CN210223785U - Metallized film with wave section - Google Patents
Metallized film with wave section Download PDFInfo
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- CN210223785U CN210223785U CN201921600559.2U CN201921600559U CN210223785U CN 210223785 U CN210223785 U CN 210223785U CN 201921600559 U CN201921600559 U CN 201921600559U CN 210223785 U CN210223785 U CN 210223785U
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- film
- vapor deposition
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- wave
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Abstract
The utility model discloses a metallized film with wave section, including the base film, the upper and lower surface of base film has evaporated first metal vapor deposition film and second metal vapor deposition film respectively, first metal vapor deposition film includes two first side vapor deposition films, and two first side vapor deposition films set up and form the first edge that is located the base film upper surface at an interval each other, the second metal vapor deposition film includes two second side vapor deposition films, and two second side vapor deposition films set up and form the second edge that is located the base film upper surface at an interval each other; wherein, first metal vapor deposition membrane and second metal vapor deposition membrane all have the wave and cut, the wave is cut and is located the top surface of first metal vapor deposition membrane and second metal vapor deposition membrane and form the wave edge, the utility model aims to provide a metallized film that the tangent plane is divided to the wave has, can be applicable to electric capacity, makes its performance requirement that can satisfy high frequency heavy current.
Description
Technical Field
The utility model relates to a condenser technical field especially relates to a metallized film with wave divides tangent plane.
Background
With the rapid development of the electronic industry and information technology, the market demand of the thin film capacitor is increasing, and the requirements on the structure, technical performance and reliability level of the capacitor, and the performance indexes of high voltage resistance, high current resistance, high frequency loss resistance and the like are continuously improved. The metallized film is a process of evaporating metal into gas to deposit on the surface of a film substrate under vacuum condition and high temperature to form a composite film.
At present, the high-voltage, high-current and high-frequency resistant film capacitor which is mainstream at home adopts an inner-series single-sided metallization structure, and is formed by matching a layer of single-sided aluminized metallization single-edge film and another layer of single-sided aluminized metallization double-edge film, so that the voltage resistance of the capacitor can be improved, but the performance requirement of high-frequency and large current cannot be met.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a metallized film with wave divides tangent plane can be applicable to electric capacity, makes its performance requirement that can satisfy high frequency heavy current.
In order to achieve the above purpose, the technical scheme of the utility model has:
a metallized film with a wavy section comprises a base film, wherein the upper surface and the lower surface of the base film are respectively coated with a first metal vapor-deposited film and a second metal vapor-deposited film, the first metal vapor-deposited film comprises two first side vapor-deposited films, the two first side vapor-deposited films are arranged at intervals and form a first remaining edge on the upper surface of the base film, the second metal vapor-deposited film comprises two second side vapor-deposited films, and the two second side vapor-deposited films are arranged at intervals and form a second remaining edge on the upper surface of the base film;
the first metal evaporation coating film and the second metal evaporation coating film are both provided with wavy slits, and the wavy slits are positioned on the top surfaces of the first metal evaporation coating film and the second metal evaporation coating film to form wavy edges.
Further, the projection positions of the first reserved edge and the second reserved edge on the base film are overlapped.
Furthermore, the section of the wave slitting is in a positive-sine wave shape, the amplitude size of the wave slitting is 0.2-0.45 mm, and the wavelength size of the wave slitting is 2-3.5 mm.
Further, the first metal deposition film and the second metal deposition film are zinc, aluminum or zinc-aluminum alloy.
The utility model discloses a metallized film with tangent plane is divided to wave evaporates respectively to have plated first metal vapor deposition membrane and second metal vapor deposition membrane on the base film on the surface, and forms first margin and second margin on the base film, adopts this internal string structure to improve the high pressure resistance ability of the condenser of using this metallized film, and states first metal vapor deposition membrane and second metal vapor deposition membrane and all have the wave and cut, the wave is cut and is located the top surface of first metal vapor deposition membrane and second metal vapor deposition membrane and form the wave edge, through the structural design who cuts the wave, has effectively increased the marginal area of contact of metal coating, strengthens its overcurrent ability, and then makes the condenser of using this metal flower membrane can satisfy the performance requirement of high frequency heavy current.
Drawings
FIG. 1 is a schematic structural view of a metallized film having a wavy section;
fig. 2 is a schematic side view of the first metal vapor-deposited film or the second metal vapor-deposited film.
Detailed Description
The metallized film with wave section of the invention is described with the attached drawings.
As shown in fig. 1 or fig. 2, as a preferred embodiment of the present invention:
a metallized film with wave slitting 6 surfaces comprises a base film 1, wherein the upper surface and the lower surface of the base film 1 are respectively coated with a first metal vapor deposition film 2 and a second metal vapor deposition film 3, the first metal vapor deposition film 2 comprises two first side vapor deposition films 21, the two first side vapor deposition films 21 are arranged at intervals and form a first remaining edge 4 positioned on the upper surface of the base film 1, the second metal vapor deposition film 3 comprises two second side vapor deposition films 31, and the two second side vapor deposition films 31 are arranged at intervals and form a second remaining edge 5 positioned on the upper surface of the base film 1;
the first metal deposition film 2 and the second metal deposition film 3 both have a wavy cut 6, and the wavy cut 6 is located on the top surfaces of the first metal deposition film 2 and the second metal deposition film 3 to form a wavy edge.
Preferably, the metallized film sets up to two-sided structure, as the embodiment of the utility model discloses, first side evaporated film 21 and second side evaporated film set up respectively on the upper and lower surface of base film 1, can increase the thickness of metallized film relatively.
Further preferably, the wave-shaped slits 6 are arranged to further increase the thickness of the coating, so that the coating can bear higher overcurrent capacity, and the arrangement of the first remaining edge 4 and the second remaining edge 5 enables the metallized film to have the performance of average partial pressure, so that the voltage resistance is improved.
Further preferably, the width of the first side evaporated film 21 is set to be M1, and the width of the first remaining edge 4 is set to be a1, wherein the width of each first side evaporated film 21 is equal; setting the width of the second side edge evaporation film to be M2, and the width of the second remaining edge 5 to be A2, wherein the width of each second side edge evaporation film is equal;
the following conditions are satisfied, namely A1-A2:
the first remaining edge 4 and the second remaining edge 5 are superposed on the projection position of the base film 1, and the first remaining edge 4 and the second remaining edge 5 are identical in position and equal in width.
Meanwhile, each first side edge vapor deposition film 21 and each second side edge vapor deposition film are arranged in an equal width manner, so that an arc discharge effect caused by the metallized film in a high-voltage environment can be avoided.
The cross section of the wave slitting part 6 is in a positive-sine wave shape, the amplitude size is 0.2-0.45 mm, and the wavelength size is 2-3.5 mm, so that the application requirement is met.
Preferably, in order to improve the ability of metallized film to withstand ultra-high voltage, can be with metallized film set to many interior cluster structures, first side coating by vaporization 21 or the impartial interval of second side coating by vaporization are provided with many promptly.
The first metal deposition film 2 and the second metal deposition film 3 are made of zinc, aluminum or zinc-aluminum alloy, meet application requirements and are used for adapting to different use conditions.
The utility model discloses a metallized film with 6 faces are cut to wave evaporates respectively and has plated first metal vapor deposition membrane 2 and second metal vapor deposition membrane 3 on base film 1 lower surface, and forms first margin 4 and second margin 5 on base film 1, adopts this interior string structure to improve the high pressure resistant ability of the condenser of using this metallized film, just states first metal vapor deposition membrane 2 and second metal vapor deposition membrane 3 and all has the wave and cuts 6, 6 are cut to the wave and form the wave edge on the top surface that is located first metal vapor deposition membrane 2 and second metal vapor deposition membrane 3, cut 6 structural design through the wave, have effectively increased the marginal area of contact of metal coating, strengthen its overcurrent ability, and then make the condenser of using this metal flower membrane can satisfy the performance requirement of high frequency heavy current.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (4)
1. A metallized film with a wavy section comprises a base film and is characterized in that the upper surface and the lower surface of the base film are respectively coated with a first metal vapor-deposited film and a second metal vapor-deposited film, the first metal vapor-deposited film comprises two first side vapor-deposited films, the two first side vapor-deposited films are arranged at intervals and form a first remaining edge on the upper surface of the base film, the second metal vapor-deposited film comprises two second side vapor-deposited films, and the two second side vapor-deposited films are arranged at intervals and form a second remaining edge on the upper surface of the base film;
the first metal evaporation coating film and the second metal evaporation coating film are both provided with wavy slits, and the wavy slits are positioned on the top surfaces of the first metal evaporation coating film and the second metal evaporation coating film to form wavy edges.
2. The metallized film of claim 1, wherein the first margin coincides with a projected position of the second margin on the base film.
3. The metallized film of claim 1, wherein the cross section of the wave slits is in the shape of a positive sine wave, and the amplitude dimension of the wave is 0.2-0.45 mm, and the wavelength dimension of the wave is 2-3.5 mm.
4. The metallized film of claim 1, wherein the first metal deposited film and the second metal deposited film are zinc, aluminum, or a zinc-aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921600559.2U CN210223785U (en) | 2019-09-25 | 2019-09-25 | Metallized film with wave section |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921600559.2U CN210223785U (en) | 2019-09-25 | 2019-09-25 | Metallized film with wave section |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210223785U true CN210223785U (en) | 2020-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921600559.2U Active CN210223785U (en) | 2019-09-25 | 2019-09-25 | Metallized film with wave section |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210223785U (en) |
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2019
- 2019-09-25 CN CN201921600559.2U patent/CN210223785U/en active Active
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