CN210022881U - Vacuum hole bracket for LED wafer automatic sorting machine - Google Patents
Vacuum hole bracket for LED wafer automatic sorting machine Download PDFInfo
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- CN210022881U CN210022881U CN201920631115.9U CN201920631115U CN210022881U CN 210022881 U CN210022881 U CN 210022881U CN 201920631115 U CN201920631115 U CN 201920631115U CN 210022881 U CN210022881 U CN 210022881U
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- vacuum
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- negative pressure
- vacuum hole
- bracket body
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Abstract
A vacuum hole bracket for an automatic LED wafer sorting machine comprises a vacuum bracket body, wherein a vacuum hole bracket sealing cover is connected below the vacuum bracket body, and a gap is formed between the vacuum bracket body and the vacuum hole bracket sealing cover to form a negative pressure cavity; the vacuum hole bracket has upper surface and lower surface, and the upper surface is the plane, the lower surface distribution of vacuum hole bracket has a plurality of micropore, a plurality of micropore totality is the hexagon and arranges, and the shape of micropore arrangement shape suits with the shape of wafer, and the negative pressure chamber is that the negative pressure passes through the micropore and produces great adsorption affinity, adsorbs the blue membrane at the upper surface of vacuum hole bracket, because the adsorption affinity that a plurality of micropore produced is even, can not make blue membrane produce deformation, guarantees the roughness of welding wafer blue membrane.
Description
Technical Field
The utility model relates to a LED wafer automatic separation machine, specific theory relates to a vacuum hole bracket for LED wafer automatic separation machine, belongs to LED wafer manufacturing technical field.
Background
Traditional LED sorter when carrying out the fixed of wafer, generally adopts mechanical type fixed mode, and although fixed firm, the structure is complicated, when the wafer was taken, need open mechanical type fixing device earlier, then takes, has reduced machining efficiency, and mechanical type fixed mode causes the damage of LED wafer easily moreover.
SUMMERY OF THE UTILITY MODEL
The to-be-solved problem of the utility model is to above not enough, provide a vacuum hole bracket for LED wafer automatic separation machine, this vacuum hole bracket makes the micropore produce great adsorption affinity through the negative pressure, adsorbs the blue membrane at the upper surface of vacuum hole bracket, because the adsorption affinity that a plurality of micropore produced is even, can not make blue membrane produce deformation, guarantees the roughness of welding wafer blue membrane.
In order to solve the technical problem, the utility model adopts the technical scheme that: a vacuum hole bracket for an automatic LED wafer sorting machine comprises a vacuum bracket body, wherein a vacuum hole bracket sealing cover is connected below the vacuum bracket body, and a gap is formed between the vacuum bracket body and the vacuum hole bracket sealing cover to form a negative pressure cavity;
the vacuum bracket body is provided with an upper surface and a lower surface, the upper surface is a plane, the lower surface is a plane, a plurality of micropores are distributed on the lower surface of the vacuum bracket body, the plurality of micropores are arranged in a hexagonal shape, and the arrangement shape of the micropores is adapted to the shape of the wafer.
The following is a further improvement of the above technical solution:
the micropore is a conical through hole and is communicated with the negative pressure cavity and the upper surface of the vacuum bracket body.
The vertical section of the micropore is fan-shaped, the micropore is provided with a large-diameter end and a small-diameter end, the large-diameter end of the micropore is positioned on the lower surface of the vacuum bracket body, and the small-diameter end of the micropore is positioned on the upper surface of the vacuum bracket body.
Comprises a sealing cover of a vacuum hole bracket and a sealing glue assembly of the vacuum bracket.
The outer circumference of the vacuum bracket body is provided with a plurality of vacuum hole bracket process holes.
The vacuum bracket is characterized by further comprising a negative pressure air inlet elbow, wherein the negative pressure air inlet elbow is arranged on the base of the vacuum bracket body and is in threaded connection with the vacuum bracket body, and the negative pressure air inlet elbow is communicated with the negative pressure cavity.
The utility model adopts the above technical scheme, compare with prior art, have following advantage: the negative pressure cavity generates larger adsorption force through the micropores by negative pressure, the blue membrane is adsorbed on the upper surface of the vacuum hole bracket, and the blue membrane cannot deform due to uniform adsorption force generated by the micropores, so that the flatness of the blue membrane of the welded wafer is ensured.
The present invention will be described in detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural view of a vacuum hole bracket for an automatic sorting machine of LED chips according to an embodiment of the present invention;
FIG. 2 is a sectional view taken along line A-A of FIG. 1;
in the figure, the position of the upper end of the main shaft,
the vacuum bracket comprises a vacuum bracket body 1, a vacuum hole bracket sealing cover 2, a vacuum hole bracket process hole 3, a negative pressure air inlet elbow 4, a negative pressure cavity 5, a micropore 51, an upper surface 101, a lower surface 102 and a base 103.
Detailed Description
In the embodiment, as shown in fig. 1 and fig. 2, a vacuum hole bracket for an automatic sorting machine of LED chips comprises a vacuum bracket body 1, a vacuum hole bracket sealing cover 2 connected to the lower part of the vacuum bracket body 1, and a negative pressure cavity 5 formed by a gap between the vacuum bracket body 1 and the vacuum hole bracket sealing cover 2; the vacuum hole bracket sealing cover 2 and the vacuum bracket body 1 are assembled by sealing glue.
The outer circumference of the vacuum bracket body 1 is provided with a plurality of vacuum hole bracket process holes 3.
The vacuum bracket body 1 has an upper surface 101 and a lower surface 102, the upper surface 101 is a plane, the lower surface 102 is a plane, a plurality of micro holes 51 are distributed on the lower surface 102 of the vacuum bracket body 1, the plurality of micro holes 51 are arranged in a hexagonal shape, and the arrangement shape of the micro holes 51 is adapted to the shape of the wafer.
The minute hole 51 is a tapered through hole communicating the negative pressure chamber 5 and the upper surface of the vacuum holder body 1.
The vertical cross section of the micro hole 51 is fan-shaped, and the micro hole 51 has a large diameter end and a small diameter end, the large diameter end of the micro hole is located on the lower surface of the vacuum holder body 1, and the small diameter end of the micro hole 51 is located on the upper surface of the vacuum holder body 1.
The vacuum bracket further comprises a negative pressure air inlet elbow 4, the negative pressure air inlet elbow 4 is arranged on the base 103 of the vacuum bracket body 1, the negative pressure air inlet elbow 4 is in threaded connection with the vacuum bracket body 1, and the negative pressure air inlet elbow 4 is communicated with the negative pressure cavity 5.
The negative pressure cavity 5 generates larger adsorption force by the negative pressure through the micropores, the blue film is adsorbed on the upper surface of the vacuum bracket body 1, and the blue film cannot deform due to the uniform adsorption force generated by the micropores 51, so that the flatness of the blue film of the welded wafer is ensured.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention.
Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (6)
1. A vacuum hole bracket for an automatic LED wafer sorting machine comprises a vacuum bracket body (1), a vacuum hole bracket sealing cover (2) is connected below the vacuum bracket body (1), and a gap is formed between the vacuum bracket body (1) and the vacuum hole bracket sealing cover (2) to form a negative pressure cavity (5);
the vacuum bracket body (1) is provided with an upper surface (101) and a lower surface (102), the upper surface (101) is a plane, the lower surface (102) is a plane, a plurality of micropores (51) are distributed on the lower surface (102) of the vacuum bracket body (1), the plurality of micropores (51) are arranged in a hexagonal shape, and the arrangement shape of the micropores (51) is adapted to the shape of a wafer.
2. The vacuum hole bracket for an automatic sorting machine of LED chips according to claim 1, wherein: the micropore (51) is a conical through hole and is communicated with the negative pressure cavity (5) and the upper surface of the vacuum bracket body (1).
3. The vacuum hole bracket for an automatic sorting machine of LED chips according to claim 2, wherein: the vertical section of the micropore (51) is fan-shaped, the micropore (51) is provided with a large-diameter end and a small-diameter end, the large-diameter end of the micropore is positioned on the lower surface of the vacuum bracket body (1), and the small-diameter end of the micropore (51) is positioned on the upper surface of the vacuum bracket body (1).
4. The vacuum hole bracket for an automatic sorting machine of LED chips as claimed in claim 3, wherein: comprises a vacuum hole bracket sealing cover (2) and a vacuum bracket body (1) which are assembled by sealing glue.
5. The vacuum hole bracket for an automatic sorting machine of LED chips as claimed in claim 4, wherein: the outer circumference of the vacuum bracket body (1) is provided with a plurality of vacuum hole bracket process holes (3).
6. The vacuum hole bracket for an automatic sorting machine of LED chips according to claim 5, wherein: the vacuum bracket is characterized by further comprising a negative pressure air inlet elbow (4), wherein the negative pressure air inlet elbow (4) is arranged on the base (103) of the vacuum bracket body (1), the negative pressure air inlet elbow (4) is in threaded connection with the vacuum bracket body (1), and the negative pressure air inlet elbow (4) is communicated with the negative pressure cavity (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920631115.9U CN210022881U (en) | 2019-05-06 | 2019-05-06 | Vacuum hole bracket for LED wafer automatic sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920631115.9U CN210022881U (en) | 2019-05-06 | 2019-05-06 | Vacuum hole bracket for LED wafer automatic sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210022881U true CN210022881U (en) | 2020-02-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920631115.9U Active CN210022881U (en) | 2019-05-06 | 2019-05-06 | Vacuum hole bracket for LED wafer automatic sorting machine |
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| Country | Link |
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| CN (1) | CN210022881U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109985828A (en) * | 2019-05-06 | 2019-07-09 | 山东泓瑞光电科技有限公司 | A kind of LED wafer automatic fraction collector vacuum hole bracket |
| CN114472189A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Method and device for controlling LED and semiconductor laser chip placing workbench |
-
2019
- 2019-05-06 CN CN201920631115.9U patent/CN210022881U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109985828A (en) * | 2019-05-06 | 2019-07-09 | 山东泓瑞光电科技有限公司 | A kind of LED wafer automatic fraction collector vacuum hole bracket |
| CN114472189A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Method and device for controlling LED and semiconductor laser chip placing workbench |
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