CN210073854U

CN210073854U - Display panel and electronic device

Info

Publication number: CN210073854U
Application number: CN201921364106.4U
Authority: CN
Inventors: 刘敏
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-08-21
Filing date: 2019-08-21
Publication date: 2020-02-14
Anticipated expiration: 2029-08-21

Abstract

The disclosure relates to the technical field of display, and discloses a display panel and an electronic device. The display panel includes: a substrate; the driving layer is arranged on one side of the substrate and comprises a plurality of thin film transistors distributed in an array manner; the light-emitting layer is arranged on one side, away from the substrate, of the driving layer; the light-emitting layer is provided with a through hole penetrating through the light-emitting layer, the driving layer and the substrate; and the packaging layer covers the light-emitting layer and covers the side wall of the through hole. The display panel can improve the water-oxygen resistance of the luminous layer, reduce the size of the hole frame and reduce the occupancy rate of the hole frame to the screen display area.

Description

Display panel and electronic device

Technical Field

The present disclosure relates to the field of display technologies, and more particularly, to a display panel and an electronic device.

Background

With the development of the display technology field, an Organic Light-Emitting Diode (OLED) display has the advantages of self-luminescence, short reaction time, wide color gamut, low working voltage, thin panel, capability of manufacturing large-size and flexible panels, and the like, and has a wide application prospect. The OLED display panel can be provided with mounting holes by using the anisotropic cutting technology, so that elements such as a camera, a distance touch sensor, a Home key and a listening microphone are arranged in the OLED display panel.

In the related art, since the OLED self-emitting layer is sensitive to water vapor and oxygen, in order to prevent the damage caused by the intrusion of water and oxygen into the OLED self-emitting layer, a thin film encapsulation technology is used to protect the display, but the problem of the reduction of the product life due to the encapsulation failure of the self-emitting layer still exists.

It is to be noted that the information invented in the background section above is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

An object of the present disclosure is to provide a display panel and an electronic device, which can avoid the problem of damage to a self-luminous layer caused by failure of packaging of a cutting surface of the self-luminous layer due to a hole in the related art, and reduce the thickness of a hole frame. In order to achieve the technical effects, the following technical scheme is adopted in the disclosure.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows, or in part will be obvious from the description, or may be learned by practice of the disclosure.

According to an aspect of the present disclosure, there is provided a display panel including:

a substrate;

the driving layer is arranged on one side of the substrate and comprises a plurality of thin film transistors distributed in an array manner;

the light-emitting layer is arranged on one side, away from the substrate, of the driving layer; the light-emitting layer is provided with a through hole penetrating through the light-emitting layer, the driving layer and the substrate;

and the packaging layer covers the light-emitting layer and covers the side wall of the through hole.

In an exemplary embodiment of the disclosure, the thickness of the encapsulation layer on the sidewall of the through hole is less than or equal to the thickness of the encapsulation layer on the side of the light emitting layer facing away from the substrate.

In an exemplary embodiment of the present disclosure, the encapsulation layer includes:

the first packaging layer covers the light-emitting layer and covers the side wall of the through hole;

the second packaging layer is arranged on one side, away from the substrate, of the first packaging layer;

a third encapsulation layer covering the first encapsulation layer and the second encapsulation layer.

In an exemplary embodiment of the present disclosure, the substrate is made of a flexible transparent material.

In one exemplary embodiment of the present disclosure, the flexible transparent material is at least one of polyimide, polyarylate, polycarbonate, and polyethylene naphthalate.

According to an aspect of the present disclosure, there is provided an electronic device including the display panel of any one of the above.

In an exemplary embodiment of the present disclosure, at least one of a camera, a light sensor, an iris recognition sensor, a distance sensor, or an earpiece is disposed in the through-hole.

In the display panel and the electronic apparatus according to the exemplary embodiments of the present disclosure, after the substrate, the driving layer, and the light emitting layer are formed, the light emitting layer is covered with the encapsulation layer, and the hole sidewall of the through hole penetrating the light emitting layer, the driving layer, and the substrate is covered, thereby achieving effective encapsulation of the light emitting device. On one hand, the packaging layer covers the light-emitting layer and also covers the side wall of the through hole, so that a cutting surface formed during hole opening is blocked, external water vapor, oxygen and the like are prevented from diffusing from the cutting surface to the light-emitting layer, and the failure of the light-emitting layer is avoided; on the other hand, the packaging mode is formed on the side wall of the through hole, the packaging width of the periphery of the through hole does not need to be additionally increased, the hole frame is reduced to a certain extent, the hole frame is prevented from occupying more screen display areas, and more expression forms are provided for the appearance form of the opening.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

fig. 1 shows a schematic structural view of a display panel provided in the related art;

fig. 2 is a schematic view showing a structure of a display panel provided in the related art;

fig. 3 is a schematic view showing a structure of a display panel provided in the related art;

fig. 4 is a schematic view showing a structure of a thin film package provided in the related art;

FIG. 5 shows a display panel structure schematic of an exemplary embodiment of the present disclosure;

FIG. 6 shows a top view of a display panel structure of an exemplary embodiment of the present disclosure;

FIG. 7 illustrates a cross-sectional view of the display panel of FIG. 6 in a first packaging mode;

fig. 8 shows a cross-sectional view of the display panel of fig. 6 in a second packaging mode.

The numerical description of the main elements in the figures includes:

100. a substrate; 1. a substrate; 2. a drive layer; 3. a light emitting layer; 301. a through hole; 302. sidewalls 302 of the via hole; 4. a packaging layer; 401. a first encapsulation layer; 402. a second encapsulation layer; 403. and a third encapsulation layer.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, and the features discussed in connection with the embodiments are interchangeable, if possible. In the above description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a", "an", "the", "said", "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc. The terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

Fig. 1 to 3 are cross-sectional views illustrating a structure of an OLED (Organic Light-Emitting diode) display panel in the related art, and as shown in fig. 1 to 3, the entire process of manufacturing the OLED display panel includes: firstly, the whole panel process is completed on a substrate 100 (sequentially forming a substrate 1, a driving layer 2, a light-emitting layer 3 and an encapsulation layer 4; then, the substrate 100 is stripped by laser, and finally, laser hole cutting is carried out in the OLED display panel to obtain a through hole 301.

In the related art, when the opening region is cut, the cut surface of the light emitting layer 3 in the OLED device is exposed to the external environment, which results in the failure of the package of the light emitting layer 3, and with reference to the related art shown in fig. 4, the package layer 4 is increased in width to isolate water and oxygen, but the increase in the package width results in the increase in the frame of the hole, occupies more display area, and limits the appearance of the hole to some extent.

Based on this, in an exemplary embodiment of the present disclosure, there is first provided a display panel, which is applicable to electronic devices including, but not limited to, smart phones, tablet computers, digital voice video players, electronic readers, handheld game machines, in-vehicle electronic devices, smart wearable devices, and the like; including but not limited to OLED display panels.

Fig. 5 shows a cross-sectional view of a display panel structure of an exemplary embodiment of the present disclosure, which may include a substrate 1, a driving layer 2, a light emitting layer 3, and an encapsulation layer 4, as shown in fig. 5, wherein:

the driving layer 2 may be disposed on one side of the substrate 1, and the driving layer 2 may include a plurality of thin film transistors distributed in an array;

the light-emitting layer 3 can be arranged on the side of the driving layer 2 departing from the substrate 1, wherein the light-emitting layer 3 is provided with a through hole 301 penetrating through the light-emitting layer 3, the driving layer 2 and the substrate 1;

the encapsulation layer 4 may cover the light emitting layer 3 and cover the sidewalls 302 of the via hole 301.

The display panel provided by the exemplary embodiment of the present disclosure encapsulates the light emitting layer 3, and also encapsulates the sidewall 302 of the through hole 301 penetrating through the light emitting layer 3, the driving layer 2 and the substrate 1, which is disposed on the light emitting layer 3, so that the cut surface (the sidewall 302 of the through hole 301) formed after the hole is opened in the hole-opened region is plugged, thereby effectively preventing the diffusion path of external moisture, oxygen and the like from the cut surface to the light emitting layer 3, and avoiding the failure of the light emitting layer 3. Meanwhile, the substrate 1, the driving layer 2 and the light emitting layer 3 are integrally packaged by the packaging layer in a surrounding manner, the peripheral packaging width of the through hole 301 does not need to be additionally increased, the thickness of the side wall 302 of the hole is reduced to a certain extent, the side wall does not occupy more screen display areas, and the shape of the through hole 301 has more plasticity and expression forms. Therefore, compared with the related art, the display panel provided by the present disclosure can improve the anti-water-oxygen performance of the light emitting layer 3 without increasing the number of process steps, and also effectively reduce the frame thickness of the through hole, thereby facilitating the optimization of the appearance form of the hole.

Portions of a display panel provided by an exemplary embodiment of the present disclosure are explained in detail below with reference to fig. 5:

the substrate 1 may be, for example, a flexible substrate, and may be bent, rolled, or folded, the material of the flexible substrate may include at least one of Polyimide (PI), polyarylate, polycarbonate, polyethylene naphthalate, polyethersulfone, and the like, the substrate 1 may play a bearing role, and the disclosure does not specifically limit the material, the manufacturing process, the thickness, and the like of the substrate 1, and a person skilled in the art may select the substrate according to actual working conditions. In an alternative embodiment, the substrate 1 may also be a rigid substrate, such as glass; in an alternative embodiment, the substrate 1 may also be a transparent film, such as a transparent PI film substrate, which may allow the resulting display panel to produce a blind via effect.

With continued reference to fig. 5, the driving layer 2 is disposed on one side of the substrate 1, and in an alternative embodiment, the driving layer 2 may include a plurality of Thin-Film transistors (TFTs) distributed in an array, such as a switching Transistor and a driving Transistor. Specifically, a buffer layer is formed on the substrate 1, and the buffer layer can prevent moisture and oxygen from penetrating into the driving layer 2 to affect the performance of the display panel, wherein the material of the buffer layer includes, but is not limited to, silicon oxide, silicon nitride, silicon oxynitride, or other materials with similar and stable properties, and further, the driving layer 2 is disposed on the buffer layer and includes a semiconductor layer, a gate insulating layer, a gate electrode, a drain electrode, a conductive circuit, and the like. The drain of the thin film transistor is connected to the anode of the light-emitting layer 3 to facilitate hole injection. The working process of the light-emitting layer 3 is that after the thin film transistor is turned on, an electric signal in a power supply voltage signal is provided to the anode of the light-emitting layer 3; a potential difference is formed between the anode and the cathode of the light-emitting layer 3, and the holes of the anode and the electrons of the cathode are recombined in the light-emitting layer 3 to emit light, so that the display panel has a display function. The anode can be an Ag/ITO layer, and the cathode can be an Mg/Ag layer.

Further, the light emitting layer 3 is provided with a through hole 301 penetrating through the light emitting layer 3 itself, the driving layer 2 and the substrate 1, wherein the shape of the through hole 301 needs to be related to the shape of the functional module embedded therein or match the actual working requirement thereof, and the shape of the through hole 301 includes, but is not limited to, a circle, an ellipse, a truncated cone, a rectangle, or other regular shape and irregular shape, which is not listed in this disclosure. In an optional embodiment, according to actual requirements, the through hole 301 may also only penetrate through the light emitting layer 3, or penetrate through the light emitting layer 3 and the driving layer 2, or penetrate through the light emitting layer 3, the driving layer 2 and the substrate 1, and it is only necessary to ensure that the through hole 301 penetrates through the light emitting layer 3, so that the encapsulation layer 4 formed in the subsequent encapsulation process blocks the sidewall 302 formed by the through hole 301 penetrating through the light emitting layer 3, and effective blocking of the light emitting layer 3 and external water and oxygen is realized.

Fig. 6 shows a top view of a display panel structure according to an exemplary embodiment of the disclosure, fig. 7 shows a cross-sectional view along a-a in fig. 6 in a first packaging manner, and as shown in fig. 7, the packaging layer 4 includes:

a first encapsulation layer 401 covering the light emitting layer 3 and covering the sidewall 302 of the through hole 301;

the second packaging layer 402 is arranged on one side, away from the substrate 1, of the first packaging layer 401;

and a third encapsulation layer 403 covering the first encapsulation layer 401 and the second encapsulation layer 402.

Each layer of the packaging layer can adopt the lamination combination of various organic materials and inorganic materials, and can be packaged by TFE (Thin film encapsulation technology); the first encapsulation layer 401 and the third encapsulation layer 403 are made of inorganic material layers, such as SiNx/SiOx, and the second encapsulation layer 402 is made of organic material layers, such as silicon-based/epoxy/acrylic materials, and naturally, the corresponding encapsulation layers may be selected according to actual requirements, which is not listed in this disclosure.

In an alternative embodiment, the first, second and third encapsulation layers 401, 402 and 403 may be formed by CVD (Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), ALD (Atomic layer Deposition), and the like, and the disclosure does not specifically limit the material, the brake process, and the like of each encapsulation layer.

As shown in fig. 7, the second encapsulation layer 402 does not extend to the sidewall 302 of the through hole 301 along the side a of the light-emitting layer 3 away from the substrate 1, that is, the sidewall 402 of the through hole 401 only covers the first encapsulation layer 401 and the third encapsulation layer 403, so that the thickness of the encapsulation layer of the sidewall 302 of the through hole 301 is smaller than that of the encapsulation layer of the light-emitting layer 3 away from the substrate 1, and the rim of the through hole is further reduced.

Fig. 8 shows a cross-sectional view along a-a in fig. 6 in a second packaging mode, where, as shown in fig. 8, the packaging layer 4 comprises:

a first encapsulation layer 401 covering the light-emitting layer 3, comprising the light-emitting layer 3 on a side facing away from the substrate 1, and covering the sidewalls 302 of the through-hole 301;

a second encapsulation layer 402 covering the first encapsulation layer 401, comprising the first encapsulation layer 401 on the side facing away from the substrate 1 and the first encapsulation layer 401 on the side wall covering the through hole 301;

a third encapsulation layer 403, covering the second encapsulation layer 402, comprises the second encapsulation layer 402 on the side a facing away from the substrate 1 and the second encapsulation layer 402 on the side walls of the through-hole 301.

Based on the above encapsulation layer structure, although three encapsulation layers cover the light-emitting layer 3 and the sidewall 302 of the through hole 301, in an alternative embodiment, the thickness of the encapsulation layer (including the sum of the thicknesses of the first encapsulation layer 401, the second encapsulation layer 402 and the third encapsulation layer 403) covering the sidewall 302 of the through hole 301 may be smaller than the sum of the thicknesses of the encapsulation layers covering the light-emitting layer 3; in an alternative embodiment, the thickness of the encapsulation layer covering the sidewall 302 of the through hole 301 is equal to the thickness of the encapsulation layer covering the light-emitting layer 3, so that the thickness of the encapsulation layer is allowed to be smaller than that of the encapsulation layer covering the light-emitting layer 3 while the sidewall 302 of the through hole 301 covers multiple layers of encapsulation layers, and the requirements of the light-emitting layer 3 for resisting water and oxygen and reducing the frame of the through hole 301 are both considered. Of course, other packaging manners can be selected according to actual working requirements, and the present disclosure includes but is not limited to the packaging manners described above.

It should be noted that the number of through holes 301 provided in the light emitting layer 3 in the above exemplary embodiments of the present disclosure to penetrate the light emitting layer 3 itself, the driving layer 2 and the substrate 1 may be one or more, and when the number of through holes 301 is plural, the substrate 1, the driving layer 2, the light emitting layer 3 and the encapsulation layer 4 may be correspondingly provided with reference to the above description to form one display panel.

It is to be understood that the present disclosure describes only a part of the hierarchical structure, the packaging form, etc. in the display panel, and other hierarchical structures, packaging forms, etc. provided for satisfying the functions thereof may be further included in the display panel, and a skilled person may clearly know that other packaging forms should exist by referring to the related art. For example, with continued reference to fig. 7, the encapsulation layer 4 on the sidewall 302 of the via 301 covers the light-emitting layer 3, the driving layer 2 and the substrate 1; in an alternative embodiment, the encapsulation layer 4 disposed on the sidewall 302 of the through hole 301 may also be encapsulated only to the light emitting layer 3 and the driving layer 2, and does not extend to the substrate 1; or, the encapsulation layer 4 on the sidewall 302 of the through hole 301 is only encapsulated to the light emitting layer 3 and does not extend to the driving layer 2 and the substrate 1, that is, it is only necessary to ensure that the cutting surface (part of the hole wall 302) of the light emitting layer 3 is surrounded by the encapsulation layer 4, so as to isolate the light emitting layer 3 from water and oxygen in the external environment, thereby improving the encapsulation effect.

An electronic device is also provided in an exemplary embodiment of the present disclosure, and the electronic device includes the above display panel, wherein the encapsulation layer 4 covers the light emitting layer 3 and covers the sidewall 302 of the through hole 301, so as to isolate the light emitting layer 3 from external water and oxygen, improve the water and oxygen resistance, and improve the encapsulation effectiveness. In alternative embodiments, the electronic device includes a smart phone, a tablet computer, a digital voice video player, an electronic reader, a handheld game console, a vehicle-mounted electronic device, a smart wearable device, and the like.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A display panel, comprising:

a substrate;

2. The display panel according to claim 1, wherein the thickness of the encapsulation layer on the sidewall of the through hole is less than or equal to the thickness of the encapsulation layer on the side of the light-emitting layer facing away from the substrate.

3. The display panel of claim 1, wherein the encapsulation layer comprises:

4. The display panel according to any one of claims 1 to 3, wherein the substrate is made of a flexible transparent material.

5. The display panel according to claim 4, wherein the flexible transparent material is at least one of polyimide, polyarylate, polycarbonate, and polyethylene naphthalate.

6. An electronic device comprising the display panel of any one of claims 1 to 5.

7. The electronic device of claim 6, wherein at least one of a camera, a light sensor, an iris recognition sensor, a distance sensor, or an earpiece is disposed within the through hole.