CN210142728U - Connection structure and electronic equipment - Google Patents
Connection structure and electronic equipment Download PDFInfo
- Publication number
- CN210142728U CN210142728U CN201920889994.5U CN201920889994U CN210142728U CN 210142728 U CN210142728 U CN 210142728U CN 201920889994 U CN201920889994 U CN 201920889994U CN 210142728 U CN210142728 U CN 210142728U
- Authority
- CN
- China
- Prior art keywords
- elastic sheet
- circuit board
- device body
- conductive layer
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000012634 fragment Substances 0.000 abstract description 4
- 238000005452 bending Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- Telephone Set Structure (AREA)
Abstract
The utility model provides a connecting structure, which comprises a shell, a device body, a circuit board, a first elastic sheet and a second elastic sheet, wherein the device body, the circuit board, the first elastic sheet and the second elastic sheet are arranged in the shell; the first elastic sheet is electrically connected with the device body, and the second elastic sheet is electrically connected with the circuit board; the inner surface of the shell is provided with a conducting layer, and the first elastic sheet and the second elastic sheet are respectively contacted with the conducting layer and electrically connected with each other, so that the device body is electrically connected with the circuit board. The utility model also provides an electronic equipment. The utility model discloses a first shell fragment, second shell fragment replace wire or FPC's connected mode among the prior art with being connected of conducting layer, can promote connection quality and life, have effectively saved electronic equipment's thickness space.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to an electronic equipment technical field especially relates to a connection structure and electronic equipment.
[ background of the invention ]
All earphones, speakers or electric sound devices such as motors in the electronic equipment need to be in conductive connection with the circuit board, the conventional mode is that wires are adopted for connection, the wires influence the performance of the antenna, welding is needed, and operation is complex. At present, a mode of switching by using an FPC (Flexible Printed Circuit) is also available, but this mode needs a certain thickness space, which is not favorable for the realization of the thinning of the electronic device, and has high cost, and the connection elastic piece of the electroacoustic device is easily worn or the FPC is penetrated by the top, which affects the service life of the connection structure.
Therefore, it is desirable to provide a connection structure and an electronic device to overcome the above-mentioned drawbacks.
[ Utility model ] content
The utility model aims at providing a connection structure and electronic equipment practices thrift the space, can promote connection quality and life.
In order to achieve the above object, the present invention provides a connection structure, which includes a housing, and a device body, a circuit board, a first elastic sheet and a second elastic sheet disposed in the housing; the first elastic sheet is electrically connected with the device body, and the second elastic sheet is electrically connected with the circuit board; the inner surface of the shell is provided with a conducting layer, and the first elastic sheet and the second elastic sheet are respectively contacted with the conducting layer and electrically connected with each other, so that the device body is electrically connected with the circuit board.
In a preferred embodiment, the first elastic sheet is made of metal and includes a connecting portion, an inclined portion extending along the connecting portion, and a bent portion formed by extending an end of the inclined portion away from the connecting portion, the connecting portion is fixedly connected to the device body, the bent portion abuts against the conductive layer, and a distal end of the bent portion is bent in a direction away from the conductive layer.
In a preferred embodiment, the second elastic sheet is a metal spiral elastic sheet, and the second elastic sheet is pressed between the circuit board and the conductive layer.
In a preferred embodiment, one end of the second elastic sheet is fixed on the circuit board, and the other end of the second elastic sheet is in elastic contact with the conductive layer.
In a preferred embodiment, the housing includes an upper cover, a lower cover, and a middle frame, the middle frame is disposed between the upper cover and the lower cover, and the conductive layer is disposed on a side of the middle frame facing away from the lower cover.
In a preferred embodiment, the device body and the circuit board are disposed close to the upper cover, and the device body and the circuit board are disposed at an interval from the conductive layer to form a space for accommodating the first elastic piece and the second elastic piece.
In a preferred embodiment, the conductive layer is a layered structure formed by silver paste ink spraying or laser etching.
In a preferred embodiment, the conductive layer has a thickness of 0.1 to 0.2mm and a width of 1.2 to 2.0 mm.
In a preferred embodiment, the device body is one of an earpiece, a speaker, or a motor.
In order to achieve the above object, the present invention further provides an electronic device including the above connecting structure.
Compared with the prior art, the beneficial effects of the utility model reside in that: the connection mode of a lead or an FPC in the prior art is replaced by the connection of the first elastic sheet, the second elastic sheet and the conducting layer, so that the connection quality can be improved, the service life of the electronic equipment can be prolonged, the thickness space of the electronic equipment is effectively saved, and the thin design of the electronic equipment is facilitated.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic plan view of a connection structure according to a preferred embodiment of the present invention;
fig. 2 is a cross-sectional view of a connection structure according to a preferred embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of the area A shown in FIG. 1;
fig. 4 is an enlarged view of a portion of the structure of fig. 2.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantageous technical effects of the present invention more clearly understood, the present invention is further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration only and not by way of limitation.
Referring to fig. 1 to 4, the present invention provides a connection structure, which includes a housing 10, and a device body 20, a circuit board 30, a first elastic sheet 40 and a second elastic sheet 50 disposed in the housing 10. The first elastic sheet 40 is electrically connected with the device body 20, and the second elastic sheet 50 is electrically connected with the circuit board 30. The inner surface of the housing 10 is provided with a conductive layer 60, and the first elastic sheet 40 and the second elastic sheet 50 are respectively in contact with and electrically connected to the conductive layer 60, so that the device body 20 is electrically connected to the circuit board 30. The utility model discloses a first shell fragment 40, second shell fragment 50 replace wire or FPC's connected mode among the prior art with being connected of conducting layer 60, practice thrift the space, can promote connection quality and life.
Specifically, as shown in fig. 4, the first elastic sheet 40 is made of metal and includes a connecting portion 41, an inclined portion 42 extending along the connecting portion 41, and a bent portion 43 formed by extending one end of the inclined portion 42 away from the connecting portion 41, and the first elastic sheet 40 is long and occupies a small space. The connecting portion 41 extends along the edge of the device body 20 to form an arc shape, the bending portion 43 abuts against the conductive layer 60, and the end of the bending portion 43 bends towards the direction away from the conductive layer 60, so that the connecting portion 41 has better elasticity, avoids damage caused by pressing, is fixedly connected with the device body 20, and ensures reliable connection of the first elastic sheet 40.
The second elastic sheet 50 is a metal spiral elastic sheet, the second elastic sheet 50 is pressed between the circuit board 30 and the conductive layer 60, and the second elastic sheet 50 is formed by bending an elastic metal sheet for multiple times and is made of a stainless steel material. Specifically, one end of the second elastic sheet 50 is fixed on the circuit board 30, and the other end of the second elastic sheet is in elastic contact with the conductive layer 60, and the second elastic sheet 50 can be fixed on the surface, close to the conductive layer 60, of the circuit board 30 through welding, so that the stability of the connection structure is ensured, and the connection quality is improved.
The housing 10 includes an upper cover 11, a lower cover 12 and a middle frame 13, the middle frame 13 is disposed between the upper cover 11 and the lower cover 12, and the conductive layer 60 is disposed on one side of the middle frame 13 departing from the lower cover 12, so as to facilitate processing and assembling. In the present embodiment, a mounting groove is formed in the housing 10 for mounting the device body 20. In other embodiments, the housing 10 may not include the middle frame 13, and the conductive layer 60 is disposed on a side surface of the lower cover 12 close to the upper cover 11.
Specifically, the device body 20 and the circuit board 30 are disposed near the upper cover 11, and the device body 20 and the circuit board 30 are disposed at intervals with the conductive layer 60 to form a space for accommodating the first elastic sheet 40 and the second elastic sheet 50, so that the first elastic sheet 40 and the second elastic sheet 50 can extend and retract conveniently, and the contact force and the friction force are reduced.
In this embodiment, the conductive layer 60 is a layered structure formed by silver paste ink spraying or laser etching, and has high wear resistance and wear resistance, the thickness of the conductive layer 60 is 0.1-0.2mm, the width is 1.2-2.0mm, and the shape of the conductive layer 60 is set according to actual needs. In a preferred embodiment, the thickness of the conductive layer 60 is 0.1mm, which is effective in saving space while conducting electricity. In other embodiments, the conductive layer 60 may also be a copper foil covering the middle frame 13, and the copper foil may be formed on the surface of the middle frame 13 by physical sputtering, which facilitates the thin design of the electronic device.
Specifically, as shown in fig. 3, the device body 20 is an earpiece, the two first elastic pieces 40 are respectively disposed at intervals on one side of the device body 20 and are respectively used for connecting the positive electrode and the negative electrode of the device body 20, it can be understood that the two second elastic pieces 50 are respectively disposed at intervals on the circuit board 30, the two conductive layers 60 are also respectively disposed and conductively connect one first elastic piece 40 and the corresponding second elastic piece 50, and the specific number and the arrangement mode can be designed according to actual requirements. In other embodiments, the device body 20 may also be an electroacoustic device such as a speaker, a motor, or the like. In other embodiments, the number of the first resilient sheets 40 may be more than two, and correspondingly, the number of the second resilient sheets 50 and the number of the conductive layers 60 correspond to the number of the first resilient sheets 40, so as to transmit corresponding electrical signals.
In another embodiment of the present invention, an electronic device is also provided, which includes the above-mentioned connecting structure. The electronic equipment comprises but is not limited to a mobile phone, a tablet personal computer, intelligent glasses and a handheld game machine, the electronic equipment adopts the connecting structure, the connecting quality can be improved, the service life can be prolonged, and the thickness of the whole machine can be reduced.
The invention is not limited solely to that described in the specification and the embodiments, and additional advantages and modifications will readily occur to those skilled in the art, and it is not intended to be limited to the specific details, representative apparatus, and illustrative examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.
Claims (10)
1. A connecting structure is characterized by comprising a shell, a device body, a circuit board, a first elastic sheet and a second elastic sheet, wherein the device body, the circuit board, the first elastic sheet and the second elastic sheet are arranged in the shell; the first elastic sheet is electrically connected with the device body, and the second elastic sheet is electrically connected with the circuit board; the inner surface of the shell is provided with a conducting layer, and the first elastic sheet and the second elastic sheet are respectively contacted with the conducting layer and electrically connected with each other, so that the device body is electrically connected with the circuit board.
2. The connecting structure according to claim 1, wherein the first resilient piece is made of metal and includes a connecting portion, an inclined portion extending along the connecting portion, and a bent portion formed by extending an end of the inclined portion away from the connecting portion, the connecting portion is fixedly connected to the device body, the bent portion abuts against the conductive layer, and an end of the bent portion is bent in a direction away from the conductive layer.
3. The connection structure of claim 1, wherein the second resilient piece is a metal spiral resilient piece, and the second resilient piece is pressed between the circuit board and the conductive layer.
4. The connecting structure according to claim 3, wherein one end of the second elastic sheet is fixed on the circuit board and the other end is in elastic contact with the conductive layer.
5. The connecting structure according to claim 1, wherein the housing includes an upper cover, a lower cover, and a middle frame, the middle frame is disposed between the upper cover and the lower cover, and the conductive layer is disposed on a side of the middle frame facing away from the lower cover.
6. The connecting structure according to claim 5, wherein the device body and the circuit board are disposed close to the upper cover, and the device body and the circuit board are disposed at intervals from the conductive layer to form a space for accommodating the first resilient piece and the second resilient piece.
7. The connection structure of claim 1, wherein the conductive layer is a layered structure formed by silver paste ink spraying or laser etching.
8. The connection structure according to claim 7, wherein the conductive layer has a thickness of 0.1 to 0.2mm and a width of 1.2 to 2.0 mm.
9. The connection structure according to claim 1, wherein the device body is one of an earpiece, a speaker, or a motor.
10. An electronic device characterized in that it comprises a connection structure according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920889994.5U CN210142728U (en) | 2019-06-14 | 2019-06-14 | Connection structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920889994.5U CN210142728U (en) | 2019-06-14 | 2019-06-14 | Connection structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210142728U true CN210142728U (en) | 2020-03-13 |
Family
ID=69734667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920889994.5U Expired - Fee Related CN210142728U (en) | 2019-06-14 | 2019-06-14 | Connection structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210142728U (en) |
-
2019
- 2019-06-14 CN CN201920889994.5U patent/CN210142728U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200313 |