CN110491920A - Display panel, display panel manufacturing method and electronic equipment - Google Patents
Display panel, display panel manufacturing method and electronic equipment Download PDFInfo
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- CN110491920A CN110491920A CN201910775150.2A CN201910775150A CN110491920A CN 110491920 A CN110491920 A CN 110491920A CN 201910775150 A CN201910775150 A CN 201910775150A CN 110491920 A CN110491920 A CN 110491920A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 115
- 239000010409 thin film Substances 0.000 claims abstract description 15
- 238000009826 distribution Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- -1 poly-naphthalene dicarboxylic acid glycol ester Chemical class 0.000 claims description 4
- 206010040844 Skin exfoliation Diseases 0.000 claims description 3
- 230000035618 desquamation Effects 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 238000009738 saturating Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052760 oxygen Inorganic materials 0.000 abstract description 16
- 239000001301 oxygen Substances 0.000 abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 317
- 238000005538 encapsulation Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 229920001230 polyarylate Polymers 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 210000004276 hyalin Anatomy 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
This disclosure relates to field of display technology, a kind of display panel and its manufacturing method, electronic equipment are disclosed.The display panel includes: substrate；Layer is driven, the one side of substrate is set to, the driving layer includes multiple thin film transistor (TFT)s of array distribution；Luminescent layer deviates from the side of the substrate set on the driving layer；The luminescent layer is equipped with the through-hole through the luminescent layer, the driving layer and the substrate；Encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole.The display panel of the disclosure can improve the water resistant oxygen of luminescent layer, also reduce the size of hole frame, reduce hole frame to the occupancy in screen display region.
Description
Technical field
This disclosure relates to which field of display technology, sets more particularly, to a kind of display panel and its manufacturing method, electronics
It is standby.
Background technique
With the development of field of display technology, Organic Light Emitting Diode (Organic Light-Emitting Diode,
OLED) display have self-luminous, the reaction time is short, colour gamut is wide, operating voltage is low, panel is thin, can make large scale and flexibility
The advantages that panel, possesses broad application prospect.Wherein, installation can be opened up in OLED display panel using anisotropic cutting technique
Hole, so as to camera, apart from tactility apparatus, Home key and listen the component positionings such as microphone wherein.
In the related technology, since OLED light emitting layer is very sensitive to water vapour and oxygen, to prevent water oxygen from invading OLED certainly
Damage, protects display using thin film encapsulation technology, however there are still the encapsulation because of light emitting layer caused by luminescent layer
Failure leads to problems such as life of product reduce.
It should be noted that the information in the invention of above-mentioned background technology part is only used for reinforcing the reason to the background of the disclosure
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The disclosure is designed to provide a kind of display panel and its manufacturing method, electronic equipment, and then at least certain
Light emitting layer caused by the cut surface package failure of the light emitting layer due to caused by aperture in the related technology is avoided in degree
The problems such as damage, and reduce hole seal ring thickness.To realize that the above technical effect, the disclosure adopt the following technical scheme that.
Other characteristics and advantages of the disclosure will be apparent from by the following detailed description, or partially by the disclosure
Practice and acquistion.
According to one aspect of the disclosure, a kind of display panel is provided, comprising:
Substrate；
Layer is driven, the one side of substrate is set to, the driving layer includes multiple thin film transistor (TFT)s of array distribution；
Luminescent layer deviates from the side of the substrate set on the driving layer；The luminescent layer be equipped with through the luminescent layer,
The through-hole of the driving layer and the substrate；
Encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole.
In a kind of exemplary embodiment of the disclosure, the encapsulated layer thickness of the side wall of the through-hole is less than or equal to described
Luminescent layer deviates from the encapsulated layer thickness of the one side of substrate.
In a kind of exemplary embodiment of the disclosure, the encapsulated layer includes:
First encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole；
Second encapsulated layer deviates from the side of the substrate set on first encapsulated layer；
Third encapsulated layer covers first encapsulated layer and second encapsulated layer.
In a kind of exemplary embodiment of the disclosure, the material of the substrate is flexible clear materials.
In a kind of exemplary embodiment of the disclosure, the flexible clear materials are polyimides, polyarylate, poly- carbonic acid
At least one of ester and poly-naphthalene dicarboxylic acid glycol ester.
According to one aspect of the disclosure, a kind of electronic equipment, including display panel described in above-mentioned any one are provided.
In a kind of exemplary embodiment of the disclosure, camera, light sensor, iris recognition are set in the through-hole
At least one of sensor, range sensor or earpiece.
According to one aspect of the disclosure, a kind of manufacturing method of display panel is provided, which comprises
Substrate is formed on a substrate；
Driving layer is formed in the side of the substrate, the driving layer includes multiple thin film transistor (TFT)s of array distribution；
Luminescent layer is formed away from the side of the substrate in the driving layer；The luminescent layer is equipped with to shine through described
The through-hole of layer, the driving layer and the substrate；
Encapsulated layer is formed, the encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole；
By the substrate and the substrate desquamation.
In a kind of exemplary embodiment of the disclosure, the encapsulated layer thickness of the side wall of the through-hole is less than or equal to described
Luminescent layer deviates from the encapsulated layer thickness of the one side of substrate.
In a kind of exemplary embodiment of the disclosure, the formation encapsulated layer, the encapsulated layer covers the luminescent layer,
And the side wall of the covering through-hole, comprising:
It is formed and covers the luminescent layer, and cover the first encapsulated layer of the side wall of the through-hole；
It is formed and is set to first encapsulated layer away from the second encapsulated layer of the side of the substrate；
Form the third encapsulated layer for covering first encapsulated layer and second encapsulated layer.
Display panel and its manufacturing method, electronic equipment in the exemplary embodiment of the disclosure are forming substrate, driving layer
After luminescent layer, by covering luminescent layer using encapsulated layer, and the hole side of the through-hole through luminescent layer, driving layer and substrate is covered
Wall, realization effectively encapsulate luminescent device.On the one hand, encapsulated layer also covers the side wall of through-hole while covering luminescent layer, will
Cut surface is formed when aperture to be blocked, and is prevented extraneous diffusion path of the Self cleavages such as steam and oxygen towards luminescent layer, is avoided
The failure of luminescent layer；On the other hand, wide in such a way that through-hole side wall forms encapsulation, being not necessarily to the encapsulation of additional increase hole periphery
Degree, reduces hole frame to a certain extent, avoids it from occupying more screen display regions, also provides more multilist for the mode of appearance of aperture
Existing form.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The following detailed description is read with reference to the accompanying drawings, above-mentioned and other mesh of disclosure illustrative embodiments
, feature and advantage will become prone to understand.In the accompanying drawings, if showing the disclosure by way of example rather than limitation
Dry embodiment, in which:
Fig. 1 shows the structural schematic diagram of the display panel provided in the related technology；
Fig. 2 shows the structural schematic diagrams of the display panel provided in the related technology；
Fig. 3 shows the structural schematic diagram of the display panel provided in the related technology；
Fig. 4 shows the thin-film packing structure schematic diagram provided in the related technology；
Fig. 5 shows the display panel structure schematic diagram of the exemplary embodiment of the disclosure；
Fig. 6 shows the display panel structure top view of the exemplary embodiment of the disclosure；
Fig. 7 shows the sectional view of Fig. 6 display panel under the first packaged type；
Fig. 8 shows the sectional view of Fig. 6 display panel under the second packaged type；
Fig. 9 shows the flow chart of the manufacturing method of the display panel of the exemplary embodiment of the disclosure；
Figure 10 shows the signal of the display panel structure in the display panel manufacturing process of the exemplary embodiment of the disclosure
Figure；
Figure 11 shows the signal of the display panel structure in the display panel manufacturing process of the exemplary embodiment of the disclosure
Figure；
Figure 12 shows the signal of the display panel structure in the display panel manufacturing process of the exemplary embodiment of the disclosure
Figure；
Figure 13 shows the signal of the display panel structure in the display panel manufacturing process of the exemplary embodiment of the disclosure
Figure；
Figure 14 shows the signal of the display panel structure in the display panel manufacturing process of the exemplary embodiment of the disclosure
Figure.
Main element description of symbols includes: in figure
100, substrate；1, substrate；2, layer is driven；3, luminescent layer；301, through-hole；302, the side wall 302 of through-hole；4, it encapsulates
Layer；401, the first encapsulated layer；402, the second encapsulated layer；403, third encapsulated layer.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Identical attached drawing in figure
Label indicates same or similar structure, thus the detailed description that will omit them.
Above-mentioned described feature, structure or characteristic can be incorporated in one or more embodiment party in any suitable manner
In formula, if possible, it is characterized in discussed in each embodiment interchangeable.In the above description, it provides many specific thin
Section fully understands embodiments of the present invention to provide.It will be appreciated, however, by one skilled in the art that this can be practiced
The technical solution of invention, or can be using other methods, material etc. without one or more in the specific detail.
In other cases, known features, material or operation are not shown in detail or describe to avoid fuzzy each aspect of the present invention.
Although the term of relativity, such as "upper" "lower" is used to describe a component of icon for another in this specification
The relativeness of one component, but these terms are in this manual merely for convenient, for example, with reference to the accompanying drawings described in show
The direction of example.It is appreciated that, if making it turn upside down the device overturning of icon, the component described in "upper" will
As the component in "lower".When certain structure is at other structures "upper", it is possible to refer to that certain structural integrity is formed in other structures
On, or refer to that certain structure is " direct " and be arranged in other structures, or refer to that certain structure is arranged by the way that another structure is " indirect " in other knots
On structure.
Term "an", " one ", "the", " described " "at least one" are to indicate that there are one or more elements/compositions
Partially/etc.；Term " comprising " and " having " is to indicate the open meaning being included and refer in addition to that lists wants
Element/component part/also may be present except waiting other element/component part/etc..Term " first ", " second " and " third " etc.
It is only used as label, is not the quantity limitation to its object.
FIG. 1 to FIG. 3 shows OLED (Organic Light-Emitting, Organic Light Emitting Diode) in the related technology
Display panel structure sectional view, as shown in Figures 1 to 3, the production process of entire OLED display panel include: firstly, in substrate 100
The upper entire panel process of completion (sequentially forms substrate 1, forms driving layer 2, forms luminescent layer 3 and encapsulated layer 4；Then, laser is shelled
From substrate 100；Finally, carrying out laser hole-cutting in OLED display panel obtains through-hole 301.
It has the following technical problems in the related technology, the luminescent layer 3 when being cut to opening area, in OLED device
Cut surface will be exposed in external environment, lead to 3 package failure of luminescent layer, with continued reference to the relevant technologies shown in Fig. 4, by that will seal
The increased mode of width of dress layer 4 completely cuts off water oxygen, but the increase of the package width causes the frame in hole to increase, and occupies more aobvious
Show region, also limits the mode of appearance in hole to a certain extent.
Based on this, in an exemplary embodiment of the disclosure, a kind of display panel is provided firstly, which can answer
For electronic equipment, which includes but is not limited to smart phone, tablet computer, digital speech video player, electronics
Reader, handheld game machine, vehicle electronic device and intelligent wearable device, etc.；Wherein display panel includes but is not limited to
OLED display panel.
Fig. 5 shows the display panel structure sectional view of the exemplary embodiment of the disclosure, shown in Figure 5, the display
Panel may include substrate 1, driving layer 2, luminescent layer 3, encapsulated layer 4, in which:
Drive layer 2 that can be set to the side of substrate 1, which may include multiple thin film transistor (TFT)s of array distribution；
Luminescent layer 3 can be set to driving layer 2 deviate from substrate 1 side, wherein the luminescent layer 3 be equipped with through luminescent layer 3 itself,
Drive the through-hole 301 of layer 2 and substrate 1；
Encapsulated layer 4 can cover luminescent layer 3, and cover the side wall 302 of through-hole 301.
The display panel that the exemplary embodiment of the disclosure provides, while encapsulating light emitting layer 3, also by the luminescent layer
The side wall 302 of 3 through-holes 301 through luminescent layer 3 itself, driving layer 2 and substrate 1 being equipped with accordingly is encapsulated, so that opening
The cut surface (side wall 302 of through-hole 301) formed after bore region aperture is blocked, effectively prevent extraneous steam and oxygen etc. by
The diffusion path towards luminescent layer 3 is cut, the failure of luminescent layer 3 is avoided.Meanwhile encapsulated layer 4 with " enclosed " by substrate 1, drive
Dynamic 3 overall package of layer 2 and luminescent layer reduces hole without additionally increasing the periphery package width of through-hole 301 to a certain extent
The thickness of side wall 302 avoids it from occupying more screen display regions, and the shape of through-hole 301 is also made to have more plasticity and performance shape
Formula.Accordingly, with respect to the relevant technologies, the display panel that the disclosure provides can improve under conditions of not increasing processing step
The water resistant oxygen of luminescent layer 3, is also effectively reduced the seal ring thickness of through-hole, just there is the appearance form of optimization institute's aperture.
The each section for the display panel that 5 pairs of disclosure exemplary embodiments provide with reference to the accompanying drawing is described in detail:
Substrate 1 can be for example flexible base board, can be bent, crimp or fold, the material of flexible base board may include
In polyimides (Polyimide film, PI), polyarylate, polycarbonate, poly-naphthalene dicarboxylic acid glycol ester and polyether sulfone etc.
At least one, substrate 1 can play the role of carrying, and the disclosure does not do particular determination to the material of substrate 1, manufacture craft, thickness etc.,
Those skilled in the art can select according to real work situation.In an alternate embodiment of the invention, substrate 1 can also be hardness
Substrate, such as glass；In an alternate embodiment of the invention, substrate 1 can also use hyaline membrane, such as transparent PI film substrate, be based on
This display panel allowed generates blind hole effect.
With continued reference to shown in Fig. 5, driving layer 2 is set to the side of substrate 1, and in an alternate embodiment of the invention, driving layer 2 may include
Multiple thin film transistor (TFT)s (Thin-Film Transistor, TFT) of array distribution, such as switching transistor and driving transistor.
Specifically, forming buffer layer on substrate 1, which, which can prevent moisture and oxygen from infiltrating into driving layer 2, influences display surface
The performance of plate, wherein the material of buffer layer include but is not limited to silica, silicon nitride, silicon oxynitride or other properties it is close and
Stable material, further, on the buffer layer setting driving layer 2, including semiconductor layer, gate insulating layer, grid, drain electrode and
Conducting wire etc..The drain electrode of thin film transistor (TFT) is connected with the anode of luminescent layer 3, in order to hole injection.Luminescent layer 3 it is worked
Journey is that the electric signal in power supply voltage signal is provided to the anode of luminescent layer 3 after thin film transistor (TFT) is opened；Luminescent layer 3
Potential difference is formed between anode and cathode, the hole of anode and the electronics of the cathode recombination luminescence in luminescent layer 3 make display panel
With display function.Wherein, anode for example can be Ag/ITO layers, and cathode can be Mg/Ag layers.
Further, luminescent layer 3 is equipped with the through-hole 301 through luminescent layer 3 itself, driving layer 2 and substrate 1, wherein through-hole
301 shape need to be related to the shape of the functional module built in it, or matches with its practical work requirements, the shape of through-hole 301
Shape includes but is not limited to circle, ellipse, truncated cone-shaped, rectangle or Else Rule shape and irregular shape, the disclosure to this not
It enumerates again.In an alternate embodiment of the invention, according to actual needs, through-hole 301 can also only wear luminescent layer 3, or wear
Luminescent layer 3 and driving layer 2, or wear luminescent layer 3, driving layer 2 and substrate 1, it is only necessary to guarantee that the through-hole 301 wears luminescent layer
3, it blocks, realizes so that through-hole 301 is worn the side wall 302 that luminescent layer 3 is formed by the encapsulated layer 4 that subsequent encapsulation process is formed
Effective barrier of luminescent layer 3 and extraneous water oxygen.
Fig. 6 shows the display panel structure top view of disclosure exemplary embodiment, and Fig. 7 shows the first packaged type
The sectional view of the lower A-A along Fig. 6, as shown in fig. 7, encapsulated layer 4 includes:
First encapsulated layer 401 covers luminescent layer 3, and covers the side wall 302 of through-hole 301；
Second encapsulated layer 402 deviates from the side of substrate 1 set on the first encapsulated layer 401；
Third encapsulated layer 403 covers the first encapsulated layer 401 and the second encapsulated layer 402.
The stack combinations of a variety of organic materials, inorganic material can be used in each layer of encapsulated layer 4, can pass through TFE (Thin
Film Encapsulation, thin film encapsulation technology) it is packaged；Wherein, the first encapsulated layer 401 and third encapsulated layer 403
Material is inorganic material layer, such as can be SiNx/SiOx, and the second encapsulated layer 402 is organic material layer, such as can be silicon
The materials such as base/epoxy resin/acrylic system, it is, of course, also possible to select corresponding encapsulated layer according to actual needs, the disclosure is to this
It will not enumerate.
In an alternate embodiment of the invention, can be used CVD (Chemical Vapor Deposition, chemical vapour deposition technique),
PECVD (Plasma Enhanced Chemical Vapor Deposition, plasma enhanced chemical vapor deposition method) and
The methods of ALD (Atomic layer deposition, atomic layer deposition) forms first encapsulated layer 401, the second encapsulated layer
402 and third encapsulated layer 403, the disclosure does not do particular determination to material, the braking technique etc. of each encapsulated layer.
With continued reference to shown in Fig. 7, the second encapsulated layer 402 does not extend to through-hole 301 away from the side A of substrate 1 along luminescent layer 3
Side wall 302, that is, the side wall 402 of through-hole 401 only covers the first encapsulated layer 401 and third encapsulated layer 403, therefore, through-hole
The encapsulated layer thickness of 301 side wall 302 is less than the encapsulated layer thickness that luminescent layer 3 deviates from 1 side of substrate, makes the frame of through-hole into one
Step reduces.
Fig. 8 shows the sectional view of the A-A along Fig. 6 under the second packaged type, as shown in figure 8, encapsulated layer 4 includes:
First encapsulated layer 401 covers luminescent layer 3, including the luminescent layer 3 on the side of substrate 1, and covers through-hole
301 side wall 302；
Second encapsulated layer 402 covers the first encapsulated layer 401, the first encapsulated layer 401 on the side including deviating from substrate 1,
And the first encapsulated layer 401 on the side wall of covering through-hole 301；
Third encapsulated layer 403 covers the second encapsulated layer 402, the second encapsulated layer 402 on the side A including deviating from substrate 1,
And the second encapsulated layer 402 on the side wall of through-hole 301.
Based on above-mentioned encapsulation layer structure, although covering three layers of encapsulated layer on the side wall 302 of luminescent layer 3 and through-hole 301, and
In an alternate embodiment of the invention, encapsulated layer thickness (including the first encapsulated layer 401, second of the covering on the side wall 302 of through-hole 301
The sum of encapsulated layer 402 and the thickness of third encapsulated layer 403) it is smaller than the sum of the encapsulated layer thickness covered on luminescent layer 3；Optional
Embodiment in, the encapsulated layer thickness of the covering on the side wall 302 of through-hole 301 is equal to the encapsulated layer thickness covered on luminescent layer 3,
Based on this, it is ensured that while the side wall 302 of through-hole 301 covers multilayer encapsulation layer, its encapsulated layer thickness is also allowed to be less than luminescent layer 3
The encapsulated layer of upper covering has taken into account the water resistant oxygen of luminescent layer 3 and the reduction demand to 301 frame of through-hole.It is, of course, also possible to root
Factually border need of work selects other packaged types, and the disclosure includes but is not limited to above-mentioned packaged type.
It should be noted that the luminescent layer 3 in the above exemplary embodiments of the disclosure be equipped with through luminescent layer 3
The quantity of the through-hole 301 of body, driving layer 2 and substrate 1 can be one or more, when the quantity of through-hole 301 is multiple, substrate
1, it drives layer 2, luminescent layer 3 and encapsulated layer 4 to can refer to foregoing description and be correspondingly arranged, forms a display panel.
It is understood that the disclosure only describes part hierarchical structure, packing forms in display panel etc., display surface
It can also include to meet its function and the other hierarchical structures being arranged and packing forms etc., technical staff can pass through ginseng in plate
It examines the relevant technologies and clearly knows should also there be other packing forms.For example, with continued reference to shown in Fig. 7, lead in the figure
Encapsulated layer 4 on 301 side wall 302 of hole covers luminescent layer 3, driving layer 2 and substrate 1；In an alternate embodiment of the invention, it is set to through-hole
The encapsulated layer 4 of 301 side walls 302 can also be encapsulated only to luminescent layer 3 and driving layer 2, and be not extend to substrate 1；Alternatively, through-hole 301
The encapsulated layer 4 of side wall 302 is only encapsulated to luminescent layer 3, and is not extend to driving layer 2 and substrate 1, that is to say, that only needs to guarantee to send out
The cut surface (hole wall 302 of part) of photosphere 3 is packaged layer 4 and surrounds, with this by the water oxygen in luminescent layer 3 and external environment every
Absolutely, packaging effect is promoted.
A kind of manufacturing method of display panel is additionally provided in the exemplary embodiment of the disclosure, Fig. 9 shows display surface
The flow chart of the manufacturing method of plate, as shown in figure 9, the manufacturing method may include steps of:
Step S910, forms substrate on a substrate；
Step S920 forms driving layer in the side of the substrate, and the driving layer includes multiple films of array distribution
Transistor；
Step S930 forms luminescent layer away from the side of the substrate in the driving layer；The luminescent layer, which is equipped with, to be run through
The through-hole of the luminescent layer, the driving layer and the substrate；
Step S940 forms encapsulated layer, and the encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole；
Step S950, by the substrate and the substrate desquamation.
Knowable to step S950 referring to step S910, being packaged on luminescent layer 3 with the side wall 302 of through-hole 301 can
It is completed at the same time, therefore there is no the systems in order to increase display panel in the side wall of through-hole 301 increase encapsulated layer for the manufacturing method
Standby process, allows the display panel to maintain lower manufacturing cost and higher packaging effect, is also the display of hole frame
The reduction of width provides may.Each step of the manufacture of display panel in the exemplary embodiment of the disclosure is carried out below detailed
Illustrate:
In step S910, substrate is formed on a substrate.
In an exemplary embodiment of the disclosure, substrate 100 is as the molding and mould group leading portion that auxiliary layer is display panel
Process provides hard support plate, facilitates molding；Substrate 100 can be rigid substrate, such as glass.Substrate 1 is flexible base board, substrate 1
Material can in polyimides (PI), polyarylate, polycarbonate, poly-naphthalene dicarboxylic acid glycol ester and polyether sulfone etc. at least
One kind, it is, of course, also possible to select corresponding substrate material according to actual needs, the disclosure does not do particular determination to this.
In step S920, driving layer is formed in the side of the substrate, the driving layer includes the multiple of array distribution
Thin film transistor (TFT).
In an exemplary embodiment of the disclosure, driving layer 2 is formed in the side of substrate 1, forms driving layer on substrate 1
2 can refer to the relevant technologies.In an optional embodiment, it may include following steps that driving layer 2 is formed on substrate 1:
A buffer layer is deposited on substrate 1, and deposits a polysilicon layer on the buffer layer, wherein the material packet of buffer layer
Include but be not limited to silica, silicon nitride, silicon oxynitride or the close and stable material of other properties；
Heavy ion is carried out in polysilicon two sides to adulterate to form doped region；
In polysilicon layer first grid insulating layer, and the first metal gate layers are deposited on first grid insulating layer,
And second grid insulating layer is deposited in the first metal gate layers, and the second metal gates are deposited on second grid insulating layer
Layer；
An interlayer dielectric layer is deposited in the second metal gate layers；
The depositing insulating layer on dielectric layer, and flatness layer is formed on which insulating layer, wherein flatness layer is organic insulation
Layer.
Certainly, in above-mentioned steps may not will drive layer 2 all interlayer structures explanation, the disclosure include but is not limited on
The driving layer structure stated.
In step S930, luminescent layer is formed away from the side of the substrate in the driving layer；The luminescent layer is equipped with
Through the luminescent layer, the through-hole of the driving layer and the substrate.
In an exemplary embodiment of the disclosure, luminescent layer 3, the luminescent layer are formed away from the side of substrate 1 in driving layer 2
3 are equipped with the through-hole 301 through luminescent layer 3, driving layer 2 and substrate 1.The shape of through-hole 301 includes but is not limited to round, oval
Shape, truncated cone-shaped, rectangle or Else Rule shape and irregular shape, the disclosure will not enumerate this.
In step S940, encapsulated layer is formed, the encapsulated layer covers the luminescent layer, and covers the side of the through-hole
Wall.
In an exemplary embodiment of the disclosure, Figure 10~Figure 14 shows display surface in the exemplary embodiment of the disclosure
The sectional view of the display panel of the manufacturing process of plate forms substrate 1, and in substrate as shown in Figure 10 first on a substrate 100
1 side forms driving layer 2；As shown in figure 11, the hollow processing of through-hole is carried out, in default hole location to obtain through substrate 1, drive
The through-hole 301 of dynamic layer 2；As shown in figure 12, luminescent layer 3 is formed away from the side of substrate 1 in driving layer 2, it is to be understood that this
When luminescent layer 3 cover the display area in addition to through-hole 301；As shown in figure 13, encapsulated layer 4 is formed, the encapsulated layer 4 covering shines
Layer 3, and the side wall 302 of through-hole 301 is covered, continue parameter Figure 14 corresponding with step S950, by substrate after forming encapsulated layer 4
100 are removed with substrate 1, wherein such as can be by the way that laser lift-off, the disclosure does not do particular determination to this.
In an optional embodiment, the sequence of step shown in Figure 11 and Figure 12 can also be adjusted, i.e., is first carried on the back in driving layer 2
Side from substrate 1 forms luminescent layer 3；Then the hollow processing of through-hole is carried out, in default hole location to obtain through substrate 1, drive
The through-hole 301 of dynamic layer 2 and luminescent layer 3；It is finally packaged again by step shown in Figure 12, both the above mode can be achieved
By the purpose fully enclosed away from the side of substrate 1 and the cut surface (301 side wall 302 of through-hole) of luminescent layer 3 of luminescent layer 3.
, can also according to actual needs in another optional embodiment, through-hole 301 only wears luminescent layer 3；Or it wears
Luminescent layer 3 and driving layer 2；Or wear luminescent layer 3, driving layer 2 and substrate 1, it is therefore an objective to it is luminous to guarantee that the through-hole 301 is worn
Layer 3 blocks so that through-hole 301 is worn the side wall 302 that luminescent layer 3 is formed by the encapsulated layer 4 that subsequent encapsulation process is formed, real
Effective barrier of existing luminescent layer 3 and extraneous water oxygen.
In an exemplary embodiment of the disclosure, the encapsulated layer thickness of the side wall 302 of through-hole 301 can be less than or equal to hair
Photosphere 3 deviates from the encapsulated layer thickness of 1 side of substrate.It may include steps of with continued reference to encapsulated layer shown in Fig. 7, is formed: first
First, the first encapsulated layer 401 is formed, which covers the side wall 302 of luminescent layer 3 and through-hole 301；Then, the is formed
Two encapsulated layers 402, second encapsulated layer 402 are set to the side that the first encapsulated layer 401 deviates from substrate 1；Finally, forming third encapsulation
Layer 403, to cover the first encapsulated layer 401 and the second encapsulated layer 402, including first on the side wall 302 of covering through-hole 301
Encapsulated layer 401.
Wherein, luminescent layer 3 can carry out away from the encapsulation of 1 side of substrate and simultaneously the encapsulation of 301 side wall 302 of through-hole,
It is, of course, also possible to according to actual needs, the encapsulation to luminescent layer 3 away from the encapsulation of 1 side of substrate and to 301 side wall 302 of through-hole
It carries out, such as luminescent layer 3 is packaged away from 1 side of substrate respectively first, then 301 side wall 302 of through-hole is packaged, In
During this, encapsulation depth of the encapsulated layer 4 along 301 aperture direction of vertical through hole is equal to substrate 1, driving on 301 side wall 302 of through-hole
The sum of the thickness of layer 2, luminescent layer 3 and luminescent layer 3 away from 1 side encapsulated layer of substrate；It for another example, can be first to 301 side wall 302 of through-hole
It is packaged, then luminescent layer 3 is packaged away from 1 side of substrate.It is, of course, also possible to select other envelopes according to actual needs
Dress mode, the disclosure are not specially limited 4 packaging technology of encapsulated layer, encapsulation sequence.
In another optional embodiment, referring to shown in Fig. 8, unlike embodiment illustrated in fig. 7, the second envelope is being formed
Layer 402 is filled, when, which covers the first encapsulated layer 401, including the first envelope on the side A of substrate 1
The first encapsulated layer 401 on layer 401, and the side wall of covering through-hole 301 is filled, i.e., on the side wall 302 of luminescent layer 3 and through-hole 301
Cover three layers of encapsulated layer；Optionally, the encapsulated layer thickness of the covering on the side wall 302 of through-hole 301 may be less than or equal to luminescent layer 3
The encapsulated layer thickness of upper covering, it is ensured that while the side wall 302 of through-hole 301 covers multilayer encapsulation layer, it is also allowed to encapsulate thickness
Degree is less than the encapsulated layer covered on luminescent layer 3, has taken into account the water resistant oxygen for guaranteeing luminescent layer 3 and the reduction to 301 frame of through-hole
Demand.
Wherein, the methods of CVD, PECVD and ALD can be used and form first encapsulated layer 401, the second encapsulated layer 402 and the
Three encapsulated layers 403, the disclosure do not do particular determination to material, the packaging technology etc. of each encapsulated layer.
In summary, by by formed through-hole 301 execution technique be placed in packaging technology before so that encapsulated layer 4 is covering
While lid luminescent layer 3, also cover through-hole 301 side wall 302, will when aperture formed cut surface (side wall 302 of through-hole 301) into
Row blocks, and prevents extraneous diffusion path of the Self cleavages such as steam and oxygen towards luminescent layer 3, avoids the failure of luminescent layer 3；Together
When, hole border width can also be reduced to a certain extent, avoided it from occupying more screen display regions, shown in order to promote display panel
Effect.
A kind of electronic equipment is additionally provided in the exemplary embodiment of the disclosure, which includes above-mentioned display surface
Plate, wherein encapsulated layer 4 covers luminescent layer 3, and covers the side wall 302 of through-hole 301, so that luminescent layer 3 and extraneous water oxygen are separated, mentions
Its high water resistant oxygen improves encapsulation validity.In an alternate embodiment of the invention, the electronic equipment include smart phone, tablet computer,
Digital speech video player, electronic reader, handheld game machine, vehicle electronic device and intelligent wearable device etc..
It should be noted that although describing each step of manufacturing method in the disclosure in the accompanying drawings with particular order,
But this does not require that or implies must execute these steps in this particular order, or have to carry out shown in whole
The step of be just able to achieve desired result.Additional or alternative, it is convenient to omit multiple steps are merged into one by certain steps
Step executes, and/or a step is decomposed into execution of multiple steps etc..
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
Claims (10)
1. a kind of display panel characterized by comprising
Substrate；
Layer is driven, the one side of substrate is set to, the driving layer includes multiple thin film transistor (TFT)s of array distribution；
Luminescent layer deviates from the side of the substrate set on the driving layer；The luminescent layer is equipped with through the luminescent layer, described
Drive the through-hole of layer and the substrate；
Encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole.
2. display panel according to claim 1, which is characterized in that the encapsulated layer thickness of the side wall of the through-hole be less than or
Equal to the encapsulated layer thickness that the luminescent layer deviates from the one side of substrate.
3. display panel according to claim 1, which is characterized in that the encapsulated layer includes:
First encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole；
Second encapsulated layer deviates from the side of the substrate set on first encapsulated layer；
Third encapsulated layer covers first encapsulated layer and second encapsulated layer.
4. display panel according to any one of claims 1 to 3, which is characterized in that the material of the substrate is flexible saturating
Bright material.
5. display panel according to claim 4, which is characterized in that the flexible clear materials are polyimides, poly- virtue
At least one of ester, polycarbonate and poly-naphthalene dicarboxylic acid glycol ester.
6. a kind of electronic equipment, including display panel described in any one of claims 1 to 5.
7. electronic equipment according to claim 6, the interior setting camera of the through-hole, light sensor, iris recognition are passed
At least one of sensor, range sensor or earpiece.
8. a kind of manufacturing method of display panel characterized by comprising
Substrate is formed on a substrate；
Driving layer is formed in the side of the substrate, the driving layer includes multiple thin film transistor (TFT)s of array distribution；
Luminescent layer is formed away from the side of the substrate in the driving layer；The luminescent layer, which is equipped with, runs through the luminescent layer, institute
State the through-hole of driving layer and the substrate；
Encapsulated layer is formed, the encapsulated layer covers the luminescent layer, and covers the side wall of the through-hole；
By the substrate and the substrate desquamation.
9. the manufacturing method of display panel according to claim 8, which is characterized in that the encapsulated layer of the side wall of the through-hole
Thickness is less than or equal to the encapsulated layer thickness that the luminescent layer deviates from the one side of substrate.
10. the manufacturing method of display panel according to claim 8, which is characterized in that the formation encapsulated layer, the envelope
It fills layer and covers the luminescent layer, and cover the side wall of the through-hole, comprising:
It is formed and covers the luminescent layer, and cover the first encapsulated layer of the side wall of the through-hole；
It is formed and is set to first encapsulated layer away from the second encapsulated layer of the side of the substrate；
Form the third encapsulated layer for covering first encapsulated layer and second encapsulated layer.
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