CN210042645U

CN210042645U - Heat dissipation device and electronic equipment

Info

Publication number: CN210042645U
Application number: CN201920151918.4U
Authority: CN
Inventors: 卢玉华
Original assignee: Xingluo Intelligent Technology Co Ltd
Current assignee: Xingluo Home Yunwulian Technology Co ltd
Priority date: 2019-01-29
Filing date: 2019-01-29
Publication date: 2020-02-07
Anticipated expiration: 2029-01-29

Abstract

A heat dissipation device comprises a first fixing frame, a heat radiator, a buffer piece and a second fixing frame, wherein a limiting piece and a first mounting column are arranged on the first fixing frame, a second mounting column corresponding to the first mounting column is arranged on the second fixing frame, the buffer piece is arranged on the first fixing frame and limited by the limiting piece, the heat radiator is sleeved in the buffer piece, the first mounting column and the second mounting column are mutually locked through a locking piece, so that the second fixing frame and the first fixing frame are mutually fixed, and the buffer piece is surrounded by the first fixing frame and the second fixing frame. The radiator is sleeved in the buffer piece, and the buffer piece sleeved with the radiator is arranged between the first fixing frame and the second fixing frame, so that the radiator forms a suspension mounting structure, and vibration can be prevented from being transmitted to other elements of the electronic equipment when the radiator works. Still include an electronic equipment, this electronic equipment simple structure, it is fast, shock attenuation effectual to arrange the heat dissipation in the electronic equipment in, can not influence the work efficiency of other components in the electronic equipment.

Description

Heat dissipation device and electronic equipment

Technical Field

The utility model relates to an electronic equipment's heat dissipation technique particularly, mainly relates to a heat abstractor and electronic equipment.

Background

Along with the development of modern electronic technology, the performance of electronic equipment is rapidly improved, the dissipation power of the whole system is also sharply increased, the heat dissipation problem caused by the requirements of the increase of the dissipation power and the miniaturization is increasingly serious, and if the whole problem cannot be well solved, the performance of the equipment is influenced, and the service life of the equipment is also shortened. Research has shown that heat dissipation is critical among the many factors that affect the reliability of electronic devices. In high-power equipment, high-power components can be used, the heat productivity is large, and the equipment needs larger heat dissipation power to ensure the good operation of the equipment in the working process, so that most of the components are matched with a radiator for use.

In the prior art, because electronic equipment has increased functions and power and the heat dissipation requirement of the equipment is improved, and a conventional heat dissipation structure cannot meet the heat dissipation requirement of the electronic equipment in use, the heat dissipation is generally carried out by means of a heat sink; the heat sink has high power and large volume, and the work of the heat sink may generate vibration to be transmitted to other structures of the electronic device, thereby damaging other structures of the electronic device.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provide a heat dissipation device which has the advantages of fast heat dissipation and good damping effect;

the utility model also provides an electronic equipment with this heat abstractor.

For the purpose of the utility model discloses above the realization, the utility model provides a heat abstractor, including first mount, radiator, bolster and second mount, be provided with locating part and first erection column on the first mount, the second mount be provided with the second erection column that first erection column corresponds, the bolster install in on the first mount and quilt the locating part is spacing, the radiator cover is located in the bolster, first erection column with the second erection column passes through the mutual lock solid of locking part, thereby will the second mount with first mount reciprocal anchorage, first mount with the second mount will the bolster surrounds.

As a further improvement of the above technical solution, an adhesive layer for adhering the buffer member and the mounting bracket is disposed between the buffer member and the first fixing bracket.

As a further improvement of the above technical solution, a buffer cap for buffering is arranged between the first mounting column and the second mounting column.

As a further improvement of the above technical solution, the buffering cap is disposed at an end of the first mounting post or the second mounting post, and the locking member passes through the buffering cap to lock the first mounting post and the second mounting post to each other.

As a further improvement of the technical scheme, a limiting column is arranged on the second fixing frame and close to the second mounting column, the limiting column is right opposite to the surface of the buffer piece, and a gap is reserved between the limiting column and the buffer piece.

As a further improvement of the technical scheme, a convex rib is arranged on one surface of the buffer part connected with the bonding layer, and the convex rib is bonded with the first fixing frame through the bonding layer.

As a further improvement of the technical scheme, the middle part of the first fixing frame is provided with a ventilation hole communicated with the radiator.

An electronic device comprising a heat dissipation apparatus as described above.

As a further improvement of the technical scheme, the heat dissipation device further comprises a shell and a control assembly, wherein an air channel is formed in the inner wall of the shell, and the heat dissipation device is arranged between the control assembly and the air channel and used for dissipating heat of the control assembly.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model provides a heat dissipation device, including first mount, radiator, bolster and second mount, be provided with locating part and first erection column on the first mount, the second mount be provided with the second erection column that first erection column corresponds, the bolster install in on the first mount and quilt the locating part is spacing, the radiator jacket is located in the bolster, first erection column with the second erection column passes through the mutual lock solid of locking part, thereby will the second mount with first mount reciprocal anchorage, first mount with the second mount will the bolster surrounds. The radiator is sleeved in the buffer piece, and the buffer piece sleeved with the radiator is arranged between the first fixing frame and the second fixing frame, so that the radiator forms a suspension mounting structure, and vibration can be prevented from being transmitted to other elements of the electronic equipment when the radiator works.

The heat dissipation device has a simple structure, and is fast in heat dissipation and good in shock absorption effect when being placed in the electronic equipment.

The utility model provides an electronic equipment, includes heat abstractor, heat abstractor can effectively reduce electronic equipment's heat, and heat abstractor's shock attenuation is effectual simultaneously, can not influence the work efficiency of other components in the electronic equipment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention.

Fig. 1 is an installation schematic view of a heat dissipation device of the present invention;

fig. 2 is an exploded view of a heat dissipation device of the present invention;

fig. 3 is a schematic structural diagram of a router according to an embodiment of the present invention.

Description of the main element symbols:

1. a heat sink; 2. a routing antenna assembly; 3. a control component; 4. a horn assembly; 10. a first fixing frame; 20. a first mounting post; 21. a limiting member; 30. a heat sink; 40. a buffer member; 50. a second fixing frame; 60. a second mounting post.

Detailed Description

Hereinafter, various embodiments of the present invention will be described more fully. The present invention is capable of various embodiments and of being modified and varied therein. However, it should be understood that: there is no intention to limit the various embodiments of the invention to the specific embodiments disclosed herein, but on the contrary, the intention is to cover all modifications, equivalents, and/or alternatives falling within the spirit and scope of the various embodiments of the invention.

Hereinafter, the terms "includes" or "may include" used in various embodiments of the present invention indicate the presence of the disclosed functions, operations, or elements, and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in various embodiments of the present invention, the terms "comprises," "comprising," "includes," "including," "has," "having" and their derivatives are intended to refer only to the particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combination of the foregoing.

In various embodiments of the present invention, the expression "a or/and B" includes any or all combinations of the words listed simultaneously, e.g. may include a, may include B or may include both a and B.

Expressions (such as "first", "second", and the like) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the respective constituent elements. For example, the above description does not limit the order and/or importance of the elements described. The foregoing description is for the purpose of distinguishing one element from another. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present invention.

It should be noted that: in the present invention, unless otherwise explicitly specified or defined, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; there may be communication between the interiors of the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present invention, it should be understood by those skilled in the art that the terms indicating orientation or positional relationship herein are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the invention. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.

Referring to fig. 1 to 3, a heat dissipation device 1 is sequentially provided with a first fixing frame 10, a buffer 40 sleeved with a heat sink 30, and a second fixing frame 50 from bottom to top, for dissipating heat of an electronic device, wherein the heat dissipation device 1 has a damping function, and can prevent other elements from being damaged due to excessive vibration of the heat sink 30, thereby improving the operation stability of the electronic device.

A heat dissipation device 1 comprises a first fixing frame 10, a heat radiator 30, a buffering member 40 and a second fixing frame 50, wherein a limiting member 21 and a first mounting column 20 are arranged on the first fixing frame 10, the second fixing frame 50 is provided with a second mounting column 60 corresponding to the first mounting column 20, the buffering member 40 is arranged on the first fixing frame 10 and limited by the limiting member 21, the heat radiator 30 is sleeved in the buffering member 40, the first mounting column 20 and the second mounting column 60 are mutually locked through a locking member, so that the second fixing frame 50 and the first fixing frame 10 are mutually fixed, and the first fixing frame 10 and the second fixing frame 50 surround the buffering member 40.

The heat dissipation device 1 is installed in the electronic equipment and used for dissipating heat of the electronic equipment, reducing the internal temperature of the electronic equipment and ensuring stable operation of internal devices of the electronic equipment.

When the heat dissipation device 1 of the present embodiment is installed, the heat dissipation device 1 can be installed and fixed only by fixing the first fixing frame 10 and the second fixing frame 50 to a platform to be installed, and the operation is convenient.

In the present embodiment, the heat sink 30 is sleeved in the buffer member 40, and the buffer member 40 sleeved with the heat sink 30 is disposed between the first fixing frame 10 and the second fixing frame 50, so that the heat sink 30 forms a suspension mounting structure, which can reduce the vibration transmitted to other elements of the electronic device by the heat sink 30 during operation, meanwhile, because the heat sink 30 is sleeved in the buffer member 40, the buffer member 40 can absorb the vibration of the heat sink 30 to form a buffering effect, further reduce the vibration transmitted to other elements of the electronic device by the heat sink 30 during operation, reduce the damage of other elements due to excessive vibration, and improve the operation stability of the electronic device.

Optionally, the electronic device includes a router, an intelligent speaker, a computer printer, a facsimile machine, and other devices having the characteristics of multiple functions, high power, and an improvement in the heat dissipation requirement of the device.

Optionally, the buffer 40 may be made of one or more of polyurethane, rubber, and EVA resin. The buffer member 40 made of the material has good buffering and shock-proof effects.

Alternatively, the buffer member 40 may be a sleeve structure with a cavity formed therein, and the shape of the cavity corresponds to that of the heat sink 30, so as to be sleeved on the heat sink 30. The outer surface of the buffer member 40 may be square or circular.

In this embodiment, the outer surface of the buffer 40 is a square structure, so as to be conveniently limited on the first fixing frame 10.

Optionally, the first fixing frame 10 includes a circular ring surface and a peripheral wall connected to the circular ring surface, and the limiting members 21 are arranged on the circular ring surface of the first fixing frame 10 in a shape corresponding to the buffering members 40. The limiting members 21 are arranged in a square structure in this embodiment, and are used for limiting the buffering members 40.

Optionally, the cross section of the second fixing frame 50 is a circular surface, and corresponds to the circular ring surface of the first fixing frame 10.

Optionally, the number of the limiting members 21 is 4 to 8. The buffering member 40 can be limited in the first fixing frame 10. Meanwhile, when the heat sink 30 drives the buffer member 40 to vibrate during operation, the limiting member 21 can generate a lateral limiting force on the buffer member 40 to prevent the buffer member 40 from deviating from the first fixing frame 10.

Preferably, the number of the stoppers 21 is 7.

Optionally, an adhesive layer for adhering the buffer 40 and the first fixing frame 10 is disposed between the buffer 40 and the first fixing frame 10. Since the heat sink 30 may generate a large vibration during the heat dissipation process, the connection between the buffer 40 and the first fixing frame 10 may be further strengthened by providing an adhesive layer between the buffer 40 and the first fixing frame 10.

Specifically, a buffer cap for buffering is arranged between the first mounting column 20 and the second mounting column 60. The damping cap is provided at an end of the first mounting post 20 or the second mounting post 60.

Optionally, the buffering cap is disposed at an end of the first mounting post 20 or the second mounting post 60, and the locking member passes through the buffering cap to lock the first mounting post 20 and the second mounting post 60 to each other.

Optionally, the end of the bumper cap portion protruding from the first mounting post 20 or the second mounting post 60 forms a bumper zone.

Optionally, the locking member is a stud lock, the stud includes a nut and a cylinder, the nut is clamped in the second mounting column 60, the cylinder extends out of the lower end of the second mounting column 60 and then penetrates through the buffer cap and then screws into the first mounting column 20, and the stud can fasten and lock the first mounting column 20 and the second mounting column 60.

In one embodiment, the buffering cap is disposed at an end of the first mounting post 20, and the locking member is fixed to the second mounting post 60 through the first mounting post 20 and the buffering cap.

In another embodiment, the buffering cap is disposed at the end of the second mounting post 60, and the locking member passes through the second mounting post 60 and the buffering cap and is locked to the first mounting post 20.

As an implementation mode, the buffer cap is a gasket made of a silica gel material.

As another possible embodiment, the buffering cap is a gasket made of EVA material.

Above-mentioned silica gel packing ring has good buffering characteristic with the EVA packing ring.

The buffer member 40 sleeved with the heat sink 30 is arranged between the first fixing frame 10 and the second fixing frame 50, the first fixing frame 10 and the second fixing frame 50 are connected with the second mounting column 60 through the first mounting column 20, and a buffer cap is arranged between the first mounting column 20 and the second mounting column 60, and can weaken the vibration of the heat sink 30 on the first fixing frame 10 and the second fixing frame 50 to a certain extent, so that a buffer effect is achieved; the buffering cap is matched with the buffering piece 40 to buffer the vibration of the radiator 30 together, so that the vibration is further transmitted to other elements of the electronic equipment when the radiator 30 works, the damage of the other elements caused by overlarge vibration can be greatly avoided, and the operation stability of the electronic equipment is improved.

Optionally, a ventilation hole communicated with the heat sink 30 is formed in the middle of the first fixing frame 10. The ventilation holes are used for communicating other components of the electronic equipment which need to dissipate heat with the radiator 30, so that the heat dissipation effect is accelerated.

Optionally, a limiting column is arranged on the second fixing frame 50 near the second mounting column 60, the limiting column is opposite to the surface of the buffer 40, and a gap exists between the limiting column and the buffer 40. The limiting columns are used for limiting the buffer piece 40 when the radiator 30 vibrates too much, and the buffer piece 40 sleeved with the radiator 30 is prevented from offsetting relative to the first fixing frame 10 and the second fixing frame 50 due to the fact that vibration is too big.

Optionally, a convex rib is arranged on one side of the buffer member 40 connected with the adhesive layer, and the convex rib is bonded with the first fixing frame 10 through the adhesive layer. The rib structure can improve the bending acting force of the buffer member 40, so that the buffer member 40 can bear the vibration acting force from all directions, the overall structural strength of the buffer member 40 is effectively improved, and the deformation is avoided.

Optionally, the number of the first mounting posts 20 is 5-8. Correspondingly, the number of the second mounting columns 60 is 5-8.

Preferably, the number of the first mounting posts 20 is 6. Correspondingly, the number of the second mounting posts 60 is 6.

Optionally, a ventilation hole is formed in the middle of the second fixing frame 50.

An electronic device comprises a heat sink 1 as described above.

Still include casing, control assembly 3, shells inner wall is equipped with the wind channel, heat abstractor 1 sets up between control assembly 3 and wind channel, be used for right control assembly 3 dispels the heat.

The electronic equipment comprises a router, an intelligent sound box, a computer printer, a fax machine and other devices with the characteristics of multiple functions, high power, improvement on the heat dissipation requirement of the equipment and the like.

The electronic device has a good heat dissipation function, and vibration generated by the built-in heat sink 30 has no influence or little influence on other elements of the electronic device. The damage of other elements caused by overlarge vibration can be avoided, and the operation stability of the electronic equipment is improved.

Examples

As shown in fig. 1 to 3, the embodiment of the utility model provides a router still provides simultaneously, include heat abstractor 1, casing, route antenna module 2, control assembly 3 and loudspeaker subassembly 4 as above, route antenna module 2, heat abstractor 1, control assembly 3 and loudspeaker subassembly 4 connect gradually and all set up in the casing, shells inner wall is equipped with the wind channel, heat abstractor 1 intercommunication control assembly 3 and wind channel. The router has good heat dissipation performance, and the heat dissipation device 1 can dissipate heat generated components in the router, such as the control module 3. The heat sink 30 is formed into a suspension mounting structure by the first fixing frame 10 and the second fixing frame 50 of the heat dissipation apparatus 1, and the heat sink 30 does not generate vibration or has small vibration to other elements in the router. The damage of other elements caused by overlarge vibration can be avoided, and the operation stability of the router is improved.

In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above-described embodiments are merely illustrative of several embodiments of the present invention, which are described in detail and specific, but not intended to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, other various changes and modifications can be made according to the above-described technical solutions and concepts, and all such changes and modifications should fall within the protection scope of the present invention.

Claims

1. The utility model provides a heat dissipation device, its characterized in that, includes first mount, radiator, bolster and second mount, be provided with locating part and first erection column on the first mount, the second mount be provided with the second erection column that first erection column corresponds, the bolster install in on the first mount and quilt the locating part is spacing, the radiator cover is located in the bolster, first erection column with the second erection column passes through the mutual lock solid of locking part, thereby will the second mount with first mount reciprocal anchorage, first mount with the second mount will the bolster surrounds.

2. The heat dissipation device as claimed in claim 1, wherein an adhesive layer is disposed between the buffer and the first fixing frame for adhering the buffer and the first fixing frame.

3. The heat dissipating device of claim 1, wherein a buffering cap is disposed between the first mounting post and the second mounting post for buffering.

4. The heat dissipating device of claim 3, wherein the bumper cap is disposed at an end of the first mounting post or the second mounting post, and the locking member passes through the bumper cap to lock the first mounting post and the second mounting post to each other.

5. The heat dissipating device of claim 1, wherein a limiting post is disposed on the second fixing frame near the second mounting post, the limiting post faces the surface of the buffer member, and a gap exists between the limiting post and the buffer member.

6. The heat dissipation device as claimed in claim 2, wherein a rib is disposed on a surface of the buffer connected to the adhesive layer, and the rib is bonded to the first fixing frame through the adhesive layer.

7. The heat dissipating device of claim 1, wherein a vent hole is formed in the middle of the first fixing frame and communicates with the heat sink.

8. An electronic device characterized by comprising the heat dissipating apparatus according to any one of claims 1 to 7.

9. The electronic device of claim 8, further comprising a housing and a control component, wherein an air duct is disposed on an inner wall of the housing, and the heat dissipation device is disposed between the control component and the air duct and used for dissipating heat from the control component.