CN210273211U

CN210273211U - APF modular structure designed by phase separation and partition

Info

Publication number: CN210273211U
Application number: CN201921654114.2U
Authority: CN
Inventors: 董会然; 董锁英; 苏立江; 朱东涛; 赵艳; 王军超
Original assignee: HEBEI XUHUI ELECTRIC CO Ltd
Current assignee: HEBEI XUHUI ELECTRIC CO Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-04-07
Anticipated expiration: 2029-09-30

Abstract

The utility model discloses a APF modular structure of phase separation subregion design, including dismantling the box, its characterized in that: the interior of the detachable box body is provided with an APF modular structure which is arranged in an up-down layered mode and used for forming space isolation to achieve the purpose of strong and weak current separation, the APF modular structure comprises a control assembly used for using weak current, a middle layer assembly and a lower layer assembly used for using high-voltage strong current, and the control assembly, the middle layer assembly and the lower layer assembly are sequentially arranged in a layered mode from top to bottom; the air duct is formed between the middle layer assembly, the lower layer assembly and the inner wall of the detachable box body, ventilation holes communicated with the air duct are formed in the front side wall and the rear side wall of the detachable box body, and a heat dissipation mechanism which is arranged below the middle layer assembly and used for dissipating heat of the device is arranged in the air duct. The utility model discloses according to the partition design of phase splitting, follow strong and weak electric separation, layering thermal isolation, important device that generates heat and be close to ventilation hole design, effectively improved product property ability, improved work efficiency.

Description

APF modular structure designed by phase separation and partition

Technical Field

The utility model relates to a power electronic converter technical field, especially an APF modular structure of phase separation subregion design.

Background

With the continuous development of electronic technology, the use of a large number of nonlinear loads increases the harmonic pollution of a power grid, and the harmonic pollution problem of power electronic devices and other harmonic sources can be solved by arranging a harmonic compensation device to compensate the harmonic. The traditional method for installing the harmonic compensation device adopts an LC tuned filter, but the method has the defects of simple structure, the influence of the impedance and the running state of a power grid on the compensation characteristic, easy parallel resonance with a system, irrational harmonic amplification and compensation effect and the like. At present, an important trend of harmonic suppression is to use an Active Power Filter (APF), the APF can track and compensate the harmonic waves with both changing frequency and amplitude, and the compensation characteristic is not affected by the impedance of the Power grid, so that the APF is widely valued and increasingly applied.

The APF is a power electronic product with higher integration level and has higher requirement on the operation environment, an IGBT high-power device is arranged in the APF and needs ventilation and heat dissipation design, and if the APF has more dust accumulation, temperature rise and complicated wiring in long-term operation, the APF can cause the hidden trouble of frequent equipment failure, so that the APF has higher requirements on heat dissipation design, air duct design, structure planning and the like.

At present, the structural design of an APF module mostly adopts a modular design, and the main solution of a large-capacity APF is to connect a plurality of modules of the modular APF in parallel, but the APF module structure is not provided with a strong and weak current separation structure, so that components using weak current to work are easily damaged, the service life of the device is short, frequent maintenance is needed, and the maintenance cost is greatly increased.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that needs to solve provides a APF modular structure of looks subregion design to solve present APF structure and not set up strong and weak electric isolating construction and lead to the life of device not long, need frequently maintain, increase the problem of maintenance cost, so that APF modular structure is inside to set up to isolating construction, in order to reach the life that increases the device, strengthen the purpose of electrical safety.

In order to solve the technical problem, the utility model adopts the following technical proposal.

The utility model provides a APF modular structure of looks subregion design, is including dismantling the box, its characterized in that: the interior of the detachable box body is provided with an APF modular structure which is arranged in an up-down layered mode and used for forming space isolation to achieve the purpose of strong and weak current separation, the APF modular structure comprises a control assembly used for using weak current, a middle layer assembly and a lower layer assembly used for using high-voltage strong current, and the control assembly, the middle layer assembly and the lower layer assembly are sequentially arranged in a layered mode from top to bottom; the air duct is formed between the middle layer assembly, the lower layer assembly and the inner wall of the detachable box body, ventilation holes communicated with the air duct are formed in the front side wall and the rear side wall of the detachable box body, and a heat dissipation mechanism which is arranged below the middle layer assembly and used for dissipating heat of the device is arranged in the air duct.

According to the technical scheme, the middle layer assembly comprises a plurality of inlet wire plates which are sequentially arranged in parallel and a plurality of power plates which are sequentially arranged in parallel and are respectively connected with the inlet wire plates in a one-to-one correspondence mode, and the inlet wire plates and the power plates are connected to form an isolation layer which is used for isolating the control assembly from the air channel and keeping the control assembly clean; the rear end of the wire inlet plate is connected with an alternating current main circuit wiring terminal for connecting high-voltage alternating current through a bent copper bar, and two adjacent wire inlet plates are connected through a zigzag copper bar; the bottom of the power board is provided with an IGBT (insulated gate bipolar translator) positioned in the ventilation channel, and the power board is connected with the corresponding wire inlet board and the two adjacent power boards through small busbars respectively.

According to the technical scheme, the power supply board is provided with a charging resistor, a control relay and a bypass relay which are used for achieving soft start and closing functions of the APF modular structure, and the power supply board is further provided with a unit network side output current sampling circuit and a fuse which are used for achieving output current sampling functions of the APF modular structure.

According to the technical scheme, the power board is provided with a direct current capacitor for completing unit core power inversion and a bridge side output current sampling circuit.

Further optimize technical scheme, lower floor's subassembly includes that the polylith corresponds respectively and sets up the reactance board under the inlet wire board, passes through electrically conductive copper columnar connection between reactance board and the inlet wire board.

Further optimizing the technical scheme, the reactance plate is provided with a filter capacitor, a filter reactance and a fuse for realizing the LCL filtering function.

The technical scheme is further optimized, the control assembly comprises an insulation board arranged right above the incoming line board through a connecting column, a main control board arranged on the insulation board, a direct current fan power supply arranged on the insulation board and used for providing electric energy for the heat dissipation mechanism, a three-level drive board inserted above the power board and a main drive board inserted above the three-level drive board, and a main control board wiring terminal used for being connected with a weak current power supply is arranged at the rear end of the main control board.

According to the technical scheme, the driving circuit for realizing the IGBT driving function and the NTC sampling circuit are arranged on the three-level driving board.

Further optimize technical scheme, heat dissipation mechanism sets up the radiator fan on the diapire of can dismantling the box and sets up the IGBT radiator on the diapire of dismantling the box through radiator panel beating support including being located respectively under the power board through radiator fan panel beating support, and the IGBT next-door neighbour sets up directly over the IGBT radiator, and the power board supports through radiator panel beating support.

According to the technical scheme, the detachable box body comprises a four-side shell bottom plate, a front panel detachably arranged at the front end of the four-side shell bottom plate and a top cover plate detachably arranged at the top end of the four-side shell bottom plate, and a push-pull handle convenient to pull is further arranged on the outer wall of the front panel; the ventilation holes are formed in the rear side walls of the front panel and the four-side shell bottom plate.

Due to the adoption of the technical scheme, the utility model has the following technical progress.

The utility model discloses according to the partition design of phase splitting, follow strong and weak electric separation, the layering thermal isolation, important device that generates heat is close to design thinking such as ventilation hole, set up APF modular structure inside to the isolating construction, the life of increase device has been reached, the purpose of reinforcing electrical safety, it is succinct compact to have, good heat dissipation, the dirt resistance is good, easy assembly, easy maintenance, advantage with low costs, product property can effectively be improved, the assembly has been made things convenient for, the debugging, the maintenance, work efficiency is improved, the cost is saved, be favorable to batch production and popularization.

The utility model discloses the plate is according to phase splitting and functional partitioning design, and the alternating current high pressure is concentrated on reactance board and inlet plate, power board, and the direct current high pressure is concentrated on power board, separately designs on the plate with three level drive plate, main drive board and the weak current plate of main control board, and structural layer design forms the space and keeps apart, is favorable to strengthening electrical safety.

The utility model discloses be master control and unit control two parts with the control part split, only need a master control board when the parallelly connected use of a plurality of modules of needs, this kind of design cost advantage is obvious.

The utility model discloses polylith inlet wire board and polylith power board are connected and are formed an isolation layer, and the isolation layer is used for making control assembly isolated with the wind channel to keep control assembly clean, form dustproof interlayer to control assembly, be favorable to the plate to keep clean, reduce the module fault rate.

Drawings

Fig. 1 is a schematic external structural view of the present invention;

FIG. 2 is an exploded view of the whole device of the present invention;

fig. 3 is a side view of the APF modular structure of the present invention;

fig. 4 is a top view of the APF module structure of the present invention;

fig. 5 is a schematic structural diagram of an APF module structure of the present invention;

fig. 6 is a rear view of the present invention;

fig. 7 is a schematic structural view of the top cover plate of the present invention when it is removed.

Wherein: 1. a top cover plate; 2. a front panel; 3. four-sided housing floor; 4. an AC main loop wiring terminal; 5. bending the copper bar; 6. a copper bar shaped like a Chinese character 'ji'; 7. a small busbar; 8. a reactance plate; 9. a wire inlet plate; 10. a power board; 11. a three-level drive board; 12. a main drive plate; 13. a main control board; 14. a DC fan power supply; 15. An IGBT; 16. an IGBT radiator; 17. a radiator sheet metal bracket; 18. a heat radiation fan; 19. a radiating fan sheet metal bracket; 20. a push-pull handle; 21. main control panel binding post.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

An APF modular structure with a split-phase and partitioned design, as shown in fig. 1 to 7, comprises a detachable box body and an APF modular structure.

The inside APF modular structure that is provided with of box can dismantle, APF modular structure sets up hierarchically from top to bottom for form the space and keep apart in order to realize strong and weak electric separation purpose.

The APF modular structure comprises a control assembly, a middle layer assembly and a lower layer assembly, wherein the control assembly, the middle layer assembly and the lower layer assembly are sequentially arranged from top to bottom in a layered mode. Weak current is concentrated on the control assembly, and high-voltage strong current is concentrated on the middle-layer assembly and the lower-layer assembly.

An air duct is formed between the middle layer assembly, the lower layer assembly and the inner wall of the detachable box body, and ventilation holes communicated with the air duct are formed in the front side wall and the rear side wall of the detachable box body. And a heat dissipation mechanism is arranged in the air duct, and the heat dissipation mechanism is arranged below the middle layer assembly and used for dissipating heat of the device.

The intermediate level subassembly includes inlet wire board 9 and power board 10, and inlet wire board 9 has set up the polylith in proper order side by side, and power board 10 has set up the polylith in proper order side by side to be connected with inlet wire board 9 one-to-one respectively.

The plurality of the wiring boards 9 are connected with the plurality of the power boards 10 to form an isolation layer, the isolation layer is used for isolating the control assembly from the air channel so as to keep the control assembly clean, a dustproof isolation layer is formed on the control assembly, the control assembly is kept clean, and the module fault rate is reduced.

The rear end of the wire inlet plate 9 is connected with an alternating current main circuit wiring terminal 4 through a bent copper bar 5, and the alternating current main circuit wiring terminal 4 is used for connecting high-voltage alternating current. N lines between two adjacent wire inlet plates 9 are connected through a 'N' -shaped copper bar 6.

The inlet wire board 9 is provided with a charging resistor, a control relay and a bypass relay which are used for realizing the soft start and closing functions of the APF modular structure, and the inlet wire board 9 is also provided with a unit network side output current sampling circuit and a fuse which are used for realizing the output current sampling function of the APF modular structure.

The bottom end of each power board 10 is welded with an IGBT15 located in the air duct, the power boards 10 and the corresponding incoming line boards 9 and the two adjacent power boards 10 are connected through small busbars 7 of the same specification, and assembly is convenient.

The power board 10 is provided with a dc capacitor for completing the core power inversion of the unit and a bridge side output current sampling circuit.

Lower floor's subassembly includes reactance board 8, and reactance board 8 is provided with the polylith, corresponds respectively to set up under inlet wire board 9, through electrically conductive copper columnar connection between reactance board 8 and the inlet wire board 9, and electrically conductive copper post had both had electrically conductive function, had the support function again, simplified module structure design.

Besides, the main circuit current-carrying medium uses copper foil of the PCB, so that the design and layout of copper bars are saved, and the assembly process is simplified.

The heat radiation fan 18, the IGBT radiator 16 and the reactance plate 8 are arranged in the ventilation duct in sequence according to the wind direction, and main heating components are arranged on the same layer.

And a filter capacitor, a filter reactance and a fuse for realizing the LCL filtering function are arranged on the reactance plate 8.

The control assembly comprises an insulating plate, a main control board 13, a direct current fan power supply 14, a three-level driving board 11 and a main driving board 12.

The insulation board passes through the spliced pole setting and is directly over inlet wire board 9.

The main control board 13 is arranged on the insulating board, and a main control board wiring terminal 21 for connecting a weak current power supply is arranged at the rear end of the main control board 13. The main control board 13 mainly performs core algorithm calculation, analog quantity sampling, protection logic control, output control on the module, and the like.

The direct current fan power supply 14 is arranged on the insulating plate and used for providing electric energy for the heat dissipation mechanism.

The three-level driving board 11 is inserted above the power board 10, and a driving circuit and an NTC sampling circuit are arranged on the three-level driving board 11 and used for realizing an IGBT driving function.

The main driving board 12 is inserted above the three-level driving board 11, and mainly realizes functions of driving distribution control, protection, master control communication and the like of the module.

The heat dissipation mechanism includes a heat dissipation fan 18 and an IGBT heat sink 16 located directly below the power board 10, respectively. The cooling fan 18 is arranged on the bottom wall of the detachable box body through a cooling fan sheet metal support 19. IGBT radiator 16 passes through radiator panel beating support 17 and sets up on the diapire of can dismantling the box. The IGBT15 is closely adjacent to and is arranged right above the IGBT radiator 16, and the important heating element IGBT radiator 16 is arranged at the air inlet end close to the air vent, so that the radiating efficiency is improved, and the space is fully utilized. The IGBT15 is fixed on the IGBT radiator 16 by screws, and the power board 10 is provided with holes corresponding to the fixing screws of the IGBT15, so that the IGBT is convenient to fix. The power board 10 is supported by a radiator sheet metal bracket 17.

The detachable box body comprises a four-side shell bottom plate 3, a front panel 2 and a top cover plate 1. The inner wall of the four-side shell bottom plate 3 is provided with holes for pressing and riveting screws and fixing screws, and the holes are used for fixing internal structural members such as a reactance plate 8, a radiator metal plate support 17 and a radiating fan metal plate support 19. The two side surfaces of the bottom plate of the four-side shell are provided with small sheet metal parts for fixing the wire inlet plate 9 and the main control plate 13. The main control board connecting terminal 21 and the alternating current main circuit connecting terminal 4 extend out of the four-side shell bottom plate 3.

The front panel 2 can be dismantled and set up in four sides casing bottom plate 3 front end, still is provided with the push-and-pull handle 20 that is convenient for pull on the outer wall of front panel 2, and push-and-pull handle 20 is provided with two altogether. Top apron 1 can be dismantled and set up in four sides casing bottom plate 3 top, specifically, top apron 1 and front panel 2 are through undercut with the screw fixation on four sides casing bottom plate 3. The ventilation holes are opened on the rear side walls of the front panel 2 and the four-side housing bottom plate 3.

The utility model discloses power module printing plate is according to the independent function plate of function partition design: main drive board 12, three level drive board 11, power board 10, inlet wire board 9 and reactance board 8. The reactance plate 8, the incoming line plate 9, the power plate 10 and the three-level driving plate 11 are printed plate members designed in a phase-splitting partition mode. The reactance plate 8, the incoming line plate 9 and the power plate 10 are respectively designed into three same plates according to phases, and the three-level driving plate 11 is designed into three paths of same circuits according to phases.

The utility model discloses exchange high pressure and concentrate on reactance board 8, inlet wire board 9 and power board 10, direct current high pressure is concentrated on power board 10, and high pressure and three level drive board 11, main drive board 12 and the weak current plate of main control board 13 separately design on the plate, structural layering design has formed the space isolation state.

Claims

1. The utility model provides a APF modular structure of looks subregion design, is including dismantling the box, its characterized in that: the interior of the detachable box body is provided with an APF modular structure which is arranged in an up-down layered mode and used for forming space isolation to achieve the purpose of strong and weak current separation, the APF modular structure comprises a control assembly used for using weak current, a middle layer assembly and a lower layer assembly used for using high-voltage strong current, and the control assembly, the middle layer assembly and the lower layer assembly are sequentially arranged in a layered mode from top to bottom; the air duct is formed between the middle layer assembly, the lower layer assembly and the inner wall of the detachable box body, ventilation holes communicated with the air duct are formed in the front side wall and the rear side wall of the detachable box body, and a heat dissipation mechanism which is arranged below the middle layer assembly and used for dissipating heat of the device is arranged in the air duct.

2. The APF modular structure of claim 1, wherein: the middle layer assembly comprises a plurality of wire inlet plates (9) which are sequentially arranged in parallel and a plurality of power plates (10) which are sequentially arranged in parallel and are respectively connected with the wire inlet plates (9) in a one-to-one correspondence mode, and the plurality of wire inlet plates (9) are connected with the plurality of power plates (10) to form an isolation layer which is used for isolating the control assembly from the air channel so as to keep the control assembly clean; the rear ends of the wire inlet plates (9) are connected with an alternating current main circuit wiring terminal (4) used for accessing high-voltage alternating current through bent copper bars (5), and two adjacent wire inlet plates (9) are connected through a zigzag copper bar (6); the bottom of the power board (10) is provided with an IGBT (15) positioned in the ventilation duct, and the power board (10) is connected with the corresponding wire inlet board (9) and the two adjacent power boards (10) through a small busbar (7) respectively.

3. The APF modular structure of claim 2, wherein: the power supply line board (9) is provided with a charging resistor, a control relay and a bypass relay which are used for achieving soft start and closing functions of the APF modular structure, and the power supply line board (9) is further provided with a unit network side output current sampling circuit and a fuse which are used for achieving the output current sampling function of the APF modular structure.

4. The APF modular structure of claim 2, wherein: and the power board (10) is provided with a direct current capacitor for completing the inversion of the core power of the unit and a bridge side output current sampling circuit.

5. The APF modular structure of claim 2, wherein: the lower-layer assembly comprises a plurality of reactance plates (8) which are arranged under the wire inlet plate (9) correspondingly, and the reactance plates (8) are connected with the wire inlet plate (9) through conductive copper columns.

6. The APF modular structure of phase-split partition design according to claim 5, characterized in that: and a filter capacitor, a filter reactance and a fuse wire for realizing the LCL filter function are arranged on the reactance plate (8).

7. The APF modular structure of claim 2, wherein: the control assembly comprises an insulation board arranged right above the wire inlet board (9) through a connecting column, a main control board (13) arranged on the insulation board, a direct current fan power supply (14) arranged on the insulation board and used for providing power for the heat dissipation mechanism, a three-level drive board (11) inserted above the power board (10) and a main drive board (12) inserted above the three-level drive board (11), wherein a main control board wiring terminal (21) used for connecting a weak current power supply is arranged at the rear end of the main control board (13).

8. The APF modular structure of phase-split partition design according to claim 7, characterized in that: and the three-level driving board (11) is provided with a driving circuit for realizing an IGBT driving function and an NTC sampling circuit.

9. The APF modular structure of claim 2, wherein: the heat dissipation mechanism comprises a heat dissipation fan (18) which is arranged on the bottom wall of the detachable box body through a heat dissipation fan sheet metal support (19) and an IGBT radiator (16) which is arranged on the bottom wall of the detachable box body through a radiator sheet metal support (17) under a power board (10) respectively, wherein the IGBT radiator (15) is closely arranged right above the IGBT radiator (16), and the power board (10) is supported through the radiator sheet metal support (17).

10. The APF modular structure of claim 1, wherein: the detachable box body comprises a four-side shell bottom plate (3), a front panel (2) detachably arranged at the front end of the four-side shell bottom plate (3) and a top cover plate (1) detachably arranged at the top end of the four-side shell bottom plate (3), and a push-pull handle (20) convenient to pull is further arranged on the outer wall of the front panel (2); the ventilation holes are formed in the rear side walls of the front panel (2) and the four-side shell bottom plate (3).