CN210008157U - Combined type hollow liquid cooling box plate packaging structure - Google Patents
Combined type hollow liquid cooling box plate packaging structure Download PDFInfo
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- CN210008157U CN210008157U CN201920827359.4U CN201920827359U CN210008157U CN 210008157 U CN210008157 U CN 210008157U CN 201920827359 U CN201920827359 U CN 201920827359U CN 210008157 U CN210008157 U CN 210008157U
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- liquid cooling
- packaging structure
- protruding strip
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- cooling box
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Abstract
Combined hollow liquid cooling box board packaging structure, relates to kinds of hollow liquid cooling box board packaging structure, the center part of the top surface of the central board (4) is provided with a C-shaped groove (6), the opposite two sides of the outside of the C-shaped groove (6) on the central board (4) are respectively provided with a liquid cooling channel (5), the inner ends of the two liquid cooling channels (5) are respectively connected with the two ends of the C-shaped groove (6), a U-shaped protruding strip A (2) arranged on the upper board (3) is arranged in a U-shaped protruding strip B (12) arranged on the lower board (11) to form a end open cavity (14), and the central board (4) is arranged in the cavity (14).
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to an kind cavity liquid cooling boxboard packaging structure especially relates to modular cavity liquid cooling boxboard packaging structure.
[ background of the invention ]
With the progress of science and technology, various precision instruments are continuously developed, the miniaturization and the compaction of the precision instruments are a development trend, but the heat dissipation of the miniaturized and compacted precision instruments is a difficult problem in research, because the radiator is usually installed inside the precision instruments, and the radiator needs to occupy a large space, the volume of the precision instruments is increased virtually, the traditional solution is that the outer box body of the precision instruments is set to be a hollow structure, the precision instruments inside the precision instruments are cooled through cooling liquid arranged in the hollow outer box body, when the liquid cooling channels are complex, the traditional machining process can not be realized, and at this time, the traditional process of covering the liquid cooling channels needs to be improved to match the requirements of various complex liquid cooling channels.
[ summary of the invention ]
In order to overcome not enough among the background art, the utility model discloses a modular cavity liquid cooling boxboard packaging structure sets up on solitary well board through the liquid cooling passageway with the difficult realization of traditional liquid cooling passageway capping technology to with well board with upper plate and hypoplastron through vacuum brazing or diffusion welding combination encapsulation, realized the purpose of the effective encapsulation of complicated liquid cooling passageway.
In order to realize the purpose, the utility model adopts the following technical scheme:
packaging structure of combined hollow liquid cooling box board, comprising an upper board, a central board and a lower board, wherein a U-shaped protruding strip A is arranged on the bottom of the upper board, a U-shaped protruding strip B with outer edge parallel to the top edge of the lower board is arranged on the top of the lower board, a C-shaped groove is arranged in the center of the top of the central board, liquid cooling channels are respectively arranged on two opposite sides of the outer part of the C-shaped groove on the central board, each liquid cooling channel comprises a semi-arc through groove and an arc transition groove, the semi-arc through grooves are arranged by inner and outer intervals by taking the C-shaped groove as center according to a fan-shaped structure, the semi-arc through grooves and the arc transition grooves are connected end to form a liquid cooling channel, the inner ends of the two liquid cooling channels are respectively connected with the two ends of the C-shaped groove, the U-shaped protruding strip A arranged on the upper board is arranged in the U-shaped protruding strip B arranged on the lower board to form a.
The combined type hollow liquid cooling box plate packaging structure is characterized in that an outer flanging is arranged at the lower end of the U-shaped protruding strip A, an inner flanging is arranged at the upper end of the U-shaped protruding strip B, and the outer flanging is arranged in the inner flanging to form a clamping structure.
The combined hollow liquid cooling box plate packaging structure is characterized in that the two liquid cooling channels are arranged in an axisymmetric manner.
In the combined type hollow liquid cooling box board packaging structure, liquid inlet holes penetrating through the outer part of the side wall of the central board are formed in the outer ends of liquid cooling channels, and liquid outlet holes penetrating through the central board and the liquid inlet holes and penetrating through the outer part of the side wall of are formed in the outer ends of liquid cooling channels.
The outer end of the liquid inlet hole and the outer end of the liquid outlet hole are arranged at the opening of the cavity.
Since the technical scheme is used, the utility model discloses following beneficial effect has:
modular cavity liquid cooling boxboard packaging structure, through adding the difficult liquid cooling passageway that realizes of lid technology with traditional liquid cooling passageway and set up on solitary well core plate to with well core plate with upper plate and hypoplastron through vacuum brazing or diffusion welding combination encapsulation, realized the purpose of the effective encapsulation of complicated liquid cooling passageway, the utility model has the characteristics of simple structure, practicality are strong, excellent in use effect, break through traditional restriction etc, market prospect is wide.
[ description of the drawings ]
Fig. 1 is a schematic view of an assembly structure of the present invention;
FIG. 2 is a schematic view of the structure of the upper plate and the lower plate of the present invention;
fig. 3 is a schematic structural view of the center plate of the present invention;
fig. 4 is a schematic structural diagram of the present invention.
In the figure: 1. flanging; 2. a U-shaped protruding strip A; 3. an upper plate; 4. a center plate; 5. a liquid cooling channel; 6. a "C" shaped slot; 7. a semi-arc through slot; 8. an arc-shaped transition groove; 9. a liquid inlet hole; 10. a liquid outlet hole; 11. a lower plate; 12. a U-shaped protruding strip B; 13. inward flanging; 14. a cavity.
[ detailed description ] embodiments
The present invention will be explained in more detail by the following examples, which are not intended to limit the invention, and the object of the disclosure is to protect changes and improvements within the scope of the invention;
the combined type hollow liquid cooling box board packaging structure described with reference to fig. 1, 2, 3 or 4 includes an upper board 3, a central board 4 and a lower board 11, a "U" shaped protruding strip a2 is provided on the bottom surface of the upper board 3, a "U" shaped protruding strip B12 having an outer edge flush with the top edge of the lower board 11 is provided on the top surface of the lower board 11, a "C" shaped groove 6 is provided at the central portion of the top surface of the central board 4, liquid cooling channels 5 are provided on the opposite sides of the outside of the "C" shaped groove 6 on the central board 4, the liquid cooling channels 5 include semi-circular through grooves 7 and arc transition grooves 8, the semi-circular through grooves 7 are arranged at intervals from inside to outside according to a fan-shaped structure with the "C" shaped groove 6 as the center, the semi-circular through grooves 7 and the arc transition grooves 8 are connected end to form liquid cooling channels 5, the inner ends of the two liquid cooling channels 5 are connected to both ends of the "C" shaped groove 6, the two liquid cooling channels 5 are arranged axially symmetrically, a liquid cooling channel 5 is provided with an outer end having a liquid inlet hole 359 penetrating through the outside the central board 4 side wall of the central board 5, a liquid inlet hole 359 and a liquid outlet hole 3514 is provided in the liquid outlet hole 3514, a 3614 is provided in the outer end of the liquid outlet side wall of the liquid cooling channel 9, a 3610, a convex strip B3, a 3614 is provided in the liquid outlet 3, a 3614, a liquid outlet is provided in a liquid inlet is provided with a liquid outlet 14, a liquid outlet 9, a liquid outlet.
Implement combination formula cavity liquid cooling boxboard packaging structure, "U" shape protruding strip A2 that upper plate 3 was equipped with is arranged in "U" shape protruding strip B12 that hypoplastron 11 was equipped with and is formed end open-ended cavity 14, make flanging 1 arrange in interior turn-ups 13 and form the block structure, arrange cavity 14 in with well core plate 4 according to the outer end of feed liquor hole 9 and the oral area that goes out liquid hole 10 and arrange cavity 14 in, it is right to use vacuum brazing or diffusion welding the utility model discloses encapsulate, realized will unable complex liquid cooling channel 5 that utilizes traditional technology to add the lid to realize and set up the characteristics on solitary well core plate 4, connect the radiator respectively with feed liquor hole 9 and play liquid cooling hole 10, fill up the coolant liquid in two liquid cooling channels 5 and "C" groove 6, utilize the radiator to make coolant liquid circulation, make two liquid cooling channels 5 and the coolant liquid cooling channel in "C" groove 6 for the interior precision instruments heat dissipation of cavity outer box, owing to encapsulate at upper plate 3 and hypoplastron 11 with the well core plate 4 that will be equipped with two liquid cooling channels 5 and "C" 6, the effectual block liquid cooling channel 3 and the effectual cold and the hypoplastron in the effectual precision instruments that has closely solved down board and hypoplastron 11 again.
The part of the utility model not detailed is prior art.
Claims (5)
- The utility model provides a modular hollow liquid cooling box board packaging structure, characterized by includes upper plate (3), well plate (4) and hypoplastron (11), be equipped with "U" shape protruding strip A (2) on the bottom surface of upper plate (3), be equipped with "U" shape protruding strip B (12) that the border is the same level with hypoplastron (11) top surface border on the top surface of hypoplastron (11) down, be equipped with "C" shape groove (6) at the central point of well plate (4) top surface, the relative both sides of "C" shape groove (6) outside on well plate (4) are equipped with liquid cooling passageway (5) respectively, liquid cooling passageway (5) include half-circular arc logical groove (7) and arc cross aqueduct (8), a plurality of half-circular arc logical groove (7) use "C" shape groove (6) as the center by interior outer interval arrangement of fan-shaped structure, a plurality of half-circular arc logical groove (7) and a plurality of arc cross aqueduct (8) and form liquid cooling passageway (5) end to end connection, the inner end of two liquid cooling passageway (5) link with the both ends of "C" shape groove (6) respectively, the protruding strip A (3) is equipped with the cavity that the hypoplastron (14) was equipped with the opening of the U "shape (14" 4 "of.
- 2. The combined type hollow liquid cooling box plate packaging structure of claim 1, wherein: the lower end of the U-shaped protruding strip A (2) is provided with an outward flange (1), the upper end of the U-shaped protruding strip B (12) is provided with an inward flange (13), and the outward flange (1) is arranged in the inward flange (13) to form a clamping structure.
- 3. The combined type hollow liquid cooling box plate packaging structure of claim 1, wherein: the two liquid cooling channels (5) are arranged in an axisymmetric manner.
- 4. The combined type hollow liquid cooling box plate package structure of claim 1, wherein the outer ends of liquid cooling channels (5) are provided with liquid inlet holes (9) penetrating the outer part of the side wall of the central plate (4), and the outer ends of liquid cooling channels (5) are provided with liquid outlet holes (10) penetrating the central plate (4) and the liquid inlet holes (9) and the outer part of the side wall of .
- 5. The combined type hollow liquid cooling box plate packaging structure of claim 4, wherein: the outer end of the liquid inlet hole (9) and the outer end of the liquid outlet hole (10) are arranged at the mouth part of the cavity (14).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920827359.4U CN210008157U (en) | 2019-06-04 | 2019-06-04 | Combined type hollow liquid cooling box plate packaging structure |
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CN201920827359.4U CN210008157U (en) | 2019-06-04 | 2019-06-04 | Combined type hollow liquid cooling box plate packaging structure |
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CN210008157U true CN210008157U (en) | 2020-01-31 |
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CN201920827359.4U Expired - Fee Related CN210008157U (en) | 2019-06-04 | 2019-06-04 | Combined type hollow liquid cooling box plate packaging structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110072374A (en) * | 2019-06-04 | 2019-07-30 | 洛阳磊佳电子科技有限公司 | A kind of Combined hollow liquid cooling boxboard encapsulating structure |
-
2019
- 2019-06-04 CN CN201920827359.4U patent/CN210008157U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110072374A (en) * | 2019-06-04 | 2019-07-30 | 洛阳磊佳电子科技有限公司 | A kind of Combined hollow liquid cooling boxboard encapsulating structure |
CN110072374B (en) * | 2019-06-04 | 2024-01-30 | 洛阳磊佳电子科技有限公司 | Combined hollow liquid cooling box board packaging structure |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200131 |
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CF01 | Termination of patent right due to non-payment of annual fee |