CN210162770U - Automatic wafer testing machine - Google Patents

Abstract

The utility model discloses a wafer automatic test machine belongs to wafer test technical field. The automatic wafer testing machine comprises a plurality of material tray devices, a plurality of testing devices and a transfer device; the plurality of material tray devices comprise material tray devices to be detected and classification material tray devices; the to-be-tested tray device is configured to bear a tray on which a to-be-tested wafer is placed; the classification tray device is configured to bear a tray on which a tested wafer is placed; the transfer device can transfer the wafers to be tested of the tray device to be tested to the test device to complete the test; the transfer device can also transfer the tested wafers to the classification tray device from the testing device. The utility model provides an automatic testing machine has realized the automatic test of wafer, has improved the efficiency and the productivity of wafer test, has reduced the intensity of labour that the operation personnel produced.

Description

Automatic wafer testing machine

Technical Field

The utility model relates to a wafer test technical field especially relates to a wafer automatic test machine.

Background

After the wafer is manufactured, the wafer is cut to form chips, so that in order to avoid the damage of the chips in the cutting process and produce unqualified products, the quality test needs to be carried out on a single chip so as to ensure the product qualification rate before the chip is packaged and avoid the increase of the later repair cost. The wafer test is performed by using a test board, and the probes on the test board contact with the wafer to complete the program test. The traditional wafer testing machine needs to manually feed and take materials, so that the labor intensity of personnel is improved, and the production efficiency and the productivity are not improved.

Therefore, it is desirable to provide an automatic wafer testing machine to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer automatic test machine can improve the efficiency of wafer test.

In order to realize the purpose, the following technical scheme is provided:

an automatic wafer testing machine comprises a plurality of tray devices, a plurality of testing devices and a plurality of transferring devices; the plurality of material tray devices comprise material tray devices to be detected and classification material tray devices; the to-be-tested tray device is configured to bear a tray on which a to-be-tested wafer is placed; the classification tray device is configured to bear a tray on which a tested wafer is placed;

the transfer device can transfer the wafers to be tested of the tray device to be tested to the test device to complete the test; the transfer device can also transfer the tested wafers to the classification tray device from the testing device.

Preferably, the tray device further comprises an empty tray device configured to carry an empty tray without wafers placed thereon; the transfer device can transfer the empty tray of the tray device to be detected to the empty tray device; the moving and carrying device can also move the empty trays carried by the empty tray device to the classification tray device.

Preferably, the empty tray device and the tray device to be tested are both provided with at least one.

Preferably, the classifying tray devices are provided in plurality, the test result of the wafer is divided into a plurality of grades, and each grade corresponds to one classifying tray device; and the tested wafers are transferred to the trays of the classified tray device representing the corresponding grades according to the test results.

Preferably, twelve charging tray devices are arranged, and twelve charging tray devices are distributed in a matrix manner; the ten sorting tray devices are arranged.

Preferably, the test device further comprises a display device configured to be capable of displaying the operation state of each device and the test result.

Preferably, the wafer automatic testing machine further comprises an electric control device, wherein the electric control device is configured to control the time sequence action of each device of the wafer automatic testing machine.

Preferably, the test device is provided in plurality, and the plurality of test devices are arranged linearly along the first direction.

Preferably, the automatic wafer testing machine further comprises a rack, wherein the rack comprises a main machine body and a bearing platform arranged on the upper portion of the main machine body, and the bearing platform is used for bearing the transfer device and the tray device.

Preferably, a U-shaped baffle is arranged around the outer side of the bearing platform to shield the tray device and the transfer device, and the testing device is arranged at the opening end of the U-shaped baffle.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model provides an automatic testing machine has realized the automatic test of wafer, has improved the efficiency and the productivity of wafer test, has reduced the intensity of labour that the operation personnel produced.

Drawings

Fig. 1 is a schematic structural diagram of an automatic wafer testing machine according to an embodiment of the present invention;

fig. 2 is a front view of an automatic wafer testing machine according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a rack according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a tray device in an embodiment of the present invention;

fig. 5 is a schematic structural view of a tray according to an embodiment of the present invention;

FIG. 6 is an enlarged view of a portion of FIG. 4 at A;

fig. 7 is a schematic structural view of a transfer device according to an embodiment of the present invention;

fig. 8 is a schematic structural view of a transfer device according to an embodiment of the present invention after removing a second substrate;

FIG. 9 is an enlarged partial view at B of FIG. 8;

fig. 10 is a schematic structural diagram of a testing apparatus according to an embodiment of the present invention;

fig. 11 is a side view of a testing device in an embodiment of the invention;

FIG. 12 is an enlarged partial view at C of FIG. 10;

fig. 13 is a schematic partial structural diagram of a testing apparatus according to an embodiment of the present invention;

fig. 14 is a schematic view of a part of a testing apparatus according to an embodiment of the present invention;

fig. 15 is a schematic view of a part of a testing apparatus according to an embodiment of the present invention.

Reference numerals:

100-material tray; 101-a groove;

1-a frame; 11-a main body; 12-a load-bearing platform; 121-through groove; 13-a baffle; 14-a carrier plate;

2-a tray device; 21-installing a top plate; 211-correlation sensor; 22-mounting a base plate; 23-a connecting rod; 24-tray support block; 25-a first drive mechanism; 251-a lifting table; 2511-a first shutter plate; 252-a drive motor; 26-a first opto-electronic switch; 27-positioning blocks; 28-a guide block; 281-a linker moiety; 282-a guide; 2821-a first guide surface; 2822-a second guide surface; 2823-locating surface;

3-a transfer device; 31-a first substrate; 311-a first slide rail; 312-a second opto-electronic switch; 32-a second substrate; 321-a second slide rail; 322-a third opto-electronic switch; 323-accommodating grooves; 33-a first drive assembly; 331-a first drive source; 332-a first capstan; 333-a first driven wheel; 334-a first conveyor belt; 335-a first belt attachment; 3351-first fixing plate; 3352-second fixing plate; 336-a first mounting frame; 34-a second drive assembly; 341-second drive source; 342-a second drive wheel; 343-a second driven wheel; 344-a second conveyor belt; 345-a second belt connector; 346-a second mounting frame; 35-a first slider; 36-a second slider; 361-a fourth light shield; 37-a suction nozzle assembly; 371-suction nozzle cylinder; 372-suction nozzle fixing plate; 373-a nozzle body; 374-pneumatic control valves; 375 — second guide bar;

4-a testing device; 40-an angle adjustment mechanism; 401-a rotating table; 402-a conditioning block; 4021-a strip groove; 403-a conditioning column; 404-adjusting rod; 405-a first helical differential head; 406-a first locking bolt; 407-locking nut; 41-a support mechanism; 411-supporting the top plate; 412-a support floor; 413-a support riser; 4131-a fourth photoelectric switch; 414-a support plate; 415-a support bar; 42-a lifting mechanism; 421-a lifting driving source; 422-first connecting plate; 43-test stand assembly; 431-test station; 432-stage; 433-positioning bar; 434-a pushing structure; 4341-push cylinder; 4342-push plate; 4343-push the thimble; 4344-third guide bar; 44-test plate assembly; 441-test board; 442-a platen; 443-a springboard; 444-limit stop piece; 45-a buffer structure; 451-buffer connecting block; 452-a buffer; 46-linear guide rail structure; 461-third slider; 462-a third slide rail; 47-displacement adjustment mechanism; 471-cross guide displacement platform; 472-second spiral differential; 473-second locking bolt; 48-a height adjustment mechanism; 481 — third helix differential head; 482-cross rail configuration; 483-fourth locking bolt; 49-a second connecting plate;

5-display device.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

Example one

Referring to fig. 1 and 2, the embodiment discloses an automatic wafer testing machine, which includes a rack 1, a transfer device 3 disposed on the rack 1, a tray device 2, a testing device 4, and a display device 5. The rack 1 is also provided with an electric control device which mainly comprises a PLC module and is used for controlling the time sequence action of each device of the integrated wafer automatic testing machine and realizing the automatic operation of wafer testing. The display device 5 is configured to display the operation status of each device and the test result, so as to facilitate manual real-time monitoring of the test process.

Specifically, referring to fig. 3, the rack 1 includes a main body 11 and a carrying platform 12 disposed on an upper portion of the main body 11, wherein the main body 11 is used for accommodating an electric control device; the bearing platform 12 is used for bearing the transfer device 3 and the tray device 2; optionally, the carrying platform 12 is made of marble material to stably support the transferring device 3 and the tray device 2. The frame 1 also comprises a baffle 13 which is arranged around the outer side of the bearing platform 12; the baffle 13 is in a U-shaped structure, so that the whole loading platform, the transfer device 3 and the tray device 2 on the loading platform can be surrounded by the baffle 13, and the transfer device 3 is prevented from being interfered by the outside or touching the tray device 2; the testing device 4 is arranged at the opening end of the U-shaped baffle 13, so that the transfer device 3 can transfer the wafer on the tray device 2 to the testing device 4 at the opening end for testing. Optionally, the rack 1 further comprises a carrier plate 14, the testing device 4 being arranged on the carrier plate 14. One end of the bearing plate 14 is detachably connected with the main machine body 11, and the other end is detachably connected with the bearing platform 12, so that the stability of the position relation between the testing device 4 and the material tray device 2 is ensured. Further, the bearing plate 14 is connected with the bearing platform 12 through a wedge-shaped reinforcing plate, so that the bearing stability of the bearing plate 14 is improved. Optionally, the display device 5 is disposed on the side wall of the main body 11 through a gimbal, so that it does not affect the testing process of the entire automatic testing machine, and can also perform flexible conversion of the placement position.

In order to improve the efficiency of wafer testing, the testing device 4 is provided in plurality, and the plurality of testing devices 4 are arranged linearly along the first direction. In this embodiment, the number of the test devices 4 is five, so that five wafers can be tested at the same time, and the wafer testing efficiency is remarkably improved; of course, in some other embodiments, the number of the test apparatuses 4 or the test apparatuses 4 in use may be further specifically limited according to the test time of each wafer and the moving speed of the transfer apparatus 3.

The tray device 2 is used for carrying a tray 100, and wafers are placed on the tray 100. The tray devices 2 are arranged in a plurality of manners, the tray devices 2 can be divided into three categories, the first category is an empty tray device and is used for bearing an empty tray without wafers, the second category is a tray device to be tested, the tray 100 borne by the empty tray device is provided with wafers which are not tested, the third category is a classified tray device, the test result of the wafer can be divided into a plurality of levels, the classified tray device is also divided into a plurality of levels according to the level of the test result, each level corresponds to one classified tray device, and the wafers which are tested are placed on the tray 100 of the classified tray device representing the corresponding level according to the test result. The arrangement of the three types of tray devices 2 enables the automatic testing machine to automatically classify and store wafers according to test results, and effectively improves the automation and intelligence of wafer testing. In this embodiment, twelve tray devices 2 are provided, and twelve tray devices 2 are optionally distributed on the carrying platform 12 in a matrix, wherein one empty tray device, one tray device to be tested, and ten tray devices for classification are provided. Certainly, in the specific implementation, the number of the classified tray devices can be specifically limited according to the grade division of the wafer test result; meanwhile, the number of the empty tray devices and the number of the tray devices to be tested are set to be at least one; the empty tray device and the tray device to be tested may be provided in plural numbers depending on the number of trays 100 that can be loaded by each tray device 2, the number of wafers that can be placed on each tray 100, and the transfer method of the transfer device 3.

In this embodiment, after all the wafers of the tray 100 carried by the tray device to be tested are taken, the remaining empty trays are transferred to the empty tray device by the transfer device 3; for the empty tray device, the empty tray loaded on the empty tray device can be transferred to the corresponding sorting tray device by the transfer device 3 for sorting and storing the tested wafers; therefore, the turnover utilization of the empty tray in the wafer testing process is realized, the utilization rate of the tray 100 is improved, and meanwhile, the testing efficiency and the intelligent degree of the automatic wafer testing are further improved. In specific implementation, when the automatic testing machine is initially started, the empty tray device is ensured to be provided with a plurality of empty trays, and the continuity of transferring the empty trays among the tray devices 2 of different types is realized.

Example two

The present embodiment provides a tray device 2 that can be used in the wafer automatic testing machine in the first embodiment. Specifically, referring to fig. 4, the tray device 2 includes a top mounting plate 21 and a bottom mounting plate 22, and optionally, the top mounting plate 21 and the bottom mounting plate 22 are spaced apart and connected by a connecting rod 23, and the connecting rod 23 is vertically disposed between the top mounting plate 21 and the bottom mounting plate 22. Further, in order to enable the automatic testing machine to test more wafers, each tray device 2 is configured to allow a plurality of trays 100 to be stacked in the vertical direction in the space between the top mounting plate 21 and the bottom mounting plate 22, and the transfer device 3 completes the reciprocating movement of the wafer located on the uppermost tray 100 between the tray device 2 and the testing device 4 or the transfer of the empty tray between the device to be tested and the empty tray device and between the empty tray device and the sorting tray device according to the instruction. Further optionally, be provided with the logical groove 121 with the same figure of charging tray device 2 on load-bearing platform 12, lead to groove 121 and run through whole load-bearing platform 12 and set up and be linked together with the main frame body 11 is inside, every leads to all to correspond in the groove 121 and sets up a charging tray device 2 for the charging tray 100 of piling up between roof 21 and mounting plate 22 can be stored in the main frame body 11, make full use of frame 1 space, compress the size of whole wafer automatic testing machine. Wherein, the mounting top plate 21 is fixedly connected with the bearing platform 12 to fix the tray device 2 and the bearing platform 12. Alternatively, the fixing means may be a bolt or a snap, but is not limited to the above. The mounting top plate 21 is a frame structure, the tray 100 is a plate structure, the tray 100 at the top is arranged in the frame structure of the mounting top plate 21, and the centers of the tray and the frame structure are superposed; optionally, the inner frames of the tray 100 and the top installation plate 21 are both rectangular structures, and four sides of the tray 100 and four sides of the inner frame of the top installation plate 21 are arranged in parallel one by one. Further, referring to fig. 5, the tray 100 is provided with a plurality of grooves 101, and the grooves 101 are used for storing wafers. Further, the wafers on the tray 100 are arranged in a matrix, so that the transfer device 3 can conveniently obtain the specific positions of the wafers and the positions to which the wafers need to be moved according to the rectangular coordinates.

Furthermore, since the plurality of stacked trays 100 are arranged on the tray device 2, when the trays 100 are rotated out or rotated into one tray 100, the overall height of the trays 100 stacked on the tray device 2 changes, in order to ensure that the transfer device 3 can complete the transfer of the wafers or the trays 100 of each tray device 2 in the horizontal plane with the same height, the uppermost tray 100 of each tray device 2 is kept in the same horizontal plane, and therefore, the tray device 2 further comprises a tray support block 24 for bearing the trays 100 and a first driving mechanism 25 for driving the tray support block 24 to ascend and descend; the trays 100 are stacked on the tray support 24 in the vertical direction, and the first driving mechanism 25 drives all the trays 100 to integrally lift. In specific implementation, when the uppermost tray 100 of the tray device 2 is transferred, the first driving mechanism 25 drives the tray 100 to move up by the height of one tray 100 as a whole, so that the next tray 100 moves to the position of the transferred tray 100, and the transfer device 3 is convenient to perform subsequent operations on a new tray 100 at the same position; when the transfer device 3 transfers a new tray 100 to a certain tray device 2, the first driving mechanism 25 drives the tray 100 to move down by one tray 100, the original tray 100 on the top is stored in the space between the top mounting plate 21 and the bottom mounting plate 22, and the transfer device 3 performs the subsequent operation on the new tray 100 on the top. Further, when a batch of wafers has been completely tested and needs to be taken out from the automatic testing machine, the tray support block 24 is lifted to the highest height by the first driving mechanism 25, and all the trays 100 stacked on top of each other can be taken out from the automatic testing machine. In this embodiment, the plane on which the optional carrier platform 12 is located is a transfer plane.

Optionally, still referring to fig. 4, the first driving mechanism 25 includes a lifting table 251 and a driving motor 252, the tray support 24 is disposed on the lifting table 251, a main body of the driving motor 252 is disposed on the mounting base plate 22, an output shaft of the driving motor 252 extends out of the mounting base plate 22 and is connected to the lifting table 251 through a screw nut structure, a nut of the screw nut structure is fixed to the lifting table 251, a lead screw of the screw nut is connected to the output shaft of the driving motor 252, and conversion from a rotary motion to a linear motion is achieved through a threaded connection between the lead screw and the nut, so that the lifting table 251 is lifted up and down, and the tray support 24 can move freely between the mounting top plate 21 and the mounting base plate 22. In some other embodiments, the first driving mechanism 25 may also adopt a cylinder lifting structure or a rack and pinion lifting structure. Optionally, in order to improve the lifting accuracy of the lifting platform 251, a first guide through hole is formed in the lifting platform 251, and a first guide rod is arranged on at least one of the mounting top plate 21 and the mounting bottom plate 22, and is arranged in the first guide through hole, so that the guide effect is realized through the relative sliding of the first guide rod in the first guide through hole. Further optionally, a first guide sleeve is arranged in the first guide through hole to ensure the smoothness in the guide process. Alternatively, in the present embodiment, the connecting rod 23 may serve as the first guide rod. Optionally, the lifting platform 251 and the tray support block 24 are integrally formed, so that the synchronism of lifting driving is facilitated.

In order to limit the descending height of the tray support block 24, a first photoelectric switch 26 is arranged on the mounting bottom plate 22, a first light shielding plate 2511 is arranged at the lower part of the lifting platform 251, and when the lifting platform 251 descends until the first light shielding plate 2511 is positioned between the transmitting end and the receiving end of the first photoelectric switch 26, the first photoelectric switch 26 is triggered to generate a signal that the lifting platform 251 descends to a limit position, so that the lifting platform 251 is prevented from further descending.

Further, the upper surface of the material tray 100 is provided with a first positioning protrusion, the lower surface of the material tray 100 is provided with a first positioning groove, the material tray 100 is clamped with the first positioning groove of the material tray 100 above the material tray through the first positioning protrusion, and the first positioning groove is clamped with the first positioning protrusion of the material tray 100 below the material tray through the first positioning groove, so that the stable stacking of two adjacent material trays 100 is realized. Further, the first positioning protrusion and the first positioning groove of the tray 100 may be rectangular structures adapted to the tray 100, and accordingly, the groove 101 for holding the wafer is formed on the first positioning protrusion. Of course, in other embodiments, the upper surface of the tray 100 may be provided with a first positioning groove, the lower surface of the tray 100 is provided with a first positioning protrusion, the groove 101 is opened in the first positioning groove, and the stable stacking of the trays 100 is also realized by mutually clamping. Furthermore, the upper surface of the tray support block 24 is provided with a positioning block 27, and when the lower surface of the tray 100 is provided with a first positioning groove, the outer contour shape of the positioning block 27 is matched with the inner contour shape of the first positioning groove, so that the tray 100 at the lowest position can be stably placed on the tray support block 24, and the function of positioning the tray 100 to prevent the tray 100 from shaking is achieved. When the first positioning protrusion is arranged on the lower surface of the charging tray 100, the positioning block 27 is provided with a positioning clamping groove, and the inner contour shape of the positioning clamping groove is matched with the outer contour shape of the first positioning protrusion, so that the effect of positioning the lowest charging tray 100 is still achieved. Optionally, the positioning block 27 may be integrally formed with the tray support block 24, or may be detachably connected; the detachable connection mode is adopted, so that the positioning block 27 can be replaced conveniently according to the specific structure of the tray 100.

When more trays 100 are stacked in the vertical direction, due to the accumulation of assembly errors and the existence of self-deflection, the tray 100 cannot be kept vertical as a whole, but is inclined or twisted to a certain extent, so that the tray 100 at the top is deviated, and the position of the deviated tray 100 affects the accuracy of the transfer device 3 for taking and placing wafers, and the continuity of the test process is affected. In order to solve the above problems, referring to fig. 4 and 6, a guide block 28 is disposed on a side of an inner frame of the top mounting plate 21, the guide block 28 includes a connecting portion 281 and a guide portion 282 disposed vertically, the connecting portion 281 is connected to the top mounting plate 21, a first guide surface 2821 and a positioning surface 2823 are disposed on a side of the guide portion 282 away from the top mounting plate 21, the positioning surface 2823 is parallel to a vertical direction, and the first guide surface 2821 is disposed obliquely with respect to the positioning surface 2823, that is, an end of the first guide surface 2821 not connected to the positioning surface 2823 is closer to the top mounting plate 21 than an end of the first guide surface 2821 connected to the positioning surface 2823, so that when the tray 100 is lifted from the bottom, the tray 100 is subjected to position correction under the guiding action of the first guide surface 2821, and gradually moves toward the center of the inner frame until the tray 100 moves up to a space surrounded by the positioning surface 2823; furthermore, a second guide surface 2822 connected to the upper part of the positioning surface 2823 is further arranged on the side wall of the guide block 28 far away from the side of the installation top plate 21; the second guiding surface 2822 inclines relative to the positioning surface 2823, that is, the end of the second guiding surface 2822 not connected with the positioning surface 2823 is closer to the top installation plate 21 than the end of the second guiding surface 2822 connected with the positioning surface 2823, when the tray 100 relatively descends, the tray 100 can be corrected in position under the guiding action of the second guiding surface 2822 and gradually moves towards the center of the inner frame until the tray 100 descends to the space surrounded by the positioning surface 2823. Further optionally, when the installation top plate 21 is of a rectangular structure, the guide blocks 28 are arranged on four sides of the inner frame, so that the tray 100 can be guided by the guide blocks 28 at four different positions to shift downwards to the middle when being lifted, the position is corrected, the accuracy of the position of the tray 100 in the inner frame of the installation top plate 21 is ensured, and the efficiency of correcting the position of the tray 100 is improved. Alternatively, when only one guide block 28 is provided per side, the guide block 28 is provided at a middle position of a certain side of the installation top plate 21. Further, in some other embodiments, each side of the inner frame of the top installation plate 21 is not limited to only one guide block 28, and two or more guide blocks may be provided.

The installation top plate 21 is provided with an installation groove, the connection portion 281 of the guide block 28 is connected to the installation groove, and the guide portion 282 of the guide block 28 is arranged outside the installation groove. Alternatively, the connecting portion 281 is fixedly connected to the mounting top plate 21 by a first bolt. Specifically, a first through hole is formed in a wall of the mounting groove, a second through hole is formed in the connecting portion 281, and after the first bolt sequentially passes through the second through hole and the first through hole, the guide block 28 and the mounting top plate 21 are fixed by a nut. Further, the second through hole is a strip hole, and the second through hole extends along the direction perpendicular to the side of installing the corresponding guide block 28, through changing the position of the first bolt in the strip hole, the distance between the positioning surface 2823 of the guide block 28 and the side provided with the guide block 28 can be adjusted, the applicability of the tray device 2 is improved, personnel can reasonably adjust the installation position of the guide block 28 according to the size of the actual tray 100 or the difference of the gap error between the tray 100 and the positioning surface 2823, the size of the space surrounded by the positioning surface 2823 is reasonably set, the center of the tray 100 positioned in the space can coincide with the center of the installation top plate 21, the tray 100 is prevented from greatly deviating, and the accurate transfer of the transfer device 3 is ensured.

In order to monitor whether the uppermost tray 100 is placed in the frame structure of the top mounting plate 21, the corresponding sensor 211 is disposed on the inner frame of the top mounting plate 21, referring to fig. 4 and 6, specifically, the transmitter and the receiver, which are structurally separated from each other and have optical axes opposite to each other, of the corresponding sensor 211 are respectively disposed on two oppositely disposed sides of the inner frame, and the light emitted from the transmitter directly enters the receiver. When the tray 100 is placed in the frame structure of the top mounting plate 21, the light between the emitter and the receiver is blocked by the tray 100, and the correlation sensor 211 generates a signal that the tray 100 is located in the inner frame of the top mounting plate 21.

EXAMPLE III

The present embodiment provides a transfer device 3 for an automatic wafer testing machine in the first embodiment, wherein the transfer device 3 is configured to realize movement of the tray 100 between different tray devices 2 and movement of the wafer between the tray device 2 and the testing device 4, so as to complete the material taking or discharging operation. Specifically, referring to fig. 7 and 8, the transfer device 3 includes a first slide rail 311, a first driving assembly 33, a second slide rail 321, a second driving assembly 34, and a nozzle assembly 37, wherein the nozzle assembly 37 includes a nozzle body 373 for directly sucking the tray 100 or the wafer, the first driving assembly 33 is configured to drive the nozzle assembly 37 to move along the first slide rail 311, the second driving assembly 34 is configured to drive the nozzle assembly 37 and the first slide rail 311 to move integrally along the second slide rail 321, and the extending directions of the first slide rail 311 and the second slide rail 321 are perpendicular to each other. In this embodiment, the extending directions of the first slide rail 311 and the second slide rail 321 can be understood as the X axis and the Y axis in the rectangular coordinate system of the transfer plane, respectively, and the driving assembly can receive the system command, drive the suction nozzle assembly 37 to move to the corresponding coordinate position of the transfer plane along the X axis and the Y axis, and suck the tray 100 or the wafer at the corresponding position. In this embodiment, the X axis is a first direction, and the Y axis is a second direction. Further, the transfer device 3 further includes a first base 31 provided with the first slide rail 311 and a second base 32 provided with the second slide rail 321, the first driving component 33 is disposed on the first base 31, the second driving component 34 is disposed on the second base 32, and the second driving component 34 directly drives the first base 31 to move relative to the second base 32, so as to realize the movement of the first slide rail 311 relative to the second slide rail 321. Further alternatively, the load-bearing platform 12 may be used directly as the second substrate 32.

Specifically, the first driving assembly 33 includes a first driving source 331, a first driving wheel 332, a first driven wheel 333, a first belt 334 wound around the first driving wheel 332 and the second driven wheel 343, and a first belt connector 335 fixed on the first belt 334, wherein a first slider 35 is disposed on a side of the first belt connector 335 close to the first sliding rail 311, and a suction nozzle body 373 is disposed on a side of the first belt connector 335 away from the first sliding rail 311; first driving source 331 and first action wheel 332 locate the one end of first slide rail 311, the other end of first slide rail 311 is located to first driven wheel 333, first driving source 331 drives first conveyer belt 334 and rotates, first belt connecting piece 335 follows first conveyer belt 334 synchronous motion, realize the accurate direction in first direction through the sliding fit realization of first slider 35 and first slide rail 311, suction nozzle body 373 can follow first belt connecting piece 335 synchronous motion simultaneously, realize the displacement of suction nozzle body 373 in first direction. Alternatively, the first driving source 331 includes a servo motor and a speed reducer, an output end of which is connected to the first driving wheel 332. Alternatively, in order to improve the stability of the suction nozzle assembly 37 moving along the first sliding rail 311, referring to fig. 8, two first sliding rails 311 are disposed on the first base 31 at intervals, two first sliding blocks 35 are disposed on the corresponding first belt connectors 335, each first sliding block 35 is correspondingly slidably disposed on one first sliding rail 311, and the two first sliding rails 311 improve the stability of the movement of the suction nozzle assembly 37 and the accuracy of transferring along the first direction. Of course, in specific implementation, the number of the first slide rails 311 is not limited to two in this embodiment, and may be more. Alternatively, the first driving source 331 and the first base 31 are fixed by a first mounting plate, and the first driven pulley 333 and the first base 31 are fixed by a first mounting frame 336, so as to satisfy the conveying operation of the first conveyor belt 334. Optionally, first base member 31 optional section bar, set up the spout along first direction on the section bar, first mounting bracket 336 is equipped with first screw through-hole, twists first screw through-hole and spout in proper order through the second bolt, is fixed in first base member 31 with first mounting bracket 336 on, through finely tuning the position of first mounting bracket 336 on the section bar, can adjust the tension of first conveyer belt 334, guarantees going on smoothly of data send process.

The second driving assembly 34 includes a second driving source 341, a second driving wheel 342, a second driven wheel 343, a second transmission belt 344 wound around the second driving wheel 342 and the second driven wheel 343, and a second belt connector 345 fixed to the second transmission belt 344, where the second belt connector 345 is connected to the first substrate 31, so that when the second driving source 341 drives the second transmission belt 344 to rotate, the second transmission belt 344 can drive the entire first substrate 31 to move. In order to ensure that the first base 31 and the nozzle body 373 thereon move along the second direction, the second slide rail 321 is disposed on the upper portion of the second base 32, the second slider 36 is disposed on the lower portion of the first base 31, and the first base 31 is precisely guided along the second direction by the sliding fit of the second slider 36 on the second slide rail 321. Optionally, in this embodiment, the second driving assembly 34 is disposed in the middle of the second base 32, the second sliding rails 321 are disposed in two, and the two second sliding rails 321 are symmetrically disposed on two sides of the second driving assembly 34, so that the driving force can be uniformly transmitted, the whole first base 31 can uniformly and synchronously move along the second direction, and the deviation of a certain side is avoided. Alternatively, the second driving source 341 has the same structure as the first driving source 331, and both use a servo motor and a speed reducer to generate driving force. Optionally, a receiving groove 323 is formed in the second substrate 32, and the second driving assembly 34 is disposed in the receiving groove 323 to hide the second driving assembly 34, so as to not only avoid interference with the suction nozzle assembly 37 moving along the first slide rail 311, but also reduce the size of the automatic wafer testing machine. Further alternatively, the second driving source 341 and the second base 32 are fixed by a second mounting plate, and the second driven wheel 343 and the second base 32 are fixed by a second mounting rack 346, so as to satisfy the conveying operation of the second conveyor belt 344. Optionally, a second threaded through hole is formed in the second base 32, an adjusting elongated hole is formed in the second mounting frame 346, the second mounting frame 346 is fixed to the second base 32 by screwing a third bolt into the adjusting elongated hole and the second threaded through hole in sequence, and the position of the adjusting elongated hole by fine-tuning the third bolt can change the tension of the second conveyor belt 344, so that the conveying efficiency is improved.

Further, referring to fig. 8 and 9, the suction nozzle assembly 37 includes a suction nozzle cylinder 371, a suction nozzle fixing plate 372 and a suction nozzle body 373 disposed on the suction nozzle fixing plate 372, an output end of the suction nozzle cylinder 371 is connected with the suction nozzle fixing plate 372, and then the suction nozzle fixing plate 372 and the suction nozzle body 373 are driven to lift, so as to complete material taking and discharging of the tray 100 or the wafer; further, the suction nozzle assembly 37 further includes a pneumatic control valve 374, an input end of the suction nozzle cylinder 371 is connected to the pneumatic control valve 374, and the pneumatic control valve 374 is in communication connection with an electric control device of the testing machine and receives a signal of the electric control device, so as to control the suction nozzle cylinder 371 to operate. Optionally, a first fixing plate 3351 is disposed above the first belt connector 335, a second fixing plate 3352 is disposed below the first belt connector 335, and the second fixing plate 3352 is optionally vertically connected to the first belt connector 335; the first fixing plate 3351 is connected with a pneumatic control valve 374, the second fixing plate 3352 is provided with a suction nozzle cylinder 371, and the output end of the suction nozzle cylinder 371 vertically extends downwards out of the second fixing plate 3352 and then is connected with the suction nozzle fixing plate 372 to drive the suction nozzle fixing plate 372 to be close to or far away from the second fixing plate 3352; the first and second fixing plates 3351 and 3352 are disposed such that the whole suction nozzle assembly 37 can synchronously move along the first slide rail 311 following the first belt connector 335, thereby ensuring the stability and consistency of the suction nozzle assembly 37 during operation. Further, one of them is equipped with second guide bar 375 in suction nozzle fixed plate 372 and the second fixed plate 3352, is equipped with second direction through-hole on the other, and second guide bar 375 inserts and locates in the second direction through-hole to realize the guide effect when suction nozzle cylinder 371 drive suction nozzle fixed plate 372 goes up and down, avoid suction nozzle body 373 to take place the skew, can not get material and unloading accurately. In this embodiment, the second guide rod 375 is disposed on the suction nozzle fixing plate 372, and the second guide through hole is disposed on the second fixing plate 3352. Optionally, a second guide sleeve is disposed on the second fixing plate 3352, and the second guide sleeve is sleeved on the periphery of the second guide rod 375, so as to ensure the guiding function of the second guide rod 375.

In this embodiment, the plurality of suction nozzle bodies 373 are divided into three types according to different suction objects, one type is a tray suction nozzle body, which is used for sucking the tray 100 and moving the tray 100 from a tray device to be tested to an empty tray device or from the empty tray device to a classification tray device; the second type is a material taking suction nozzle body which is used for sucking a wafer to be tested on a material tray 100 in a material tray device to be tested and moving the wafer to be tested to the testing device 4; the third type is a feeding suction nozzle body, which is used for sucking the wafer which is tested on the testing device 4 and moving the wafer to the tray 100 of the corresponding classified tray device according to the test result. Further, the number of each type of the suction nozzle body 373 is not specifically limited, but each type of the suction nozzle body 373 is correspondingly provided with a suction nozzle fixing plate 372 and a suction nozzle cylinder 371, so that the actions of the different types of the suction nozzle bodies 373 do not interfere with each other. Specifically, in this embodiment, since the tray device 2 has a rectangular structure and four tray suction nozzle bodies are arranged, the four tray suction nozzle bodies are distributed in a rectangular shape on the corresponding suction nozzle fixing plates 372, and each tray suction nozzle body can correspondingly suck one side edge of the tray 100, so that the tray 100 is effectively sucked, and the transfer process is smoothly performed; in addition, in this embodiment, get material suction nozzle body and unloading suction nozzle body and all set up to one to be fixed in respectively on corresponding suction nozzle fixed plate 372, and by the lift of corresponding suction nozzle cylinder drive. Optionally, at least two second guiding through holes are disposed on each suction nozzle fixing plate 372 to realize the guiding of the corresponding suction nozzle body 373.

Optionally, in this embodiment, a protective cover covers the outer sides of the first driving wheel 332, the first driven wheel 333, the second driving wheel 342, and the second driven wheel 343 to keep the appearance of the whole testing machine and avoid a person touching the driving component. Further, referring to fig. 7, two second photoelectric switches 312 are disposed on the first substrate 31, the two second photoelectric switches 312 are disposed at intervals along the first direction, and the positions of the two second photoelectric switches 312 respectively represent two limit positions that the suction nozzle assembly 37 can reach along the first direction, and correspondingly, a second light shielding plate is disposed on the first fixing plate 3351, and when the first conveyor belt 334 drives the first fixing plate 3351 to move along the first direction, the second light shielding plate can be located at the emitting end and the receiving end of the second photoelectric switch 312 to generate a signal that the suction nozzle assembly 37 moves to the position, and transmit the signal to the electronic control device. Similarly, two third photoelectric switches 322 are disposed on the second substrate 32 at intervals and beside the second slide rail 321, respectively representing two limit positions that the suction nozzle assembly 37 can reach along the second direction; accordingly, a third light shielding plate is disposed on the second slider 36, and when the second conveyor belt 344 drives the second slider 36 to move along the second direction, the third light shielding plate can be located at the emitting end and the receiving end of the third photoelectric switch 322 to generate a signal that the suction nozzle assembly 37 moves to the position, and transmit the signal to the electronic control device.

Example four

The present embodiment provides a testing apparatus 4 for an automatic wafer testing machine in the first embodiment, so as to complete the testing of the wafer. Specifically, referring to fig. 10 and 11, the testing device 4 includes a supporting mechanism 41, a lifting mechanism 42, a testing platform assembly 43 and a testing board assembly 44, wherein the supporting mechanism 41 is used for supporting the whole testing device 4; the test station assembly 43 includes a test station 431 for placing a wafer to be tested; the testing board assembly 44 includes a testing board 441, and the elevating mechanism 42 is used to drive the testing platform 431 to move up and down, so that the wafer to be tested placed thereon contacts with the testing board 441, thereby completing the testing. Further, the testing device 4 can output the testing result to the electronic control device, the electronic control device determines the classification grade of the wafer according to the testing result and transmits a signal to the transfer device 3, and the transfer device 3 transfers the tested wafer to the tray 100 of the corresponding classified tray device according to the signal indication.

Further, the testing platform assembly 43 further comprises a stage 432, the testing platform 431 is disposed on the upper portion of the stage 432, and the upper surface of the testing platform 431 is provided with a testing plane on which the wafer is placed. Since the position of the test board 441 is kept relatively fixed during the testing process, the position of each wafer to be tested on the test plane should be kept fixed in order to ensure that the wafer is fully contacted with the test board 441 each time. In order to solve the above problem, referring to fig. 12, the testing platform assembly 43 further includes a positioning bar 433 disposed on the testing plane and a pushing structure 434 disposed on the testing platform 431, the positioning bar 433 is disposed to protrude out of the testing plane, and after the wafer to be tested is placed on the testing plane, the pushing structure 434 can push the wafer to be tested until the wafer to be tested abuts against the sidewall of the positioning bar 433, thereby completing the positioning of the wafer to be tested. Furthermore, the shape structure of the wafer to be tested is matched with the shape structure surrounded by the side walls of the positioning bars 433, so as to ensure the sufficient abutting of the wafer and the side walls of the positioning bars 433 and maintain the stability of the position of the wafer. Optionally, in this embodiment, the wafer is set to be a regular rectangular structure, so that a first positioning bar 433 and a second positioning bar 433 perpendicular to each other may be disposed on the test plane, both of which protrude a certain height from the test plane, and one end of the first positioning bar 433 abuts against a sidewall of the second positioning bar 433, so that the first positioning bar 433 and the sidewall of the second positioning bar 433 form a right-angled structure; when the wafer is placed on the testing plane, the pushing structure 434 is used to repeatedly push the wafer to be tested for many times, so that two mutually perpendicular sides of the wafer can be respectively abutted against the side walls of the first positioning bar 433 and the second positioning bar 433, the wafer to be tested reaches a fixed position, and the wafer to be tested at the position can be fully contacted with the testing board 441 after rising, thereby ensuring the smooth performance of the test. Further, the first positioning bar 433 extends along a fourth direction, and the second positioning bar 433 extends along a fifth direction, which is perpendicular to the fourth direction. In the present embodiment, the fourth direction and the fifth direction are both parallel to the horizontal plane.

Specifically, referring to fig. 12 again, the pushing structure 434 includes a pushing cylinder 4341, a pushing plate 4342 connected to the output end of the pushing cylinder 4341, and a plurality of pushing pins 4343 disposed on the pushing plate 4342, wherein the free end of the pushing pins 4343 can abut against the wafer to be tested placed on the testing platform 431. In specific implementation, the pushing cylinder 4341 is actuated to drive the pushing plate 4342 and the pushing thimble 4343 thereon to move along a specific direction until the wafer to be tested on the test plane is pushed to abut against the sidewall of the positioning bar 433. Optionally, in order to increase the accuracy of the pushing direction, the pushing structure 434 further includes a third guide rod 4344 disposed on the test platform 431 and a third guide through hole disposed on the pushing plate 4342, and the third guide rod 4344 is disposed in the third guide through hole to realize the sliding guide of the pushing plate 4342. Optionally, a third guide sleeve is arranged in the third guide through hole, so that smoothness of relative sliding of the third guide rod 4344 is ensured. Further, the pushing structure 434 includes two, i.e. a first pushing structure and a second pushing structure, which are respectively used for pushing the wafer to be tested along the fourth direction and the fifth direction. Therefore, the pushing directions of the pushing cylinders 4341 of the first pushing structure and the second pushing structure are consistent with the fourth direction and the fifth direction, respectively, and the extending directions of the pushing thimbles 4343 and the third guide rods 4344 are also consistent with the pushing directions. Optionally, in this embodiment, the testing platform 431 has a rectangular parallelepiped structure, and the first pushing structure and the second pushing structure are respectively disposed on two sides of the testing platform 431, which are perpendicular to each other. Further optionally, in order to ensure the smoothness of the movement of the push thimble 4343 along the fourth direction or the fifth direction, a thimble groove may be formed in the test plane, the thimble groove extends along the fourth direction or the fifth direction, the push thimble 4343 is disposed in the thimble groove, the offset of the push thimble 4343 is further limited, and the push thimble 4343 is ensured to be able to move along a specific direction; the pushing thimble 4343 protrudes from the testing plane to a certain height to complete pushing by contacting with the wafer to be tested. Alternatively, the pushing pins 4343 of each pushing structure 434 may be provided in two, three or more numbers according to the size of the wafer, so as to achieve the effect of uniformly pushing the wafer while fully contacting the wafer.

Referring to fig. 11 and 13, the supporting mechanism 41 includes a top supporting plate 411 and a bottom supporting plate 412 disposed parallel to and spaced apart from each other, and a vertical supporting plate 413 vertically disposed between the top supporting plate 411 and the bottom supporting plate 412, the bottom supporting plate 412 is connected to the loading plate 14, the testing plate assembly 44 is disposed on the top supporting plate 411, and the testing plate assembly 43 is disposed between the top supporting plate 411 and the bottom supporting plate 412. Furthermore, in order to improve the stability of the supporting mechanism 41, a supporting plate 414 parallel to the supporting base plate 412 is further disposed on the supporting riser 413, and the supporting plate 414 is connected to the supporting base plate 412 through a supporting rod 415, so as to enhance the supporting function of the supporting mechanism 41. Optionally, the test bench component 43 and the support rod 415 are respectively disposed on opposite sides of the support riser 413, so that the support rod 415 can be prevented from interfering with the test bench component 43, and the stability of the support riser 413 can be further improved.

Referring to fig. 10 and 13, the lifting mechanism 42 includes a lifting driving source 421 and a first connecting plate 422 connected to an output end of the lifting driving source 421, the first connecting plate 422 is connected to the stage 432 of the testing table assembly 43 through a second connecting plate 49, and the lifting driving source 421 drives the first connecting plate 422, the second connecting plate 49 and the stage 432 to lift and lower along the third direction together, so as to achieve the approaching and separating of the testing table assembly 43 and the testing table assembly 44. In this embodiment, the third direction is a vertical direction, which is perpendicular to the horizontal plane, and can be understood as a Z axis in a rectangular coordinate system. Alternatively, the lifting driving source 421 adopts a rodless cylinder, a main body of the rodless cylinder is fixed on the supporting vertical plate 413, and a lifting slider of the rodless cylinder is connected with the first connecting plate 422, and the lifting slider drives the first connecting plate 422 to move. In some other embodiments, the lifting driving source 421 may also adopt a screw nut lifting structure or a rack and pinion lifting structure. Further, the lifting mechanism 42 and the testing platform assembly 43 are disposed on opposite sides of the supporting riser 413, that is, the lifting mechanism 42 is disposed between the supporting support 414 and the supporting base 412, so that the lifting mechanism 42 does not interfere with the testing platform assembly 43. Optionally, the two second connecting plates 49 are provided, and the two second connecting plates 49 are symmetrically distributed relative to the supporting riser 413, so that the test bench assembly 43 is uniformly stressed to lift. Alternatively, referring to fig. 13, in order to prevent the device damage caused by the ascending or descending height of the test platform assembly 43 exceeding the preset range, two fourth photoelectric switches 4131 are respectively disposed at the upper and lower parts of the supporting riser 413, which respectively represent the limit positions of the test platform 431 capable of ascending and descending, a fourth light shielding plate 361 is disposed on the second connecting plate 49, and when the second connecting plate 49 drives the test platform assembly 43 to ascend and descend until the fourth light shielding plate 361 is located between the emitting end and the receiving end of the fourth photoelectric switch 4131, the fourth photoelectric switch 4131 is triggered to generate a signal, so as to prevent the test platform 431 from further ascending and descending. Further, in order to buffer the impact of the test plate 441 contacting the wafer, a buffer structure 45 is disposed on each of the upper and lower portions of the first connection plate 422, and the buffer structure 45 can contact the support bottom plate 412 or the support top plate 411 to perform a buffering effect when the first connection plate 422 is about to ascend or about to descend to the limit position. Optionally, the buffering structure 45 includes a buffering connection block 451 and a buffer 452 vertically disposed on the buffering connection block 451, and the buffering connection block 451 is connected to the first connection plate 422. Alternatively, the second connecting plate 49 may be directly connected to the buffer connecting block 451 to achieve the synchronous driving of the buffer 452 and the testing table assembly 43 by the first connecting plate 422. In this embodiment, the buffer 452 is an ACA-1007 type hydraulic buffer available from sandwich.

Further, in order to improve the accuracy of the lifting mechanism 42 driving the test platform 431 to lift along the third direction, a linear guide structure 46 is further disposed between the test platform assembly 43 and the supporting vertical plate 413, specifically, referring to fig. 10, 11 and 15, the linear guide structure 46 includes a third sliding block 461 disposed on the carrying platform 432 and a third sliding rail 462 disposed on the supporting vertical plate 413, the third sliding rail 462 extends along the third direction, and the third sliding block 461 is slidably disposed on the third sliding rail 462, so as to achieve the sliding guidance of the test platform assembly 43 in the third direction. Optionally, the carrier 432 and the third slider 461 are connected through a third connecting plate, and the third connecting plate and the second connecting plate 49 are connected vertically, so as to improve the stability of the lifting of the test platform 431.

Specifically, referring to fig. 11, the test board assembly 44 further includes two press plates 442 disposed below the top supporting plate 411, the two press plates 442 are disposed at two sides of the top supporting plate 411 along the length direction, and an elastic plate 443 is disposed below each press plate 442, and the test board 441 is clamped between the press plates 442 and the elastic plates 443 by the elastic force of the elastic plates 443; the pressing plate 442 has a certain thickness such that a gap is formed between the testing plate 441 and the supporting top plate 411 to buffer the impact generated when the wafer contacts the testing plate 441, thereby achieving uniform and sufficient contact between the wafer and the testing plate 441. Optionally, the side edge of the top supporting plate 411 is further provided with a limiting stop piece 444, which serves as a limiting function when the test board 441 is installed.

In order to improve the testing accuracy, the testing platform 431 needs to be calibrated before each use, so that the pre-placed position of the wafer to be tested on the testing plane can correspond to the testing board 441 as much as possible, and the wafer to be tested can be fully contacted with the testing board 441 after the testing platform 431 is lifted. Specifically, referring to fig. 10, 14, and 15, testing apparatus 4 includes angle adjusting mechanism 40, angle adjusting mechanism 40 includes rotary table 401 rotatably provided on stage 432, rotary table 401 and stage 432 are rotatably connected by a bearing structure, while test table 431 is provided on an upper portion of rotary table 401, and test table 431 can rotate together with rotary table 401 with respect to stage 432 to adjust the angle of test table 431 in the horizontal plane. Further, the angle adjusting mechanism 40 further includes an adjusting column 403 vertically disposed at the bottom of the rotary table 401, the adjusting column 403 vertically penetrates through the entire carrier 432 and is rotatably connected with the carrier 432 through the above-mentioned bearing structure, and the adjusting column 403 can be selected to be a cylindrical structure; the bottom of the adjusting column 403 is provided with an adjusting rod 404, and the adjusting rod 404 is pushed to drive the adjusting column 403 and the rotary worktable 401 to rotate, so that the operation of workers is facilitated. Further, the axis of the adjusting rod 404 is perpendicular to the axis of the adjusting column 403, so that the adjusting column 403 and the rotary table 401 can be pushed to rotate with a small pushing force. Optionally, the adjusting rod 404 vertically penetrates through the entire adjusting column 403 to increase the acting area between the adjusting rod 404 and the adjusting column 403, so that the adjusting rod 404 can push the adjusting column 403 more conveniently and more easily. Further, in order to adjust the angle of the test platform 431 within a certain range and avoid excessive deflection of the test platform 431, the side of the carrier 432 is provided with an adjusting block 402, one side wall of the adjusting block 402 close to the adjusting column 403 is provided with a strip-shaped groove 4021 (refer to fig. 14 specifically), the extending direction of the strip-shaped groove 4021 is located in the horizontal plane, the free end of the adjusting rod 404 is arranged in the strip-shaped groove 4021, the free end of the adjusting rod 404 is located in different positions in the strip-shaped groove 4021, the adjusting column 403 and the rotary table 401 rotate by different angles until the free end of the adjusting rod 404 abuts against the groove wall of the end of the strip-shaped groove 4021, further movement of the adjusting rod 404 is blocked, the rotary table 401 adjusts the angle within a limited angle range, and the occurrence of an excessive adjustment phenomenon. Further, in order to realize the quantization of angle adjustment, a first spiral differential head 405 is arranged on the adjusting block 402, a measuring rod of the first spiral differential head 405 extends into the adjusting block 402 and abuts against the side wall of the adjusting rod 404, a fine adjustment knob of the first spiral differential head 405 is rotated to change the extension length of the measuring rod, the adjusting rod 404 is driven to move in the strip groove 4021, the adjusting angle of the adjusting rod 404 can be known through the reading of the first spiral differential head 405, and the quantization of angle adjustment is realized. Further, the spindle of the first screw differential head 405 is vertically abutted against the adjustment lever 404. Furthermore, the adjusting block 402 is further provided with a first locking bolt 406, and after the angle adjustment is finished, the first locking bolt 406 locks the adjusting rod 404 to limit the adjusting rod to move again, so that the angle of the test platform 431 is kept fixed. Optionally, an external thread is further disposed on a side wall of the adjusting column 403 between the lower portion of the carrying platform 432 and the upper portion of the adjusting rod 404, and the locking nut 407 locks the adjusting column 403 and the bearing structure through threaded connection, so as to ensure that the adjusting column 403 can drive the rotating table 401 to rotate on the same horizontal plane without deviation.

Further, referring to fig. 10, 11 and 12, the testing device 4 further includes a displacement adjusting mechanism 47, the displacement adjusting mechanism 47 includes a cross guide displacement platform 471 arranged between the rotary worktable 401 and the testing platform 431, and the cross guide displacement platform 471 is integrally arranged on the rotary worktable 401 and can rotate synchronously with the rotary worktable 401; the object carrying surface of the cross rail displacement platform 471 is connected to the bottom surface of the test platform 431, so as to drive the test platform assembly 43 to move synchronously with the object carrying surface. Optionally, the cross rail displacement platform 471 in this embodiment is mainly used for implementing displacement of the test platform 431 in the fourth direction and the fifth direction, and therefore a second spiral differential 472 head and a second spiral differential 472 head are respectively disposed on two mutually perpendicular side walls of the cross rail displacement platform 471, so as to implement quantification of displacement of the test platform 431 in two directions. Furthermore, two side walls of the cross rail displacement platform 471, which are perpendicular to each other, are respectively provided with a second locking bolt 473 and a third locking bolt, and after the test platform 431 adjusts the position of the cross rail displacement platform 471 to be adjusted, the object carrying surface of the cross rail displacement platform 471 is locked by the second locking bolt 473 and the third locking bolt, so that the object carrying surface cannot move any more.

By the arrangement of the angle adjusting mechanism 40 and the displacement adjusting mechanism 47, the test platform 431 can rotate in the horizontal plane, and displacement adjustment can be performed in the fourth direction and the fifth direction, so that the test plate 441 corresponds to the wafer to be tested. However, in the third direction, since the thickness of different wafers and different test boards 441 is different, before the batch test, the height between the top supporting plate 411 and the bottom supporting plate 412 of the test apparatus 4 needs to be adjusted by calibration, so as to ensure that the wafer to be tested can always be in full contact with the test board 441 by the lifting mechanism 42 driven by the lifting mechanism with a specific lifting distance to reciprocate, therefore, the test apparatus 4 further includes a height adjusting mechanism 48, referring to fig. 10 and 14, the height adjusting mechanism 48 includes a third spiral differential head 481 arranged on the top supporting plate 411, a spindle of the third spiral differential head 481 extends in the third direction, and abuts against the top surface of the vertical supporting plate 413 after passing through the top supporting plate 411, and a fine tuning knob of the third spiral differential head 481 is rotated to change the extending length of the spindle, so as to drive the top supporting plate 411 to approach or depart from the bottom supporting plate 412 in the third direction, further, the distance between the testing board 441 disposed on the top supporting plate 411 and the testing platform 431 is changed until the wafer to be tested can be ensured to be in full contact with the testing board 441 under a specific lifting displacement. Further, the supporting top plate 411 and the supporting vertical plate 413 are slidably connected through the cross guide structure 482, the cross guide structure 482 can realize high-precision and stable linear motion of the supporting top plate 411 relative to the supporting vertical plate 413, and accuracy of movement of the supporting top plate 411 along the third direction is improved, further, the cross guide structure 482 comprises a fourth slide rail arranged on the supporting vertical plate 413 and a fourth slide block arranged on the supporting top plate 411, and the fourth slide rail extends along the third direction to realize guiding of the supporting top plate 411 in the third direction. Alternatively, two cross-rail structures 482 are provided, one on each side of the top support plate 411. Further, the height adjusting mechanism 48 further includes a fourth locking bolt 483 for locking the cross rail structure 482 after the height adjustment of the supporting top plate 411 is completed, so as to prevent relative sliding between the fourth slider and the fourth slide rail.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. The automatic wafer testing machine is characterized by comprising a plurality of tray devices (2), a plurality of testing devices (4) and a plurality of transferring devices (3), wherein the tray devices (2) are arranged; the plurality of material tray devices (2) comprise material tray devices to be tested and classification material tray devices; the tray device to be tested is configured to bear a tray (100) on which a wafer to be tested is placed; the sorting tray device is configured to carry a tray (100) on which the tested wafers are placed;

the transfer device (3) can transfer the wafers to be tested of the tray device to be tested to the test device (4) to complete the test; the transfer device (3) can also transfer the tested wafers from the testing device (4) to the sorting tray device.

2. The wafer automatic testing machine according to claim 1, characterized in that the tray arrangement (2) further comprises an empty tray device configured to carry an empty tray without a wafer placed thereon; the transfer device (3) can transfer empty trays of the tray device to be tested to the empty tray device; the transfer device (3) can also transfer the empty trays loaded by the empty tray device to the classification tray device.

3. The automatic wafer testing machine according to claim 2, wherein at least one of the empty tray device and the tray device to be tested is provided.

4. The automatic wafer testing machine according to claim 3, wherein a plurality of classification tray devices are provided, the test result of the wafer is divided into a plurality of grades, and each grade corresponds to one classification tray device; the tested wafers are transferred to the tray (100) of the classified tray device representing the corresponding grade according to the test result.

5. The wafer automatic testing machine according to claim 4, characterized in that twelve tray devices (2) are provided, twelve tray devices (2) are distributed in a matrix; the ten sorting tray devices are arranged.

6. The wafer automatic testing machine according to claim 1, further comprising a display device (5), wherein the display device (5) is configured to be capable of displaying an operation state of each device and a test result.

7. The wafer automatic testing machine of claim 1, further comprising an electronic control device configured to control timing actions of the respective devices of the wafer automatic testing machine.

8. The wafer automatic testing machine according to claim 1, wherein a plurality of the testing devices (4) are provided, and a plurality of the testing devices (4) are linearly arranged along the first direction.

9. The automatic wafer testing machine according to any one of claims 1 to 8, further comprising a rack (1), wherein the rack (1) comprises a main body (11) and a carrying platform (12) disposed on an upper portion of the main body (11), and the carrying platform (12) is used for carrying the transferring device (3) and the tray device (2).

10. The automatic wafer testing machine according to claim 9, wherein a U-shaped baffle (13) is disposed around the outer side of the carrying platform (12) to shield the tray device (2) and the transfer device (3), and the testing device (4) is disposed at an opening end of the baffle (13).

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