CN210008158U - radiating structure of double-layer three-dimensional liquid cooling channel - Google Patents
radiating structure of double-layer three-dimensional liquid cooling channel Download PDFInfo
- Publication number
- CN210008158U CN210008158U CN201920827371.5U CN201920827371U CN210008158U CN 210008158 U CN210008158 U CN 210008158U CN 201920827371 U CN201920827371 U CN 201920827371U CN 210008158 U CN210008158 U CN 210008158U
- Authority
- CN
- China
- Prior art keywords
- liquid cooling
- shaped
- groove
- strip
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
heat radiation structures of double-layer three-dimensional liquid cooling channels, relate to hollow liquid cooling box plate structures, be equipped with "S" shape liquid cooling groove (6) on the top surface of "S" shape protruding piece (18), be equipped with spread groove (17) at the central part of dull and stereotyped (16) face B (20), bar apron (19) cover the oral area in spread groove (17), apron strip A (2) cover the oral area in liquid cooling groove A (7), apron strip B (5) cover the oral area in liquid cooling groove B (8), "S" shape apron strip (4) cover the oral area in "S" shape liquid cooling groove (6), the utility model discloses a set up "S" shape protruding piece on the flat board to set up the liquid cooling channel respectively at "S" shape protruding piece and dull and stereotyped face, make two way liquid cooling channels form double-layer three-dimensional structure, utilize wherein channels to connect at the dull and stereotyped back, make it can bridge smoothly to realize two ways three-dimensional structure channels mutually noninterfered purpose.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to an kind cavity liquid cooling boxboard structures especially relate to the heat radiation structure of kind double-deck three-dimensional liquid cooling passageway.
[ background of the invention ]
With the progress of science and technology, various precision instruments are continuously developed, and the miniaturization and the compaction of the precision instruments are a development trend, but the heat dissipation of the miniaturized and compacted precision instruments is a difficult problem in research, because the heat radiator is usually installed inside the precision instruments, and the heat radiator needs to occupy a large space, the volume of the precision instruments is increased virtually, the traditional solution is that an outer box body of the precision instruments is set to be a hollow structure, the precision instruments inside the precision instruments are cooled through cooling liquid arranged in the hollow outer box body, when a liquid cooling channel is complex and has a multilayer structure, the traditional machining process can not be realized, and at this time, the traditional process of a single-side liquid cooling channel needs to be improved to match the requirements of various complex liquid cooling channels.
[ summary of the invention ]
In order to overcome not enough in the background art, the utility model discloses a heat radiation structure of kinds of double-deck three-dimensional liquid cooling passageways is through setting up "S" shape protruding piece on the flat board to set up the liquid cooling passageway respectively at "S" shape protruding piece and dull and stereotyped face, make two way liquid cooling passageways form double-deck three-dimensional structure, utilize wherein passageways to connect at dull and stereotyped back fluting at two way passageway intersections, make it to bridge smoothly, realized the purpose of two way three-dimensional structure passageways mutual noninterference.
In order to realize the purpose, the utility model adopts the following technical scheme:
A heat dissipation structure of a double-layer three-dimensional liquid cooling channel comprises a cover plate strip A, an S-shaped cover plate strip, a cover plate strip B and a flat plate, wherein S-shaped protruding blocks extending to two ends of the plate surface A are arranged on the plate surface A of the flat plate, S-shaped liquid cooling grooves are arranged on the top surfaces of the S-shaped protruding blocks, liquid cooling grooves A are arranged on the plate surface A in bends of the S-shaped protruding blocks, liquid cooling grooves B are arranged on the plate surface A in another bends of the S-shaped protruding blocks, the liquid cooling grooves B and the liquid cooling grooves A are arranged in central symmetry, a connecting groove is arranged in the central part of the flat plate surface B, a strip-shaped cover plate covers an opening of the connecting groove to form a connecting channel, the cover plate strip A covers an opening of the liquid cooling groove A to form the liquid cooling channel A, the cover plate strip B is arranged at the opening of the liquid cooling groove B to form the liquid cooling channel B, a end of the liquid cooling channel A and a end of the liquid cooling channel are respectively connected to form the S-shaped liquid cooling groove covering an S-shaped opening of the liquid cooling channel.
The heat radiation structure of double-deck three-dimensional liquid cooling passageway, apron strip A is the combination of a plurality of "S" shape structures of a plurality of straight cover strips and a plurality of arc cover strip end to end formation, apron strip B is the same with apron strip A 'S structure, liquid cooling tank A is the combination of a plurality of "S" shape structures of a plurality of straight flutes and a plurality of arc wall end to end formation, liquid cooling tank B is the same with liquid cooling tank A' S structure.
The heat dissipation structure of the double-layer three-dimensional liquid cooling channel is characterized in that a liquid inlet hole A penetrating through the outer wall of the S-shaped protruding block is formed in the end of the S-shaped liquid cooling groove, and a liquid outlet hole A penetrating through the outer wall of the S-shaped protruding block is formed in the other end of the S-shaped liquid cooling groove.
The heat dissipation structure of the double-layer three-dimensional liquid cooling channel is characterized in that a liquid outlet hole B penetrating through the outer wall of the flat plate is formed in the other end of the liquid cooling channel A, and a liquid inlet hole B penetrating through the outer wall of the flat plate is formed in the other end of the liquid cooling channel B.
Since the technical scheme is used, the utility model discloses following beneficial effect has:
double-deck three-dimensional liquid cooling passageway 'S heat radiation structure, through set up "S" shape protruding piece on the flat board to set up the liquid cooling passageway respectively at "S" shape protruding piece and dull and stereotyped face, make two way liquid cooling passageways form double-deck three-dimensional structure, utilize wherein passageways to connect at dull and stereotyped back fluting at two way passageway intersections, make it to take a bridge smoothly, realized two way three-dimensional structure passageway mutual noninterference' S mesh, the utility model has the characteristics of modern design, practicality are strong, excellent in use effect, break through traditional restriction etc, market prospect .
[ description of the drawings ]
Fig. 1 is a schematic view of an assembly structure of the present invention;
fig. 2 is a schematic view of an assembly structure of the board surface B of the present invention;
FIG. 3 is a schematic cross-sectional view of the connecting groove of the present invention;
fig. 4 is a schematic structural diagram of the present invention.
In the figure: 1. an arc-shaped cover strip; 2. a cover plate strip A; 3. a straight cover strip; 4. an "S" shaped cover strip; 5. a cover plate strip B; 6. an S-shaped liquid cooling tank; 7. a liquid cooling tank A; 8. a liquid cooling tank B; 9. a liquid inlet hole A; 10. a liquid inlet hole B; 11. a board surface A; 12. an arc-shaped slot; 13. a liquid outlet A; 14. a liquid outlet hole B; 15. a straight groove; 16. a flat plate; 17. connecting grooves; 18. an S-shaped convex block; 19. a strip-shaped cover plate; 20. and (4) a board surface B.
[ detailed description ] embodiments
The present invention will be explained in more detail by the following examples, which are not intended to limit the invention, and the object of the disclosure is to protect changes and improvements within the scope of the invention;
the heat dissipation structure of the double-layer three-dimensional liquid cooling channel comprises a cover plate strip A, an S-shaped cover plate strip 4, a cover plate strip B and a flat plate 16, wherein an S-shaped protruding block 18 extending to two ends of the plate surface A is arranged on the plate surface A of the flat plate 16, an S-shaped liquid cooling channel 6 is arranged on the top surface of the S-shaped protruding block 18, a liquid cooling channel A is arranged on the plate surface A in a plurality of bends of the S-shaped protruding block 18, a liquid cooling channel B is arranged on the plate surface A in another bend of the S-shaped protruding block 18, the liquid cooling channel B and the liquid cooling channel A are arranged in a central symmetry manner, a connecting groove 17 is arranged in the central part of the plate surface B of the flat plate 16, a strip-shaped cover plate 19 covers the opening part of the connecting groove 17 to form a connecting channel, the cover plate strip A covers the opening part of the liquid cooling channel A, the space of the connecting groove A forms the liquid cooling channel A, the space of the liquid cooling channel A forms the liquid cooling channel A, the cover plate strip B covers the opening part of the liquid cooling channel B, the cover plate strip B forms a plurality of the arc-shaped protruding block A, the cover plate strip A is connected with the liquid cooling channel A, the cover strip A, the liquid cooling channel A, the cover strip B, the cover plate strip A is connected with the liquid cooling channel A, the cover strip A, the liquid cooling.
Implement the heat radiation structure of double-deck three-dimensional liquid cooling passageway, cover bar apron 19 in the connecting groove 17 oral area, apron strip A2 covers in the oral area of liquid cooling tank A7, apron strip B5 covers in the oral area of liquid cooling tank B8, "S" shape apron strip 4 covers in the oral area of "S" shape liquid cooling tank 6, then encapsulate with vacuum brazing, diffusion welding or friction stir welding wherein, after finishing waiting to encapsulate, connect radiator A respectively with feed liquor hole A9 and liquid hole A13, it is full of coolant liquid in "S" shape liquid cooling passageway, utilize the radiator to make coolant liquid circulation, make the coolant liquid in "S" shape passageway dispel the heat for the precision instrument in the cavity outer box, connect radiator B respectively with feed liquor hole B10 and liquid hole B14, also fill with coolant liquid in liquid cooling passageway A and liquid cooling passageway B, utilize radiator B to make coolant liquid cooling circulation, make the coolant liquid cooling passageway A and the interior coolant liquid cooling passageway B of liquid cooling passageway B be the interior coolant liquid cooling passageway A of cavity box because the smooth three-way liquid cooling passageway A that "S" liquid cooling channel does not cross the three-dimensional instrument that the bridge and liquid cooling passageway A18 that the three-dimensional liquid cooling passageway that the three-dimensional transition can not set up on the three-way liquid cooling passageway, the three-dimensional liquid cooling passageway that the three-dimensional liquid cooling passageway is formed the three-dimensional transition structure, the three-dimensional liquid cooling.
The part of the utility model not detailed is prior art.
Claims (4)
- The heat dissipation structure of the double-layer three-dimensional liquid cooling channel is characterized by comprising a cover plate strip A (2), an S-shaped cover plate strip (4), a cover plate strip B (5) and a flat plate (16), wherein S-shaped protruding blocks (18) extending to two ends of the plate surface A (11) are arranged on the plate surface A (11) of the flat plate (16), S-shaped liquid cooling grooves (6) are formed in the top surfaces of the S-shaped protruding blocks (18), liquid cooling grooves A (7) are formed in the plate surfaces A (11) of bends of the S-shaped protruding blocks (18), liquid cooling grooves B (8) are formed in the plate surfaces A (11) of bends of the S-shaped protruding blocks (18) in the middle, the liquid cooling grooves B (8) and the liquid cooling grooves A (7) are arranged in a central symmetry mode, a connecting groove (17) is arranged in the central portion of the plate surface B (20) of the flat plate (16), a strip-shaped cover plate (19) covers an opening portion of the connecting groove (17), the liquid cooling groove A space is formed at the bottom of the S-shaped liquid cooling groove A (7), and the liquid cooling groove A (7) is connected with the liquid cooling groove A (6) to form a connecting groove opening portion, and a liquid cooling groove opening portion which is formed at two ends of the liquid cooling groove A2 and a liquid cooling channel A2 which cover plate channel A2 and a liquid cooling groove opening portion is connected with the liquid cooling groove 6.
- 2. The heat dissipation structure of a dual-layer three-dimensional liquid cooling channel as claimed in claim 1, wherein: the cover plate strip A (2) is a combination of a plurality of S-shaped structures formed by connecting a plurality of straight cover strips (3) and a plurality of arc-shaped cover strips (1) end to end, the cover plate strip B (5) and the cover plate strip A (2) are identical in structure, the liquid cooling tank A (7) is a combination of a plurality of S-shaped structures formed by connecting a plurality of straight tanks (15) and a plurality of arc-shaped tanks (12) end to end, and the liquid cooling tank B (8) and the liquid cooling tank A (7) are identical in structure.
- 3. The heat dissipation structure of the double-layer three-dimensional liquid cooling channel as claimed in claim 1, wherein a liquid inlet A (9) penetrating the outer wall of the S-shaped protrusion (18) is formed at the end of the S-shaped liquid cooling tank (6), and a liquid outlet A (13) penetrating the outer wall of the S-shaped protrusion (18) is formed at the other end of the S-shaped liquid cooling tank (6).
- 4. The heat dissipating structure of a liquid cooling channel of claim 1, wherein a liquid outlet B (14) is formed through the outer wall of the plate (16) at the other end of the liquid cooling channel A, and a liquid inlet B (10) is formed through the outer wall of the plate (16) at the other end of the liquid cooling channel B.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920827371.5U CN210008158U (en) | 2019-06-04 | 2019-06-04 | radiating structure of double-layer three-dimensional liquid cooling channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920827371.5U CN210008158U (en) | 2019-06-04 | 2019-06-04 | radiating structure of double-layer three-dimensional liquid cooling channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210008158U true CN210008158U (en) | 2020-01-31 |
Family
ID=69308940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920827371.5U Expired - Fee Related CN210008158U (en) | 2019-06-04 | 2019-06-04 | radiating structure of double-layer three-dimensional liquid cooling channel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210008158U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072373A (en) * | 2019-06-04 | 2019-07-30 | 洛阳磊佳电子科技有限公司 | A kind of radiator structure in Dual-layer three-dimensional type liquid cooling channel |
-
2019
- 2019-06-04 CN CN201920827371.5U patent/CN210008158U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072373A (en) * | 2019-06-04 | 2019-07-30 | 洛阳磊佳电子科技有限公司 | A kind of radiator structure in Dual-layer three-dimensional type liquid cooling channel |
| CN110072373B (en) * | 2019-06-04 | 2024-01-30 | 洛阳磊佳电子科技有限公司 | Heat radiation structure of double-layer three-dimensional liquid cooling channel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210008158U (en) | radiating structure of double-layer three-dimensional liquid cooling channel | |
| CN205920762U (en) | Liquid cooling passageway of cavity liquid cooling dustbin body board material | |
| CN209169131U (en) | Radiating fin mould group | |
| CN205373480U (en) | Ultra -thin heat pipe of high -efficient imbibition core | |
| CN110081761B (en) | Efficient heat dissipation structure of double-sided liquid cooling channel and manufacturing method thereof | |
| CN210004835U (en) | hollow liquid cooling box plate structure with micro-channel | |
| CN209998553U (en) | hollow liquid cooling aluminum plate packaging structure suitable for friction stir welding | |
| CN210008157U (en) | Combined type hollow liquid cooling box plate packaging structure | |
| CN208538828U (en) | Integrated carbon nanotube sheet heater | |
| CN210042684U (en) | Rack that heat dissipation is good | |
| CN210136989U (en) | Double-channel power battery liquid cooling plate | |
| CN210773567U (en) | Embedded liquid cooling plate structure | |
| CN110072373B (en) | Heat radiation structure of double-layer three-dimensional liquid cooling channel | |
| CN209822283U (en) | High-efficient heat radiation structure of liquid cooling passageway | |
| CN210524218U (en) | Hollow liquid cooling aluminum plate packaging structure suitable for diffusion welding | |
| CN110021571B (en) | Radiator based on jet flow micro-channel | |
| CN210470165U (en) | Splicing structure between two liquid cooling plates | |
| CN209675457U (en) | New energy car battery packet radiator structure | |
| CN207781701U (en) | Heat-conducting plate structure for power battery cabin | |
| CN210773609U (en) | Heat conducting plate | |
| TWM570457U (en) | Heat exchanger | |
| CN216600580U (en) | Power supply radiator and power supply module | |
| CN206210982U (en) | Battery modules | |
| CN205825755U (en) | A kind of water-filled radiator | |
| CN218550515U (en) | Heat dissipation water drainage device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200131 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |