CN210304357U - A point gum machine constructs for semiconductor chip production - Google Patents
A point gum machine constructs for semiconductor chip production Download PDFInfo
- Publication number
- CN210304357U CN210304357U CN201920996207.7U CN201920996207U CN210304357U CN 210304357 U CN210304357 U CN 210304357U CN 201920996207 U CN201920996207 U CN 201920996207U CN 210304357 U CN210304357 U CN 210304357U
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- Prior art keywords
- sleeve
- pipe
- sliding block
- semiconductor chip
- sleeve pipe
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 210000001503 joint Anatomy 0.000 claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 2
- 230000009471 action Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a glue dispensing mechanism for semiconductor chip production, including sliding block, communicating pipe and butt joint pipe, communicating pipe fixed mounting is in the lower extreme surface intermediate position of sliding block, the bottom movable mounting of sliding block has first sleeve pipe, one side movable mounting that the bottom of sliding block is close to first sleeve pipe has the second sleeve pipe, second sleeve pipe and first sleeve pipe are through-connected through pipe box and communicating pipe, the first sleeve pipe is all fixed with the point and is glued the drip nozzle with the lower extreme surface of second sleeve pipe, and first sleeve pipe and the one end surface of second sleeve pipe are all fixed with the spacing ring, the inboard embedding of spacing ring has a plurality of groups of balls; the utility model discloses a setting of first sleeve pipe, second sleeve pipe and fastening snap ring makes the utility model discloses well point gum machine that is used for semiconductor chip production constructs has the point and glues interval regulation structure, increases the flexibility ratio when it uses, makes it have supplementary fixed knot to construct simultaneously, increases its security, and is comparatively practical.
Description
Technical Field
The utility model belongs to the technical field of the point gum machine constructs, a point gum machine of semiconductor chip production constructs is related to, specifically is a point gum machine constructs for semiconductor chip production.
Background
The glue dispensing mechanism for semiconductor chip production is a device for dispensing and fixing the semiconductor chip during the semiconductor chip production process, and can simplify the operation steps of dispensing the semiconductor chip through the glue dispensing mechanism.
The comparative document CN202238510U discloses a dispensing mechanism, which comprises a dispensing arm, a dispensing needle and a driving mechanism, wherein the driving mechanism comprises a base, a rotating motor, an eccentric shaft, a slider seat and a linear guide rail, a protruding rotating shaft is arranged on the base, and the slider seat is rotatably mounted on the rotating shaft; a linear sliding block is fixedly arranged on the sliding block seat; the rotating electrical machines is fixed on the base, eccentric shaft connection the rotating electrical machines's power output shaft, with the utility model discloses compare, it does not have the point and glues interval adjustment structure, has reduced the flexibility ratio when it uses.
However, the existing glue dispensing mechanism for semiconductor chip production has certain disadvantages when in use, and the drip nozzles of the traditional glue dispensing mechanism for semiconductor chip production are of an integrated fixed structure, so that a user cannot randomly adjust the drip nozzle spacing of the glue dispensing mechanism according to the size of a semiconductor chip, and the flexibility of the glue dispensing mechanism in use is reduced; meanwhile, the traditional drip nozzle of the glue dispensing mechanism for semiconductor chip production does not have an auxiliary fixing structure, so that the phenomenon of looseness of the connecting pipe after butt joint is easy to occur, the safety is poor, and certain inconvenience is brought to a user.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problem that the drip nozzles of the dispensing mechanism used for the semiconductor chip production are of an integrated fixed structure, so that a user can not freely adjust the drip nozzle spacing of the dispensing mechanism according to the different sizes of the semiconductor chips, and the flexibility of the dispensing mechanism in use is reduced; meanwhile, the traditional glue dripping nozzle of the glue dripping mechanism for producing the semiconductor chip is not provided with an auxiliary fixing structure, so that the phenomenon of looseness is easy to occur after the connecting pipe is butted, and the safety is poor.
The purpose of the utility model can be realized by the following technical scheme:
a glue dispensing mechanism for semiconductor chip production comprises a sliding block, a communicating pipe and a butt joint pipe, wherein the communicating pipe is fixedly arranged at the middle position of the outer surface of the lower end of the sliding block, the bottom of the sliding block is movably provided with a first sleeve, the bottom of the sliding block is movably provided with a second sleeve close to one side of the first sleeve, the second sleeve is communicated and connected with the first sleeve through a pipe sleeve and the communicating pipe, the outer surface of the lower end of the first sleeve and the outer surface of the lower end of the second sleeve are fixedly provided with glue dispensing drip nozzles, the outer surface of one end of the first sleeve and the outer surface of one end of the second sleeve are fixedly provided with a limiting ring, the inner side of the limiting ring is embedded with a plurality of groups of balls, one side of the limiting ring is fixedly sleeved and connected with a sealing gasket ring, the butt joint pipe is fixedly arranged at the front part of the sliding block, the outer surface of the butt joint pipe is fixedly provided with a fixed snap ring close to the upper part of the fastening snap ring, and the outer surface of the upper end of the butt joint pipe is fixedly provided with a butt joint clamping mouth.
Furthermore, the cross section structure of the butt joint clamping mouth is an isosceles trapezoid structure, and the inner side of the upper part of the butt joint clamping mouth is provided with a circular notch in a penetrating mode.
Further, the second sleeve pipe all is equipped with the arc notch with first sheathed tube surface, it is fixed through the screw thread butt joint between communicating pipe and the sliding block.
Furthermore, the movable sliding rod is movably sleeved on the inner side of the sliding block, the sliding block and the movable sliding rod are fixedly connected in a butt joint mode through a sliding groove, and two groups of limiting clamping bolts are fixedly mounted on the outer surface of the upper end of the movable sliding rod.
Furthermore, the outer surface of the lower end of the dispensing dripping nozzle is fixedly provided with a dripping cap, and the inner sides of the second sleeve and the first sleeve are both of cylindrical hollow structures.
Furthermore, the diameter of the cross section of the limiting ring is larger than that of the cross section of the sealing gasket ring, and the outer surface of the fixing clamping ring is of an arc-shaped structure.
The utility model has the advantages that: the utility model discloses a set up first sleeve pipe and second sleeve pipe, utilize the extending structure of first sleeve pipe and second sleeve pipe, through outwards spurting first sleeve pipe and second sleeve pipe, make first sleeve pipe and second sleeve pipe take out from the pipe box of feeding takeover bottom, the ball through the spacing ring can reduce the frictional force when first sleeve pipe and second sleeve pipe are taken out, the spacing ring plays spacing fixed action to first sleeve pipe and second sleeve pipe simultaneously, the sealed backing ring can make first sleeve pipe and second sleeve pipe keep the encapsulated situation after removing, avoid it to appear the weeping phenomenon, can adjust the interval between two sets of point glue drip nozzles through first sleeve pipe and second sleeve pipe after removing, thereby make this point gum machine can be suitable for the semiconductor chip of different models, increase its application scope;
through the setting of fastening snap ring, when the user carries out the pipe connection operation through the butt joint pipe, utilize the butt joint bayonet catch on butt joint pipe top, through its inclined plane structure, resistance when can reducing the pipeline and insert, simultaneously after the pipeline inserts, rotate the fastening snap ring, can fix it with pipeline outer wall card between fastening snap ring and fixed snap ring for this point gum mechanism has supplementary fixed knot to construct, increases its security, convenient to use.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an overall structure of the butt joint pipe of the present invention;
fig. 3 is an overall structure diagram of the first sleeve of the present invention.
In the figure: 1. dispensing a drop nozzle; 2. a first sleeve; 3. a communicating pipe; 4. a feeding pipe connection; 5. fastening the snap ring; 6. a limiting clamping bolt; 7. a sliding groove; 8. butting the clamping mouths; 9. a slider; 10. moving the sliding rod; 11. butt-joint pipes; 12. a second sleeve; 13. fixing the snap ring; 14. a circular notch; 15. an arc-shaped notch; 16. a sealing gasket ring; 17. a limiting ring; 18. and a ball.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1-3, a dispensing mechanism for semiconductor chip production comprises a sliding block 9, a communicating tube 3 and a butt joint tube 11, the communicating tube 3 is fixedly installed at the middle position of the outer surface of the lower end of the sliding block 9, a first sleeve 2 is movably installed at the bottom of the sliding block 9, a second sleeve 12 is movably installed at one side of the bottom of the sliding block 9 close to the first sleeve 2, the sliding block 9 can perform transverse movement operation on the dispensing mechanism to enable the dispensing mechanism to move more conveniently, the second sleeve 12 is connected with the first sleeve 2 through a sleeve and the communicating tube 3, dispensing nozzles 1 are fixedly installed on the outer surfaces of the lower ends of the first sleeve 2 and the second sleeve 12, a limiting ring 17 is fixedly installed on the outer surface of one end of the first sleeve 2 and the second sleeve 12, a plurality of groups of balls 18 are embedded in the inner side of the limiting ring 17, a sealing gasket ring 16 is fixedly sleeved on one side, the sealing gasket ring 16 can promote the leakproofness of the limiting ring 17, the butt joint pipe 11 is fixedly installed on the front portion of the sliding block 9, the butt joint pipe 11 and the sliding block 9 are connected in a penetrating mode through the feeding connecting pipe 4, the fastening clamping ring 5 is sleeved on the outer surface of the butt joint pipe 11 in a movable mode, the fixed clamping ring 13 is fixedly installed on the upper portion, close to the fastening clamping ring 5, of the outer surface of the butt joint pipe 11, and the butt joint clamping mouth 8 is fixedly installed on the outer surface of the upper end of the butt.
The cross section structure of butt joint bayonet catch 8 is isosceles trapezoid structure, and the upper portion inboard of butt joint bayonet catch 8 runs through and has seted up circular notch 14, utilizes butt joint bayonet catch 8 can reduce the resistance when the pipeline docks.
The inboard activity of sliding block 9 has cup jointed and has moved slide bar 10, and through sliding tray 7 butt joint fixed between sliding block 9 and the removal slide bar 10, the outer fixed surface of the upper end of removing slide bar 10 installs two sets of spacing bolts 6, and spacing bolt 6 can play spacing fixed action to removing slide bar 10, increases its security.
The outer fixed surface of the lower end of the dispensing nozzle 1 is provided with a dispensing cap, the inner sides of the second sleeve 12 and the first sleeve 2 are both cylindrical hollow structures, and the dispensing mechanism is provided with an interval adjusting structure through the second sleeve 12 and the first sleeve 2, so that the dispensing mechanism is more flexible to use.
The cross section diameter of spacing ring 17 is greater than the cross section diameter of seal gasket ring 16, and the surface of fixed snap ring 13 is the arc structure, and seal gasket ring 16 can promote the leakproofness of spacing ring 17, avoids it to appear the weeping phenomenon.
A glue dispensing mechanism for semiconductor chip production, when using, the user uses the butt joint pipe 11 to connect the material pipe, so that the glue enters the feeding connection pipe 4 through the butt joint pipe 11, the glue flows into the first sleeve 2 and the second sleeve 12 from the connection pipe 3, flows out from the glue dispensing nozzle 1, moves the slide block 9 through the movable slide bar 10, drives the glue dispensing nozzle 1, makes the glue dispensing nozzle 1 stick on the semiconductor chip, carries on glue dispensing operation, through setting the first sleeve 2 and the second sleeve 12, uses the telescopic structure of the first sleeve 2 and the second sleeve 12, through pulling the first sleeve 2 and the second sleeve 12 outwards, makes the first sleeve 2 and the second sleeve 12 draw out from the pipe sleeve at the bottom of the feeding connection pipe 4, can reduce the friction force when the first sleeve 2 and the second sleeve 12 draw out through the ball 18 of the spacing ring 17, at the same time the spacing ring 17 plays a spacing fixing role for the first sleeve 2 and the second sleeve 12, the sealing gasket ring 16 can make the first sleeve 2 and the second sleeve 12 keep a sealing state after moving, avoid the liquid seepage phenomenon to occur, the first sleeve 2 and the second sleeve 12 after moving can adjust the distance between two sets of glue dispensing drip nozzles 1, thereby make this glue dispensing mechanism be suitable for the semiconductor chip of different models, increase its application scope, setting through fastening snap ring 5, when the user carries out the pipe connection operation through the butt joint pipe 11, utilize the butt joint bayonet 8 on butt joint pipe 11 top, through its inclined plane structure, resistance when the pipeline inserts can be reduced, simultaneously after the pipeline inserts, rotate fastening snap ring 5, can be with pipeline outer wall card between fastening snap ring 5 and fixed snap ring 13, fix it, make this glue dispensing mechanism have supplementary fixed knot structure, increase its security, high durability and convenient use.
The foregoing is merely exemplary and illustrative of the structure of the invention, and various modifications, additions and substitutions as described in the detailed description may be made by those skilled in the art without departing from the structure or exceeding the scope of the invention as defined in the claims.
Claims (6)
1. The glue dispensing mechanism for semiconductor chip production is characterized by comprising a sliding block (9), a communicating pipe (3) and a butt joint pipe (11), wherein the communicating pipe (3) is fixedly arranged at the middle position of the outer surface of the lower end of the sliding block (9), a first sleeve (2) is movably arranged at the bottom of the sliding block (9), a second sleeve (12) is movably arranged at one side, close to the first sleeve (2), of the bottom of the sliding block (9), the second sleeve (12) is communicated with the first sleeve (2) through a sleeve and the communicating pipe (3), glue dispensing nozzles (1) are fixedly arranged on the outer surfaces of the lower ends of the first sleeve (2) and the second sleeve (12), and a limiting ring (17) is fixedly arranged on the outer surfaces of one ends of the first sleeve (2) and the second sleeve (12);
the inboard embedding of spacing ring (17) has a plurality of groups ball (18), fixed the having cup jointed sealing gasket ring (16) in one side of spacing ring (17), connect pipe (11) fixed mounting in the front portion of sliding block (9), and connect through feeding takeover (4) through-connection between pipe (11) and sliding block (9), fastening snap ring (5) have been cup jointed to the surface activity of connecting pipe (11), the upper portion fixed mounting that the surface of connecting pipe (11) is close to fastening snap ring (5) has fixed snap ring (13), the upper end fixed surface of connecting pipe (11) installs butt joint bayonet catch (8).
2. The glue dispensing mechanism for semiconductor chip production according to claim 1, wherein the cross-sectional structure of the butt joint nozzle (8) is an isosceles trapezoid structure, and a circular notch (14) is formed through the inner side of the upper part of the butt joint nozzle (8).
3. The glue dispensing mechanism for semiconductor chip production according to claim 1, wherein the outer surfaces of the second sleeve (12) and the first sleeve (2) are provided with arc-shaped notches (15), and the communicating pipe (3) and the sliding block (9) are fixed in a butt joint manner through threads.
4. The glue dispensing mechanism for semiconductor chip production according to claim 1, wherein a moving slide rod (10) is movably sleeved on the inner side of the slide block (9), the slide block (9) and the moving slide rod (10) are fixed in a butt joint mode through a slide groove (7), and two groups of limiting clamping bolts (6) are fixedly installed on the outer surface of the upper end of the moving slide rod (10).
5. The glue dispensing mechanism for semiconductor chip production according to claim 1, wherein a dispensing cap is fixedly mounted on the outer surface of the lower end of the glue dispensing nozzle (1), and the inner sides of the second sleeve (12) and the first sleeve (2) are both cylindrical hollow structures.
6. The glue dispensing mechanism for semiconductor chip production according to claim 1, wherein the cross-sectional diameter of the limiting ring (17) is larger than that of the gasket ring (16), and the outer surface of the fixing snap ring (13) is of an arc structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920996207.7U CN210304357U (en) | 2019-06-28 | 2019-06-28 | A point gum machine constructs for semiconductor chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920996207.7U CN210304357U (en) | 2019-06-28 | 2019-06-28 | A point gum machine constructs for semiconductor chip production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210304357U true CN210304357U (en) | 2020-04-14 |
Family
ID=70147437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920996207.7U Expired - Fee Related CN210304357U (en) | 2019-06-28 | 2019-06-28 | A point gum machine constructs for semiconductor chip production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210304357U (en) |
-
2019
- 2019-06-28 CN CN201920996207.7U patent/CN210304357U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200414 |