CN210283623U - Chip detection device - Google Patents

Chip detection device Download PDF

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Publication number
CN210283623U
CN210283623U CN201920641407.0U CN201920641407U CN210283623U CN 210283623 U CN210283623 U CN 210283623U CN 201920641407 U CN201920641407 U CN 201920641407U CN 210283623 U CN210283623 U CN 210283623U
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chip
probe
test piece
substrate
needle
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CN201920641407.0U
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Chinese (zh)
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不公告发明人
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Guangzhou Zhongnuo Microelectronics Co ltd
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Guangzhou Zhono Electronic Technology Co ltd
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Priority to CN201920641407.0U priority Critical patent/CN210283623U/en
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Abstract

The utility model discloses a chip detection device, chip detection device includes: mould chip, wire and test piece, the wire with mould chip with the test piece is connected respectively, the test piece includes: the probe is arranged on the substrate; and parts of the probes extend out of the surface of the substrate, and the probes are connected with the leads in a one-to-one correspondence manner. From this, chip detection device can detect the chip of different grade type on the one hand to it is convenient for more change the chip, save time, and on the other hand can guarantee that the contact terminal of chip is not destroyed, thereby guarantees the life of chip.

Description

Chip detection device
Technical Field
The utility model belongs to the technical field of imaging device consumptive material technique and specifically relates to a chip detection device is related to.
Background
Need usually to install in imaging device (printer, duplicator etc.) consumable devices such as cartridge or ink horn just can normally work to need to install the consumptive material chip on the consumable device, after the mainboard communication in consumptive material chip and the imaging box, the imaging box could normally use carbon dust or ink etc. in the consumable device, the consumptive material chip has played decisive effect for the normal work of printer, consequently need monitor the intercommunication of printer and chip.
In the related art, the communication between the monitoring printer and the chip is usually monitored by soldering wires to the contact terminals of the chip and connecting the wires to the logic analyzer. On one hand, the direct welding on the contact terminal of the chip can cause the contact terminal of the chip to be damaged, thereby influencing the normal work of the chip, and the communication monitoring stability of the method is poor; on the other hand, often can thousands of times plug the powder box during test chip, easily lead to the powder box to be damaged and produce the phenomenon of leaking the powder, make its life shorten, be unfavorable for long-term the use.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a chip detection device, which is convenient for replacing the chip and can also avoid damaging the contact terminals of the chip.
According to the utility model discloses a chip, include: mould chip, wire and test piece, the wire with mould chip with the test piece is connected respectively, the test piece includes: the probe is arranged on the substrate; and parts of the probes extend out of the surface of the substrate, and the probes are connected with the leads in a one-to-one correspondence manner.
Therefore, the utility model discloses a chip detection device can detect the chip of different grade type on the one hand to it is convenient for more change the chip, save time, and on the other hand can guarantee that the contact terminal of chip is not destroyed, thereby guarantees the life of chip.
In some examples of the invention, at least a portion of the probe is retractable with respect to the substrate.
In some examples of the invention, the probe comprises: the needle tube is fixed on the base body and is connected with the lead, and the needle is telescopically arranged in the needle tube.
In some examples of the present invention, further comprising: the elastic part is stopped against between the needle head and the needle tube so as to push the needle head to extend out of the needle tube.
In some examples of the present invention, the needle head and the needle tube are metal tubes, and the elastic portion is a metal spring.
In some examples of the invention, the probe extends from a top surface of the substrate;
the test piece further includes: and the pressing plate is positioned above the base body.
In some examples of the invention, the test piece further comprises: the pressing plate is arranged on the base body through the pivot shaft, the torsion spring is wound on the pivot shaft, one end of the torsion spring is connected to the pressing plate, and one end, far away from the pivot shaft, of the pressing plate is constructed into a pressing head.
In some examples of the invention, an adjustment mechanism is provided on the base for adjusting the position of the probe on the base.
In some examples of the present invention, the base body is provided with an adjusting hole or an adjusting groove, and the probe is inserted into the adjusting hole or the adjusting groove.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a front view of a chip detection apparatus according to an embodiment of the present invention;
FIG. 2 is a perspective view of the chip detection device;
FIG. 3 is a top view of the chip detection device;
FIG. 4 is a front view of a chip inspection apparatus for a plurality of test pieces;
FIG. 5 is a side view of a test piece substrate and probes;
fig. 6 is a front view of an operation state of the chip detecting apparatus for a plurality of test pieces.
Reference numerals:
a chip detection device 100;
a die chip 10; a lead wire 20;
a test piece 30; a base 31; a probe 32; a needle tube 321; a needle 322; a platen 33; a ram 331; a pivot shaft 34.
Detailed Description
Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.
Referring to fig. 1-6, the chip detection device 100 according to the embodiment of the present invention is described below, and this chip detection device 100 is simple and fast to replace the chip, and can also be conveniently connected to the logic detector and monitor the communication between the imaging device and the consumable chip, and can also avoid damaging the contact terminals of the chip.
As shown in fig. 1, 4 and 6, a chip detection apparatus 100 according to an embodiment of the present invention includes: a die chip 10, a wire 20, and a test piece 30.
As shown in fig. 2, the die chip 10 may have a rectangular shape, a circular shape, or other geometric shapes, and a plurality of contact terminals are disposed on the surface of the die chip 10, and the plurality of contact terminals are arranged side by side and may be spaced apart. The wires 20 are connected between the die chip 10 and the test piece 30, one end of the wire 20 is connected to the die chip 10, and the connection positions of the wires 20 correspond to the positions of contact terminals, each of which is connectable to at least one of the wires 20. The testing piece 30 includes a base 31 and probes 32, the probes 32 are disposed on the base 31 and extend out of the surface of the base 31, the probes 32 are used for contacting and detecting contact terminals of chips to be tested, the number of the contact terminals of the chips to be tested is less than or equal to the number of the probes 32, the chips to be tested may be consumable chips, such as powder box chips, wherein the shape structure of the mold chip 10 may be consistent with that of the powder box chips, which may facilitate the mold chip 10 to be fitted in the powder box. The test piece 30 may be configured in a clip shape, but it may be configured in other shapes, with the probes 32 being connected to the leads 20 in a one-to-one correspondence.
Mold chip 10 and test piece 30 and wire 20 have constituted chip detection device 100 jointly, it can replace consumptive material chip powder box chip with mold chip 10 and install in the powder box, consumptive material chip powder box chip is installed on test piece 30, be connected and transmit data through wire 20 and logic detection instrument, the logic detection instrument can acquire the data that chip detection device 100 transmitted, can save the process of plug powder box chip repeatedly, can avoid the harm to the powder box chip, and the mode of monitoring is simple and convenient, save time, and make things convenient for quick replacement powder box chip. In addition, still can be through changing the examination of awaiting measuring chip on the test piece 30 to the change to the realization is to the consumptive material chip, for example, when the examination of awaiting measuring chip is used up or it receives to damage when needing to be changed, only need to change the examination of awaiting measuring chip on the test piece 30 can, need not to await measuring the chip from the equipment (if the examination of awaiting measuring chip is the consumptive material chip of imaging device, above-mentioned equipment is imaging device) take out the back again installation, this kind of mode can more convenient and fast change examination of awaiting measuring chip.
Therefore, the utility model discloses a chip detection device 100, the chip that can detect the different grade type on the one hand to it is convenient for more change the chip, save time, on the other hand can guarantee that the contact terminal of chip is not destroyed, thereby guarantees the life of chip.
According to an embodiment of the invention, at least a part of the probe 32 is retractable with respect to the base 31. Set up probe 32 for the telescopic form of base member 31, can change the chip that awaits measuring from testing 30 more conveniently, reduce the complexity of operation to can save time, it can also guarantee probe 32 and the continuous contact of the contact terminal of the chip that awaits measuring, thereby can be favorable to detecting the chip that awaits measuring better, can adapt to the chip that awaits measuring of different shape structures moreover, its commonality is good.
As shown in fig. 1, according to another embodiment of the present invention, the probe 32 may include: a needle tube 321 and a needle 322, the needle tube 321 being fixed to the base 31. The needle tube 321 is connected to the lead wire 20 extending into the base 31, and the needle 322 is telescopically disposed within the needle tube 321. The needle tube 321 is connected with the lead 20 extending into the substrate 31, and can transmit the received signal to the logic analyzer through the lead 20, so that the purpose that the logic analyzer monitors the communication between the imaging device and the consumable chip can be achieved. Set up syringe needle 322 telescopically in needle pipe 321, can be more convenient change the powder box chip from test piece 30 to reach the purpose that can survey different powder box chips.
Optionally, the probe 32 further includes an elastic portion, the elastic portion is stopped between the needle 322 and the needle tube 321, and can push the needle 322 to extend out of the needle tube 321, and the elastic portion is disposed between the needle 322 and the needle tube 321, and can automatically reset when the needle 322 and the needle tube 321 move up and down. The elastic part can ensure the continuous contact between the needle 322 and the contact terminal of the powder box chip, and can ensure the detection stability of the chip detection device 100.
Specifically, the needle 322 and the needle tube 321 are metal tubes, and the elastic part is a metal spring. The metal material is used as the material of the needle 322, the needle tube 321 and the elastic part, so that the conductivity is strong, the data signals of the imaging device and the consumable chip can be better transmitted, and the communication stability of the imaging device and the consumable chip is enhanced.
According to an alternative embodiment of the present invention, as shown in FIG. 1, the probe 32 extends from the top surface of the substrate 31; test piece 30 further includes a pressure plate 33, pressure plate 33 being positioned above substrate 31, a portion of pressure plate 33 being movable between a position pressing on probe 32 and a position spaced from probe 32. The probes 32 extend from the top surface of the substrate 31, for example, the probes 32 may extend from a direction perpendicular to the top surface of the substrate 31, which can ensure that the probes 32 are in sufficient contact with the chip to better transmit signals. The pressing plate 33 is arranged above the substrate 31, the chip is arranged between the pressing plate 33 and the probe 32, the chip is pressed by the pressing plate 33 and pressed on the probe 32, the probe 32 can be in contact with the chip, the probe 32 can perform signal transmission with the chip, and the test piece 30 and the chip can perform data transmission or communication conveniently.
As shown in fig. 1, according to an embodiment of the present invention, the testing member 30 further includes a pivot shaft 34 and a torsion spring, the pressing plate 33 is disposed on the base 31 through the pivot shaft 34, the torsion spring is connected to the pressing plate 33 around the pivot shaft 34, and one end of the pressing plate 33 away from the pivot shaft 34 is configured as a pressing head 331. The pressing plate 33 is connected to the base 31 by a pivot shaft 34 and a torsion spring, and the pressing plate 33 is rotatable with respect to the pivot shaft 34 so that the pressing head 331 can move between a position pressing the probe 31 and a position away from the probe 32. When the pressing plate 33 is pressed toward the end of the pivot shaft 34, the pressing head 331 is tilted upward (the pressing head 331 is moved toward a position away from the probe pin 32), and the chip can be replaced. After the chip is replaced, the pressure on the pressing plate 33 is removed, the pressing plate 33 is far away from the pivot shaft 34, the pressing head 331 moves towards the position for pressing the probe 32, the pressing head 331 can be pressed on the chip or the probe 32 through the torsion of the torsion spring, the pressing head 331 is arranged in a structure parallel to the substrate, the pressing head 331 can clamp the chip, and the probe 32 can conveniently detect data of the chip.
According to the utility model discloses a another embodiment is provided with adjustment mechanism on the base member 31, and adjustment mechanism can adjust the position of probe 32 on base member 31, through adjusting the position of probe 32 on base member 31, can make things convenient for probe 32 and chip to contact to make probe 32 and chip carry out signal transmission. The adjusting mechanism comprises an adjusting rod, the position of the probe 32 can be adjusted by the adjusting rod, one part of the adjusting rod extends out of the base body 31, so that a tester can change the position of the probe 32 by manipulating the adjusted extending part, the contact between the probe 32 and a chip terminal can be ensured, and the universality of the chip detection device 100 can be improved to at least a certain extent.
Optionally, an adjusting groove or an adjusting hole is formed in the substrate 31, the probe 32 is inserted into the adjusting groove or the adjusting hole, the probe 32 can move in the adjusting groove or the adjusting hole, the probe 32 moves in the adjusting groove or the adjusting hole, so that the position of the probe 32 on the substrate 31 can be adjusted, and the probe 32 can be conveniently contacted with a chip by the adjusting groove or the adjusting hole, so that the contact stability of the probe 32 is ensured.
According to the utility model discloses a further embodiment, clamp plate 33 is elastic pressing plate 33, for example, clamp plate 33 is elastic rotation clamp plate 33, and it can carry out reliable invariable pressure fixation to the chip, avoids its position to take place the skew to avoid the data that detect to be inaccurate enough.
Among them, the arrangement form of the test piece 30 is various.
Alternatively, as shown in fig. 1, the testing device 30 is one, that is, the lead 20 is connected to only one testing device 30, so that the chip testing apparatus 100 has a simple structure and can effectively test one chip to be tested through the testing device 30.
Alternatively, as shown in fig. 4, the test piece 30 is provided in plurality, the base 31 is provided with a through hole, and the lead 20 is inserted through the through holes of the plurality of bases 31. For example, a plurality of cartridges with different colors are usually arranged in a color printer, and each cartridge needs to be provided with one chip, so when the chip detection device 100 is used for monitoring communication between the printer and the chip, only the mold chip 10 needs to be arranged on one cartridge of the printer, then the chips to be tested are respectively installed by using a plurality of test pieces 30, each test piece 30 is provided with one chip to be tested, and then the substrates 31 of the plurality of test pieces 30 are connected together through the wires 20, so that communication between the plurality of chips and the printer can be monitored simultaneously.
According to another alternative embodiment of the present invention, one end of the substrate 31 is provided with a probe 32 and the opposite end is provided with an insertion hole into which the lead wire 20 is inserted. The front end of base member 31 is provided with probe 32, the signal through probe 32 detection chip, the rear end of base member 31 is provided with the access hole, wire 20 links to each other and transmits signal with test piece 30 through the access hole, the wire 20 of test piece 30 base member 31 rear end can directly link to each other with the logic analyzer, at this moment, the communication of printer and a chip is directly monitored to the logic analyzer, 100 simple structures of this kind of chip detection device, the operation can be accomplished in the handheld operation of tester, high durability and convenient use.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features. In the description of the present invention, "a plurality" means two or more. In the description of the present invention, the first feature "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween. In the description of the invention, the first feature being "on", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. A chip detection apparatus, comprising: mould chip, wire and test piece, the wire with mould chip with the test piece is connected respectively, the test piece includes: the probe is arranged on the substrate; and parts of the probes extend out of the surface of the substrate, and the probes are connected with the leads in a one-to-one correspondence manner.
2. The apparatus of claim 1, wherein at least a portion of the probe is retractable with respect to the substrate.
3. The chip detection apparatus according to claim 2, wherein the probe comprises: the needle tube is fixed on the base body and is connected with the lead, and the needle is telescopically arranged in the needle tube.
4. The chip detection apparatus according to claim 3, further comprising: the elastic part is stopped against between the needle head and the needle tube so as to push the needle head to extend out of the needle tube.
5. The chip detecting device according to claim 4, wherein the needle and the needle tube are metal tubes, and the elastic portion is a metal spring.
6. The chip detecting apparatus according to claim 1, wherein the probe protrudes from a top surface of the base;
the test piece further includes: and the pressing plate is positioned above the base body.
7. The chip detection apparatus according to claim 6, wherein the test piece further comprises: the pressing plate is arranged on the base body through the pivot shaft, the torsion spring is wound on the pivot shaft, one end of the torsion spring is connected to the pressing plate, and one end, far away from the pivot shaft, of the pressing plate is constructed into a pressing head.
8. The apparatus for detecting a chip according to claim 1, wherein an adjusting mechanism is provided on the substrate for adjusting the position of the probe on the substrate.
9. The chip detecting device according to claim 1 or 8, wherein the substrate is provided with an adjusting hole or an adjusting groove, and the probe is inserted into the adjusting hole or the adjusting groove.
CN201920641407.0U 2019-05-06 2019-05-06 Chip detection device Active CN210283623U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920641407.0U CN210283623U (en) 2019-05-06 2019-05-06 Chip detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920641407.0U CN210283623U (en) 2019-05-06 2019-05-06 Chip detection device

Publications (1)

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CN210283623U true CN210283623U (en) 2020-04-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113533939A (en) * 2021-08-09 2021-10-22 苏州联讯仪器有限公司 Probe station for chip test

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113533939A (en) * 2021-08-09 2021-10-22 苏州联讯仪器有限公司 Probe station for chip test
CN113533939B (en) * 2021-08-09 2022-03-15 苏州联讯仪器有限公司 Probe station for chip test

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Address after: Room 202, Building G10, South China New Material Innovation Park, No. 31, Kefeng Road, High-tech Industrial Development Zone, Guangzhou, Guangdong, 510700

Patentee after: Guangzhou Zhongnuo Microelectronics Co.,Ltd.

Address before: No. 202, Building G10, South China New Materials Innovation Park, 31 Kefeng Road, Guangzhou High-tech Industrial Development Zone, Guangdong Province

Patentee before: GUANGZHOU ZHONO ELECTRONIC TECHNOLOGY Co.,Ltd.