CN210231841U - Heating module and reflow soldering - Google Patents
Heating module and reflow soldering Download PDFInfo
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- CN210231841U CN210231841U CN201920757204.8U CN201920757204U CN210231841U CN 210231841 U CN210231841 U CN 210231841U CN 201920757204 U CN201920757204 U CN 201920757204U CN 210231841 U CN210231841 U CN 210231841U
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Abstract
The utility model belongs to the technical field of welding equipment, in particular to a heating module and reflow soldering, wherein the heating module comprises a shell, a fan and a heating device; a cavity is arranged in the shell, a blowing area, a wind collecting area and a heating area are sequentially arranged in the cavity at intervals, the fan is arranged in the blowing area, a ventilating plate is arranged between the wind collecting area and the heating area, a plurality of vent holes penetrating through the ventilating plate are uniformly arranged on the ventilating plate, the heating device is arranged in the heating area, and the heating area and the blowing area are communicated with each other through an air flow channel; after the air collecting area is filled with heat air flow, the heat air flow uniformly enters the heating area through the vent holes so as to generate stable air flow, so that the PCB is uniformly heated, and the quality of welding spots at each position is improved.
Description
Technical Field
The utility model belongs to the technical field of the welding equipment, especially, relate to a heating module and reflow soldering.
Background
Reflow soldering stove is the equipment that keeps warm the effect to the PCB panel after the solder joint welding, and the heating device of reflow soldering stove generally is located the play tuber pipe top in the reflow soldering stove on the existing market, heats the gas in the reflow soldering stove through heating device, then spouts hot air current from going out the tuber pipe blowout through setting up the fan wheel at reflow soldering stove top, spouts on the PCB board. However, due to the fact that the position structure of the heating device is unreasonable, the temperature of gas close to the heating device is high, the temperature of gas far away from the heating device is low, the temperature of air flow in the air outlet pipe close to the heating device is high, the temperature of air flow in the air outlet pipe far away from the heating device is low, the temperature of air flow sprayed out of each air outlet pipe is poor, uniform heating of the PCB is affected, and the quality of welding spots at each position on the PCB cannot be stable.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heating module and reflow soldering aims at solving among the prior art reflow soldering stove because of its inner structure sets up the unstable technical problem of air current temperature that unreasonable and lead to producing.
In order to achieve the above object, an embodiment of the present invention provides a heating module, which includes a housing, a fan, and a heating device; the fan is characterized in that a cavity is arranged in the shell, a blowing area, a wind collecting area and a heating area are sequentially arranged in the cavity at intervals, the fan is arranged in the blowing area, a ventilating plate is arranged between the wind collecting area and the heating area, a plurality of air holes penetrating through the ventilating plate are uniformly arranged on the ventilating plate, the heating device is arranged in the heating area, and the heating area and the blowing area are mutually communicated through an air flow channel.
Optionally, the heating device comprises a plurality of heating resistance wires; and the heating resistance wires are respectively and uniformly arranged in the heating area.
Optionally, each heating resistance wire is arranged on the same plane to form a heating layer, and the heating layer and the ventilation plate are arranged in parallel.
Optionally, the ventilation board is made of graphene or a thermally conductive silicone material.
Optionally, a filter is disposed in the airflow passage.
Optionally, a thermal insulation layer is arranged in the airflow channel.
Optionally, the radius of the vent hole ranges from 2.0mm to 2.5 mm.
Optionally, the thickness of the vent plate ranges from 1.5mm to 2.0 mm.
Optionally, an exhaust fan is arranged in the airflow channel.
The embodiment of the utility model provides an above-mentioned one or more technical scheme in the heating module have one of following technological effect at least: arranging the PCB in the heating area, the heating device works to generate heat, the heat makes the solder on two sides of the element in the PCB melt and then is bonded with the PCB, the fan works to make the heat generated by the heating device enter the blowing area through the airflow channel, the heat airflow sequentially passes through the airflow channel and reaches the wind collecting area after the blowing area, and after the wind collecting area is filled with the heat airflow, the heat airflow passes through the vent holes to uniformly enter the heating area so as to generate stable airflow, thereby uniformly heating the PCB and improving the quality of welding spots at each position.
In order to achieve the above object, the embodiment of the present invention further provides a reflow soldering apparatus, which includes the above heating module.
The embodiment of the utility model provides an above-mentioned one or more technical scheme in the reflow soldering have one of following technological effect at least: and placing the PCB in the reflow soldering for heating and soldering to generate uniform heat airflow so as to uniformly heat the PCB and improve the quality of soldering points at each position.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a heating module according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
10-housing 11-cavity 12-blowing zone
13-wind-collecting zone 14-heating zone 15-ventilating plate
16-vent hole 20-fan 30-heating device
40-airflow channel 41-heat insulation layer 42-exhaust fan
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the embodiments of the present invention and are not to be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.
In one embodiment of the present invention, as shown in fig. 1, a heating module is provided, which comprises a housing 10, a blower 20 and a heating device 30; the improved air-conditioning fan is characterized in that a cavity 11 is arranged in the shell 10, a blowing area 12, an air collecting area 13 and a heating area 14 are sequentially arranged in the cavity 11 at intervals, the fan 20 is arranged in the blowing area 12, a ventilation plate 15 is arranged between the air collecting area 13 and the heating area 14, a plurality of air holes 16 penetrating through the ventilation plate 15 are uniformly formed in the ventilation plate 15, the heating device 30 is arranged in the heating area 14, and the heating area 14 is communicated with the blowing area 12 through an air flow passage 40.
The embodiment of the utility model provides an in, arrange the PCB board in the zone of heating 14, heating device 30 work produces the heat, and the heat makes the solder of component both sides bond with the PCB board in the PCB board after melting, fan 20 work makes the heat that heating device 30 produced passes through airflow channel 40 gets into in the zone of blowing 12, the heat air current passes through in proper order airflow channel 40 with reach wind-collecting area 13 behind the zone of blowing 12, after wind-collecting area 13 was filled with the heat air current, the heat air current passed through air vent 16 evenly gets into in the zone of heating 14 to the messenger produces stable air current, makes PCB board even heating, improves the quality of solder joint everywhere.
In another embodiment of the present invention, as shown in fig. 1, the heating device 30 of the heating module comprises a plurality of heating resistance wires; the heating resistance wires are respectively and uniformly arranged in the heating area 14, and the heating device 30 is made of the heating resistance wires, so that the heating device has the advantages of uniform heating, high thermal efficiency and less environmental pollution.
In another embodiment of the present invention, as shown in fig. 1, each of the heating resistance wires of the heating module is disposed on the same plane to form a heating layer, and the heating layer is disposed in parallel with the ventilation plate 15; so as to generate uniform heat, heat the PCB uniformly and further improve the quality of welding spots.
In another embodiment of the present invention, the ventilation board 15 of the heating module is made of graphene or heat-conducting silica gel material, and has the advantages of good heat-conducting performance and stability.
In another embodiment of the present invention, a filter is disposed in the air flow passage 40 of the heating module, so as to filter dust particles in the heat air flow, improve the cleanliness of the casing 10, and further improve the welding effect of the PCB.
In another embodiment of the present invention, as shown in fig. 1, a heat insulation layer 41 is disposed in the airflow channel 40 of the heating module, so as to reduce heat loss and greatly improve heating efficiency.
The utility model discloses a further embodiment, this heating module the radius value scope of air vent 16 is 2.0mm ~ 2.5mm, 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm or 2.5mm can be chooseed for use to the radius of air vent 16, through experimental test, 2.5 mm's ventilation effect preferred is chooseed for use to the radius of air vent 16.
The utility model discloses an in another embodiment, this heating module the thickness value scope of ventilating board 15 is 1.5mm ~ 2.0mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2.0mm can be chooseed for use to ventilating board 15's thickness, through experimental test, 1.5 mm's ventilation effect preferred is chooseed for use to the radius of air vent 16.
In another embodiment of the present invention, as shown in fig. 1, an exhaust fan 42 is disposed in the air flow channel 40 of the heating module, and the exhaust fan 42 is added to improve the fluidity of the heat air flow so as to improve the thermal efficiency and improve the utilization rate of the heat.
In another embodiment of the present invention, a reflow soldering apparatus is provided, which includes the above-mentioned heating module; and placing the PCB in the reflow soldering for heating and soldering to generate uniform heat airflow so as to uniformly heat the PCB and improve the quality of soldering points at each position.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A heating module is characterized by comprising a shell, a fan and a heating device; the fan is characterized in that a cavity is arranged in the shell, a blowing area, a wind collecting area and a heating area are sequentially arranged in the cavity at intervals, the fan is arranged in the blowing area, a ventilating plate is arranged between the wind collecting area and the heating area, a plurality of air holes penetrating through the ventilating plate are uniformly arranged on the ventilating plate, the heating device is arranged in the heating area, and the heating area and the blowing area are mutually communicated through an air flow channel.
2. The heating module of claim 1, wherein the heating device comprises a plurality of heating resistance wires; and the heating resistance wires are respectively and uniformly arranged in the heating area.
3. The heating module according to claim 2, wherein each of the heating resistance wires is disposed on a same plane to form a heating layer, and the heating layer is disposed in parallel with the ventilation plate.
4. The heating module of claim 1, wherein the vent plate is made of graphene or a thermally conductive silicone material.
5. A heating module according to any one of claims 1 to 4, wherein a filter is provided in the air flow channel.
6. The heating module according to any one of claims 1 to 4, wherein a heat insulating layer is provided in the air flow channel.
7. The heating module according to any one of claims 1 to 4, wherein the radius of the vent hole ranges from 2.0mm to 2.5 mm.
8. The heating module according to any one of claims 1 to 4, wherein the thickness of the vent plate ranges from 1.5mm to 2.0 mm.
9. The heating module according to any one of claims 1 to 4, wherein an exhaust fan is disposed in the air flow channel.
10. Reflow soldering, characterized in that it comprises a heating module according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920757204.8U CN210231841U (en) | 2019-05-23 | 2019-05-23 | Heating module and reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920757204.8U CN210231841U (en) | 2019-05-23 | 2019-05-23 | Heating module and reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210231841U true CN210231841U (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920757204.8U Active CN210231841U (en) | 2019-05-23 | 2019-05-23 | Heating module and reflow soldering |
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| Country | Link |
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| CN (1) | CN210231841U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114289816A (en) * | 2021-12-10 | 2022-04-08 | 王晓娜 | Assembling system for welding patch element |
-
2019
- 2019-05-23 CN CN201920757204.8U patent/CN210231841U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114289816A (en) * | 2021-12-10 | 2022-04-08 | 王晓娜 | Assembling system for welding patch element |
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