CN210122553U

CN210122553U - Substrate-free AB adhesive for fingerprint AF screen under screen

Info

Publication number: CN210122553U
Application number: CN201920934765.0U
Authority: CN
Inventors: 周英杰; 麦启波
Original assignee: Crown Taicang Adhesive Products Co Ltd
Current assignee: Jiangsu Huangguan New Material Technology Co., Ltd
Priority date: 2019-06-20
Filing date: 2019-06-20
Publication date: 2020-03-03
Anticipated expiration: 2029-06-20

Abstract

The utility model relates to a fingerprint AF screen is glued with no substrate AB glue under screen, including high adhesion strength OCA glue film (14), transition gluing agent layer (13), the special gluing agent layer of AF screen (12) that set gradually from bottom to top, high adhesion strength OCA glue film (14) are acrylic acid ester gluing agent layer, and it is 1500 and 3500gf/in for 180 peel strength of steel sheet; the transition adhesive layer (13) is an acrylate adhesive, and the 180-degree stripping force of the acrylate adhesive to the steel plate is 300-2500 gf/in; the special adhesive layer (12) for the AF screen is a silica gel layer, the peeling force of the special adhesive layer to the steel plate at 180 degrees is 200-1200gf/in, and the peeling force to the AF screen at the water drop angle of more than or equal to 115 degrees is 15-100 gf/in. The utility model discloses have stronger bonding effect to the AF screen, can be applied to screen protection fields such as cell-phone, computer, TV, on-vehicle screen, can provide the guard action under the prerequisite that does not reduce screen display effect.

Description

Substrate-free AB adhesive for fingerprint AF screen under screen

Technical Field

The utility model relates to an optical protection film field especially relates to a fingerprint AF screen is glued with no substrate AB under screen.

Background

The AF screen refers to a fingerprint-proof screen, which has ultralow surface energy and hydrophobic and oleophobic performances, common materials cannot be effectively soaked/adhered on the surface of the screen, the screen is not easy to pollute, trace oil stains remained on the surface can be easily wiped off without leaving marks even if the AF screen is heavily used, and the AF screen is widely applied to various display devices, in particular to electronic products with touch operation requirements due to the excellent isolation effect of the AF screen.

Along with the improvement of people's standard of living, the requirement to electronic product is also from the promotion in the aspect of single performance before, progressively improve to the performance, outward appearance, the improvement of whole product designs such as secret safety and operation convenience, under this condition, the fingerprint unlocking screen takes place in response to the screen with AF function, this kind of product not only has the security and the privacy of conventional fingerprint unlocking product, still hide in the screen below because of the fingerprint identification system, avoid opening a hole in electronic product surface, the underframe is reduced greatly, the screen accounts for and improves by a wide margin, the product outward appearance is more neat/pleasing to the eye, whole display effect and use experience far beyond traditional product.

However, the requirements of the under-screen fingerprint identification screen after fingerprint prevention treatment on optical performance are high, the accuracy and response speed in the fingerprint identification process are greatly reduced due to the phase difference problem of the base material or the hardened film of the traditional screen-attached protection product, and the problems of low upper limit of operating temperature and insufficient strength exist in the current novel base material or the hardened film which meets the identification requirements. At present, in order to realize a better identification effect, a part of manufacturers adopt a novel base material or a hardening film to match with a low-temperature curing condition, so that although the fingerprint identification requirement can be met, the lower curing temperature can cause poor curing of a colloid, the strength is lower, and finally, in the actual use, the bad problems of adhesive residue, degumming or slippage and the like occur, so that the use experience of a customer is seriously influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model aims at providing a fingerprint AF screen is glued with no substrate AB under screen, and this AF screen is glued with gluing has high luminousness and low haze, and is high to sclerosis membrane and substrate bonding strength, is difficult for coming unstuck, to AF screen bonding jail, is difficult for sliding in the use.

The utility model provides a fingerprint AF screen is with no substrate AB glue under screen, including high bonding strength OCA glue film (14), transition gluing agent layer (13) and AF screen special use gluing agent layer (12) that set gradually from bottom to top, high bonding strength OCA glue film (14) are acrylate gluing agent layer, and it is 1500-3500gf/in to 180 peeling strength of steel sheet; the transition adhesive layer (13) is a modified acrylate adhesive, and the 180-degree stripping force of the transition adhesive layer to the steel plate is 300-2500 gf/in; the special adhesive layer (12) for the AF screen is a silica gel layer, the 180-degree stripping force of the special adhesive layer to the steel plate is 200-1200gf/in, and the 180-degree stripping force of the special adhesive layer to the AF screen with the water drop angle larger than or equal to 115-15 gf/in.

Further, a first release film layer (11) is further arranged on one side, away from the transition adhesive layer (13), of the special adhesive layer (12) for the AF screen, and the release force of the first release film layer (11) is 10-50 gf/in.

Further, the first release film layer (11) is a medium release force release film, such as a non-silicon release film or a fluorine release film, and the substrate is a PET, PE, PVC, PC or BOPP film. Preferably, the first release film layer (11) substrate is a PET film.

Further, the thickness of the first release film layer (11) is 25-50 microns.

Furthermore, a second release film layer (15) is further arranged on one side, away from the transition adhesive layer (13), of the high-adhesion-strength OCA adhesive layer (14), and the release force of the second release film layer (15) is 5-20 gf/in.

Further, the second release film layer (15) is a light release force release film, such as a silicon release film, and the substrate thereof is a PET, PE, PVC, PC or BOPP film. Preferably, the second release film layer (15) substrate is a PET film.

Further, the thickness of the second release film layer (15) is 25-50 microns.

Further, the thickness of the high bonding strength OCA glue layer (14) is 20-150 microns.

Further, the thickness of the transition adhesive layer (13) is 10-50 microns. The transition adhesive layer (13) is used for improving the bonding strength of the high-bonding-strength OCA adhesive layer (14) and the AF screen special adhesive layer (12), the coating yield is improved, and meanwhile, the refractive index mutation from the high-bonding-strength OCA adhesive layer (14) to the AF screen special adhesive layer (12) is reduced through the transition layer, namely the transition adhesive layer (13) can promote the bonding of the upper and lower adhesive layers and provide gradient refractive index, the light transmittance and the integral optical performance are improved, and the haze is reduced.

Further, the thickness of the special adhesive layer (12) for the AF screen is 10-80 microns.

Preferably, the special adhesive layer (12) for the AF screen is an organic silicon pressure-sensitive adhesive layer.

Further, the utility model discloses in, high bonding strength OCA layer is glued (14), transition gluing agent layer (13), AF screen special use gluing agent layer (12) all are plane film form.

Further, the preparation method of the substrate-free AB adhesive for the fingerprint AF screen under the screen comprises the following steps:

and coating an OCA layer adhesive (14) with high bonding strength, a transition adhesive layer (13) and an AF screen special adhesive layer (12) on the surface of the second release film layer (15) from bottom to top in sequence, and finally compounding a first release film layer (11) on one side of the AF screen special adhesive layer (12) far away from the transition adhesive layer (13).

Further, the coating process adopts one or two of micro-gravure coating, blade coating and slit coating, and each layer is subjected to baking treatment after coating to be formed.

Further, fingerprint AF screen is glued with no substrate AB under the screen when using, tears the second earlier and leaves type rete (15), glues (14) with high bonding strength OCA layer and laminate the hardening film or the substrate back that accord with fingerprint identification effect under the screen, after the laminating finishes, tears first again and leaves type rete (11), laminates AF screen special-purpose gluing agent layer (12) on the AF screen of fingerprint identification under the screen that needs the protection.

Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:

the utility model discloses an utilize transition gluing agent layer (13) to couple together high bonding strength OCA glue film (14) and AF screen special adhesive agent layer (12), reduce the refractive index sudden change from high bonding strength OCA glue film (14) to AF screen special adhesive agent layer (12), make fingerprint AF screen have high luminousness, low haze under the screen with no substrate AB glue, its screen finger mark discernment is fast, and the identification accuracy is high; and the arrangement of the special adhesive layer (12) for the AF screen enables the bonding strength of the substrate-free AB adhesive for the fingerprint AF screen under the screen to be high.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.

Drawings

Fig. 1 is a schematic side view of the present invention;

description of reference numerals:

11-a first release film layer; 12-AF screen special adhesive layer; 13-a transition adhesive layer; 14-high bond strength OCA glue layer; 15-a second release film layer.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

Example 1

The non-base material AB glue for the fingerprint AF screen under the screen comprises a first release film layer 11, a special adhesive layer 12 for the AF screen, a transition adhesive layer 13, a high-adhesion-strength OCA glue layer 14 and a second release film layer 15 which are sequentially arranged from top to bottom. Each layer is in the form of a planar film.

Wherein, the first release film layer 11 is a fluorine release film with a thickness of 50 microns and a 180 DEG peeling force to a steel plate of 13 gf/in.

The special adhesive layer 12 for the AF screen is an organic silicon pressure-sensitive adhesive, the thickness of the adhesive is 30 micrometers, the 180-degree peeling force to a steel plate is 900gf/in, and the 180-degree peeling force to a 117-degree water drop angle AF screen is 53 gf/in.

The transition adhesive layer 13 is a modified acrylate adhesive, the thickness is 10 micrometers, and the 180-degree peeling force to the steel plate is 870 gf/in.

The high-bonding-strength OCA adhesive layer 14 is an acrylate adhesive, the thickness of the OCA adhesive layer is 30 micrometers, and the 180-degree stripping force of the OCA adhesive layer to a steel plate is 2500 gf/in.

The second release film layer 15 is a silicon-based release film with a thickness of 50 μm and a 180 ° peel force to a steel plate of 5 gf/in.

Example 2

Wherein, the first release film layer 11 is a non-silicon release film with a thickness of 25 microns and a 180 DEG peeling force to a steel plate of 35 gf/in.

The special adhesive layer 12 for the AF screen is an organic silicon pressure-sensitive adhesive, the thickness of the adhesive is 20 micrometers, the 180-degree peeling force to a steel plate is 400gf/in, and the 180-degree peeling force to a 115-degree water drop angle AF screen is 28 gf/in.

The transition adhesive layer 13 is a modified acrylate adhesive, the thickness is 20 micrometers, and the 180-degree stripping force to the steel plate is 1800 gf/in.

The high-bonding-strength OCA adhesive layer 14 is an acrylate adhesive, the thickness of the OCA adhesive layer is 30 micrometers, and the 180-degree peeling force of the OCA adhesive layer to a steel plate is 2000 gf/in.

The second release film layer 15 is a silicon-based release film with a thickness of 25 μm and a 180 ° peel force to a steel plate of 12 gf/in.

Example 3

Wherein, the first release film layer 11 is a fluorine release film with a thickness of 25 microns and a 180 DEG peeling force to a steel plate of 18 gf/in.

The special adhesive layer 12 for the AF screen is an organic silicon pressure-sensitive adhesive, the thickness of the adhesive is 25 micrometers, the 180-degree peeling force to a steel plate is 750gf/in, and the 180-degree peeling force to a 116-degree water drop angle AF screen is 42 gf/in.

The transition adhesive layer 13 is a modified acrylate adhesive, the thickness is 15 micrometers, and the 180-degree peeling force to the steel plate is 1500 gf/in.

The high-bonding-strength OCA adhesive layer 14 is an acrylate adhesive, the thickness is 40 micrometers, and the 180-degree peeling force to a steel plate is 1700 gf/in.

The second release film layer 15 is a silicon-based release film with a thickness of 25 μm and a 180 ° peel force against a steel plate of 10 gf/in.

Example 4

Wherein, the first release film layer 11 is a fluorine release film with a thickness of 50 microns and a 180 DEG peeling force to a steel plate of 25 gf/in.

The special adhesive layer 12 for the AF screen is an organic silicon pressure-sensitive adhesive, the thickness of the adhesive is 25 micrometers, the 180-degree peeling force to a steel plate is 350gf/in, and the 180-degree peeling force to a 116-degree water drop angle AF screen is 23 gf/in.

The transition adhesive layer 13 is a modified acrylate adhesive, the thickness is 20 micrometers, and the 180-degree peeling force to the steel plate is 2600 gf/in.

The high-bonding-strength OCA adhesive layer 14 is an acrylate adhesive, the thickness is 25 micrometers, and the 180-degree stripping force of the OCA adhesive layer to a steel plate is 3000 gf/in.

The second release film layer 15 is a silicon-based release film with a thickness of 25 μm and a 180 ° peel force to a steel plate of 5 gf/in.

The AF screen with the lower fingerprint in the embodiment has the advantages that the AF screen is bonded by the substrate-free AB glue, the AF screen is strong in bonding acting force, the AF screen is not degummed and does not slide, the light transmittance of the whole product is larger than 92%, the haze is smaller than 1.0, the fingerprint identification is rapid, the product is accurate, the operation is simple, and the use is convenient. The screen protection device can be applied to the screen protection fields of mobile phones, computers, televisions, vehicle-mounted screens and the like, and can provide protection on the premise of not reducing the screen display effect. The utility model discloses a layer upon layer coating method preparation, through 14 bonding hardening film or substrates in high bonding strength OCA glue film during the use, through AF screen special gluing agent layer 12 bonding AF screen, have high luminousness, low haze, have bonding, guard action to all kinds of AF screens.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a fingerprint AF screen is glued with no substrate AB under screen which characterized in that: the high-bonding-strength OCA adhesive layer (14), the transition adhesive layer (13) and the special adhesive layer (12) for the AF screen are sequentially arranged from bottom to top, wherein the high-bonding-strength OCA adhesive layer (14) is an acrylate adhesive layer, and the 180-degree stripping force of the high-bonding-strength OCA adhesive layer to a steel plate is 1500-3500 gf/in; the transition adhesive layer (13) is a modified acrylate adhesive layer, and the 180-degree stripping force of the transition adhesive layer to a steel plate is 300-2500 gf/in; the special adhesive layer (12) for the AF screen is a silica gel layer, the 180-degree stripping force of the special adhesive layer to the steel plate is 200-1200gf/in, and the 180-degree stripping force of the special adhesive layer to the AF screen with the water drop angle larger than or equal to 115-15 gf/in.

2. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 1, which is characterized in that: one side, away from the transition adhesive layer (13), of the AF screen special adhesive layer (12) is further provided with a first release film layer (11), and the release force of the first release film layer (11) is 10-50 gf/in.

3. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 2, which is characterized in that: the first release film layer (11) is a non-silicon release film or a fluorine release film.

4. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 2, which is characterized in that: the thickness of the first release film layer (11) is 25-50 microns.

5. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 1, which is characterized in that: one side of the high-bonding-strength OCA adhesive layer (14) far away from the transition adhesive layer (13) is further provided with a second release film layer (15), and the release force of the second release film layer (15) is 5-20 gf/in.

6. The substrate-free AB glue for the fingerprint AF screen under the screen of claim 5, wherein: the second release film layer (15) is a silicon-based release film.

7. The substrate-free AB glue for the fingerprint AF screen under the screen of claim 5, wherein: the thickness of the second release film layer (15) is 25-50 microns.

8. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 1, which is characterized in that: the thickness of the OCA glue layer (14) with high bonding strength is 20-150 microns.

9. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 1, which is characterized in that: the thickness of the transition adhesive layer (13) is 10-50 microns.

10. The substrate-free AB adhesive for the fingerprint AF screen under the screen of claim 1, which is characterized in that: the thickness of the special adhesive layer (12) for the AF screen is 10-80 micrometers.