CN210147446U - Automatic equipment of packing into of IC base plate - Google Patents

Abstract

The utility model provides an automatic IC substrate assembling device, which comprises a jig backflow mechanism, a base feeding mechanism, a jig overturning and turning mechanism, an IC assembling mechanism and a PCB assembling mechanism, wherein the jig backflow mechanism is used for conveying jigs; the base feeding mechanism is used for placing the base on the jig; the jig overturning and turning mechanism is used for overturning the upper cover and the lower cover of the jig and turning the jig; the IC assembling mechanism is used for assembling an IC to the base; the PCB assembling mechanism is used for assembling the PCB to the base. The utility model provides a pair of automatic equipment of assembling of IC base plate can improve production efficiency, reduction in production cost with IC, PCB board equipment to the base automatically.

Description

Automatic equipment of packing into of IC base plate

Technical Field

The utility model relates to an equipment technical field especially relates to an automatic equipment of packing into of IC substrate.

Background

The IC substrate is an important component of the chip, the IC substrate comprises a base, an IC and a PCB, the IC and the PCB are required to be installed in the base through the upper surface and the lower surface of the base respectively, the existing IC substrate is assembled manually, the efficiency is low, and the production cost is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an automatic equipment of inserting of IC base plate can improve production efficiency, reduction in production cost automatically with IC, PCB board equipment to the base on.

To achieve the purpose, the utility model adopts the following technical proposal:

an IC substrate automated assembly apparatus, comprising:

the jig backflow mechanism is used for conveying the jigs;

the base feeding mechanism is used for placing the base on the jig;

the jig overturning and turning mechanism is used for turning the upper cover and the lower cover of the jig and overturning the jig;

an IC assembly mechanism for mounting an IC to the base;

a PCB assembly mechanism for assembling a PCB to the base,

the base feeding mechanism, the IC assembling mechanism and the PCB assembling mechanism are arranged in sequence along the jig reflow mechanism,

the fixture turnover cover mechanism is at least three and is respectively arranged in front of the base feeding mechanism, in front of the PCB assembly mechanism and behind the PCB assembly mechanism.

Preferably, the base feed mechanism comprises:

a first bracket;

the first XZ-axis moving mechanism is arranged on the first bracket;

and the base clamping jaw is in transmission connection with the first XZ shaft moving mechanism and is used for clamping the base.

Preferably, the jig flip mechanism includes:

a second bracket;

the second XZ-axis moving mechanism is arranged on the second bracket;

the first rotary driving mechanism is in transmission connection with the second XZ-axis moving mechanism;

the first rotary driving mechanism is connected with the crank and drives the crank to rotate, and the crank can extend into the space between the upper cover and the lower cover of the jig.

Preferably, the first rotary drive mechanism comprises:

a drive member;

the belt pulley is in transmission connection with the driving piece;

the belt pulley drives the first rotating shaft to rotate, and the first rotating shaft is connected with the crank.

Preferably, the jig flip mechanism further comprises a jig detector, wherein the jig detector is arranged on one side of the crank and is used for detecting the flip state of the upper cover or the lower cover of the jig and the flip state of the jig.

Preferably, the IC assembling mechanism includes:

the IC feeding mechanism is used for feeding an IC to one side of the jig backflow mechanism;

and the IC feeding mechanism is used for transferring the IC from the IC feeding mechanism to the base.

Preferably, the PCB panel assembling mechanism includes:

a PCB feeding mechanism;

the PCB board turnover mechanism;

a PCB feeding mechanism;

the PCB feeding mechanism conveys the PCB to the PCB turnover mechanism, the PCB turnover mechanism turns over the PCB, and the PCB feeding mechanism conveys and installs the PCB onto the base from the PCB turnover mechanism.

Preferably, the PCB board feeding mechanism includes:

an XY-axis moving mechanism;

and the PCB clamping jaw is in transmission connection with the XY-axis moving mechanism and used for clamping the PCB.

Preferably, the PCB board turnover mechanism includes:

a third support;

the second rotating shafts are arranged in two corresponding ways, penetrate through the third support and are used for clamping the PCB;

and the second rotary driving mechanism is used for driving the second rotating shaft to rotate.

Preferably, the PCB assembly mechanism further includes a PCB shaping mechanism, and the PCB shaping mechanism includes:

the PCB shaping platform is used for placing a PCB;

and the shaping blocks are arranged in a plurality and are arranged around the PCB shaping platform, and the shaping blocks move relatively to shape the PCB.

The utility model has the advantages that:

1. the utility model provides a pair of automatic equipment of assembling of IC base plate realizes installing IC and PCB board on the base through setting up base feed mechanism, IC equipment mechanism and PCB board assembly mechanism, improves the packaging efficiency of IC base plate.

2. The utility model provides a pair of automatic equipment of assembling of IC base plate realizes the whole tool of opening and upset of the upper cover and the lower cover of tool through setting up tool upset flip mechanism for IC and PCB board can install to the base on two faces of base in, improve the packaging efficiency of IC base plate.

3. The utility model provides a pair of automatic equipment of assembling of IC base plate inhales detection mechanism, probe and PCB board detector through setting up tool detector, vacuum and realizes the automated inspection of defective products to push away the defective products through the manipulator, realize the detection automation of IC base plate.

Drawings

Fig. 1 is a plan view of an IC substrate automatic loading apparatus according to an embodiment of the present invention;

fig. 2 is a three-dimensional structure diagram of a jig flip mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention;

fig. 3 is a three-dimensional structure diagram of a base feeding mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention;

fig. 4 is a perspective view of an IC assembling mechanism of an IC substrate automatic loading apparatus according to an embodiment of the present invention;

fig. 5 is an exploded view of a vacuum suction detection mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention;

fig. 6 is a schematic structural view of the vacuum chuck and IC of the IC substrate automatic assembly apparatus according to the embodiment of the present invention;

fig. 7 is a perspective view of a PCB board assembling mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention;

FIG. 8 is an enlarged view of portion A of FIG. 7;

fig. 9 is a perspective view of a PCB feeding mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention;

fig. 10 is a perspective view of a PCB turnover mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention;

fig. 11 is a perspective view of a PCB loading mechanism of an IC substrate automatic assembly apparatus according to an embodiment of the present invention.

In the figure:

1. a base feeding mechanism; 11. a first bracket; 12. a first XZ-axis moving mechanism; 13. a base jaw;

2. an IC assembling mechanism; 21. an IC feeding mechanism; 211. a vibrating pan; 212. a linear feeder; 22. an IC feeding mechanism; 221. a third XZ-axis moving mechanism; 222. a vacuum suction detection mechanism; 2221. a first cylinder; 2222. a probe pin; 2223. vacuum suction; 23. a first jig fixing mechanism;

3. the jig overturns the cover overturning mechanism; 31. a second bracket; 32. a second XZ-axis moving mechanism; 33. a first rotary drive mechanism; 331. a drive member; 332. a support plate; 333. a belt pulley; 334. a first rotating shaft; 34. a crank; 35. a jig detector;

4. a PCB assembly mechanism; 41. a PCB feeding mechanism; 411. an XY-axis moving mechanism; 412. a PCB board clamping jaw; 42. the PCB board turnover mechanism; 421. a third support; 422. a second rotary drive mechanism; 4221. a third cylinder; 4222. a rotating arm; 423. a second rotating shaft; 43. a PCB feeding mechanism; 431. a first feeding clamping jaw of the PCB; 432. a second feeding clamping jaw for the PCB; 44. a PCB shaping mechanism; 441. a PCB shaping platform; 442. a first shaping block; 443. a second shaping block; 444. a third shaping block; 445. a fourth shaping block; 45. a material tray; 46. a second jig fixing mechanism;

5. a PCB board detector;

6. a feed line;

7. a jig; 71. a jig body, 72 and a lower cover; 73. an upper cover;

8. a PCB board;

9、IC。

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention.

The IC substrate includes a base, an IC9, and a PCB board 8, the IC9 being mounted into the base via an upper face of the base, and the PCB board 8 being mounted into the base via a lower face of the base.

Please refer to fig. 1 and fig. 2, the utility model provides a pair of automatic equipment of assembling of IC substrate, including tool backward flow mechanism, base feed mechanism 1, tool upset flip mechanism 3, IC equipment mechanism 2, PCB board assembly mechanism 4, tool upset flip mechanism 3 and pay-off assembly line 6, tool 7 includes tool body 71, upper cover 73 and lower cover 72, base feed mechanism 1, IC equipment mechanism 2 and PCB board assembly mechanism 4 arrange the setting along tool backward flow mechanism order.

The jig turnover mechanism 3 is three, and the three jig turnover mechanism 3 is respectively arranged before the base feeding mechanism 1, before the PCB assembly mechanism 4 and after the PCB assembly mechanism 4.

The jig 7 is moved by being placed on the jig backflow mechanism, the jig overturning and turning mechanism 3 opens the upper cover 73 of the jig 7, the base is conveyed to one side of the jig backflow mechanism through the feeding line 6, the base feeding mechanism 1 conveys the base on the feeding line 6 to the jig 7 on the jig backflow mechanism, the jig backflow mechanism conveys the jig 7 to one side of the IC assembling mechanism 2, the IC assembling mechanism 2 loads the IC to the front side of the base, the jig backflow mechanism conveys the jig 7 to one side of the jig overturning and turning mechanism 3, the jig overturning and turning mechanism 3 closes the upper cover 73 of the jig 7, then the jig body 71 is turned, finally the lower cover 72 of the jig 7 is turned, the jig backflow mechanism 7 then conveys the jig 7 to one side of the PCB board assembling mechanism 4, the PCB board assembling mechanism 4 loads the PCB board 8, the jig backflow mechanism then conveys the jig 7 to the jig 3, the jig turnover mechanism 3 closes the lower cover 72 of the jig 7, the assembly of the IC substrate is completed, and the jig return mechanism is further provided with a PCB detector 5 for detecting whether the base has a PCB 8, and if the PCB 8 cannot be detected, the jig return mechanism is determined to be a defective product, in this embodiment, the PCB detector 5 is an optical fiber detector.

The jig flip-open cover mechanism 3 comprises a second support 31, a crank 34, a second XZ axis moving mechanism 32 and a first rotary driving mechanism 33, the second XZ axis moving mechanism 32 is installed on the second support 31, the second XZ axis moving mechanism 32 drives the first rotary driving mechanism 33 to move in the X and Z directions, the first rotary driving mechanism 33 is connected with the crank 34 and drives the crank 34 to rotate, and the crank 34 can extend into the space between an upper cover 73 and a lower cover 72 of the jig 7.

Specifically, the method comprises the following steps:

when the upper cover 73 or the lower cover 72 of the jig 7 is turned over, the second XZ axis moving mechanism 32 drives the first rotating mechanism 33 to integrally move, so that the crank 34 can extend between the upper cover 73 and the lower cover 72 of the jig 7, and the first rotating mechanism 33 drives the crank 34 to clockwise rotate, so that the upper cover 73 or the lower cover 72 is turned over.

When the jig 7 is turned over, the second XZ axis moving mechanism 32 drives the first rotating mechanism 33 to integrally move, so that the crank 34 can extend into the space between the upper cover 73 and the lower cover 72 of the jig 7 and be clamped into the jig body 71, the first rotating mechanism 33 drives the crank 34 to clockwise rotate, the jig 7 is driven to turn over 180 degrees, and the jig 7 is turned over.

When the upper cover 73 or the lower cover 72 of the jig 7 is closed, the second XZ axis moving mechanism 32 drives the first rotating mechanism 33 to integrally move, so that the crank 34 can be placed below the upper cover 73 or the lower cover 72, and the first rotating mechanism 33 rotates, thereby closing the upper cover 73 or the lower cover 72.

In this embodiment, only one jig flip mechanism 3 is installed before the PCB assembly mechanism 4 to complete three actions of closing the upper cover 73, flipping the jig 7, and flipping the lower cover 72, so as to simplify the structure of the device. Of course, three jig flip mechanisms 3 may be provided to complete three operations of closing the upper cover 73, flipping the jig 7, and flipping the lower cover 72, respectively, so as to improve the assembly efficiency.

Preferably, the first rotary driving mechanism 33 includes a driving member 331, a supporting plate 332, a belt pulley 333 and a first rotating shaft 334, the supporting plate 332 is in transmission connection with the second XZ-axis moving mechanism 32, the driving member 331 is fixed on the supporting plate 332, the driving member 331 drives the first rotating shaft 334 to rotate through the belt pulley 333, the first rotating shaft 334 is connected with one end of the crank 34, when the first rotating shaft 334 rotates, the crank 34 is driven to rotate, and the driving member 331 is a motor. Of course, the first shaft 334 may be directly driven to rotate by the motor.

Preferably, the jig flipping mechanism 3 further comprises a jig detector 35, the jig detector 35 is installed on the support plate 332 and disposed on one side of the crank 34, and is used for detecting the flipping state of the upper cover 73 or the lower cover 72 of the jig 7 and the flipping state of the jig 7, and when the jig 7, the upper cover 73, and the lower cover 72 are not rotated in place, it is determined as a defective product. In this embodiment, the fixture detector 35 is an optical fiber detector.

Referring to fig. 3, the base feeding mechanism 1 includes a first bracket 11 and a base clamping jaw 13, the first bracket 11 is provided with a first XZ axis moving mechanism 12, the first XZ axis moving mechanism 12 drives the base clamping jaw 13 to move to the base and clamp the base, and the base is clamped into the jig 7 of the jig reflow mechanism.

Preferably, referring to fig. 4, 5 and 6, the IC assembling mechanism 2 includes an IC feeding mechanism 21 and an IC feeding mechanism 22, the IC feeding mechanism 21 feeds the IC to the IC feeding mechanism 22 located at one side of the jig reflow mechanism, and the IC feeding mechanism 22 transfers the IC from the IC feeding mechanism 21 to the base.

Specifically, the IC feeding mechanism 21 includes a vibration tray 211 and a linear feeder 212, and the ICs are conveyed onto the linear feeder 212 by the vibration tray 211 and are conveyed to the jig reflow mechanism side by the linear feeder 212.

The IC feeding mechanism 22 includes a third XZ axis moving mechanism 221 and a vacuum sucking detection mechanism 222, the third XZ axis moving mechanism 221 sends the vacuum sucking detection mechanism 222 to a position above the linear feeder 212 close to the jig reflow mechanism, the vacuum sucking detection mechanism 222 includes a first cylinder 2221, a probe 2222 and a vacuum sucker 2223, the vacuum sucker 2223 sucks the IC9 to the base, a suction port 22231 with a shape consistent with that of the IC9 is formed at the lower end of the vacuum sucker 2223, the vacuum sucker 2223 sucks the IC9 into the suction port 22231, and the suction port 22231 limits the IC9, so as to prevent the IC9 from shifting in the assembling process. The first cylinder 2221 drives the probe needle 2222 to move downward to detect whether the IC9 is assembled in place, and if not, it is determined that the product is defective. The vacuum switch is used for detecting whether the vacuum suction 2223 sucks the IC9 or not, and if the IC9 is not sucked, the IC is judged to be a defective product.

The IC assembling mechanism 2 further includes a first fixture fixing mechanism 23, when the IC feeding mechanism 22 clamps the IC9 into the base, the first fixture fixing mechanism 23 is used for fixing the fixture 7, so as to prevent the fixture 7 from moving when assembling the IC9, which may affect the assembly.

Referring to fig. 7, the PCB assembly mechanism 4 includes a PCB feeding mechanism 41, a PCB turnover mechanism 42, and a PCB feeding mechanism 43. The PCB feeding mechanism 41 feeds the PCB 8 to the PCB turnover mechanism 42, the turnover mechanism 42 turns the PCB, and the PCB feeding mechanism 43 conveys the PCB from the PCB turnover mechanism 42 and mounts the PCB on the base.

Further, referring to fig. 8, the PCB assembly mechanism 4 further includes a PCB shaping mechanism 44, the PCB shaping mechanism 44 includes a PCB shaping platform 441, and a first shaping block 442, a second shaping block 443, a third shaping block 444, and a fourth shaping block 445 respectively disposed in the front, rear, left, and right directions of the PCB shaping platform 441, the PCB 8 is horizontally placed in the middle of the PCB shaping platform 441, and the first shaping block 442, the second shaping block 443, the third shaping block 444, and the fourth shaping block 445 are driven by an air cylinder to move toward the middle of the PCB shaping platform 441 to shape the PCB 8.

Preferably, referring to fig. 9, the PCB feeding mechanism 41 includes an XY axis moving mechanism 411, a second cylinder and a PCB clamping claw 412, the PCB 8 is vertically mounted on the tray 45, the XY axis moving mechanism 41 drives the PCB clamping claw 412 to move to above the corresponding PCB 8, and the second cylinder drives the PCB clamping claw 412 to move downwards to clamp the PCB 8.

Preferably, the number of the PCB clamping jaws 412 in this embodiment is three, as shown in fig. 9, the three PCB clamping jaws 412 are respectively a first PCB clamping jaw 4121, a second PCB clamping jaw 4122 and a third PCB clamping jaw 4123, so that the PCB clamping jaws 412 can clamp three PCB boards 8 to the PCB turnover mechanism 42 at a time, and then the XY axis moving mechanism 411 moves the positions of the PCB clamping jaws 412 in the X direction, so that the three PCB boards 8 are sequentially placed at the PCB turnover mechanism 42, thereby improving the clamping efficiency.

Referring to fig. 10, the PCB turnover mechanism 42 includes a third support 421, a second rotation driving mechanism 422 and two second rotating shafts 423 disposed correspondingly, the two second rotating shafts 423 are disposed through the third support 421, one sides of the two second rotating shafts 423 corresponding to each other are respectively provided with a clamping groove 4231, and two sides of the lower portion of the PCB 8 are clamped into the clamping grooves 4231, so as to clamp the PCB 8.

Second rotary driving mechanism 422 includes swinging boom 4222 and third cylinder 4221, the third cylinder sets up in swinging boom 4222 below, swinging boom 4222's one end is connected with second pivot 423, when the other end upward operation of third cylinder 4221 drive swinging boom 4222, swinging boom 4222 drives second pivot 423 and rotates, make to press from both sides and get PCB board 8 and the horizontal plane parallel on pivot 423, be convenient for PCB board feed mechanism 43 presss from both sides the PCB board 8 clamp of placing the level to the base on, after PCB board 8 is pressed from both sides away by PCB board feed mechanism 43, third cylinder 4221 resets, swinging boom 4222 resets under the effect of gravity, press from both sides and get next vertical PCB board 8.

Referring to fig. 11, the PCB feeding mechanism 43 includes a fourth XZ axis moving mechanism 433, a first PCB feeding gripper 431 and a second PCB feeding gripper 432, the first PCB feeding gripper 431 is used for clamping the PCB 8 from the PCB turnover mechanism 42 to the PCB shaping mechanism 44 for shaping, the second PCB feeding gripper 432 is used for clamping the PCB 8 from the PCB shaping mechanism 44 to the jig, and the fourth XZ axis moving mechanism 433 drives the first PCB feeding gripper 431 and the second PCB feeding gripper 432 to move at the same time.

Preferably, the PCB assembly mechanism 4 further includes a second fixture fixing mechanism 46, and when the second feeding jaw 432 of the PCB clamps the PCB 8 into the base, the second fixture fixing mechanism 46 is used for fixing the fixture 7, so as to prevent the fixture 7 from moving when the PCB 8 is assembled and affecting the assembly.

The first jig fixing mechanism 23 and the second jig fixing mechanism 46 are both air claws.

The IC base plate of having assembled IC9 and PCB board 8 is the non-defective products, and the non-defective products flows into soldering tin machine belt through the assembly line and carries out the soldering tin, and the IC base plate that does not have assembled PCB board 8 or IC9 is the defective products, and the defective products passes through the manipulator and pushes the defective products department of placing.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (10)

1. An IC substrate automated assembly apparatus, comprising:

the jig backflow mechanism is used for conveying the jigs;

the base feeding mechanism (1) is used for placing the base on the jig;

the jig overturning and turning mechanism (3) is used for turning the upper cover and the lower cover of the jig and overturning the jig;

an IC assembling mechanism (2) for assembling an IC to the base;

a PCB assembly mechanism (4) for assembling the PCB to the base,

the base feeding mechanism (1), the IC assembling mechanism (2) and the PCB assembling mechanism (4) are arranged in sequence along the jig reflow mechanism,

the fixture turnover cover mechanism (3) is at least three and is respectively arranged in front of the base feeding mechanism (1), in front of the PCB assembly mechanism (4) and behind the PCB assembly mechanism (4).

2. The IC substrate automated assembly apparatus according to claim 1, wherein the base loading mechanism (1) comprises:

a first bracket (11);

a first XZ-axis moving mechanism (12) mounted on the first bracket (11);

and the base clamping jaw (13) is in transmission connection with the first XZ shaft moving mechanism (12) and is used for clamping the base.

3. The IC substrate automatic assembly apparatus according to claim 1, wherein the jig flip-lid mechanism (3) comprises:

a second bracket (31);

a second XZ-axis moving mechanism (32) mounted on the second bracket (31);

the first rotary driving mechanism (33) is in transmission connection with the second XZ-axis moving mechanism (32);

the first rotary driving mechanism (33) is connected with the crank (34) and drives the crank (34) to rotate, and the crank (34) can extend into a position between the upper cover and the lower cover of the jig.

4. An IC substrate automatic loading apparatus according to claim 3, wherein said first rotary drive mechanism (33) comprises:

a driver (331);

the belt pulley (333) is in transmission connection with the driving piece (331);

the first rotating shaft (334), the belt pulley (333) drives the first rotating shaft (334) to rotate, and the first rotating shaft (334) is connected with the crank (34).

5. The IC substrate automatic assembly apparatus according to claim 4, wherein the jig flip-lid mechanism (3) further comprises a jig detector (35), and the jig detector (35) is installed at one side of the crank (34) and is used for detecting a flip state of the upper cover or the lower cover of the jig and a flip state of the jig.

6. The IC substrate automated assembly apparatus according to claim 1, wherein the IC assembling mechanism (2) comprises:

the IC feeding mechanism (21) is used for feeding the IC to one side of the jig backflow mechanism by the IC feeding mechanism (21);

and the IC feeding mechanism (22) is used for conveying the IC from the IC feeding mechanism (21) to the base.

7. The IC substrate automated assembly apparatus according to claim 1, wherein the PCB assembly mechanism (4) comprises:

a PCB feeding mechanism (41);

a PCB board turnover mechanism (42);

a PCB feeding mechanism (43);

the PCB feeding mechanism (41) sends the PCB to the PCB overturning mechanism (42), the PCB overturning mechanism (42) overturns the PCB, and the PCB feeding mechanism (43) conveys the PCB from the PCB overturning mechanism (42) and installs the PCB on the base.

8. The IC substrate automatic assembly apparatus according to claim 7, wherein the PCB feeding mechanism (41) comprises:

an XY-axis moving mechanism (411);

and the PCB clamping jaw (412) is in transmission connection with the XY axis moving mechanism (411) and is used for clamping a PCB.

9. The IC substrate automatic assembly apparatus according to claim 7, wherein said PCB board inverting mechanism (42) comprises:

a third bracket (421);

the second rotating shafts (423) are arranged in two corresponding ways, penetrate through the third support (421) and are used for clamping the PCB;

and the second rotary driving mechanism (422) is used for driving the second rotating shaft (423) to rotate.

10. An IC substrate automatic assembly apparatus according to claim 7, wherein the PCB assembly mechanism (4) further comprises a PCB reshaping mechanism (44), and the PCB reshaping mechanism (44) comprises:

the PCB shaping platform (441) is used for placing a PCB;

and the shaping blocks are arranged in a plurality of numbers and are arranged around the PCB shaping platform (441), and the shaping blocks move relatively to shape the PCB.

Images