CN112151419A - Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size - Google Patents
Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size Download PDFInfo
- Publication number
- CN112151419A CN112151419A CN202010968893.4A CN202010968893A CN112151419A CN 112151419 A CN112151419 A CN 112151419A CN 202010968893 A CN202010968893 A CN 202010968893A CN 112151419 A CN112151419 A CN 112151419A
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- swing joint
- chip size
- environmental protection
- movably connected
- protection equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to the technical field of electronic chip manufacturing, and discloses environment-friendly equipment capable of automatically adjusting glue homogenizing amount according to chip size. The elasticity of back release is used in the surface of liquid storage pipe, and then extrudes the colloid and flow out from the flexible tube, and because the weight of chip is fixed, so when elasticity was released to the elasticity pipe, also can promote the extension of current-limiting rod and extrude the flexible tube gradually, so reached according to the effect of chip size automatic control colloid volume.
Description
Technical Field
The invention relates to the technical field of electronic chip manufacturing, in particular to environment-friendly equipment capable of automatically adjusting glue homogenizing amount according to the size of a chip.
Background
The electronic chip is formed by placing a large number of integrated circuits formed by microelectronic components on a plastic substrate; the IC chip comprises a wafer chip and a packaging chip, wherein the installation of the chip needs to use special colloid for adhesion, and the quality of the colloid adhesion can influence the working performance of the manufactured chip to a certain extent.
The prior art often adopts dedicated bonding equipment to the bonding of colloid, and this kind of equipment is though can drop the colloid ration on specific position, but its mechanism that realizes the ration needs to use computer programming, so when the size of chip changed to some extent, need professional to reprogram, wastes time and energy, therefore a environmental protection equipment who adjusts even volume of gluing according to chip size comes into existence soon.
Disclosure of Invention
In order to realize the purpose of automatically controlling the amount of the glue according to the size of the chip and drying the glue without transferring the glue after gluing, the invention provides the following technical scheme: the utility model provides an environmental protection equipment according to chip size self-interacting even volume of gluing, comprising a base plate, the fixed surface of bottom plate is connected with the back shaft, the surperficial swing joint of back shaft has the movable rod, the one end swing joint that the back shaft was kept away from to the movable rod has the arc, the surperficial swing joint of back shaft has buffer spring, buffer spring's surperficial swing joint has the bearing frame, the equal swing joint in both sides of bearing frame has the limiting plate, the inside swing joint of bearing frame has the screw rod, the surperficial swing joint of screw rod has the flabellum, the fixed surface of bearing frame is connected with the bearing plate, the inside swing joint of arc has the elastic tube, the.
The invention has the beneficial effects that:
1. by placing the chip to be glued on the surface of the carrier plate, which chip has a certain weight, it will act on the surface of the carrier, then acts on the surface of the buffer spring, the rear buffer spring deforms and contracts and acts on the surface of the supporting shaft, the rear supporting shaft moves to drive the movable rod to deflect towards the direction close to the screw rod, and in the deflection process of the movable rod, the arc-shaped plate can gradually contact with the bottom of the chip, and when the arc-shaped plate and the chip are contacted, the chip can react to a certain force on the surface of the return spring, further triggering the compression force of the elastic tube in the initial state, the elastic force released later acts on the surface of the liquid storage tube, and then the extrusion colloid flows out of the flexible pipe, and because the weight of the chip is fixed, when the elastic pipe releases the elastic force, the flow-limiting rod is pushed to extend and gradually extrude the flexible pipe, so that the effect of automatically controlling the amount of the glue according to the size of the chip is achieved.
2. Through the chip effect at the certain power of bearing plate surface, the deformation of back extrusion buffer spring, and can mesh the screw rod at the in-process of buffer spring deformation and rotate, the screw rod rotates and can drive the flabellum rotatory, and back flabellum rotation produces the wind-force, and wind-force blows on the rubber coating position of chip, so reached need not to shift alright air-dried effect after the rubber coating.
Preferably, the surface of the flow limiting rod is movably connected with a flexible pipe, and the lower end of the flexible pipe is movably connected with the liquid storage tank.
Preferably, the inner top wall of the arc-shaped plate is movably connected with two return springs.
Preferably, the connection part of the elastic pipe and the liquid storage tank is movably connected with a detention layer.
Preferably, the surface of the elastic tube is fixedly connected with a uniform pressure rod, and the uniform pressure rod is made of plastic elastic materials.
Preferably, the inside of the limiting plate is movably connected with an extending frame, and the surface of the extending frame is movably connected with a hydraulic rod.
Drawings
FIG. 1 is a front view of the movable bar construction of the present invention;
FIG. 2 is a schematic diagram of a limiting plate according to the present invention;
FIG. 3 is a schematic view of a stagnant layer structure of the present invention;
fig. 4 is a partially enlarged view of a portion a in fig. 3.
In the figure: 1. a base plate; 2. a support shaft; 3. a movable rod; 4. an arc-shaped plate; 5. a buffer spring; 6. a bearing frame; 7. a limiting plate; 8. a screw; 9. a fan blade; 10. a bearing plate; 11. an elastic tube; 12. a liquid storage tank; 13. a flow-restricting lever; 14. a flexible tube; 15. a return spring; 16. a retention layer; 17. a pressure equalizing rod; 18. an extension frame;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size comprises a bottom plate 1, a supporting shaft 2 is fixedly connected to the surface of the bottom plate 1, a movable rod 3 is movably connected to the surface of the supporting shaft 2, an arc-shaped plate 4 is movably connected to one end, far away from the supporting shaft 2, of the movable rod 3, a reset spring 15 is movably connected to the inner top wall of the arc-shaped plate 4, and the number of the reset springs 15 is two.
The surface of the supporting shaft 2 is movably connected with a buffer spring 5, the surface of the buffer spring 5 is movably connected with a bearing frame 6, two sides of the bearing frame 6 are movably connected with limiting plates 7, the interior of each limiting plate 7 is movably connected with an extending frame 18, and the surface of each extending frame 18 is movably connected with a hydraulic rod; by placing the chip to be glued on the surface of the bearing plate 10, because the chip has a certain weight, it will act on the surface of the bearing frame 6, and then act on the surface of the buffer spring 5, the back buffer spring 5 deforms and contracts and acts on the surface of the supporting shaft 2, the back supporting shaft 2 moves to drive the movable rod 3 to deflect towards the direction close to the screw rod 8, and in the deflection process of the movable rod 3, the arc plate 4 will gradually contact with the bottom of the chip, and when the two contact, the chip will react on a certain force on the surface of the return spring 15, and then trigger the compression force of the elastic tube 11 in the initial state, the magnitude of the elastic tube 11 releasing elastic force is in direct proportion to the pressure on the elastic tube, the elastic force of the back releasing acts on the surface of the liquid storage tube 12, and then the colloid flows out from the flexible tube 14, and because the weight of the chip is fixed, when the elastic tube 11 releasing elastic force, the flow-limiting rod 13 is pushed to extend and gradually press the flexible tube 14, so that the effect of automatically controlling the amount of the glue according to the size of the chip is achieved.
A screw rod 8 is movably connected inside the bearing frame 6, a fan blade 9 is movably connected on the surface of the screw rod 8, a bearing plate 10 is fixedly connected on the surface of the bearing frame 6, an elastic pipe 11 is movably connected inside the arc-shaped plate 4, a detention layer 16 is movably connected at the joint of the elastic pipe 11 and the liquid storage tank 12, and the detention layer 16 is used for detenting colloid limited by the current limiting rod 13; the surface of the elastic tube 11 is fixedly connected with a uniform pressure rod 17, the uniform pressure rod 17 is used for uniformly distributing the elastic force released by the elastic tube 11, and the uniform pressure rod 17 is made of plastic elastic material; act on the certain power in bearing plate 10 surface through the chip, the deformation of back extrusion buffer spring 5, and can mesh screw rod 8 at the in-process of buffer spring 5 deformation and rotate, and screw rod 8 rotates and can drive flabellum 9 rotatory, and the rotatory wind-force that produces of back flabellum 9, and wind-force blows on the rubber coating position of chip, so reached need not to shift alright air-dried effect after the rubber coating.
The surface of the elastic tube 11 is movably connected with a liquid storage tank 12, and the surface of the liquid storage tank 12 is movably connected with a flow limiting rod 13; the surface of the flow limiting rod 13 is movably connected with a flexible pipe 14, and the lower end of the flexible pipe 14 is movably connected with the liquid storage tank 12; the colloid in the liquid storage tank 12 can flow out of the flexible pipe 14 when the liquid storage tank is pressurized; the glue in the glue storage box 12 is Hansi underfill which can be used for chip IC pin protection, and the HS700 series underfill is a single-component and modified epoxy resin glue.
When the device is used, a chip to be glued is placed on the surface of the bearing plate 10, because the chip has a certain weight, the chip can act on the surface of the bearing frame 6 and further acts on the surface of the buffer spring 5, the rear buffer spring 5 deforms and contracts and acts on the surface of the supporting shaft 2, the rear supporting shaft 2 moves to drive the movable rod 3 to deflect towards the direction close to the screw rod 8, in the deflection process of the movable rod 3, the arc-shaped plate 4 can gradually contact with the bottom of the chip, when the arc-shaped plate 4 and the buffer spring are in contact, the chip can react a certain force on the surface of the reset spring 15, so that the compression force under the initial state of the elastic tube 11 is triggered, the later released elastic force acts on the surface of the liquid storage tube 12, and further the extrusion colloid flows out of the flexible tube 14, and because the weight of the chip is fixed, when the elastic tube 11 releases the elastic force, the current-limiting rod 13 can be pushed to extend and gradually extrude the, therefore, the effect of automatically controlling the amount of the glue according to the size of the chip is achieved.
Act on the certain power in bearing plate 10 surface through the chip, the deformation of back extrusion buffer spring 5, and can mesh screw rod 8 at the in-process of buffer spring 5 deformation and rotate, and screw rod 8 rotates and can drive flabellum 9 rotatory, and the rotatory wind-force that produces of back flabellum 9, and wind-force blows on the rubber coating position of chip, so reached need not to shift alright air-dried effect after the rubber coating.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (6)
1. The utility model provides an environmental protection equipment according to chip size self-interacting even volume of gluing, includes bottom plate (1), its characterized in that: the utility model discloses a bottom plate for the motor vehicle, including bottom plate (1), the surperficial fixedly connected with back shaft (2) of bottom plate (1), the surperficial swing joint of back shaft (2) has movable rod (3), the one end swing joint that back shaft (2) were kept away from in movable rod (3) has arc (4), the surperficial swing joint of back shaft (2) has buffer spring (5), the surperficial swing joint of buffer spring (5) has bearing frame (6), the equal swing joint in both sides of bearing frame (6) has limiting plate (7), the inside swing joint of bearing frame (6) has screw rod (8), the surperficial swing joint of screw rod (8) has flabellum (9), the surperficial fixedly connected with bearing plate (10) of bearing frame (6), the inside swing joint of arc (4) has elastic tube (11), the surperficial swing joint of elastic.
2. The environmental protection equipment for self-adjusting the glue leveling amount according to the chip size according to claim 1, characterized in that: the surface of the flow limiting rod (13) is movably connected with a flexible pipe (14), and the lower end of the flexible pipe (14) is movably connected with the liquid storage tank (12).
3. The environmental protection equipment for self-adjusting the glue leveling amount according to the chip size according to claim 1, characterized in that: the inner top wall of the arc-shaped plate (4) is movably connected with two return springs (15), and the number of the return springs (15) is two.
4. The environmental protection equipment for self-adjusting the glue leveling amount according to the chip size according to claim 1, characterized in that: the connection part of the elastic tube (11) and the liquid storage tank (12) is movably connected with a detention layer (16).
5. The environmental protection equipment for self-adjusting the glue leveling amount according to the chip size according to claim 1, characterized in that: the surface of the elastic tube (11) is fixedly connected with a uniform pressure rod (17), and the uniform pressure rod (17) is made of plastic elastic materials.
6. The environmental protection equipment for self-adjusting the glue leveling amount according to the chip size according to claim 1, characterized in that: the interior of the limiting plate (7) is movably connected with an extending frame (18), and the surface of the extending frame (18) is movably connected with a hydraulic rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010968893.4A CN112151419B (en) | 2020-09-15 | 2020-09-15 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010968893.4A CN112151419B (en) | 2020-09-15 | 2020-09-15 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112151419A true CN112151419A (en) | 2020-12-29 |
| CN112151419B CN112151419B (en) | 2021-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010968893.4A Expired - Fee Related CN112151419B (en) | 2020-09-15 | 2020-09-15 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
Country Status (1)
| Country | Link |
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| CN (1) | CN112151419B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112936628A (en) * | 2021-02-18 | 2021-06-11 | 广州缇舒贸易有限公司 | Wafer coating amount and wafer volume adapting equipment for manufacturing environment-friendly chips |
| CN112981762A (en) * | 2021-02-02 | 2021-06-18 | 徐忠新 | Intelligent fiber coating equipment capable of automatically adjusting coating amount |
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| US20010023137A1 (en) * | 1999-10-04 | 2001-09-20 | Gordon Brian F. | Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid deposition |
| US6767403B1 (en) * | 2000-11-15 | 2004-07-27 | Novellus Systems, Inc. | Spin bowl having fluid seal for preventing air from flowing into the bowl during spinning |
| CN103990574A (en) * | 2014-05-06 | 2014-08-20 | 大连橡胶塑料机械股份有限公司 | Precise adjusting device for roller gap of glue spreader |
| CN108682638A (en) * | 2018-05-21 | 2018-10-19 | 汤美侠 | A kind of diode lead sealing adhesive device |
| CN108766868A (en) * | 2018-05-29 | 2018-11-06 | 兰凤 | A kind of semiconductor silicon wafer spin coating system |
| CN110854015A (en) * | 2019-11-24 | 2020-02-28 | 冯聪 | Chip integrated manufacturing auxiliary equipment based on light pressure principle |
| CN210296303U (en) * | 2019-01-14 | 2020-04-10 | 河北光森电子科技有限公司 | Wafer glue homogenizing equipment in semiconductor photoetching process |
| CN211436852U (en) * | 2019-12-17 | 2020-09-08 | 成都迈科科技有限公司 | Spin coater |
-
2020
- 2020-09-15 CN CN202010968893.4A patent/CN112151419B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010023137A1 (en) * | 1999-10-04 | 2001-09-20 | Gordon Brian F. | Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid deposition |
| US6767403B1 (en) * | 2000-11-15 | 2004-07-27 | Novellus Systems, Inc. | Spin bowl having fluid seal for preventing air from flowing into the bowl during spinning |
| CN103990574A (en) * | 2014-05-06 | 2014-08-20 | 大连橡胶塑料机械股份有限公司 | Precise adjusting device for roller gap of glue spreader |
| CN108682638A (en) * | 2018-05-21 | 2018-10-19 | 汤美侠 | A kind of diode lead sealing adhesive device |
| CN108766868A (en) * | 2018-05-29 | 2018-11-06 | 兰凤 | A kind of semiconductor silicon wafer spin coating system |
| CN210296303U (en) * | 2019-01-14 | 2020-04-10 | 河北光森电子科技有限公司 | Wafer glue homogenizing equipment in semiconductor photoetching process |
| CN110854015A (en) * | 2019-11-24 | 2020-02-28 | 冯聪 | Chip integrated manufacturing auxiliary equipment based on light pressure principle |
| CN211436852U (en) * | 2019-12-17 | 2020-09-08 | 成都迈科科技有限公司 | Spin coater |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112981762A (en) * | 2021-02-02 | 2021-06-18 | 徐忠新 | Intelligent fiber coating equipment capable of automatically adjusting coating amount |
| CN112936628A (en) * | 2021-02-18 | 2021-06-11 | 广州缇舒贸易有限公司 | Wafer coating amount and wafer volume adapting equipment for manufacturing environment-friendly chips |
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| Publication number | Publication date |
|---|---|
| CN112151419B (en) | 2021-05-18 |
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Effective date of registration: 20210506 Address after: Room 107, No.39, shangxialou, Guanyang village, Meilin Town, Nanjing County, Zhangzhou City, Fujian Province 363600 Applicant after: Jian Shengjian Applicant after: Telong Kaifeng (Fujian) Environmental Protection Technology Co.,Ltd. Applicant after: Fujian jinfulai Technology Co.,Ltd. Address before: Room 759, 7th floor, Jiangning Science and technology financial center, 391 Tianyuan Road, Jiangning District, Nanjing City, Jiangsu Province, 211100 Applicant before: Nanjing bofangrui e-commerce Co.,Ltd. |
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Granted publication date: 20210518 |