CN210042646U - Radiating air duct with symmetrical circuits - Google Patents

Radiating air duct with symmetrical circuits Download PDF

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Publication number
CN210042646U
CN210042646U CN201920162707.0U CN201920162707U CN210042646U CN 210042646 U CN210042646 U CN 210042646U CN 201920162707 U CN201920162707 U CN 201920162707U CN 210042646 U CN210042646 U CN 210042646U
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CN
China
Prior art keywords
heat dissipation
air duct
symmetrical
radiators
symmetry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920162707.0U
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Chinese (zh)
Inventor
王俊舟
胡锦毅
聂慧芳
王福春
贺炳毅
顾斌
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Luoyang Longsheng Technology Co Ltd
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Luoyang Longsheng Technology Co Ltd
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Priority to CN201920162707.0U priority Critical patent/CN210042646U/en
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Abstract

The utility model relates to a heat dissipation technical field discloses a heat dissipation wind channel of symmetry type circuit, including the casing, be provided with the E type radiator of a plurality of groups symmetry in the casing, the E type radiator of symmetry is placed relatively by the heat dissipation flank of tooth of two the same E type radiators and is constituteed, and every sharp heat dissipation wind channel intercommunication on two relative E type radiators constitutes every closed wind channel on the E type radiator of symmetry. The utility model can improve the heat dissipation efficiency under the condition of the heat radiators with the same size and shape; under the condition of the same heat dissipation efficiency, the volume of the heat sink can be reduced. It has obvious effect and is convenient for wide popularization and use.

Description

Radiating air duct with symmetrical circuits
Technical Field
The utility model relates to a circuit heat dissipation technical field especially relates to a heat dissipation wind channel of symmetry type circuit.
Background
The heat dissipation design is an important link in a power supply, and the good heat design can ensure that the temperature of all electronic components in the product does not exceed the maximum temperature specified by the self standard and specification under the working environment condition. In the heat dissipation design, a good air duct is also an important link, so that the weight and the volume of the radiator are reduced to a certain extent while the heat dissipation efficiency is improved. In a symmetrical circuit structure, the heat dissipation air duct shown in fig. 1 is usually adopted for heat dissipation, and the heat dissipation assemblies of the E-shaped structures are sequentially arranged, so that the heat dissipation effect is poor.
Disclosure of Invention
For overcoming the deficiencies of the prior art, the utility model aims at providing a symmetrical circuit's heat dissipation wind channel, the design benefit in this wind channel is reasonable, more does benefit to the device heat dissipation.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a plurality of groups of symmetrical E-shaped radiators are arranged in the shell, the symmetrical E-shaped radiators are formed by oppositely placing the radiating tooth surfaces of two identical E-shaped radiators, and each straight radiating air channel on the two opposite E-shaped radiators is communicated to form each closed air channel on the symmetrical E-shaped radiators.
Due to the adoption of the technical scheme, the utility model discloses have following superiority:
a heat dissipation air duct of a symmetrical circuit aims at heat dissipation of the symmetrical circuit, after power supply thermal design is completed, through a better method for improving and designing the air duct, under the condition of a heat sink with the same size and shape, namely under the condition of the same heat dissipation efficiency, the size of the heat sink can be reduced, the smoothness of the air duct is ensured, the heat dissipation efficiency is improved, and the heat dissipation air duct is convenient and universal to implement.
Drawings
FIG. 1 is a schematic diagram of a conventional heat dissipation duct structure of a symmetrical circuit;
FIG. 2 is a schematic view of a structure of a heat dissipation air duct of the symmetrical circuit of the present invention;
fig. 3 is a schematic diagram showing the air volume of the radiator in the heat dissipation air duct of the symmetrical circuit of the present invention.
Detailed Description
The patent is further described below with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, a symmetrical circuit heat dissipation air duct comprises a housing 1, wherein a plurality of groups of symmetrical E-shaped radiators 2 are arranged in the housing, the symmetrical E-shaped radiators are formed by oppositely placing heat dissipation tooth surfaces of two identical E-shaped radiators, and each straight line heat dissipation air duct on the two opposite E-shaped radiators is communicated to form each closed air duct on the symmetrical E-shaped radiators. The fan is positioned right in front of or right behind the radiator.
The improved design of the air duct can improve the heat dissipation efficiency under the condition of the heat radiators with the same size and shape; under the condition of the same heat dissipation efficiency, the volume of the heat sink can be reduced.
Example 1.
As shown in fig. 3, a method for designing a heat dissipation duct of a symmetric circuit includes the following steps:
1. a plurality of groups of symmetrical E-shaped radiators 2 are arranged in the shell 1;
2. the radiating tooth surfaces of two identical E-shaped radiators 2 are oppositely placed and fixed to form a symmetrical E-shaped radiator; each linear radiating air duct on two opposite E-shaped radiators is communicated to form each closed air duct on the symmetrical E-shaped radiators.
3. Placing heat dissipation devices 3 on two sides of the symmetrical E-shaped heat dissipater;
the air quantity in the radiator in the design of the radiating air duct with a symmetrical circuit is shown as a dotted channel 4 in the figure. Because the radiating tooth surfaces of the E-shaped radiator are placed back to back, the air ducts in the teeth are more closed, and compared with the conventional air duct design method in the figure 1, the air volume is smoother and more centralized, and the radiating effect is better under the condition of the same fan and space structure.
The method has the advantages of ingenious design in the symmetrical circuit, obvious effect and wide popularization and application.

Claims (1)

1. The utility model provides a radiating air duct of symmetrical circuit, includes the casing, characterized by: a plurality of groups of symmetrical E-shaped radiators are arranged in the shell, the symmetrical E-shaped radiators are formed by oppositely placing the radiating tooth surfaces of two identical E-shaped radiators, and each straight radiating air duct on the two opposite E-shaped radiators is communicated to form each closed air duct on the symmetrical E-shaped radiators.
CN201920162707.0U 2019-01-30 2019-01-30 Radiating air duct with symmetrical circuits Expired - Fee Related CN210042646U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920162707.0U CN210042646U (en) 2019-01-30 2019-01-30 Radiating air duct with symmetrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920162707.0U CN210042646U (en) 2019-01-30 2019-01-30 Radiating air duct with symmetrical circuits

Publications (1)

Publication Number Publication Date
CN210042646U true CN210042646U (en) 2020-02-07

Family

ID=69352832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920162707.0U Expired - Fee Related CN210042646U (en) 2019-01-30 2019-01-30 Radiating air duct with symmetrical circuits

Country Status (1)

Country Link
CN (1) CN210042646U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200207

CF01 Termination of patent right due to non-payment of annual fee