CN210015842U - Cleaning device and dry etching equipment - Google Patents
Cleaning device and dry etching equipment Download PDFInfo
- Publication number
- CN210015842U CN210015842U CN201921146687.4U CN201921146687U CN210015842U CN 210015842 U CN210015842 U CN 210015842U CN 201921146687 U CN201921146687 U CN 201921146687U CN 210015842 U CN210015842 U CN 210015842U
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- China
- Prior art keywords
- cleaning
- unit
- electrostatic chuck
- cleaning device
- rotatable
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- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 126
- 238000001312 dry etching Methods 0.000 title claims abstract description 39
- 238000005530 etching Methods 0.000 claims description 16
- 238000005507 spraying Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 17
- 239000007788 liquid Substances 0.000 description 13
- 239000007789 gas Substances 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010070 extrusion (rubber) Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a cleaning device and a dry etching device, wherein the cleaning device comprises a transmission unit; and a rotatable cleaning unit disposed at one end of the transfer unit; wherein the transfer unit is configured to be in a folded state when not in an operative state and in an unfolded state when in an operative state such that the rotatable cleaning unit is aligned with the electrostatic chuck. When dry etching equipment includes this cleaning device, need not open the chamber, can realize the cleanness to the electrostatic chuck, and because conveying unit can realize fold condition and the switching of expansion state, when need not clean, conveying unit is in fold condition, so can not interfere this process production of electrostatic chuck to placing the wafer, and is further, because cleaning device takes rotatable formula cleaning unit, can realize the multi-angle cleanness to the electrostatic chuck, consequently, has also guaranteed clean effect.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technical field, in particular to cleaning device and dry etching device.
Background
In order to solve the problems of wafer damage, uneven etching and the like caused by the fact that a wafer is fixed in a mechanical mode in a traditional dry etching device, the wafer is usually fixed in the traditional dry etching device for etching through an electrostatic chuck technology, one surface, used for bearing a workpiece, of the electrostatic chuck is provided with a plurality of suction pins, and in order to avoid the phenomenon of uneven etching caused by uneven temperature, air holes are distributed among the suction pins and used for cooling the back surface of the wafer through helium introduced from the back of the electrostatic chuck. The helium gas can be used for cooling the wafer and reflecting whether the wafer is well contacted with the electrostatic chuck or not, and when the back pressure of the helium gas is overlarge, the dry etching machine can generate an alarm to prompt that the wafer is in trouble and down in contact with the electrostatic chuck.
After the electrostatic chuck is used for a period of time, a polymer (such as polycrystalline silicon) is deposited on the surface of the electrostatic chuck, the polymer is attached to the suction pins to influence the adsorption force of the electrostatic chuck on a wafer, in addition, the surface temperature of the electrostatic chuck is seriously uneven, and the polycrystalline silicon layer can block air holes between the suction pins, so that a helium backpressure alarm is triggered to cause the dry etching equipment to be down, and thus, the wafer etched in the wafer needs to be reworked or directly scrapped.
Therefore, after the electrostatic chuck uses a period of time, need wash the electrostatic chuck, among the prior art, when will wasing the electrostatic chuck, need open the chamber, take out the electrostatic chuck, then reinstallate the going back again, at this in-process, the procedure of etching machine need reset for the operation is more loaded down with trivial details.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cleaning device and dry etching equipment to solve current dry etching equipment and when needing to wash electrostatic chuck, need open the chamber, lead to complex operation's problem.
In order to solve the above technical problem, the utility model provides a cleaning device for clean an electrostatic chuck's surface, include:
a transfer unit; and
a rotatable cleaning unit disposed at one end of the transfer unit;
wherein the conveying unit is configured to convey the rotatable cleaning unit to above the electrostatic chuck in a folded state in a non-operating state and in an unfolded state in an operating state.
Optionally, in the cleaning device, the rotatable cleaning unit is configured to be in a retracted state in a non-operating state, and to be expanded in a direction parallel to the electrostatic chuck in an operating state.
Optionally, in the cleaning device, the rotatable cleaning unit includes a driving portion and a plurality of brush heads disposed on the driving portion, and the brush heads are driven by the driving portion to unfold and rotate in a direction away from the driving portion.
Optionally, in the cleaning device, the number of the brush heads is multiple, and the multiple brush heads are uniformly distributed around the axis of the driving part.
Optionally, in the cleaning device, the cleaning device further includes a cleaning liquid spraying unit disposed on the rotatable cleaning unit, and the cleaning liquid spraying unit is configured to spray a cleaning liquid to the electrostatic chuck when the rotatable cleaning unit cleans the electrostatic chuck.
Optionally, in the cleaning device, the cleaning device further includes a carrying chamber, and when the conveying unit is in a non-operating state, the carrying chamber can accommodate the conveying unit and the rotatable cleaning unit.
Optionally, in the cleaning device, the carrying chamber includes a tray body and a cover body, and the carrying chamber is configured such that the cover body is opened when the conveying unit is to enter the working state; the rotatable cleaning unit is driven by the conveying unit to be aligned to the electrostatic chuck through the top of the chamber.
The utility model also provides a dry etching equipment, include:
the electrostatic chuck is used for bearing the wafer;
a cantilever for carrying the electrostatic chuck; and
a cleaning device as described above.
Optionally, in the dry etching apparatus, the dry etching apparatus further includes an etching chamber, and the electrostatic chuck, the cantilever, and the cleaning device are all disposed in the etching chamber.
Optionally, in the dry etching apparatus, the dry etching apparatus further includes a supporting portion, and the cantilever and the cleaning device are fixed to the supporting portion.
In the cleaning device and the dry etching apparatus provided by the present invention, the cleaning device includes a transfer unit; and a rotatable cleaning unit disposed at one end of the transfer unit; wherein the transfer unit is configured to be in a folded state when not in an operative state and in an unfolded state when in an operative state such that the rotatable cleaning unit is aligned with the electrostatic chuck. When dry etching equipment includes this cleaning device, need not open the chamber, can realize the cleanness to the electrostatic chuck, and because conveying unit can realize fold condition and the switching of expansion state, when need not clean, conveying unit is in fold condition, so can not interfere this process production of electrostatic chuck to placing the wafer, and is further, because cleaning device takes rotatable formula cleaning unit, can realize the multi-angle cleanness to the electrostatic chuck, consequently, has also guaranteed clean effect.
Drawings
Fig. 1 is a schematic structural view of a cleaning device in an operating state and a non-operating state according to the embodiment of the present invention;
fig. 2 is a schematic structural diagram of a dry etching apparatus provided by the present invention;
wherein the reference numerals are as follows:
100-a cleaning device; 11-a transfer unit; 12-a rotatable cleaning unit; 121-a drive section; 122-a brush head; 13-cleaning liquid spraying unit; 14-a load-bearing chamber; 200-an electrostatic chuck; 300-cantilever; 400-etching the chamber; 500-molecular pump; 600-support part.
Detailed Description
As described above, after the electrostatic chuck for supporting the wafer of the conventional dry etching apparatus is used for a period of time, the electrostatic chuck needs to be cleaned, but for the conventional dry etching apparatus, when the electrostatic chuck needs to be cleaned, a cavity needs to be opened, and then the electrostatic chuck needs to be installed again.
In view of this, the utility model aims at providing a cleaning device and dry etching equipment locates this cleaning device in the dry etching equipment sculpture cavity to accomplish the cleanness to the electrostatic chuck in the sculpture cavity, owing to need not open the chamber repeatedly, consequently, avoided the procedure to the sculpture machine to need resetting, make the more loaded down with trivial details problem of operation.
The cleaning device and the dry etching apparatus according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
Referring to fig. 1, a cleaning device 100 provided in this embodiment includes: a transfer unit 11; and a rotatable cleaning unit 12 provided at one end of the transfer unit 11; the cleaning device 100 is used for cleaning an electrostatic chuck 200, wherein the conveying unit 11 is configured to be in a folded state when not in an operating state, and to be in an unfolded state when in the operating state, and to convey the rotatable cleaning unit 12 above the electrostatic chuck 200.
The cleaning device 100 provided in this embodiment can realize the switching between the folded state and the unfolded state by the conveying unit 11, and when cleaning is not needed, the conveying unit 11 is in the folded state, so that interference to the process of placing the wafer on the electrostatic chuck is avoided, and further, because the cleaning device 100 adopts the rotatable cleaning unit 12, multi-angle cleaning of the electrostatic chuck can be realized, and therefore, the cleaning effect is also ensured.
As shown in fig. 1, the transfer unit 11 may be a multi-arm manipulator, and a plurality of such transfer units are used in cooperation with each other through multiple arms, so that the entire transfer unit 11 can be switched between the folded state and the unfolded state. A motor (not shown) may be disposed at the other end of the conveying unit 11, and the conveying unit 11 is operated by driving the motor.
Preferably, in this embodiment, the rotatable cleaning unit 12 is configured to be in a retracted state when not in an operating state and to be deployed in a direction parallel to the electrostatic chuck when in an operating state. With this design, the cleaning surface can be made as large as possible during operation, but the occupied space is as small as possible during non-operation, so as to facilitate storage and avoid interference with the movement of the transfer unit 11.
Specifically, the rotatable cleaning unit 12 may include a driving portion 121 and a plurality of brush heads 122 disposed on the driving portion 121, and the brush heads 122 are driven by the driving portion 121 to spread and rotate in a direction away from the driving portion 121; wherein, the number of the brush heads 122 can be multiple, and the multiple brush heads 122 are evenly distributed around the axis of the driving part 121; more specifically, the driving part 121 may include a motor and a housing for accommodating the motor, and the brush head 122 is disposed on a lower end surface of the housing, or on a side surface of the housing near the lower end surface, and exhibits a certain inclination angle. The multiple brush head 122 design is adopted, and the cleaning times of the electrostatic chuck at the same position are increased in the same time, so that the working efficiency is improved.
Further preferably, in this embodiment, the cleaning device 100 further includes a cleaning liquid spraying unit 13 disposed on the rotatable cleaning unit 12, and the cleaning liquid spraying unit 13 is configured to spray cleaning liquid to the electrostatic chuck when the rotatable cleaning unit 12 cleans the electrostatic chuck. Specifically, the cleaning solution sprays unit 13 and can set up in the below of drive division 121, the cleaning solution sprays unit 13 and can include a bearing container that is equipped with the cleaning solution and set up the soft rubber extrusion shower nozzle on this bearing container, works as but the clean unit 12 of rotation formula is right when the electrostatic chuck cleans, because the cleaning solution sprays unit 13 and sets up the below of drive division 121, soft rubber extrusion shower nozzle can contact with the electrostatic chuck, sprays the cleaning solution at the electrostatic chuck, so, helps strengthening whole cleaning device 100 to the clean dynamics of electrostatic chuck. The cleaning liquid of the cleaning liquid spraying unit 13 may use an isopropyl alcohol solution or pure water.
In addition, in this embodiment, it is further preferable that the cleaning device 100 further includes a carrying chamber 14, and when the conveying unit 11 is in the non-operating state, the carrying chamber 14 can accommodate the conveying unit 11 and the rotatable cleaning unit 12. Specifically, the carrying chamber 14 may include a tray and a cover (not specifically distinguished in fig. 1), and is configured to be opened when the transfer unit 11 is to enter the working state; the rotatable cleaning unit 12 is aligned with the electrostatic chuck through the top of the chamber by the driving of the transfer unit 11. When the cleaning device 100 is applied to a dry etching apparatus, since the wafer is etched by using the etching gas, the etching gas generally has a certain corrosiveness, and the carrying chamber 14 can be used to protect the conveying unit 11, the rotatable cleaning unit 12, and the like to a certain extent.
Next, referring to fig. 2, the dry etching apparatus provided in this embodiment includes: an electrostatic chuck 200 for carrying a wafer; a cantilever 300 for carrying the electrostatic chuck 200; and a cleaning device 100 as described above.
In addition, the dry etching apparatus of the present embodiment further includes an etching chamber 400, and the electrostatic chuck 200, the cantilever 300 and the cleaning device 100 are all disposed in the etching chamber 400. The cleaning of the electrostatic chuck 200 by the cleaning device 100 may be performed in the etching chamber 400 without opening the chamber. It should be understood that, as with prior dry etching apparatus, the etching chamber 400 of the present embodiment is still provided with a door (not shown) for transferring wafers and for supplementing or replacing the cleaning liquid when the cleaning liquid of the cleaning device 100 is used up. However, compared with the existing dry etching equipment, the cavity opening is not needed during cleaning, so that the cavity opening times are greatly reduced, and the operation process of the whole equipment is simpler. Further, as in the existing dry etching apparatus, the dry etching apparatus of this embodiment may be provided with a molecular pump 500 below the etching chamber 400, and the polymer cleaned by the cleaning device 100 is pumped away by the molecular pump 500.
Preferably, the dry etching apparatus of the present embodiment further includes a supporting portion 600, the supporting portion 600 is used to facilitate fixing the cantilever 300 and the cleaning device 100, and the present embodiment does not limit the specific fixing manner and the specific shape of the supporting portion 600, and the specific installation positions of the cantilever 300 and the cleaning device 100 on the supporting portion, and only needs to satisfy that the conveying unit 11 of the cleaning device 100 can convey the rotatable cleaning unit 12 above the electrostatic chuck 200.
The working process of the cleaning device 100 and the dry etching apparatus provided in the preferred embodiment of the present invention may be as follows:
(1) when the electrostatic chuck 200 needs to be cleaned, the cover of the carrying chamber 14 of the cleaning device 100 is opened, the conveying unit 11 is unfolded, and the rotatable cleaning unit 12 is conveyed to the position above the electrostatic chuck 200;
(2) the brush head 122 of the rotatable cleaning unit 12 is driven by the driving part 121 to spread and rotate away from the first end, and at the same time, the cleaning liquid spraying unit 13 sprays cleaning liquid to the electrostatic chuck 200;
(3) after the cleaning, the cleaned polymer is pumped out by the molecular pump 500 of the dry etching apparatus, the conveying unit 11 is folded into the carrying chamber 14, and the cover of the carrying chamber 14 is closed.
To sum up, the utility model provides a cleaning device and dry etching equipment have solved current dry etching equipment and when needing to wash electrostatic chuck, need open the chamber, lead to complex operation's problem.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modification and modification made by those skilled in the art according to the above disclosure are all within the scope of the claims.
Claims (10)
1. A cleaning apparatus for cleaning a surface of an electrostatic chuck, comprising:
a transfer unit; and
a rotatable cleaning unit disposed at one end of the transfer unit;
wherein the conveying unit is configured to convey the rotatable cleaning unit to above the electrostatic chuck in a folded state in a non-operating state and in an unfolded state in an operating state.
2. The cleaning apparatus as recited in claim 1, wherein said rotatable cleaning unit is configured to be in a retracted state when not in an operational state and to be deployed in a direction parallel to said electrostatic chuck when in an operational state.
3. The cleaning apparatus as claimed in claim 2, wherein the rotatable cleaning unit comprises a driving portion and a plurality of brush heads disposed on the driving portion, the brush heads being spread and rotated in a direction away from the driving portion by the driving of the driving portion.
4. A cleaning apparatus as claimed in claim 3, wherein the number of said brush heads is plural, and a plurality of said brush heads are evenly distributed about the axis of said drive portion.
5. The cleaning device of claim 1, further comprising a cleaning solution spraying unit disposed on the rotatable cleaning unit, the cleaning solution spraying unit being configured to spray a cleaning solution to the electrostatic chuck when the rotatable cleaning unit cleans the electrostatic chuck.
6. The cleaning apparatus as claimed in claim 1, wherein the cleaning apparatus further comprises a carrying chamber capable of accommodating the transport unit and the rotatable cleaning unit when the transport unit is in the inactive state.
7. The cleaning apparatus as claimed in claim 6, wherein the loading chamber includes a tray body and a cover body, the loading chamber being configured such that the cover body is opened when the transfer unit is to be brought into an operating state; the rotatable cleaning unit is driven by the conveying unit to be aligned to the electrostatic chuck through the top of the chamber.
8. A dry etching apparatus, comprising:
the electrostatic chuck is used for bearing the wafer;
a cantilever for carrying the electrostatic chuck; and
a cleaning device as claimed in any one of claims 1 to 7.
9. The dry etching apparatus according to claim 8, further comprising an etching chamber, wherein the electrostatic chuck, the cantilever, and the cleaning device are disposed in the etching chamber.
10. The dry etching apparatus according to claim 8, further comprising a support portion, wherein the cantilever and the cleaning device are fixed to the support portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921146687.4U CN210015842U (en) | 2019-07-19 | 2019-07-19 | Cleaning device and dry etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921146687.4U CN210015842U (en) | 2019-07-19 | 2019-07-19 | Cleaning device and dry etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210015842U true CN210015842U (en) | 2020-02-04 |
Family
ID=69319727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921146687.4U Expired - Fee Related CN210015842U (en) | 2019-07-19 | 2019-07-19 | Cleaning device and dry etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210015842U (en) |
-
2019
- 2019-07-19 CN CN201921146687.4U patent/CN210015842U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200204 |
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| CF01 | Termination of patent right due to non-payment of annual fee |