CN210296303U - Wafer glue homogenizing equipment in semiconductor photoetching process - Google Patents
Wafer glue homogenizing equipment in semiconductor photoetching process Download PDFInfo
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- CN210296303U CN210296303U CN201920058630.2U CN201920058630U CN210296303U CN 210296303 U CN210296303 U CN 210296303U CN 201920058630 U CN201920058630 U CN 201920058630U CN 210296303 U CN210296303 U CN 210296303U
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000008569 process Effects 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 239000003292 glue Substances 0.000 title abstract description 10
- 238000001259 photo etching Methods 0.000 title abstract description 5
- 238000004528 spin coating Methods 0.000 claims abstract description 12
- 238000001459 lithography Methods 0.000 claims abstract description 11
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a wafer lithography technology field just discloses a wafer spin coating equipment among semiconductor lithography technology. The wafer glue homogenizing equipment in the semiconductor photoetching process comprises a workbench, wherein the upper surface of the workbench comprises a supporting plate, an annular groove, a fixing plate, an electric push rod, a sliding groove, a sliding rod, a sliding block, a positioning block, a connecting rod, a connecting plate, a rotating shaft, a supporting rod, a baffle plate and a feeding hole, the annular groove is formed in the surface of the supporting plate, the inner wall of the annular groove is in sliding connection with the inner wall of the fixing plate, and the bottom of the fixing plate is fixedly connected with the upper surface of the electric push rod. This wafer spin coating equipment in semiconductor lithography process fixes the wafer in backup pad center department through the locating piece, and the center of backup pad and the center of feed inlet can drip glue in wafer center department through the feed inlet in same vertical plane, prevent when spin coating, not drip the accurate in wafer center department of gluing, lead to gluing the problem of unable even distribution on the wafer easily.
Description
Technical Field
The utility model relates to a wafer lithography technology field specifically is a wafer spin coating equipment among semiconductor lithography process.
Background
The photoetching process comprises the steps of wafer photoresist homogenizing, prebaking, exposure, developing, film hardening, corrosion, photoresist removing and the like, wherein a motor is generally adopted to drive the wafer adsorbed on a vacuum chuck to rotate during photoresist homogenizing, so that the photoresist is uniformly distributed on the wafer under the action of centrifugal force, and if the photoresist is not accurately dripped at the center of the wafer during photoresist homogenizing, the photoresist is easily incapable of being uniformly distributed on the wafer.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a wafer spin coating equipment in semiconductor lithography process possesses the advantage such as the location of being convenient for, has solved when spin coating, will not glue accurate dripping in wafer center department, leads to gluing the problem of unable even distribution on the wafer easily.
(II) technical scheme
In order to realize the above positioning purpose, the utility model provides a following technical scheme: a wafer glue homogenizing device in a semiconductor photoetching process comprises a workbench, wherein the upper surface of the workbench comprises a supporting plate, an annular groove, a fixing plate, an electric push rod, a sliding groove, a sliding rod, a sliding block, a positioning block, a connecting rod, a connecting plate, a rotating shaft, a supporting rod, a baffle plate and a feeding hole, the annular groove is formed in the surface of the supporting plate, the inner wall of the annular groove is in sliding connection with the inner wall of the fixing plate, the bottom of the fixing plate is fixedly connected with the upper surface of the electric push rod, the sliding groove is formed in the upper surface of the supporting plate, one side, close to the center of the supporting plate, of the sliding rod is fixedly connected with one side, close to the center of the supporting plate, of the inner wall of the sliding groove, one side, far away from the center of the supporting plate, of the sliding rod is fixedly, the upper surface of slider and the bottom fixed connection of locating piece, the bottom of locating piece and the upper surface sliding connection of backup pad, the inner wall of slider is articulated through the top of round pin axle with the connecting rod, the bottom of connecting rod is articulated through the inner wall of round pin axle with the connecting plate, the inner wall of connecting plate and the surperficial top fixed connection of pivot, the surperficial bottom of pivot is through the inner wall fixed connection of bearing with the workstation, the upper surface of fixed plate and the bottom fixed connection of bracing piece, the top of bracing piece and the bottom fixed connection of baffle, the feed inlet is located the upper surface of baffle and sets up.
The utility model discloses a rotary table, including workstation, fixed sleeve, driving motor, shaft coupling and pivot, the bottom of workstation includes supporting leg, fixed sleeve and driving motor, the bottom of supporting leg and the bottom fixed connection of workstation, the bottom and the fixed sleeve's of workstation top fixed connection, fixed sleeve's inner wall and driving motor's fixed surface are connected, driving motor's output passes through the bottom fixed connection of shaft coupling and pivot, the front of workstation includes control panel, control panel's the back and the positive fixed connection of workstation, control panel is connected with electric putter and driving motor electricity respectively.
Preferably, the surface top of pivot includes connecting sleeve, spread groove, connecting block and gas pocket, the inner wall bottom of connecting sleeve and the surface top sliding connection of pivot, the spread groove is located the inner wall bottom of connecting sleeve and sets up, the inner wall of spread groove and the surface sliding connection of connecting block, the connecting block is close to the one side of pivot and the surface top fixed connection of pivot, the gas pocket is located the surface top of connecting sleeve and sets up.
Preferably, the center of the support plate and the center of the feed inlet are in the same vertical plane, and the center of the support plate and the center of the rotating shaft are in the same vertical plane.
Preferably, the number of the positioning blocks is four, and the four positioning blocks are symmetrically distributed.
Preferably, the included angle range between one side of the connecting rod, which is far away from the center of the rotating shaft, and the horizontal plane is thirty degrees to eighty degrees.
Preferably, the inner wall of the fixing plate is circular, and the center of the fixing plate and the center of the supporting plate are in the same vertical plane.
Compared with the prior art, the utility model provides a wafer spin coating equipment in semiconductor lithography process possesses following beneficial effect:
1. this wafer spin coating equipment among semiconductor lithography process, through setting up the backup pad, the ring channel, the fixed plate, electric putter, the spout, the slide bar, the slider, the locating piece, the connecting rod, the connecting plate, the bracing piece, baffle and feed inlet, during spin coating, place the wafer in the backup pad, through control panel with electric putter, make the fixed plate rebound, make the distance increase between connecting plate and the backup pad, under the effect of connecting rod, make the locating piece to the one side removal that is close to the wafer, fix the wafer in backup pad center department through the locating piece, the center of backup pad and the center of feed inlet are in same vertical plane, can drip glue in wafer center department through the feed inlet, prevent when spin coating, not be with the accurate drip in wafer center department of gluing, lead to gluing the problem of unable even distribution on the wafer easily.
2. This wafer spin coating equipment in semiconductor lithography process, through setting up connecting sleeve, spread groove and connecting block, when the pivot rotates, makes connecting sleeve rotate under the effect of connecting block, and then drives the backup pad and rotate, when preventing to drive the backup pad through the connecting rod and rotate, makes the connecting rod bending fracture easily.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the point A in FIG. 1 according to the present invention;
FIG. 3 is an enlarged view of the point B in FIG. 1 according to the present invention;
FIG. 4 is a cross-sectional view taken at C-C of FIG. 1 in accordance with the present invention;
fig. 5 is a front view of the structure of the present invention.
Wherein: the device comprises a workbench 1, a supporting plate 2, an annular groove 3, a fixing plate 4, an electric push rod 5, a sliding groove 6, a sliding rod 7, a sliding block 8, a positioning block 9, a connecting rod 10, a connecting plate 11, a rotating shaft 12, a supporting rod 13, a baffle 14, a feeding hole 15, supporting legs 16, a fixing sleeve 17, a driving motor 18, a control panel 19, a connecting sleeve 20, a connecting groove 21, a connecting block 22 and an air hole 23.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, a wafer glue homogenizing device in semiconductor lithography process comprises a workbench 1, the upper surface of the workbench 1 comprises a supporting plate 2, an annular groove 3, a fixing plate 4, an electric push rod 5, a sliding chute 6, a sliding rod 7, a sliding block 8, a positioning block 9, a connecting rod 10, a connecting plate 11, a rotating shaft 12, a supporting rod 13, a baffle 14 and a feed inlet 15, the annular groove 3 is arranged on the surface of the supporting plate 2, the inner wall of the annular groove 3 is connected with the inner wall of the fixing plate 4 in a sliding manner, the inner wall of the fixing plate 4 is circular, the center of the fixing plate 4 and the center of the supporting plate 2 are in the same vertical plane, the supporting plate 2 and the fixing plate 4 are connected together under the action of the annular groove 3, the supporting plate 2 can freely rotate in the fixing plate 4, the bottom of the fixing plate 4 is fixedly connected with the upper, the upper surface of the supporting plate 2 is provided with a chute 6, one side of a sliding rod 7 close to the center of the supporting plate 2 is fixedly connected with one side of the inner wall of the chute 6 close to the center of the supporting plate 2, one side of the sliding rod 7 far away from the center of the supporting plate 2 is fixedly connected with one side of the inner wall of the chute 6 far away from the center of the supporting plate 2, the surface of the sliding rod 7 is slidably connected with the inner wall of a sliding block 8, the sliding rod 7 plays a role in guiding and supporting the sliding block 8, the surface of the sliding block 8 is slidably connected with the inner wall of the chute 6, the upper surface of the sliding block 8 is fixedly connected with the bottom of a positioning block 9, the bottom of the positioning block 9 is slidably connected with the upper surface of the supporting plate 2, the number of the positioning blocks 9 is four, the four positioning blocks 9 are symmetrically distributed, the inner wall of the sliding block 8 is hinged with the top of a connecting rod 10 through, the distance between the connecting plate 11 and the supporting plate 2 is increased or decreased, under the action of the connecting rod 10, the positioning block 9 is moved to one side close to the center of the supporting plate 2 or one side far away from the center of the supporting plate 2, the inner wall of the connecting plate 11 is fixedly connected with the top of the surface of the rotating shaft 12, the rotating shaft 12 rotates, the supporting plate 2 is driven to rotate through the connecting plate 11 and the connecting rod 10, the bottom of the surface of the rotating shaft 12 is fixedly connected with the inner wall of the workbench 1 through a bearing, the upper surface of the fixing plate 4 is fixedly connected with the bottom of the supporting rod 13, the top of the supporting rod 13 is fixedly connected with the bottom of the baffle 14, the feeding hole 15 is formed in the upper surface of the baffle 14, the center of the supporting plate 2 and the center.
The bottom of the workbench 1 comprises supporting legs 16, a fixing sleeve 17 and a driving motor 18, the bottom of the supporting legs 16 is fixedly connected with the bottom of the workbench 1, the bottom of the workbench 1 is fixedly connected with the top of the fixing sleeve 17, the inner wall of the fixing sleeve 17 is fixedly connected with the surface of the driving motor 18, the output end of the driving motor 18 is fixedly connected with the bottom of the rotating shaft 12 through a coupler, the front of the workbench 1 comprises a control panel 19, the back of the control panel 19 is fixedly connected with the front of the workbench 1, the control panel 19 is respectively electrically connected with the electric push rod 5 and the driving motor 18, the top of the surface of the rotating shaft 12 comprises a connecting sleeve 20, a connecting groove 21, a connecting block 22 and an air hole 23, the bottom of the inner wall of the connecting sleeve 20 is slidably connected with the top of the surface of the rotating shaft 12, the connecting groove 21 is arranged at the bottom of the inner, connecting block 22 is close to one side of pivot 12 and the surperficial top fixed connection of pivot 12, through setting up connecting sleeve 20, spread groove 21 and connecting block 22, when pivot 12 rotates, make connecting sleeve 20 rotate under connecting block 22's effect, and then drive backup pad 2 and rotate, when preventing only to drive backup pad 2 through connecting rod 10 and rotate, make connecting rod 10 bending fracture easily, the gas pocket 23 is located connecting sleeve 20's surperficial top and sets up, the inside and outside air of connecting sleeve 20 passes through the gas pocket 23 circulation.
When the wafer rotating device is used, a wafer is placed on the supporting plate 2, the electric push rod 5 is driven through the control panel 19, the fixing plate 4 moves upwards, the distance between the connecting plate 11 and the supporting plate 2 is increased, the positioning block 9 moves towards one side close to the wafer under the action of the connecting rod 10, the wafer is fixed at the center of the supporting plate 2 through the positioning block 9, the center of the supporting plate 2 and the center of the feed inlet 15 are in the same vertical plane, glue can be dripped at the center of the wafer through the feed inlet 15, then the driving motor 18 is opened through the control panel 19, the supporting plate 2 rotates under the driving of the rotating shaft 12, the wafer on the supporting plate 2 is further rotated, and the glue is uniformly distributed on the wafer under the action of centrifugal force.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a wafer spin coating equipment in semiconductor lithography process, includes workstation (1), the upper surface of workstation (1) includes backup pad (2), ring channel (3), fixed plate (4), electric putter (5), spout (6), slide bar (7), slider (8), locating piece (9), connecting rod (10), connecting plate (11), pivot (12), bracing piece (13), baffle (14) and feed inlet (15), its characterized in that: the surface of the annular groove (3) is positioned on the supporting plate (2) and is provided, the inner wall of the annular groove (3) is slidably connected with the inner wall of the fixing plate (4), the bottom of the fixing plate (4) is fixedly connected with the upper surface of the electric push rod (5), the sliding chute (6) is positioned on the upper surface of the supporting plate (2) and is provided, one side of the sliding rod (7) close to the center of the supporting plate (2) is fixedly connected with one side of the inner wall of the sliding chute (6) close to the center of the supporting plate (2), one side of the sliding rod (7) far away from the center of the supporting plate (2) is fixedly connected with one side of the inner wall of the sliding chute (6) far away from the center of the supporting plate (2), the surface of the sliding rod (7) is slidably connected with the inner wall of the sliding block (8), the surface of the sliding block (8) is slidably connected with the inner wall, the bottom of the positioning block (9) is connected with the upper surface of the supporting plate (2) in a sliding mode, the inner wall of the sliding block (8) is hinged to the top of the connecting rod (10) through a pin shaft, the bottom of the connecting rod (10) is hinged to the inner wall of the connecting plate (11) through a pin shaft, the inner wall of the connecting plate (11) is fixedly connected with the top of the surface of the rotating shaft (12), the bottom of the surface of the rotating shaft (12) is fixedly connected with the inner wall of the workbench (1) through a bearing, the upper surface of the fixing plate (4) is fixedly connected with the bottom of the supporting rod (13), the top of the supporting rod (13) is fixedly connected with the bottom of the baffle (14), and the feeding port (15) is formed in the upper surface of;
the bottom of workstation (1) includes supporting leg (16), fixed sleeve (17) and driving motor (18), the bottom of supporting leg (16) and the bottom fixed connection of workstation (1), the bottom of workstation (1) and the top fixed connection of fixed sleeve (17), the inner wall of fixed sleeve (17) and the fixed surface of driving motor (18) are connected, the output of driving motor (18) passes through the bottom fixed connection of shaft coupling with pivot (12), the front of workstation (1) includes control panel (19), the back of control panel (19) and the positive fixed connection of workstation (1), control panel (19) are connected with electric putter (5) and driving motor (18) electricity respectively.
2. The wafer track apparatus of claim 1, wherein: the surface top of pivot (12) includes connecting sleeve (20), spread groove (21), connecting block (22) and gas pocket (23), the inner wall bottom of connecting sleeve (20) and the surface top sliding connection of pivot (12), spread groove (21) are located the inner wall bottom of connecting sleeve (20) and are seted up, the inner wall of spread groove (21) and the surface sliding connection of connecting block (22), connecting block (22) are close to the surface top fixed connection of one side of pivot (12) and pivot (12), gas pocket (23) are located the surface top of connecting sleeve (20) and are seted up.
3. The wafer track apparatus of claim 1, wherein: the center of the support plate (2) and the center of the feed port (15) are in the same vertical plane, and the center of the support plate (2) and the center of the rotating shaft (12) are in the same vertical plane.
4. The wafer track apparatus of claim 1, wherein: the number of the positioning blocks (9) is four, and the four positioning blocks (9) are symmetrically distributed.
5. The wafer track apparatus of claim 1, wherein: the included angle range between one side of the connecting rod (10) far away from the center of the rotating shaft (12) and the horizontal plane is thirty degrees to eighty degrees.
6. The wafer track apparatus of claim 1, wherein: the inner wall of the fixing plate (4) is circular, and the center of the fixing plate (4) and the center of the supporting plate (2) are in the same vertical plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920058630.2U CN210296303U (en) | 2019-01-14 | 2019-01-14 | Wafer glue homogenizing equipment in semiconductor photoetching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920058630.2U CN210296303U (en) | 2019-01-14 | 2019-01-14 | Wafer glue homogenizing equipment in semiconductor photoetching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210296303U true CN210296303U (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920058630.2U Expired - Fee Related CN210296303U (en) | 2019-01-14 | 2019-01-14 | Wafer glue homogenizing equipment in semiconductor photoetching process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210296303U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151419A (en) * | 2020-09-15 | 2020-12-29 | 南京博纺瑞电子商务有限公司 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
| CN112791881A (en) * | 2020-12-28 | 2021-05-14 | 瑞安市智造科技有限公司 | Photoresist spray nozzle alignment positioning device |
-
2019
- 2019-01-14 CN CN201920058630.2U patent/CN210296303U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151419A (en) * | 2020-09-15 | 2020-12-29 | 南京博纺瑞电子商务有限公司 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
| CN112151419B (en) * | 2020-09-15 | 2021-05-18 | 简胜坚 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
| CN112791881A (en) * | 2020-12-28 | 2021-05-14 | 瑞安市智造科技有限公司 | Photoresist spray nozzle alignment positioning device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200410 |