CN209803721U - heat radiation structure with shock-absorbing function for computer - Google Patents
heat radiation structure with shock-absorbing function for computer Download PDFInfo
- Publication number
- CN209803721U CN209803721U CN201920633871.5U CN201920633871U CN209803721U CN 209803721 U CN209803721 U CN 209803721U CN 201920633871 U CN201920633871 U CN 201920633871U CN 209803721 U CN209803721 U CN 209803721U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dust
- mainframe box
- heating panel
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a heat radiation structure with shock-absorbing function for computer, including mainframe box and heat radiation structure, the mainframe box runs through inside hollow cuboid for the up end, and all the symmetry runs through on the both sides terminal surface of mainframe box and has seted up the radiating groove, all install heat radiation structure in the radiating groove of mainframe box both sides, and the dustproof top cap of open end fixedly connected with of mainframe box, heat radiation structure comprises heating panel and second heat dissipation fan, the inside at the radiating groove is installed to the heating panel, and fixed bonding between heating panel and the radiating groove, a plurality of mounting hole has evenly been seted up along vertical direction on the heating panel. The utility model discloses thereby can guarantee under the normal radiating condition of computer, produce when reducing radiator fan and shake the normal work that influences each electronic component in the mainframe box to guarantee each electronic component's in the mainframe box normal use, improve each electronic component working life.
Description
Technical Field
The utility model relates to a computer technology field especially relates to a heat radiation structure with shock-absorbing function for computer.
Background
the computer is commonly called as a computer, is a modern intelligent electronic device for high-speed calculation, can perform numerical calculation and logic calculation, has a memory function, can operate according to a program, and automatically and high-speed processes mass data, the existing computer is composed of a plurality of electronic elements, when the electronic computer is used for working, a large amount of heat is usually generated, if the heat is accumulated and cannot be discharged in time, the temperature in a case is easily higher, the service life of various electronic elements is influenced, a fire disaster can be caused under serious conditions, the existing computer is usually provided with a heat dissipation fan in a main case, so that the heat dissipation effect is improved, but the heat dissipation fan can cause larger vibration in the using process, not only can generate larger vibration noise, but also can cause the looseness of an electric wire interface due to larger vibration, thereby affecting the normal use of the computer.
therefore, a heat dissipation structure with a shock absorption function for a computer is needed, which can reduce the influence of vibration generated during the operation of a cooling fan on the normal operation of each electronic element in a host computer box under the condition of ensuring the normal heat dissipation of the computer, thereby ensuring the normal use of each electronic element in the host computer box and prolonging the service life of each electronic element.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer is with heat radiation structure that has shock-absorbing function aims at improving that the great noise of heat radiation structure vibrations for the current computer is great, is unfavorable for guaranteeing the normal radiating problem of computer during operation.
The utility model discloses a realize like this: a heat dissipation structure with a shock absorption function for a computer comprises a mainframe box and heat dissipation structures, wherein the upper end face of the mainframe box penetrates through a hollow cuboid, heat dissipation grooves are symmetrically formed in the end faces of two sides of the mainframe box in a penetrating mode, the heat dissipation grooves in the two sides of the mainframe box are provided with the heat dissipation structures, and the opening end of the mainframe box is fixedly connected with a dustproof top cover;
The heat radiation structure comprises heating panel and second heat dissipation fan, and the heating panel is installed in the inside of radiating groove, and fixed bonding between heating panel and the radiating groove, has evenly seted up a plurality of mounting hole along vertical direction on the heating panel, and installs the second heat dissipation fan in the mounting hole, and the outside of second heat dissipation fan evenly welds has a plurality of second damping spring, and the other end welding of second damping spring is on the mounting hole inner wall on the heating panel.
Further, still include the base, and the base sets up the bottom at the mainframe box, the base includes the supporting leg, first heat dissipation fan and first damping spring, the mounting groove has been seted up at the up end middle part of base, and the equal symmetry in lower terminal surface both sides of base installs two supporting legs, the middle part of mounting groove bottom surface is run through and is installed first heat dissipation fan, and the equal vertical welding in bottom surface both sides of mounting groove has two first damping spring, and then be used for exhausting to the mainframe box inside through the first heat dissipation fan that sets up on the base, first damping spring is used for connecting the mainframe box simultaneously, reduce the vibrations influence when first heat dissipation fan moves.
further, two stoppers are symmetrically installed on both sides of the lower end face of the mainframe box, a heat dissipation hole is formed in the middle of the lower end face of the mainframe box, the stoppers are welded and fixed to the upper end of the first damping spring, and therefore when the connection between the base and the mainframe box is guaranteed through the upper end welded and fixed of the stoppers and the first damping spring, the influence of vibration on the mainframe box can be reduced.
Further, dustproof top cap includes dust filtration cotton and dust screen, and dustproof top cap passes through the screw fixation on the opening end of mainframe box, dustproof slot has been seted up to dustproof top cap's up terminal surface, and be provided with the gas pocket that link up terminal surface under the dustproof top cap on dustproof slot's the bottom surface, it has the dust filtration cotton to fill in the dustproof slot on the dustproof top cap, and the welding of dustproof slot top on the dustproof top cap has the dust screen, and then seted up through dustproof top cap's up terminal surface and installed dust filtration cotton and dust screen in the dustproof slot, outside air flows into in the mainframe box in the gas pocket of terminal surface under the dustproof top cap through dust screen and dust filtration cotton, accomplish the replacement of air and outside air in the mainframe box, realize thermal flow.
Furthermore, the outer end of mounting hole is provided with dustproof cloth on the heating panel, and dustproof cloth and heating panel fixed bonding, and then the outer end through the mounting hole on the heating panel bonds dustproof cloth, prevents that outside dust from getting into in the mainframe box through the mounting hole to the unfavorable dirt proofness that does benefit to the improvement mainframe box.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) The utility model discloses a set up the radiating groove that is used for installing heat radiation structure on the mainframe box, the inside air of second heat dissipation fan drive mainframe box through heat radiation structure outwards flows to take away the heat that produces because electronic component work in the mainframe box, prevent that the heat from piling up the operating temperature who leads to electronic component in the mainframe box and rise, thereby be unfavorable for electronic component normal work.
(2) the utility model discloses a second damping spring and heating panel fixed connection of installation on the second heat dissipation fan absorb the vibrations that the second heat dissipation fan during operation produced through second damping spring, and such connected mode one reduces the second heat dissipation fan and the vibrations production noise of heating panel lug connection work, reduces the influence that vibrations that the work of second heat dissipation fan produced led to the fact other electronic component simultaneously.
Drawings
in order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the exploded structure of the present invention;
Fig. 3 is a schematic structural diagram of the main chassis in the embodiment of the present invention;
Fig. 4 is a schematic structural view of a dustproof top cover in the embodiment of the present invention;
Fig. 5 is a schematic structural diagram of a base in an embodiment of the present invention;
Fig. 6 is a schematic structural view of a heat dissipation structure in an embodiment of the present invention;
In the figure: 1. a main chassis; 11. a heat sink; 12. a limiting block; 13. heat dissipation holes; 2. a base; 21. supporting legs; 22. mounting grooves; 23. a first heat dissipation fan; 24. a first damping spring; 3. a dust-proof top cover; 31. an ash prevention groove; 32. dust filtration cotton; 33. a dust screen; 4. a heat dissipation structure; 41. a heat dissipation plate; 42. mounting holes; 43. a second heat dissipation fan; 431. a second damping spring; 44. dustproof cloth.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
referring to fig. 1, 2, 3, 4, 5 and 6, a heat dissipation structure with a shock absorption function for a computer includes a main chassis 1 and a heat dissipation structure 4, wherein the main chassis 1 is a cuboid whose upper end surface penetrates through the interior of the main chassis 1, and heat dissipation grooves 11 are symmetrically formed in the end surfaces of the two sides of the main chassis 1, the heat dissipation grooves 11 of the two sides of the main chassis 1 are respectively provided with the heat dissipation structure 4, and the open end of the main chassis 1 is fixedly connected with a dust-proof top cover 3;
Referring to fig. 6, the heat dissipation structure 4 is composed of a heat dissipation plate 41 and a second heat dissipation fan 43, the heat dissipation plate 41 is installed inside the heat dissipation groove 11, the heat dissipation plate 41 is fixedly bonded to the heat dissipation groove 11, a plurality of mounting holes 42 are uniformly formed in the heat dissipation plate 41 along the vertical direction, the second heat dissipation fan 43 is installed in the mounting holes 42, a plurality of second damping springs 431 are uniformly welded to the outside of the second heat dissipation fan 43, the other ends of the second damping springs 431 are welded to the inner wall of the mounting holes 42 on the heat dissipation plate 41, and further, by forming the heat dissipation groove 11 for installing the heat dissipation structure 4 on the main chassis 1, the second heat dissipation fan 43 in the heat dissipation structure 4 drives the air inside the main chassis 1 to flow outwards, thereby taking away the heat generated by the work of the electronic component in the main chassis 1, and preventing the heat accumulation in the main chassis 1 from causing the rise of the, thereby be unfavorable for electronic component normal work, and second damping spring 431 and heating panel 41 fixed connection of installation on second heat dissipation fan 43, absorb the vibrations that second heat dissipation fan 43 during operation produced through second damping spring 431, such connected mode one reduces second heat dissipation fan 43 and heating panel 41 lug connection work vibrations and produces the noise, reduce the influence that vibrations that second heat dissipation fan 43 work produced led to the fact other electronic component simultaneously, thereby can guarantee under the radiating circumstances of computer normal, the normal work that produces vibrations and influence each electronic component in the host computer case when reducing the cooling fan operation, thereby guarantee each electronic component's in the host computer case normal use, improve each electronic component working life.
Please refer to fig. 5, further including the base 2, and the base 2 is disposed at the bottom of the mainframe box 1, the base 2 includes the supporting leg 21, the first heat dissipation fan 23 and the first damping spring 24, the mounting groove 22 has been seted up at the middle part of the upper end face of the base 2, and two supporting legs 21 are symmetrically installed on both sides of the lower end face of the base 2, the first heat dissipation fan 23 is installed through running through in the middle part of the bottom surface of the mounting groove 22, and two first damping springs 24 are vertically welded on both sides of the bottom surface of the mounting groove 22, and then the first heat dissipation fan 23 through setting up on the base 2 is used for exhausting the inside of the mainframe box 1, and the first damping spring 24 is used for connecting the mainframe box 1, and reduces the vibration influence when.
Referring to fig. 2, two limiting blocks 12 are symmetrically installed on two sides of the lower end surface of the main case 1, a heat dissipation hole 13 is formed in the middle of the lower end surface of the main case 1, the limiting blocks 12 are welded and fixed to the upper end of the first damping spring 24, and therefore when the connection between the base 2 and the main case 1 is ensured through the welding and fixing of the limiting blocks 12 and the upper end of the first damping spring 24, the influence of vibration on the main case 1 can be reduced.
Referring to fig. 4, the dust-proof top cover 3 includes dust-filtering cotton 32 and a dust-proof net 33, and the dust-proof top cover 3 is fixed on the opening end of the main case 1 by screws, the upper end surface of the dust-proof top cover 3 is provided with a dust-proof groove 31, and the bottom surface of the dust-proof groove 31 is provided with an air hole penetrating through the lower end surface of the dust-proof top cover 3, the dust-filtering cotton 32 is filled in the dust-proof groove 31 on the dust-proof top cover 3, and the dust-proof net 33 is welded on the top end of the dust-proof groove 31 on the dust-proof top cover 3, so that the dust-filtering cotton 32 and the dust-proof net 33 are installed in the dust-proof groove 31 through the upper end surface of the dust-proof top cover 3, and the external air flows into the main case 1 through the dust-filtering cotton 33 and the dust.
Referring to fig. 6, the outer end of the mounting hole 42 of the heat sink 41 is provided with the dustproof cloth 44, and the dustproof cloth 44 is fixedly adhered to the heat sink 41, so that the dustproof cloth 44 is adhered to the outer end of the mounting hole 42 of the heat sink 41 to prevent external dust from entering the main chassis 1 through the mounting hole 42, which is not favorable for improving the dustproof performance of the main chassis 1.
The device obtained by the design can basically meet the requirement that the normal operation of each electronic element in the host computer box is influenced by the vibration generated when the cooling fan operates under the condition of ensuring the normal heat dissipation of the computer, so that the normal use of each electronic element in the host computer box is ensured, the service life of each electronic element is prolonged, and the use of the heat dissipation structure with the damping function for the computer is improved.
the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a heat radiation structure with shock-absorbing function for computer, includes mainframe box (1) and heat radiation structure (4), its characterized in that: the upper end face of the mainframe box (1) penetrates through a hollow cuboid, radiating grooves (11) are symmetrically formed in the end faces of two sides of the mainframe box (1) in a penetrating mode, radiating structures (4) are installed in the radiating grooves (11) of the two sides of the mainframe box (1), and the opening end of the mainframe box (1) is fixedly connected with a dustproof top cover (3);
Heat radiation structure (4) are by heating panel (41) and second heat dissipation fan (43) and constitute, heating panel (41) are installed in the inside of radiating groove (11), and fixed bonding between heating panel (41) and radiating groove (11), a plurality of mounting hole (42) have evenly been seted up along vertical direction on heating panel (41), and install second heat dissipation fan (43) in mounting hole (42), the even welding in outside of second heat dissipation fan (43) has a plurality of second damping spring (431), and the other end welding of second damping spring (431) on mounting hole (42) inner wall on heating panel (41).
2. The heat dissipation structure with the shock absorption function for the computer according to claim 1, further comprising a base (2), wherein the base (2) is disposed at the bottom end of the main cabinet (1), the base (2) comprises supporting legs (21), a first heat dissipation fan (23) and first shock absorption springs (24), a mounting groove (22) is formed in the middle of the upper end face of the base (2), two supporting legs (21) are symmetrically mounted on two sides of the lower end face of the base (2), the first heat dissipation fan (23) is installed in the middle of the bottom face of the mounting groove (22) in a penetrating manner, and two first shock absorption springs (24) are vertically welded on two sides of the bottom face of the mounting groove (22).
3. The heat dissipation structure with a shock absorption function for a computer according to claim 2, wherein two limit blocks (12) are symmetrically installed on two sides of the lower end surface of the main cabinet (1), a heat dissipation hole (13) is formed in the middle of the lower end surface of the main cabinet (1), and the limit blocks (12) are welded and fixed to the upper end of the first shock absorption spring (24).
4. The heat dissipation structure with the shock absorption function for the computer according to claim 3, wherein the dust cap (3) comprises dust filtering cotton (32) and a dust screen (33), the dust cap (3) is fixed on the opening end of the main case (1) through screws, a dust groove (31) is formed in the upper end surface of the dust cap (3), an air hole penetrating through the lower end surface of the dust cap (3) is formed in the bottom surface of the dust groove (31), the dust filtering cotton (32) is filled in the dust groove (31) on the dust cap (3), and the dust screen (33) is welded at the top end of the dust groove (31) on the dust cap (3).
5. The heat dissipating structure with a shock absorbing function for a computer according to claim 4, wherein the outer end of the mounting hole (42) of the heat dissipating plate (41) is provided with a dust cloth (44), and the dust cloth (44) is fixedly bonded to the heat dissipating plate (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920633871.5U CN209803721U (en) | 2019-05-05 | 2019-05-05 | heat radiation structure with shock-absorbing function for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920633871.5U CN209803721U (en) | 2019-05-05 | 2019-05-05 | heat radiation structure with shock-absorbing function for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209803721U true CN209803721U (en) | 2019-12-17 |
Family
ID=68831997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920633871.5U Expired - Fee Related CN209803721U (en) | 2019-05-05 | 2019-05-05 | heat radiation structure with shock-absorbing function for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209803721U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111474989A (en) * | 2019-12-30 | 2020-07-31 | 吉林师范大学 | Computer machine case convenient to dehumidification heat dissipation |
| CN111597595A (en) * | 2020-05-25 | 2020-08-28 | 常州工程职业技术学院 | Computer protection equipment |
| CN112379739A (en) * | 2020-11-18 | 2021-02-19 | 深圳市戴讯通信设备有限公司 | Dustproof, shockproof and heat dissipation type computer shell |
| CN112838311A (en) * | 2020-12-31 | 2021-05-25 | 颍上县翔安新能源科技有限公司 | Lithium battery shell with protection architecture |
| CN113985975A (en) * | 2021-10-16 | 2022-01-28 | 陈君艺 | Water-cooling radiating component for computer |
-
2019
- 2019-05-05 CN CN201920633871.5U patent/CN209803721U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111474989A (en) * | 2019-12-30 | 2020-07-31 | 吉林师范大学 | Computer machine case convenient to dehumidification heat dissipation |
| CN111597595A (en) * | 2020-05-25 | 2020-08-28 | 常州工程职业技术学院 | Computer protection equipment |
| CN112379739A (en) * | 2020-11-18 | 2021-02-19 | 深圳市戴讯通信设备有限公司 | Dustproof, shockproof and heat dissipation type computer shell |
| CN112379739B (en) * | 2020-11-18 | 2024-02-09 | 深圳市戴讯通信设备有限公司 | Dustproof, shockproof and heat dissipation type computer housing |
| CN112838311A (en) * | 2020-12-31 | 2021-05-25 | 颍上县翔安新能源科技有限公司 | Lithium battery shell with protection architecture |
| CN113985975A (en) * | 2021-10-16 | 2022-01-28 | 陈君艺 | Water-cooling radiating component for computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209803721U (en) | heat radiation structure with shock-absorbing function for computer | |
| CN212781856U (en) | Shock-proof type computer machine case | |
| CN213426793U (en) | Electronic information anti-interference device | |
| CN213519928U (en) | Integrated circuit chip protection device | |
| CN207819649U (en) | A kind of electric machine fixation structure | |
| CN213479628U (en) | Safety device for computer network equipment | |
| CN212364921U (en) | Shock attenuation chassis that computer mainframe used | |
| CN209842478U (en) | High-efficient computer mainframe who makes an uproar that falls | |
| CN211202345U (en) | Low-noise computer cooling fan | |
| CN213907272U (en) | Drive power supply that stable form is good | |
| CN213460607U (en) | Electric power cabinet that electric power dustproof shock attenuation is safe | |
| CN213989789U (en) | Integrated power supply screen | |
| CN214954814U (en) | Prevent overheated server box and server | |
| CN210202309U (en) | Electromechanical device heat dissipation protection device | |
| CN215073111U (en) | Internet of things terminal based on 5G communication technology | |
| CN219318312U (en) | LED lamp circuit board with shockproof function | |
| CN212339471U (en) | Outdoor motor shield for shock absorption type household air conditioner | |
| CN218728899U (en) | Computer communication module | |
| CN213461688U (en) | Symmetrically distributed inductance loading type filter | |
| CN210724379U (en) | Fixing base of explosion-proof three-phase asynchronous motor of coal mine scraper loader | |
| CN214930410U (en) | Based on slide controller mounting structure | |
| CN216357919U (en) | Cloud storage node application server | |
| CN213522908U (en) | HDI high density lamination heat dissipation type circuit board | |
| CN211606291U (en) | Motor with shock-absorbing function | |
| CN211352823U (en) | Anti-seismic copper-clad plate easy to install |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191217 Termination date: 20210505 |