CN210183783U - Temperature-uniforming plate device with integrated radiator - Google Patents

Abstract

The utility model discloses a heat-equalizing plate device with an integrated radiator, which belongs to the technical field of heat-equalizing plates, and particularly relates to a heat-equalizing plate device with an integrated radiator, which comprises a heat-equalizing plate main body, wherein the radiator is arranged at the bottom of the heat-equalizing plate main body, the heat-radiating capacity of the heat-equalizing plate can be further improved, the heat-radiating efficiency is improved, a water tank is arranged on the left side wall of the heat-radiating plate main body, a water pump is arranged in the water tank and is communicated with a bent heat-radiating pipe, water in the water tank can be pumped into the heat-radiating pipe through the water pump to form a water circulation to absorb heat in the radiator, the heat-radiating efficiency is improved, and a temperature sensor and a controller which are matched are arranged, the temperature sensor can detect the temperature in the heat-equalizing plate, the detected temperature data are transmitted to the controller, when the temperature data are higher than the temperature data set in, the water pump is controlled to be started, and full-automatic intelligent heat dissipation is achieved.

Description

Temperature-uniforming plate device with integrated radiator

Technical Field

The utility model relates to a temperature-uniforming plate technical field specifically is a temperature-uniforming plate device with integrative radiator.

Background

With the progress of semiconductor technology, the instruction cycle of the components inside the electronic product is greatly increased, and the generated heat is also greatly increased, so that the heat generated by the electronic component needs to be dissipated to the electronic product by using a temperature equalizing plate or a radiator to control the working temperature and maintain the normal operation of the electronic component.

SUMMERY OF THE UTILITY MODEL

This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.

In view of the problems existing in the prior temperature equalizing plate, the utility model discloses.

Therefore, the utility model aims at providing a vapor chamber device with an integrated radiator, which can further improve the heat dissipation capability of the vapor chamber by arranging the radiator at the bottom of the vapor chamber main body and improve the heat dissipation efficiency, by arranging a water tank on the left side wall of the radiator main body, a water pump is arranged in the water tank and communicated with a bent radiating pipe, water in the water tank can be pumped into the radiating pipe by the water pump to form a water circulation to absorb heat in the radiator, thereby improving the heat dissipation efficiency, and by installing a temperature sensor and a controller which are matched with each other, the temperature sensor can detect the temperature in the vapor chamber and transmit the detected temperature data to a controller, when the temperature data is higher than the temperature data set in the controller, the controller can send a control instruction to the water pump to control the water pump to be started, realize full-automatic intelligent heat dissipation.

For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:

a vapor plate device with integral heat sink, comprising: the utility model provides a temperature-uniforming plate, including temperature-uniforming plate main part, radiating fin, water tank, temperature sensor, controller and radiator, the inner chamber equidistance of temperature-uniforming plate main part is provided with a plurality of radiating fin, set up in the middle of the left side wall of temperature-uniforming plate main part the water tank, the inner chamber right side wall top of water tank is provided with the water pump, the output of water pump is provided with the cooling tube, the cooling tube is the form of bending, the other end of cooling tube communicates in the right side wall bottom of water tank, the inner chamber top of temperature-uniforming plate main part sets up temperature sensor, set up in the middle of the right side wall of temperature-uniforming plate main part the controller, set up in the middle of the bottom of temperature-uniforming plate main part the radiator.

As a preferred scheme of a vapor chamber device with integrative radiator, wherein: the left side wall and the right side wall of the bottom of the temperature equalizing plate main body are symmetrically provided with two suckers, and the suckers are rubber suckers.

As a preferred scheme of a vapor chamber device with integrative radiator, wherein: the radiator is characterized in that a motor is arranged at the top of an inner cavity of the radiator, a rotating shaft is arranged at the middle of the bottom of the motor and on an output end, fan blades are arranged at the bottom end of the outer wall of the circumference of the rotating shaft, and two air channels are symmetrically formed in the left side wall and the right side wall of the top of the radiator.

As a preferred scheme of a vapor chamber device with integrative radiator, wherein: every two adjacent radiating fins are equally provided with three connecting pieces at equal intervals, and the connecting pieces are copper connecting pieces.

Compared with the prior art, the beneficial effects of the utility model are that: the bottom through at the temperature-uniforming plate main part is provided with the radiator, the heat-sinking capability of improvement temperature-uniforming plate that can step forward, the radiating efficiency has been improved, be provided with the water tank through the left side wall in the radiator main part, be provided with the water pump in the water tank, and the intercommunication has the cooling tube of the form of bending, can take out the water in the water tank to the cooling tube through the water pump, form a hydrologic cycle, absorb the inside heat of radiator, the radiating efficiency has been improved, and through installing matched with temperature sensor and controller, temperature sensor can detect the inside temperature of temperature-uniforming plate, and give the controller with the temperature data transmission who detects, when temperature data is higher than the temperature data who sets up in the controller, the controller will send control command to the water pump, the control water pump is opened, realize full-automatic intelligence heat.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the connecting sheet of the present invention;

fig. 3 is a schematic view of the heat sink of the present invention.

In the figure: the air conditioner includes a uniform temperature plate main body 100, a suction cup 110, a heat radiating fin 200, a connecting sheet 210, a water tank 300, a water pump 310, a heat radiating pipe 320, a temperature sensor 400, a controller 500, a heat radiator 600, a motor 610 and an air duct 620.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

The utility model provides a following technical scheme: a temperature-uniforming plate device with an integrated radiator comprises a temperature-uniforming plate main body 100, radiating fins 200, a water tank 300, a temperature sensor 400, a controller 500 and a radiator 600;

referring to fig. 1, the vapor chamber main body 100 includes two suction cups 110, the two suction cups 110 are respectively adhered to the left and right side walls of the bottom of the vapor chamber main body 100, the vapor chamber main body 100 is used for dissipating heat of an external device placed on the top of the vapor chamber main body, the suction cups 110 are used for conveniently adsorbing and fixing the vapor chamber main body 100, the vapor chamber main body 100 is made of copper, and the suction cups 110 are rubber suction cups;

referring to fig. 1 and 2, the heat dissipating fins 200 include connecting pieces 210, the heat dissipating fins 200 are equidistantly welded in an inner cavity of the heat sink body 100, the connecting pieces 210 are equidistantly welded between two adjacent heat dissipating fins 200, the heat dissipating fins 200 are used for absorbing heat and dissipating the heat to dissipate heat of external equipment, the connecting pieces 210 are used for increasing contact areas of the heat dissipating fins 200 and the heat, and improving heat dissipating efficiency, and the heat dissipating fins 200 and the connecting pieces 210 are both made of copper;

referring to fig. 1 again, the water tank 300 includes a water pump 310 and a heat dissipating pipe 320, the water tank 300 is screwed to the middle of the left sidewall of the temperature uniforming plate body 100, the water pump 310 is screwed to the middle of the right sidewall of the inner cavity of the water tank 300, one end of the heat dissipating pipe 320 is communicated with the output end of the water pump 310, the other end is communicated with the water tank 300, the water tank 300 is used for storing water, the water pump 310 is used for pumping out water in the water tank 300 through the heat dissipating pipe 320 and absorbing heat by circulating inside the temperature uniforming plate body 100, the water tank 300 is made of PC material, and the;

referring to fig. 1 again, the temperature sensor 400 is screwed to the top of the inner cavity of the temperature-uniforming plate main body 100, the temperature sensor 400 is used for detecting the temperature data inside the temperature-uniforming plate main body 100 and transmitting the temperature data to the controller 500, and the temperature sensor 400 is specifically a temperature sensor with a model of LM-400;

referring to fig. 1 again, the controller 500 is screwed in the middle of the right side wall of the temperature-uniforming plate main body 100, the controller 500 is used for receiving the temperature data transmitted by the temperature sensor 400, comparing and converting the temperature data, and sending a control instruction to the water pump 310, and the controller 500 is a single chip microcomputer of the model STM 32;

referring to fig. 1 and 3, the heat sink 600 includes a motor 610, a rotating shaft, fan blades and two air ducts 620, the heat sink 600 is screwed in the middle of the bottom of the main body 100 of the temperature-uniforming plate, the motor 610 is screwed in the middle of the top of the inner cavity of the heat sink 600, the rotating shaft is screwed in the output end of the motor 610, the fan blades are welded at the bottom end of the outer circumferential wall of the rotating shaft, the number of the air ducts 620 is two, the two air ducts are symmetrically arranged on the left and right side walls of the top of the heat sink 600, the motor 610 is used for driving the fan blades to rotate through the rotating shaft to generate wind power to dissipate heat the bottom of the main body 100 of the temperature-uniforming plate, the air ducts 620 are convenient for air suction.

The working principle is as follows: a notebook computer or other heat-prone devices are placed on the top of the temperature-uniforming plate main body 100 by a person skilled in the art, the heat of the heat-prone devices is absorbed by the heat dissipation fins 200 in the temperature-uniforming plate main body 100, the heat sink 600 at the bottom of the temperature-uniforming plate main body 100 can dissipate the heat of the bottom of the temperature-uniforming plate main body 100 by using wind power generated by the rotation of the rotating shaft and the fan blades driven by the motor 610, the temperature sensor 400 detects the temperature data in the temperature-uniforming plate main body 100 and transmits the detected data to the controller 500, when the internal temperature of the temperature-uniforming plate main body 100 is higher than the data set in the controller 500, the controller 500 sends a control instruction to the water pump 310 to control the water pump 310 to be opened, the water pump 310 pumps out the water in the water tank 300 and circulates in the bent heat;

referring to fig. 1 again, in order to facilitate the fixing of the vapor chamber main body 100 to an external device, two suckers 110 are symmetrically disposed on the left and right sidewalls of the bottom of the vapor chamber main body 100;

referring to fig. 2 again, in order to increase the heat absorption efficiency, three copper connection plates 210 are equidistantly disposed between every two adjacent heat dissipation fins 200.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (4)

1. A vapor chamber device with an integrated heat sink is characterized in that: including temperature-uniforming plate main part (100), radiating fin (200), water tank (300), temperature sensor (400), controller (500) and radiator (600), the inner chamber equidistance of temperature-uniforming plate main part (100) is provided with a plurality of radiating fin (200), set up in the middle of the left side wall of temperature-uniforming plate main part (100) water tank (300), the inner chamber right side wall top of water tank (300) is provided with water pump (310), the output of water pump (310) is provided with cooling tube (320), cooling tube (320) are for bending the form, the other end of cooling tube (320) communicates in the right side wall bottom of water tank (300), the inner chamber top of temperature-uniforming plate main part (100) sets up temperature sensor (400), set up in the middle of the right side wall of temperature-uniforming plate main part (100) controller (500), set up in the middle of the bottom of temperature-uniforming plate main part (100) radiator (600), the temperature sensor (400) is electrically connected to the controller (500), and the controller (500) is electrically connected to the water pump (310).

2. A vapor plate device with integral heat sink as recited in claim 1 wherein: the left side wall and the right side wall of the bottom of the temperature equalizing plate main body (100) are symmetrically provided with two suckers (110), and the suckers are rubber suckers.

3. A vapor plate device with integral heat sink as recited in claim 1 wherein: the inner chamber top of radiator (600) is provided with motor (610), be provided with the pivot in the middle of the bottom of motor (610) on the output, the circumference outer wall bottom of pivot is provided with the flabellum, the top left and right sides wall symmetry of radiator (600) is opened there are two wind channels (620).

4. A vapor plate device with integral heat sink as recited in claim 1 wherein: every two adjacent radiating fins (200) are equidistantly provided with three connecting pieces (210), and the connecting pieces (210) are copper connecting pieces.

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