901113A (en) * 2014-03-25 2014-07-02 常州市常超电子研究所有限公司 Ultrasonic diffraction probe
CN109341911A (en) * 2018-10-10 2019-02-15 中国商用飞机有限责任公司 Load detection device
CN109406036A (en) * 2018-12-04 2019-03-01 长沙飚能信息科技有限公司 Monitor the system and method for wind-driven generator bolt fastening stress on-line

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101526504A (en) * 2008-02-19 2009-09-09 通用电气公司 Fastener with a weld ultrasonic mounting a stress transducer
CN103901113A (en) * 2014-03-25 2014-07-02 常州市常超电子研究所有限公司 Ultrasonic diffraction probe
CN109341911A (en) * 2018-10-10 2019-02-15 中国商用飞机有限责任公司 Load detection device
CN109406036A (en) * 2018-12-04 2019-03-01 长沙飚能信息科技有限公司 Monitor the system and method for wind-driven generator bolt fastening stress on-line

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Address after: Room 301-302, Building 3, No. 258 Xiqin Street, Wuchang Street, Yuhang District, Hangzhou City, Zhejiang Province, 310023

Applicant after: Hangzhou Jianwei Technology Co.,Ltd.

Address before: 310000 Room 502, 5 / F, building 2, 768 Jingchang Road, Wuchang Street, Yuhang District, Hangzhou City, Zhejiang Province

Applicant before: HANGZHOU JIANWEI MECHANICAL & ELECTRICAL TECHNOLOGY Co.,Ltd.