CN210222093U - A tool for mobile phone motherboard probe module test - Google Patents
A tool for mobile phone motherboard probe module test Download PDFInfo
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- CN210222093U CN210222093U CN201920893654.XU CN201920893654U CN210222093U CN 210222093 U CN210222093 U CN 210222093U CN 201920893654 U CN201920893654 U CN 201920893654U CN 210222093 U CN210222093 U CN 210222093U
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- probe module
- probe
- mobile phone
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- mainboard
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Abstract
The utility model discloses a tool for mobile phone motherboard probe module test, including tool body, lower faller, probe module, mainboard limiting plate, lower faller sets up on the tool body; the mainboard limiting plate is arranged on the lower needle plate and used for mounting a mobile phone mainboard; the probe module is embedded on the mainboard limiting plate and the lower needle plate, and the installation position of the probe module corresponds to the connector on the mobile phone mainboard; the probe module is provided with a probe which is used for contacting with a connector on a mobile phone mainboard. The utility model discloses simple structure effectively saves working space, raises the efficiency, long service life.
Description
Technical Field
The utility model relates to a test equipment technical field especially relates to
Background
The main board of the mobile phone mainly comprises electronic components and interfaces, some auxiliary electronic components and a circuit system, and as the precision degree of the processing technology is gradually improved, some standard configurations (such as a sound card, a display card, a memory, a camera and the like) need to be inserted into a component connector on the main board. In the prior art, a manual wiring mode is generally adopted when the element connector on the mobile phone mainboard is tested, and the testing method has short service life and low efficiency.
Disclosure of Invention
Not enough to prior art exists, the utility model aims at providing a tool for mobile phone motherboard probe module test just, simple structure effectively saves working space, raises the efficiency, long service life.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a jig for testing a probe module of a mobile phone mainboard comprises a jig body, a lower needle plate, a probe module and a mainboard limiting plate, wherein the lower needle plate is arranged on the jig body; the mainboard limiting plate is arranged on the lower needle plate and used for mounting a mobile phone mainboard; the probe module is embedded on the mainboard limiting plate and the lower needle plate, and the installation position of the probe module corresponds to the connector on the mobile phone mainboard; the probe module is provided with a probe which is used for contacting with a connector on a mobile phone mainboard.
As a preferred scheme, a first probe module mounting groove is formed in the lower needle plate, and a second probe module mounting groove is formed in the main plate limiting plate; the second probe module mounting groove corresponds to the first probe module mounting groove and is arranged in the second probe module mounting groove and the first probe module mounting groove.
As a preferred scheme, the probe module comprises a first mounting plate, a second mounting plate, a third mounting plate and a contact plate which are fixedly connected in sequence from bottom to top through bolts, wherein a probe base is arranged on the second mounting plate; the bottom end of the probe is vertically connected with the probe base, and the top end of the probe passes through the third mounting plate and the contact plate to extend into a test probe; the third mounting plate is provided with a probe accommodating part, and the contact plate is provided with a connecting clamp part.
As a preferred scheme, first mounting panel sets up in first probe module mounting groove, second mounting panel and third mounting panel set up in second probe module mounting groove.
As an optimal scheme, the mainboard limiting plate is provided with a mainboard limiting part for containing a mobile phone mainboard, and the height of the mainboard limiting part is higher than that of the probe module.
As a preferred scheme, still be provided with the counterpoint board on the tool body, be provided with the guide shaft copper sheathing on this counterpoint board.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure effectively saves working space, raises the efficiency, long service life.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic structural diagram of a probe module according to the present invention;
fig. 3 is an exploded view of the probe module according to the present invention.
Detailed Description
The invention will be further described with reference to specific embodiments. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example (b):
as shown in fig. 1 to 3, a jig for testing a probe module of a mobile phone motherboard comprises a jig body 1, a lower needle plate 2, a probe module 3 and a motherboard limiting plate 4, wherein the lower needle plate 2 is arranged on the jig body 1; the mainboard limiting plate 4 is arranged on the lower needle plate 2 and used for mounting a mobile phone mainboard; the probe module 3 is embedded on the mainboard limiting plate 4 and the lower needle plate 2, and the installation position of the probe module 3 corresponds to a connector on a mobile phone mainboard; and the probe module 3 is provided with a probe 5 which is used for contacting with a connector on a mobile phone mainboard.
Specifically, the lower needle plate 2 is provided with a first probe module mounting groove (not shown in the drawings because a component is already mounted), and the main board position limiting plate 4 is provided with a second probe module mounting groove (not shown in the drawings because a component is already mounted); the second probe module mounting groove corresponds to the first probe module mounting groove and is arranged, and the probe module 3 is arranged in the second probe module mounting groove and the first probe module mounting groove.
More specifically, the probe module 3 includes a first mounting plate 32, a second mounting plate 33, a third mounting plate 34, and a contact plate 35, which are fixedly connected in sequence from bottom to top through a bolt 31, and a probe base 36 is arranged on the second mounting plate 33; the bottom end of the probe 5 is vertically connected with the probe base 36, and the top end of the probe 5 passes through the third mounting plate 34 and the contact plate 35 to extend into a test probe 51; the third mounting plate 34 is provided with a probe receiving portion 37, and the contact plate 35 is provided with a connection locking portion 38.
Further, the test probe 51 is used for contacting with the connector of the mobile phone motherboard, the probe accommodating portion 37 is used for accommodating the main body of the probe 5, the contact plate 35 is attached to the connector of the mobile phone motherboard, and the connection clamping portion 38 is used for clamping with the connector of the mobile phone motherboard.
More specifically, the first mounting plate 32 is disposed in a first probe module mounting groove, and the second mounting plate 33 and the third mounting plate 34 are disposed in a second probe module mounting groove.
More specifically, be provided with the spacing portion 41 of mainboard that is used for holding the cell-phone mainboard on the mainboard limiting plate 4, the height that highly is higher than probe module 3 of this spacing portion 41 of mainboard.
Further, when the mobile phone motherboard is discharged, the motherboard is placed into the motherboard limiting portion 41, and the connector on the mobile phone motherboard is inserted into the probe module 3, and the test probe 51 contacts with the connector on the mobile phone motherboard.
Specifically, the jig body 1 is further provided with a counterpoint plate 6, and the counterpoint plate 6 is provided with a guide shaft copper bush 61.
Furthermore, the design of the guide shaft copper sleeve 61 is adopted, so that the upper needle plate and the lower needle plate 2 are accurately aligned.
During concrete implementation, put into the tool or put into the tool with mobile phone motherboard through the manipulator through the manual work with mobile phone motherboard, the last connector of mobile phone motherboard contacts with probe 5 on the probe module 3, then puts into testing arrangement with the tool and tests mobile phone motherboard, has replaced the mode of the artifical winding displacement of prior art, and same kind of mobile phone motherboard adopts same kind of tool, has prolonged life and efficiency of software testing, convenient batch test.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (6)
1. The utility model provides a tool that is used for mobile phone motherboard probe module to test which characterized in that: the jig comprises a jig body, a lower needle plate, a probe module and a mainboard limiting plate, wherein the lower needle plate is arranged on the jig body; the mainboard limiting plate is arranged on the lower needle plate and used for mounting a mobile phone mainboard; the probe module is embedded on the mainboard limiting plate and the lower needle plate, and the installation position of the probe module corresponds to the connector on the mobile phone mainboard; the probe module is provided with a probe which is used for contacting with a connector on a mobile phone mainboard.
2. The tool that is used for mobile phone motherboard probe module group to test of claim 1, characterized in that: a first probe module mounting groove is formed in the lower needle plate, and a second probe module mounting groove is formed in the main board limiting plate; the second probe module mounting groove corresponds to the first probe module mounting groove and is arranged in the second probe module mounting groove and the first probe module mounting groove.
3. The tool that is used for mobile phone motherboard probe module group to test of claim 2, its characterized in that: the probe module comprises a first mounting plate, a second mounting plate, a third mounting plate and a contact plate which are fixedly connected from bottom to top in sequence through bolts, wherein a probe base is arranged on the second mounting plate; the bottom end of the probe is vertically connected with the probe base, and the top end of the probe passes through the third mounting plate and the contact plate to extend into a test probe; the third mounting plate is provided with a probe accommodating part, and the contact plate is provided with a connecting clamp part.
4. The tool that is used for mobile phone motherboard probe module group to test of claim 3, its characterized in that: the first mounting plate is arranged in the first probe module mounting groove, and the second mounting plate and the third mounting plate are arranged in the second probe module mounting groove.
5. The tool that is used for mobile phone motherboard probe module group to test of claim 1, characterized in that: the mainboard limiting plate is provided with a mainboard limiting part for containing a mobile phone mainboard, and the height of the mainboard limiting part is higher than that of the probe module.
6. The tool that is used for mobile phone motherboard probe module group to test of claim 1, characterized in that: still be provided with the counterpoint board on the tool body, be provided with the guide shaft copper sheathing on this counterpoint board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920893654.XU CN210222093U (en) | 2019-06-14 | 2019-06-14 | A tool for mobile phone motherboard probe module test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920893654.XU CN210222093U (en) | 2019-06-14 | 2019-06-14 | A tool for mobile phone motherboard probe module test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210222093U true CN210222093U (en) | 2020-03-31 |
Family
ID=69932103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920893654.XU Active CN210222093U (en) | 2019-06-14 | 2019-06-14 | A tool for mobile phone motherboard probe module test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210222093U (en) |
-
2019
- 2019-06-14 CN CN201920893654.XU patent/CN210222093U/en active Active
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 788 Tangjiahu Avenue, Wujiang District, Suzhou City, Jiangsu Province 215000 Patentee after: SUZHOU LD ROBOT CO.,LTD. Address before: Building 3, Wujiang Taihu New Town Science and Technology Park, No. 18, Suzhou River Road, Wujiang District, Suzhou City, Jiangsu Province, 215000 Patentee before: SUZHOU LD ROBOT CO.,LTD. |