CN210176973U

CN210176973U - Nickel plating tank for improving solution stability

Info

Publication number: CN210176973U
Application number: CN201920889931.XU
Authority: CN
Inventors: Meixing Pang; 庞美兴
Original assignee: Suzhou Preet Electronics Technology Co ltd
Current assignee: Suzhou Preet Electronics Technology Co ltd
Priority date: 2019-06-13
Filing date: 2019-06-13
Publication date: 2020-03-24
Anticipated expiration: 2029-06-13

Abstract

The utility model provides an improve nickel plating bath of solution stability has at first set up the nickel plating bath body, is equipped with the water inlet and the delivery port that supply solution business turn over in it, and water inlet mechanism includes the water flow dispersion board, has seted up a plurality of through-holes on the water flow dispersion board, wears to be equipped with the water guide sleeve in the through-hole, and the water flow dispersion board covers the water inlet. The utility model discloses compare in prior art can control the water intake speed of water inlet, improve the stability of this internal solution of nickel plating bath.

Description

Nickel plating tank for improving solution stability

Technical Field

The utility model relates to an electroplating pool particularly, relates to a nickel plating bath that improves solution stability.

Background

The electroplating process is a method for laying a layer of metal on a conductor by utilizing the principle of electrolysis. Electroplating is a surface processing method in which cations of a pre-plated metal in a plating solution are deposited on the surface of a base metal by electrolysis using the base metal to be plated as a cathode in a salt solution containing the pre-plated metal to form a plating layer. The plating performance is different from that of the base metal, and has new characteristics. The coating can be divided into protective coating, decorative coating and other functional coatings according to the functions of the coating, and can enhance the corrosion resistance of metal, increase the hardness, prevent abrasion, improve the conductivity, smoothness, heat resistance and beautify the surface.

The water inlet in the current electroplating pool is not provided with a speed control device, so that a water inlet speed control device is needed to improve the stability of the solution in the electroplating pool.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides an improve nickel plating bath of solution stability can control the water intake speed of water inlet, improves the stability of this internal solution of nickel plating bath.

Therefore, the utility model provides an improve nickel plating bath of solution stability has at first set up the nickel plating bath body, is equipped with the water inlet and the delivery port that supply solution business turn over in it, and water inlet mechanism includes the water flow dispersion board, has seted up a plurality of through-holes on the water flow dispersion board, wears to be equipped with the water guide sleeve in the through-hole, and the water flow dispersion board covers the water inlet.

Furthermore, a plurality of through holes are evenly distributed on the surface of the water flow dispersion plate.

Further, the rivers dispersion board is the arc, and it wraps up the water inlet.

Further, the water guide sleeves are perpendicular to the water flow dispersion plate.

Further, the water guide sleeve is detachably arranged in the through hole.

Furthermore, the opposite sides of the through hole are provided with clamping grooves, the opposite sides of the water guide sleeve are connected with buckles, and the buckles are clamped in the clamping grooves.

Further, the water outlet end of the water guide sleeve is detachably provided with a filter screen.

Furthermore, the filter screen is sleeved at the water outlet end of the water guide sleeve and is fastened through the rubber sleeve.

The utility model provides an improve nickel plating bath of solution stability, mainly set up the nickel plating bath body and installed in the water inlet mechanism of water inlet, from the effect, water inlet mechanism can name the reposition of redundant personnel mechanism, as the name suggests, it is used for the solution that the dispersion water inlet was emptyd, reach the effect that slows down the velocity of flow, water inlet mechanism includes the rivers dispersion board again and sets up a plurality of through-holes on the dispersion board, the guide pin bushing of through-hole department plays the effect of direction guide to rivers, make each direction in the rivers dispersion flow direction nickel plating bath, improve the uniformity of each department solution in the nickel plating bath.

Therefore, compared with the prior art, the structure has the following advantages:

1. the water inlet speed of the water inlet is controlled, and the stability of the solution in the nickel plating bath body is improved.

2. The stability of the metal surface chemical reaction is improved.

3. Filtering the impurities in the solution and improving the quality of the solution.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

fig. 1 is a schematic structural diagram of a nickel plating bath for improving solution stability provided by an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a nickel plating bath for improving solution stability provided by an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a water flow dispersing plate in a nickel plating bath for improving solution stability provided by an embodiment of the utility model.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The first embodiment is as follows:

referring to fig. 1 to 3, the embodiment of the present invention provides a nickel plating bath with improved solution stability, which comprises a nickel plating bath body 1, a water inlet and a water outlet for the solution to pass through, a water inlet mechanism 2 installed on the water inlet, a water flow dispersing plate 21, a plurality of through holes 22 installed on the water flow dispersing plate 21, a water guide sleeve 23 installed in the through holes 22, and a water inlet covered by the water flow dispersing plate 21.

Referring to fig. 1 to 3, a plurality of through-holes 22 evenly distributed is on the surface of water flow dispersion board 21, water flow dispersion board 21 is the arc, its parcel water inlet, a plurality of water guide sleeve 23 all are perpendicular to water flow dispersion board 21, water guide sleeve 23 detachably installs in through-hole 22, draw-in groove 221 has been seted up to the relative both sides of through-hole 22, the relative both sides of water guide sleeve 23 are connected with buckle 231, buckle 231 joint is in draw-in groove 221, filter screen 3 is installed to water outlet end detachably of water guide sleeve 23, filter screen 3 suit is in the water outlet end of water guide sleeve 23 and is fastened through rubber sleeve 31.

Further, the flow distribution principle of the present invention is explained in more detail: in the first embodiment, the through holes are uniformly distributed on the surface of the water flow dispersion plate, the water guide sleeve is detachably arranged in the through holes, the filter screen is sleeved at the water outlet end of the water guide sleeve, the through holes distributed in a plurality of ways play a role of one-time flow splitting, the filter screen plays a role of two-time flow splitting, the water guide sleeve arranged at the through holes is perpendicular to the arc-shaped water flow dispersion plate, the water guide sleeve is of a divergent structure and plays a role of guiding water flow to disperse and flow out, the filter screen can filter impurities in a solution while splitting, and the quality of the solution is further improved.

2. The stability of the metal surface chemical reaction is improved.

Example two:

referring to fig. 1 to fig. 3, a nickel plating bath for improving solution stability according to an embodiment of the present invention is shown, and the present embodiment further makes the following technical solutions as improvements on the basis of the above embodiments: the water flow dispersion plate 21 is provided with a plurality of through holes 22, the through holes 22 form a first flow distribution area, a second flow distribution area and a third flow distribution area on the water flow dispersion plate 21, the three areas are sequentially arranged from the center of the water flow dispersion plate 21 to the outer ring, the size of the through hole 22 in the third flow distribution area is the largest, and the size of the through hole 22 in the first flow distribution area is the smallest.

The embodiment divides the water flow dispersion plate into three shunting areas, the shunting speed of the three shunting areas depends on the size of the through hole formed in the three shunting areas, and the closer the water inlet is, the smaller the size of the through hole is, so that the flow speed of the solution is further balanced.

Example three:

referring to fig. 1 to fig. 3, a nickel plating bath for improving solution stability according to a third embodiment of the present invention is shown, and on the basis of the above embodiments, the present embodiment further provides the following technical solutions as improvements: the plastic anchor ear is used for replacing the rubber sleeve to sleeve the filter screen on the water guide sleeve, the stability of the plastic in the chemical solution is far superior to that of the rubber sleeve, and the problem that the surface layer of the rubber sleeve is dissolved in the solution to destroy the quality of the solution is avoided.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A nickel plating bath for improving solution stability, which is characterized by comprising:

the nickel plating bath body (1) is internally provided with a water inlet and a water outlet for the solution to enter and exit;

mechanism (2) of intaking, it includes rivers dispersion board (21), a plurality of through-holes (22) have been seted up on rivers dispersion board (21), wear to be equipped with water guide sleeve (23) in through-hole (22), rivers dispersion board (21) cover the water inlet.

2. A ni-plating bath for improving solution stability according to claim 1, characterized in that said plurality of through holes (22) are evenly distributed on the surface of said water current dispersion plate (21).

3. A nickel plating bath for improving solution stability according to claim 1, characterized in that said water flow dispersing plate (21) is an arc plate, which covers said water inlet.

4. A nickel plating bath for improving solution stability according to claim 1 or 3, characterized in that a plurality of said water guiding sleeves (23) are all perpendicular to said water flow dispersing plate (21).

5. A nickel plating bath for improving solution stability according to claim 1, characterized in that said water guiding sleeve (23) is detachably mounted in said through hole (22).

6. The nickel plating bath for improving the solution stability as claimed in claim 5, wherein clamping grooves (221) are formed on two opposite sides of the through hole (22), clamping buckles (231) are connected to two opposite sides of the water guide sleeve (23), and the clamping buckles (231) are clamped in the clamping grooves (221).

7. A nickel plating bath for improving solution stability according to claim 1, characterized in that the water outlet end of the water guide sleeve (23) is detachably provided with a filter screen (3).

8. A nickel plating bath for improving the solution stability according to claim 7, characterized in that the filter screen (3) is sleeved on the water outlet end of the water guide sleeve (23) and is fastened through a rubber sleeve (31).