CN210244295U - Water-cooling server power supply unit - Google Patents

Water-cooling server power supply unit Download PDF

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Publication number
CN210244295U
CN210244295U CN201921513328.8U CN201921513328U CN210244295U CN 210244295 U CN210244295 U CN 210244295U CN 201921513328 U CN201921513328 U CN 201921513328U CN 210244295 U CN210244295 U CN 210244295U
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cpu
power supply
cable
insulating material
water
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CN201921513328.8U
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Chinese (zh)
Inventor
Chengjie Huang
黃成杰
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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Priority to CN201921513328.8U priority Critical patent/CN210244295U/en
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Abstract

The utility model provides a water-cooling server power supply unit, the server includes first CPU and second CPU, first CPU directly connects power supply, adheres to a layer of insulating material above the cold water pipe between first CPU and second CPU, set up the cable on the insulating material; one end of the cable is electrically connected with the power supply, and the other end of the cable is electrically connected with a second CPU far away from the power supply. The utility model discloses a turn into the comparatively favourable combination of hardware design with water cooling pipeline occupation space, the material of messenger affixes in the water-cooled tube top, sets up the circular telegram cable on crossing insulating material, and the circular telegram cable passes through CPU nevertheless because the thickness of an interval water cooling pipeline, is unlikely to influence CPU efficiency. And the power supply problem of the left module and the right module of the server is solved, the power supply can be realized without passing a large current through a PCB, the PCB cost is greatly reduced, and the PCB is easier.

Description

Water-cooling server power supply unit
Technical Field
The utility model belongs to the technical field of server equipment, concretely relates to water cooling server power supply unit.
Background
At present, the heat dissipation requirement of a server gradually becomes huge, a fan of a server system is frequently rotated to five or six to ten thousand rotating speeds, and in the design of a cable, if the cable is too long, the fan is wire bonded after the server system is started, short circuit or other damage can be generated after the sheath of the cable is broken, and the cable is not easy to be found and regarded at the initial stage. Therefore, the use of water cooling is another future trend.
Generally, the water cooling mechanism pipeline is shown in fig. 1, taking this plate type as an example, the power is input from the lower part of the right side, and is difficult to pass through the CPU and the memory area through the PCB on the board to supply to the left module, and the direct large power on the PCB may cause adverse effect on the circuit signal of the CPU or the PCB. In order to avoid such adverse effects, the power supply problem of the two modules is solved by increasing the thickness of the copper and the lamination layer of the PCB and allowing a large current to flow through the PCB, but the cost of the PCB is greatly increased by such a method.
SUMMERY OF THE UTILITY MODEL
The above-mentioned not enough to prior art, the utility model provides a water-cooling server power supply unit to solve above-mentioned technical problem.
The embodiment of the application provides a power supply device of a water-cooling server, wherein the server comprises a first CPU and a second CPU, the first CPU is directly connected with a power supply source, a layer of insulating material is attached to the upper part of a cold water pipe between the first CPU and the second CPU, and a cable is arranged on the insulating material; one end of the cable is electrically connected with the power supply, and the other end of the cable is electrically connected with a second CPU far away from the power supply.
In one embodiment of the present application, the insulating material is a long flexible resin, and the insulating material insulates the cold water pipe from both the first CPU and the second CPU.
In an embodiment of the present application, the cold water pipe is tightly attached to the first CPU and the second CPU, and the cold water pipe sequentially passes through the first CPU, the second CPU, and the storage module.
In one embodiment of the present application, the insulating material is an over-insulation layer coated on an outer surface of the cold water pipe.
The utility model has the advantages that,
the utility model provides a water-cooling server power supply unit turns into the comparatively favourable combination of hardware design through water-cooling pipeline occupation space, and the material that makes attaches in the water-cooling tube top, sets up the circular telegram cable on crossing insulating material, and the circular telegram cable passes through CPU nevertheless because the thickness of an interval water-cooling pipeline is unlikely to influence CPU efficiency. And the power supply problem of the left module and the right module of the server is solved, the power supply can be realized without passing a large current through a PCB, the PCB cost is greatly reduced, and the PCB is easier.
Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of the arrangement of water cooling lines of an apparatus according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the layout of a device according to one embodiment of the present application;
wherein, 1, a first CPU; 2. a second CPU; 3. a storage module; 4. a water-cooled tube; 5. an insulating material; 6. a cable; 7. and (4) a power supply.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example 1
Referring to fig. 1 and 2, the present embodiment provides a power supply device for a water-cooled server, where the server includes a first CPU1 and a second CPU2, the first CPU1 is directly connected to a power supply 7, a layer of insulating material 5 is attached above a cold water pipe 4 between the first CPU1 and the second CPU2, and a cable 6 is disposed on the insulating material 5; one end of the cable 6 is electrically connected with the power supply 7, and the other end is electrically connected with the second CPU2 far away from the power supply 7. Wherein the insulating material 5 is a long strip-shaped flexible resin, and the insulating material 5 is separated from the first CPU1 and the second CPU2 by the cold water pipe 4.
The cable 6 is spaced from both the first CPU1 and the second CPU2 by the diameter of the cold water pipe 4 so that the cable 6 does not have a significant adverse effect on the PCB board when power is supplied.
Example 2
The embodiment provides a water-cooling server power supply device, the server comprises a first CPU1 and a second CPU2, and the first CPU1 is directly connected with a power supply 7. Referring to fig. 1, a cold water pipe 4 is tightly attached to a first CPU and a second CPU, and the cold water pipe 4 sequentially passes through the first CPU, the second CPU and a storage module to dissipate heat of a server motherboard. The insulating material 5 is an insulating layer coated on the outer surface of the cold water pipe. The power cable 6 is fixed to the insulating layer. One end of the cable 6 is electrically connected to the power supply 7, and the other end is electrically connected to the second CPU 2.
Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (4)

1. A water-cooling server power supply unit, the said server includes the first CPU and second CPU, the said first CPU connects the power supply directly, characterized by that, adhere to a layer of insulating material above the cold water pipe between second CPU and the first CPU, set up the cable on the said insulating material; one end of the cable is electrically connected with the power supply, and the other end of the cable is electrically connected with a second CPU far away from the power supply.
2. The water server power supply of claim 1, wherein the insulating material is an elongated flexible resin, the insulating material insulating the cold water pipe from both the first CPU and the second CPU.
3. The water-cooling server power supply device according to claim 1, wherein the cold water pipe is tightly attached to the first CPU and the second CPU, and sequentially passes through the first CPU, the second CPU and the storage module.
4. The water server power supply of claim 1 wherein the insulating material is an over-insulation layer applied to the outer surface of the cold water pipe.
CN201921513328.8U 2019-09-11 2019-09-11 Water-cooling server power supply unit Active CN210244295U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921513328.8U CN210244295U (en) 2019-09-11 2019-09-11 Water-cooling server power supply unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921513328.8U CN210244295U (en) 2019-09-11 2019-09-11 Water-cooling server power supply unit

Publications (1)

Publication Number Publication Date
CN210244295U true CN210244295U (en) 2020-04-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921513328.8U Active CN210244295U (en) 2019-09-11 2019-09-11 Water-cooling server power supply unit

Country Status (1)

Country Link
CN (1) CN210244295U (en)

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